JP6053150B2 - Light irradiation apparatus and irradiation method - Google Patents

Light irradiation apparatus and irradiation method Download PDF

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JP6053150B2
JP6053150B2 JP2013053800A JP2013053800A JP6053150B2 JP 6053150 B2 JP6053150 B2 JP 6053150B2 JP 2013053800 A JP2013053800 A JP 2013053800A JP 2013053800 A JP2013053800 A JP 2013053800A JP 6053150 B2 JP6053150 B2 JP 6053150B2
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adherend
light
adhesive layer
sealed space
adhesive sheet
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JP2014176831A (en
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芳昭 杉下
芳昭 杉下
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Lintec Corp
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Description

本発明は、光照射装置および照射方法に関する。   The present invention relates to a light irradiation apparatus and an irradiation method.

従来、半導体ウェハ（以下、単にウェハという場合がある）等の被着体に光硬化型フィルムが貼付された一体物に紫外線等の光を照射する光照射装置が提案されている（例えば、特許文献１参照）。
特許文献１に記載の光照射装置では、石英ガラスとの間に空間が形成されるように一体物を支持した後、空間内部に不活性ガスを充填し、マウントシートを蓋部材に当接させて光の焦点がずれることを防止しつつ、接着剤層に光を照射するようになっている。 2. Description of the Related Art Conventionally, there has been proposed a light irradiation apparatus that irradiates light such as ultraviolet rays onto an integrated body in which a photocurable film is attached to an adherend such as a semiconductor wafer (hereinafter, sometimes simply referred to as a wafer) (for example, a patent) Reference 1).
In the light irradiation apparatus described in Patent Document 1, after supporting the integrated object so that a space is formed between the quartz glass, the space is filled with an inert gas, and the mount sheet is brought into contact with the lid member. Thus, the adhesive layer is irradiated with light while preventing the light from defocusing.

特開２０１２−２０６２６６号公報JP 2012-206266 A

しかしながら、特許文献１に記載されたような従来の光照射装置では、不活性ガスを充填してマウントシートを蓋部材に当接させたときに、被着体に衝撃が加わり、当該被着体にストレスを与えたり破損させてしまったりするという不都合を発祥する。   However, in the conventional light irradiation device as described in Patent Document 1, when an inert gas is filled and the mount sheet is brought into contact with the lid member, an impact is applied to the adherend, and the adherend It causes the inconvenience of stressing or damaging it.

本発明は、被着体に衝撃を与えることなく接着剤層に光を適切に照射できる光照射装置および照射方法を提供することにある。   An object of the present invention is to provide a light irradiation apparatus and an irradiation method capable of appropriately irradiating light to an adhesive layer without giving an impact to an adherend.

前記目的を達成するために、本発明の光照射装置は、光反応型の接着剤層を有し被着体の外縁からはみ出す大きさの接着シートに当該被着体が貼付された一体物を照射対象とし、前記接着剤層に光を照射して光反応を起こさせる光照射装置であって、前記被着体の外縁からはみ出た接着シート領域を介して前記一体物を支持するとともに、当該接着シートを含んで外気から遮断された密閉空間を形成可能な密閉空間形成手段と、接着剤層に前記光を照射する発光手段とを備え、前記密閉空間に供給するまたは前記密閉空間から排出する気体および液体のうち少なくとも１つの量を制御して前記密閉空間の体積を変化させ、前記被着体および当該被着体に対応する接着シート部分が他の物体と接触することなく前記接着剤層を所定の位置に位置決め可能な位置決め手段を有する、という構成を採用している。
また、本発明の他の光照射装置は、光反応型の接着剤層を有し被着体の外縁からはみ出す大きさの接着シートに当該被着体が貼付された一体物を照射対象とし、前記接着剤層に光を照射して光反応を起こさせる光照射装置であって、前記被着体の外縁からはみ出た接着シート領域を介して前記一体物を支持するとともに、当該接着シートを含んで外気から遮断された密閉空間を形成可能な密閉空間形成手段と、接着剤層に前記光を照射する発光手段とを備え、前記密閉空間の温度を制御して前記密閉空間の圧力を変化させ、前記被着体および当該被着体に対応する接着シート部分が他の物体と接触することなく前記接着剤層を所定の位置に位置決め可能な位置決め手段を有する、という構成を採用している。 In order to achieve the above-mentioned object, the light irradiation device of the present invention comprises an integrated body in which the adherend is attached to an adhesive sheet having a photoreactive adhesive layer and protruding from the outer edge of the adherend. A light irradiation apparatus for irradiating the adhesive layer with light and causing a photoreaction, supporting the integrated object through an adhesive sheet region protruding from an outer edge of the adherend, and A sealed space forming means that can form a sealed space that includes an adhesive sheet and is shielded from outside air, and a light emitting means that irradiates the adhesive layer with the light, and is supplied to the sealed space or discharged from the sealed space. The volume of the sealed space is changed by controlling at least one amount of gas and liquid, and the adhesive layer without the contact between the adherend and the adhesive sheet corresponding to the adherend is in contact with another object. In place Having fit possible positioning means, that adopts the configuration that.
In addition, another light irradiation apparatus of the present invention is an irradiation object having a photoreactive adhesive layer and a single body in which the adherend is attached to an adhesive sheet having a size protruding from the outer edge of the adherend, A light irradiation device for irradiating the adhesive layer with light to cause a photoreaction, supporting the integrated object via an adhesive sheet region protruding from an outer edge of the adherend, and including the adhesive sheet And a light emitting means for irradiating the adhesive layer with the light, and controlling the temperature of the sealed space to change the pressure of the sealed space. Further, a configuration is adopted in which the adherend and the adhesive sheet portion corresponding to the adherend have positioning means that can position the adhesive layer at a predetermined position without coming into contact with other objects.

