JP6106704B2 - 電子装置のための熱サイフォンシステム - Google Patents
電子装置のための熱サイフォンシステム Download PDFInfo
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
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- 229910000679 solder Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20245—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Mechanical Engineering (AREA)
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- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
いくつかの実施例において、複数の起伏は、複数の湾曲した区間によって形成される。該湾曲した区間は、dK/dSが一定の値であり、Kが起伏の曲率半径の逆数とされており、Sが湾曲した区間に沿った長さである。起伏のための他の形状は、可能である。それらの起伏は、垂直方向の内面に形成された、凝縮した作動流体のフィルムを薄くさせ、それによって、凝縮器の熱抵抗を減少させる。
105 サーバーラック
107 スロット
110 サーバーラックサブアセンブリ
112 レール
120 フレーム、ケージ
121 側壁
122 プリント回路基板、マザーボード
124 電子装置
126 ファン
130 熱サイフォンシステム
132 蒸発器
134 凝縮器
136 凝縮物/蒸気ライン
140 ベース
141 熱伝導性インターフェース材料
142 ウィック
144 ケース
146 チャンバー
150 流れ絞り機構
170 本体
172 壁
174 キャビティー
174a チャンバー
176 中央チャンネル
180 導熱フィン
190 底部ヘッダー
192 チューブ
Claims (23)
- 凝縮器と、
凝縮物ラインによって前記凝縮器に流体的に連結される蒸発器であって、前記凝縮物ラインに対する開口部を有するハウジングと、前記ハウジング内に位置したウィックと、前記ハウジング内に位置した流れ絞り機構であって、前記凝縮物ラインから前記ウィックの一部上へ作動流体の流れを制限するように構成される流れ絞り機構と、を備える蒸発器と、
を備え、
前記ハウジングは底部内面を有しており、前記ウィックは前記底部内面上に位置付けられ、前記流れ絞り機構は、前記ウィックと前記開口部との間の前記底部内面上に液体不透過性バリアを備え、
前記流れ絞り機構は、前記作動流体の深さが前記ウィックの一部に亘る箇所より、前記液体不透過性バリアと前記開口部の間のハウジングの領域に亘る箇所において大きくなるように構成される、熱サイフォンシステム。 - 凝縮器と、
凝縮物ラインによって前記凝縮器に流体的に連結される蒸発器であって、前記凝縮物ラインに対する開口部を有するハウジングと、前記ハウジング内に位置したウィックと、前記ハウジング内に位置した流れ絞り機構であって、前記凝縮物ラインから前記ウィックの一部上へ作動流体の流れを制限するように構成される流れ絞り機構と、を備える蒸発器と、
を備え、
前記ハウジングは底部内面を有しており、前記ウィックは前記底部内面上に位置付けられ、前記流れ絞り機構は、前記ウィックと前記開口部との間の前記底部内面上に液体不透過性バリアを備え
前記液体不透過性バリアは、前記ウィックの一部を取り囲む、熱サイフォンシステム。 - 凝縮器と、
凝縮物ラインによって前記凝縮器に流体的に連結される蒸発器であって、前記凝縮物ラインに対する開口部を有するハウジングと、前記ハウジング内に位置したウィックと、前記ハウジング内に位置した流れ絞り機構であって、前記凝縮物ラインから前記ウィックの一部上へ作動流体の流れを制限するように構成される流れ絞り機構と、を備える蒸発器と、を備え、
前記ハウジングは上部内面を含み、液体不透過性バリアと前記ハウジングの前記上部内面との間に間隙が存在する、熱サイフォンシステム。 - 前記ハウジングは底部内面を有しており、前記ウィックは前記底部内面上に位置付けられ、前記流れ絞り機構は、前記ウィックと前記開口部との間の前記底部内面上に液体不透過性バリアを備えることを特徴とする請求項3に記載の熱サイフォンシステム。
- 前記液体不透過性バリアは、前記作動流体が前記ウィックへ流れることを可能にするために、複数の貫通孔を備えることを特徴とする請求項1、2、および4のいずれか1項に記載の熱サイフォンシステム。
- 前記液体不透過性バリアを貫通する前記複数の貫通孔は、前記底部内面に隣接して位置付けられることを特徴とする請求項5に記載の熱サイフォンシステム。
- 前記底部内面は、平面であることを特徴とする請求項1、2、および4のいずれか1項に記載の熱サイフォンシステム。
