JP6058988B2 - 配線基板の製造方法 - Google Patents
配線基板の製造方法 Download PDFInfo
- Publication number
- JP6058988B2 JP6058988B2 JP2012262036A JP2012262036A JP6058988B2 JP 6058988 B2 JP6058988 B2 JP 6058988B2 JP 2012262036 A JP2012262036 A JP 2012262036A JP 2012262036 A JP2012262036 A JP 2012262036A JP 6058988 B2 JP6058988 B2 JP 6058988B2
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- JP
- Japan
- Prior art keywords
- resist layer
- solder resist
- opening
- resin
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Description
2 配線導体
3 ソルダーレジスト層
3a 開口部
7 突起部
10 配線基板
M 樹脂マスク層
Claims (4)
- 上面に複数の配線導体が並設されて成る絶縁基板上に、複数の前記配線導体の一部を一括して露出させる開口部を有するソルダーレジスト層を形成する工程と、前記ソルダーレジスト層上に前記開口部を覆うとともに前記ソルダーレジスト層の一部を含む領域を露出させる樹脂マスク層を形成する工程と、前記一部領域に追加工を施す工程と、前記樹脂マスク層を除去する工程とを含み、前記上面に封止樹脂により半導体素子が固着される配線基板の製造方法において、前記開口部内の前記配線導体同士の間または前記開口部近傍の前記ソルダーレジスト層上に、前記樹脂マスク層が前記開口部内の前記絶縁基板に接触するのを防止するための突起部が形成されていることを特徴とする配線基板の製造方法。
- 前記突起部が前記配線導体と同時に形成された導体層により前記開口部内に形成されていることを特徴とする請求項1記載の配線基板の製造方法。
- 前記突起部が前記ソルダーレジスト層と同時に形成された樹脂層により前記開口部内に形成されていることを特徴とする請求項1記載の配線基板の製造方法。
- 前記突起部が前記ソルダーレジスト層上に断続的に形成されていることを特徴とする請求項1記載の配線基板の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012262036A JP6058988B2 (ja) | 2012-11-30 | 2012-11-30 | 配線基板の製造方法 |
Applications Claiming Priority (1)
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JP2012262036A JP6058988B2 (ja) | 2012-11-30 | 2012-11-30 | 配線基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014107525A JP2014107525A (ja) | 2014-06-09 |
JP6058988B2 true JP6058988B2 (ja) | 2017-01-11 |
Family
ID=51028726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012262036A Expired - Fee Related JP6058988B2 (ja) | 2012-11-30 | 2012-11-30 | 配線基板の製造方法 |
Country Status (1)
Country | Link |
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JP (1) | JP6058988B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018037842A1 (ja) * | 2016-08-22 | 2018-03-01 | 株式会社村田製作所 | セラミック基板及び電子部品内蔵モジュール |
CN113710000A (zh) * | 2021-08-30 | 2021-11-26 | 江西志浩电子科技有限公司 | 一种厚铜板的Linemask加工工艺 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3481232B2 (ja) * | 2002-03-05 | 2003-12-22 | 三洋電機株式会社 | 有機エレクトロルミネッセンスパネルの製造方法 |
JP5138277B2 (ja) * | 2007-05-31 | 2013-02-06 | 京セラSlcテクノロジー株式会社 | 配線基板およびその製造方法 |
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2012
- 2012-11-30 JP JP2012262036A patent/JP6058988B2/ja not_active Expired - Fee Related
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JP2014107525A (ja) | 2014-06-09 |
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