JP6103821B2 - 通電試験用プローブ - Google Patents
通電試験用プローブ Download PDFInfo
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- JP6103821B2 JP6103821B2 JP2012121582A JP2012121582A JP6103821B2 JP 6103821 B2 JP6103821 B2 JP 6103821B2 JP 2012121582 A JP2012121582 A JP 2012121582A JP 2012121582 A JP2012121582 A JP 2012121582A JP 6103821 B2 JP6103821 B2 JP 6103821B2
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- JP
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- Prior art keywords
- probe
- needle
- metal material
- needle tip
- body portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000523 sample Substances 0.000 title claims description 138
- 238000012360 testing method Methods 0.000 title claims description 29
- 239000007769 metal material Substances 0.000 claims description 87
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 20
- 239000010948 rhodium Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 229910052703 rhodium Inorganic materials 0.000 claims description 10
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 9
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 238000005304 joining Methods 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 230000001747 exhibiting effect Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 65
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 16
- 238000012423 maintenance Methods 0.000 description 9
- 238000000206 photolithography Methods 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 241001422033 Thestylus Species 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 150000003283 rhodium Chemical class 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
12 被検査体
24、62 プローブ
24a、62a 針本体部
24b、62b 針先部
38(38a、38b)、68 金属層
Claims (6)
- プローブ基板の回路への接続端を有し靭性を示す第1の金属材料で形成された針本体部と、針先を有する針先部であって前記針本体部の前記第1の金属材料よりも高い硬度を示す第2の金属材料で形成され、前記針本体部に連続する針先部とを備え、前記針本体部及び前記針先部には、前記針先から前記接続端に至る同一金属材料から成る電流経路が形成されており、
前記同一金属材料は前記第2の金属材料であり、該第2の金属材料は前記第1の金属材料よりも電気抵抗率(Ωcm)が小さい、通電試験用プローブ。 - 前記第1の金属材料は、ニッケル又はニッケル合金であり、前記第2の金属材料はロジウムである、請求項1に記載の通電試験用プローブ。
- 前記電流経路は前記針先部から前記針本体部を経る電流経路に対するバイパス路として作用し、該バイパス路は、その経路中に、異質金属の接合によって形成される界面を有しない、請求項1に記載の通電試験用プローブ。
- 前記針本体部が、前記プローブ基板の回路への接続端から離れる方向へ伸長する取付け部分と、該取付け部分の伸長方向とほぼ直角に伸長するアーム部分と、該アーム部の先端から前記取付け部分の伸長方向と同一方向に伸長する台座部分とを備え、前記針先部が前記台座部分の伸長端から突出するカンチレバー型プローブである、請求項1に記載の通電試験用プローブ。
- 前記針本体部が前記プローブ基板の回路への接続端から離れる方向へ棒状に伸長し、前記針先部が前記針本体部の先端から該針本体部とほぼ同一方向に伸長する垂直型プローブである、請求項1に記載の通電試験用プローブ。
- 前記電流経路は、前記針本体部と前記針先部との界面に沿って伸び、さらに前記針本体部の上端に達するように、前記針本体部の一側面の全域を覆って形成されている、請求項1に記載の通電試験用プローブ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012121582A JP6103821B2 (ja) | 2012-05-29 | 2012-05-29 | 通電試験用プローブ |
US13/891,071 US9568500B2 (en) | 2012-05-29 | 2013-05-09 | Electrical test probe |
TW102116656A TWI491883B (zh) | 2012-05-29 | 2013-05-10 | 通電試驗用探針 |
KR1020130056384A KR101453474B1 (ko) | 2012-05-29 | 2013-05-20 | 통전 시험용 프로브 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012121582A JP6103821B2 (ja) | 2012-05-29 | 2012-05-29 | 通電試験用プローブ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013246116A JP2013246116A (ja) | 2013-12-09 |
JP6103821B2 true JP6103821B2 (ja) | 2017-03-29 |
Family
ID=49669445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012121582A Active JP6103821B2 (ja) | 2012-05-29 | 2012-05-29 | 通電試験用プローブ |
Country Status (4)
Country | Link |
---|---|
US (1) | US9568500B2 (ja) |
JP (1) | JP6103821B2 (ja) |
KR (1) | KR101453474B1 (ja) |
