JP6086765B2 - 研削ホイール - Google Patents
研削ホイール Download PDFInfo
- Publication number
- JP6086765B2 JP6086765B2 JP2013049418A JP2013049418A JP6086765B2 JP 6086765 B2 JP6086765 B2 JP 6086765B2 JP 2013049418 A JP2013049418 A JP 2013049418A JP 2013049418 A JP2013049418 A JP 2013049418A JP 6086765 B2 JP6086765 B2 JP 6086765B2
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- grinding wheel
- wheel
- auxiliary
- grindstone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000227 grinding Methods 0.000 title claims description 121
- 239000000463 material Substances 0.000 claims description 11
- 238000005245 sintering Methods 0.000 claims description 7
- 239000006061 abrasive grain Substances 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 6
- 239000010432 diamond Substances 0.000 claims description 6
- 239000004575 stone Substances 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 21
- 238000000034 method Methods 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 6
- 239000008187 granular material Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000011146 organic particle Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- -1 polyethylene vinyl chloride Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
- B24B5/04—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
- B24B5/045—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally with the grinding wheel axis perpendicular to the workpiece axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
(1)粒径φ0.5μm(#8000)のダイアモンド砥粒と、SiO2を主成分としNaO、B2O3、CaO等を副成分とするビトリファイドボンド材と、珪酸ナトリウム(ゲル状の無機質発泡剤)と、粒径φ50μm前後の有機物粒子「ポリスチレン(PS)系、ポリメタクリル酸エステル(PMMA)系の有機物粒子(商品名ガッツパール:ガッツ化成株式会社)」とを混練して造粒し顆粒物(粒径φ350μm〜φ50μm)を生成する。
(2)SiO2を主成分としNaO、B2O3、CaO等を副成分とするビトリファイドボンド材と、珪酸ナトリウム(ゲル状の無機質発泡剤)と、粒径φ50μm前後の有機物粒子「ポリスチレン(PS)系、ポリメタクリル酸エステル(PMMA)系の有機物粒子(商品名ガッツパール:ガッツ化成株式会社)」とを混練して造粒し顆粒物(粒径φ350μm〜φ50μm)を生成する。
(3)セグメントを形成する枠体内に(1)の顆粒物と(2)の顆粒物とを層状に積層して充填し所定の形状に加圧成形する。
(4)焼結炉内に成形された顆粒物を搬入する。
(5)焼結炉内の温度を約2時間かけて650℃まで上昇させ、その後650℃を約6時間維持した後、約6時間かけて常温に戻して研削砥石28aと補助砥石28bとを一体に形成する。
(6)焼結炉内から一体になった研削砥石28aと補助砥石28bを搬出し、切断加工等によってセグメント形状に整形する。
11 半導体ウエーハ
22 ホイールマウント
23 保護テープ
24 研削ホイール
26 ホイール基台
28 砥石
28a 研削砥石
28b 補助砥石
38 チャックテーブル
Claims (4)
- 研削手段のホイールマウントに装着される研削ホイールであって、
該ホイールマウントに装着される環状に形成された装着部と該装着部の反対側で環状に形成された自由端部とを有するホイール基台と、
該ホイール基台の該自由端部に配設されリング状に連なる複数の砥石と、を備え、
該複数の砥石のそれぞれは、ボンド材にダイアモンド砥粒を混入して焼結した研削砥石と、ボンド材のみを焼結した補助砥石とを含み、
該複数の砥石のそれぞれに含まれる該補助砥石は、互いにリング状に連なって該研削砥石を内側から補強し、又は互いにリング状に連なって該研削砥石を外側から補強し、
該研削砥石と、該補助砥石と、は、該ホイール基台からの高さが略同一であることを特徴とする研削ホイール。 - 該砥石は、該研削砥石を内側と外側とから該補助砥石によってサンドイッチ状に挟み込んで構成される請求項1記載の研削ホイール。
- 該砥石は、該補助砥石を内側と外側とから該研削砥石によってサンドイッチ状に挟み込んで構成される請求項1記載の研削ホイール。
- 該ボンド材は、ビトリファイドボンドから構成される請求項1〜3の何れかに記載の研削ホイール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013049418A JP6086765B2 (ja) | 2013-03-12 | 2013-03-12 | 研削ホイール |
KR1020140022400A KR102119908B1 (ko) | 2013-03-12 | 2014-02-26 | 연삭 휠 |
CN201410085262.2A CN104044047B (zh) | 2013-03-12 | 2014-03-10 | 磨轮 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013049418A JP6086765B2 (ja) | 2013-03-12 | 2013-03-12 | 研削ホイール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014172147A JP2014172147A (ja) | 2014-09-22 |
JP6086765B2 true JP6086765B2 (ja) | 2017-03-01 |
Family
ID=51497699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013049418A Active JP6086765B2 (ja) | 2013-03-12 | 2013-03-12 | 研削ホイール |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6086765B2 (ja) |
KR (1) | KR102119908B1 (ja) |
CN (1) | CN104044047B (ja) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0731970Y2 (ja) * | 1989-06-06 | 1995-07-26 | 株式会社ディスコ | 研削砥石 |
TW316868B (ja) * | 1994-12-28 | 1997-10-01 | Norton Co | |
JPH08336827A (ja) * | 1995-06-12 | 1996-12-24 | Nippon Dry Tool Kk | 切削刃 |
US6196911B1 (en) * | 1997-12-04 | 2001-03-06 | 3M Innovative Properties Company | Tools with abrasive segments |
JPH11207636A (ja) * | 1998-01-26 | 1999-08-03 | Mitsubishi Materials Corp | カップ型砥石 |
JP2002009027A (ja) * | 2000-06-23 | 2002-01-11 | Hitachi Ltd | 平坦化加工方法および装置 |
JP2004238838A (ja) * | 2003-02-04 | 2004-08-26 | Japan Found Eng Co Ltd | ロータリー式ボーリング用ダイヤモンドビット |
JP2006198737A (ja) | 2005-01-21 | 2006-08-03 | Disco Abrasive Syst Ltd | ビトリファイドボンド砥石 |
CN2885506Y (zh) * | 2005-12-21 | 2007-04-04 | 梁建湘 | 一种金刚石磨边轮 |
JP4906467B2 (ja) * | 2006-10-17 | 2012-03-28 | 株式会社ジェイテクト | 傾斜溝入り砥石及びその製造方法 |
JP5295731B2 (ja) | 2008-11-21 | 2013-09-18 | 株式会社ディスコ | ウエーハの研削方法 |
CN202200190U (zh) * | 2011-08-04 | 2012-04-25 | 徐达墩 | 研磨砂轮 |
-
2013
- 2013-03-12 JP JP2013049418A patent/JP6086765B2/ja active Active
-
2014
- 2014-02-26 KR KR1020140022400A patent/KR102119908B1/ko active IP Right Grant
- 2014-03-10 CN CN201410085262.2A patent/CN104044047B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2014172147A (ja) | 2014-09-22 |
KR102119908B1 (ko) | 2020-06-05 |
CN104044047B (zh) | 2018-01-23 |
KR20140111949A (ko) | 2014-09-22 |
CN104044047A (zh) | 2014-09-17 |
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