- 前記液体不透過性バリアは、前記作動流体が前記開口部に近接する前記液体不透過性バリアの側に溜められるように、前記作動流体をせき止めることを特徴とする請求項1、2、および4のいずれか1項に記載の熱サイフォンシステム。
- 前記蒸発器を前記凝縮器に流体的に連結する蒸気ラインをさらに備え、
前記ハウジングにおける前記蒸気ラインへの開口部は、前記ハウジングの上部内面に位置しており、前記ハウジングにおける前記凝縮物ラインへの開口部は、前記ハウジングの内部側面に位置することを特徴とする請求項3に記載の熱サイフォンシステム。 - 前記凝縮物ラインは、組み合わされた凝縮物及び蒸気移送ラインを備え、前記蒸発器と前記凝縮器との間の流体的連結は、前記組み合わされた凝縮物及び蒸気移送ラインからなることを特徴とする請求項1〜3のいずれか1項に記載の熱サイフォンシステム。
- 前記凝縮器は、略垂直な内面によって囲まれた内部容積を備え、前記内面は複数の起伏を備え、該複数の起伏は、垂直方向の第1の軸に対して垂直な第2の軸上で前記内部容積の内部へ突出しており、前記複数の起伏のピークが前記第1の軸及び前記第2の軸に対して垂直な第3の軸に沿って離隔して配置される、
請求項1〜10のいずれか1項に記載の熱サイフォンシステム。 - 前記内部容積は、前記第3の軸に沿った長さと、前記第2の軸に沿った幅と、を有しており、前記長さは、前記幅より大きいことを特徴とする請求項11に記載の熱サイフォンシステム。
- 前記複数の起伏の複数のピークは、前記第3の軸に沿って一定の間隔で配置されることを特徴とする請求項11に記載の熱サイフォンシステム。
- 前記複数の起伏は、0.1mmと1mmとの間の第3の軸に沿ったピッチを有することを特徴とする請求項13に記載の熱サイフォンシステム。
- 前記複数の起伏は、0.1mmと1mmとの間の第2の軸に沿った振幅を有することを特徴とする請求項13に記載の熱サイフォンシステム。
- 前記複数の起伏は、前記第3の軸に沿ったピッチと、前記第2の軸に沿った振幅と、を有しており、前記振幅に対するピッチの比は、約1:1から約2:1とされることを特徴とする請求項13に記載の熱サイフォンシステム。
- 前記複数の起伏は、正弦波であることを特徴とする請求項13に記載の熱サイフォンシステム。
- 前記複数の起伏は、複数の湾曲した区間を備えており、dK/dSが一定の値に等しく、Kが前記複数の起伏の曲率半径の逆数であり、Sが湾曲した区間に沿った距離とされることを特徴とする請求項13に記載の熱サイフォンシステム。
- 前記凝縮器は、共通のチャンネルに接続された複数の平行なチャンバーを備え、
前記凝縮物ラインは、前記凝縮器の前記共通のチャンネルを前記蒸発器に流体的に連結し、作動流体の液相が前記凝縮物ラインの内部容積の底部を満たす状態で、前記凝縮器が前記蒸発器より上の高さに位置し、それによって、動作中に、前記液相の上面が前記凝縮器から前記蒸発器への水平方向に対してゼロではない角度を有し、前記作動流体の気相が前記凝縮物ラインの前記内部容積の上部を通過することができ、前記上部は、前記凝縮器から前記蒸発器に延在している、
ことを特徴とする請求項1〜10のいずれか1項に記載の熱サイフォンシステム。 - サーバーラック内にスライド可能に挿入されるように構成されたトレイと、
前記トレイに取り付けられ、且つ平面に載置しているマザーボードであって、前記マザーボードの下側が間隙によって前記トレイから分離されている、マザーボードと、
前記マザーボードの上側に取り付けられた熱を発生させる電子装置と、
前記熱を発生させる電子装置に支持された蒸発器と、前記トレイに支持されており、且つ前記蒸発器に流体的に連結される凝縮器と、を備えている熱サイフォンシステムであって、前記蒸発器が、前記熱を発生させる電子装置に隣接して位置付けられ、且つ前記熱を発生させる電子装置に熱伝導的に連結される底面を有し、前記凝縮器は、前記マザーボードの前記平面の上方に位置付けられた凝縮収集器と、前記マザーボードの前記平面の下方に、前記凝縮収集器から下向きに延在する複数の導熱フィンと、を備えている、請求項1〜19のいずれか1項に記載の熱サイフォンシステムと、
前記トレイに取り付けられたファンであって、前記マザーボードの上方で、且つ前記蒸発器の前記複数の導熱フィンの間で空気流れを発生させるように方向付けられている、ファンと、
を備えていることを特徴とするサーバーラックサブアセンブリ。 - 第2の熱を発生させる電子装置は、前記マザーボード上に取り付けられており、前記熱サイフォンシステムは第2の蒸発器を備えており、前記第2の蒸発器は、前記第2の熱を発生させる電子装置に隣接して位置付けられ、且つ前記第2の熱を発生させる電子装置に熱伝導的に連結される第2の底面を備えていることを特徴とする請求項20に記載のサーバーラックサブアセンブリ。
- 前記トレイは、13インチ又は19インチのサーバーラック内に挿入するために構成されることを特徴とする請求項20に記載のサーバーラックサブアセンブリ。
- 前記トレイの底部から前記複数の導熱フィンの上部までの合計高さが、最大6インチとされることを特徴とする請求項20に記載のサーバーラックサブアセンブリ。
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