TW (1) | TWI491883B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5074608B2 (ja) * | 2011-02-08 | 2012-11-14 | 田中貴金属工業株式会社 | プローブピン |
FR3022690B1 (fr) * | 2014-06-24 | 2016-07-22 | Commissariat Energie Atomique | Dispositif de connexion electrique comportant des elements de connexion a position commandable |
FR3022638B1 (fr) * | 2014-06-24 | 2016-07-22 | Commissariat Energie Atomique | Procede de caracterisation d'un dispositif de connexion electrique destine a etre hybride a un dispositif electronique |
JP2017521668A (ja) * | 2014-07-14 | 2017-08-03 | テクノプローベ エス.ピー.エー. | 試験ヘッドのための接触プローブ、及び対応する製造方法 |
TWI580969B (zh) * | 2015-04-14 | 2017-05-01 | Mpi Corp | Probe card |
CN105182010A (zh) * | 2015-05-26 | 2015-12-23 | 谈宁 | 用于材料及器件的电学性能重力探针 |
TWI713939B (zh) * | 2017-12-18 | 2020-12-21 | 義大利商探針科技公司 | 用於測試電子裝置的測試頭的接觸探針 |
IT201800001170A1 (it) * | 2018-01-17 | 2019-07-17 | Technoprobe Spa | Testa di misura di tipo cantilever e relativa sonda di contatto |
TWI647454B (zh) * | 2018-02-26 | 2019-01-11 | 中華精測科技股份有限公司 | 探針組件及其探針結構 |
JP2021105547A (ja) * | 2019-12-26 | 2021-07-26 | 日本発條株式会社 | コンタクトプローブ |
JP2022179066A (ja) * | 2021-05-21 | 2022-12-02 | 富士フイルムビジネスイノベーション株式会社 | シート電気抵抗測定器 |
TWI792996B (zh) * | 2022-04-29 | 2023-02-11 | 中華精測科技股份有限公司 | 懸臂式探針卡裝置及其彈臂型探針 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0729838U (ja) | 1993-11-08 | 1995-06-02 | 日本電子材料株式会社 | 座屈応力減少機構付垂直動作式プローブカード |
JP2006010588A (ja) * | 2004-06-28 | 2006-01-12 | Nhk Spring Co Ltd | コンタクトプローブおよびその製造方法 |
JP4382593B2 (ja) | 2004-06-29 | 2009-12-16 | 山一電機株式会社 | プローブユニット及びその製造方法 |
JP4769538B2 (ja) * | 2005-02-22 | 2011-09-07 | 富士通セミコンダクター株式会社 | 電子部品用コンタクタ及びコンタクト方法 |
JP2006284297A (ja) * | 2005-03-31 | 2006-10-19 | Kanai Hiroaki | コンタクトプローブ構造体の製造方法 |
JP2007271343A (ja) * | 2006-03-30 | 2007-10-18 | Sumitomo Electric Ind Ltd | コンタクトプローブおよびその製造方法 |
JP5123514B2 (ja) * | 2006-10-02 | 2013-01-23 | 株式会社日本マイクロニクス | 通電試験用プローブおよび通電試験用プローブ組立体 |
TW200815763A (en) * | 2006-09-26 | 2008-04-01 | Nihon Micronics Kabushiki Kaisha | Electrical test probe and electrical test probe assembly |
JP5123508B2 (ja) * | 2006-09-26 | 2013-01-23 | 株式会社日本マイクロニクス | 通電試験用プローブおよび通電試験用プローブ組立体 |
JP5123533B2 (ja) | 2007-02-01 | 2013-01-23 | 株式会社日本マイクロニクス | 通電試験用プローブおよびその製造方法 |
TW200841019A (en) | 2007-04-13 | 2008-10-16 | Microelectonics Technology Inc | Method of manufacturing low-leakage probe card and device thereof |
JP5046909B2 (ja) * | 2007-12-21 | 2012-10-10 | 株式会社日本マイクロニクス | 電気試験用接触子、これを用いる電気的接続装置、及び接触子の製造方法 |
TW201018917A (en) | 2008-11-13 | 2010-05-16 | Mpi Corp | Method of manufacturing probe card and structure thereof |
JP5597385B2 (ja) * | 2009-11-19 | 2014-10-01 | 株式会社日本マイクロニクス | 電気的試験用プローブ、それを用いた電気的接続装置、及びプローブの製造方法 |
JP5342418B2 (ja) | 2009-12-01 | 2013-11-13 | 株式会社日本マイクロニクス | 電気的試験用プローブ及びこれを用いた電気的接続装置 |
-
2012
- 2012-05-29 JP JP2012121582A patent/JP6103821B2/ja active Active
-
2013
- 2013-05-09 US US13/891,071 patent/US9568500B2/en active Active
- 2013-05-10 TW TW102116656A patent/TWI491883B/zh active
- 2013-05-20 KR KR1020130056384A patent/KR101453474B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US9568500B2 (en) | 2017-02-14 |
KR20130133669A (ko) | 2013-12-09 |
JP2013246116A (ja) | 2013-12-09 |
US20130321016A1 (en) | 2013-12-05 |
KR101453474B1 (ko) | 2014-10-22 |
TWI491883B (zh) | 2015-07-11 |
TW201400820A (zh) | 2014-01-01 |
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