一方、本発明の光照射方法は、光反応型の接着剤層を有し被着体の外縁からはみ出す大きさの接着シートに当該被着体が貼付された一体物を照射対象とし、前記接着剤層に光を照射して光反応を起こさせる光照射方法であって、前記被着体の外縁からはみ出た接着シート領域を介して前記一体物を支持するとともに、当該接着シートを含んで外気から遮断された密閉空間を形成する工程と、前記密閉空間に供給するまたは前記密閉空間から排出する気体および液体のうち少なくとも１つの量を制御して前記密閉空間の体積を変化させ、前記被着体および当該被着体に対応する接着シート部分が他の物体と接触することなく前記接着剤層を所定の位置に位置決めする工程と、前記位置決めされた接着剤層に前記光を照射する工程とを備える、という構成を採用している。
また、本発明の他の光照射方法は、光反応型の接着剤層を有し被着体の外縁からはみ出す大きさの接着シートに当該被着体が貼付された一体物を照射対象とし、前記接着剤層に光を照射して光反応を起こさせる光照射方法であって、前記被着体の外縁からはみ出た接着シート領域を介して前記一体物を支持するとともに、当該接着シートを含んで外気から遮断された密閉空間を形成する工程と、前記密閉空間の温度を制御して前記密閉空間の圧力を変化させ、前記被着体および当該被着体に対応する接着シート部分が他の物体と接触することなく前記接着剤層を所定の位置に位置決めする工程と、前記位置決めされた接着剤層に前記光を照射する工程とを備える、という構成を採用している。 On the other hand, in the light irradiation method of the present invention, the object to be irradiated is an integrated object in which the adherend is attached to an adhesive sheet having a photoreactive adhesive layer and protruding from the outer edge of the adherend. A light irradiation method for irradiating the agent layer with light to cause a photoreaction, wherein the one-piece object is supported via an adhesive sheet region protruding from an outer edge of the adherend, and includes the adhesive sheet. A step of forming a sealed space that is cut off from the substrate , and controlling the amount of at least one of a gas and a liquid supplied to or discharged from the sealed space to change the volume of the sealed space, A step of positioning the adhesive layer in a predetermined position without the body and an adhesive sheet portion corresponding to the adherend coming into contact with another object, and a step of irradiating the positioned adhesive layer with the light. With That it has adopted the cormorant configuration.
In addition, the other light irradiation method of the present invention is an irradiation object having a photoreactive adhesive layer and a single body in which the adherend is attached to an adhesive sheet having a size protruding from the outer edge of the adherend, A light irradiation method for irradiating the adhesive layer with light to cause a photoreaction, supporting the integrated object through an adhesive sheet region protruding from an outer edge of the adherend, and including the adhesive sheet And forming a sealed space that is shielded from outside air by changing the pressure of the sealed space by controlling the temperature of the sealed space, and the adherend and the adhesive sheet portion corresponding to the adherend are different from each other. A configuration is adopted in which the method includes a step of positioning the adhesive layer at a predetermined position without coming into contact with an object, and a step of irradiating the positioned adhesive layer with the light.

以上のような本発明によれば、密閉空間の圧力および温度の少なくとも一方を制御して、被着体および当該被着体に対応する接着シート部分が他の物体に接触することなく接着剤層を所定の位置に位置決めするため、被着体に衝撃を与えることなく接着剤層に光を適切に照射することができる。   According to the present invention as described above, at least one of the pressure and temperature of the sealed space is controlled so that the adherend and the adhesive sheet portion corresponding to the adherend do not contact other objects. Therefore, the adhesive layer can be appropriately irradiated with light without giving an impact to the adherend.

この際、発光手段が形成したライン光の焦点位置に位置決め手段が接着剤層を位置決めするようにすれば、被照射体全体に一括で光を照射するものと比べて、発光源を少なくすることができる。   At this time, if the positioning means positions the adhesive layer at the focal position of the line light formed by the light emitting means, the number of light emitting sources can be reduced as compared with the case where the entire irradiated body is irradiated with light collectively. Can do.

本発明の一実施形態に係る光照射装置の側面図。The side view of the light irradiation apparatus which concerns on one Embodiment of this invention.

以下、本発明の一実施形態を図面に基づいて説明する。
なお、本実施形態において、基準となる図を挙げることなく、例えば、上、下、左、右、または、手前、奥といった方向を示した場合は、全て図１を正規の方向（付した番号が適切な向きとなる方向）から観た場合を基準とし、上、下、左、右方向が紙面に平行な方向であり、手前、奥方向が紙面に直交する方向とする。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, for example, when a direction such as up, down, left, right, front, or back is shown without giving a reference figure, all of FIG. Is the direction parallel to the paper surface, and the front and back directions are orthogonal to the paper surface.

図１において、光照射装置１は、基材シートＢＳの一方の面に光反応型の接着剤層ＡＤを有し、被着体としてのウェハＷＦの外縁からはみ出す大きさの接着シートＡＳに当該ウェハＷＦが貼付された一体物ＷＫを照射対象とし、接着剤層ＡＤに光を照射して光反応（本実施形態の場合、光によって硬化する反応）を起こさせる装置であって、一体物ＷＫの外縁からはみ出た接着シート領域を介して一体物ＷＫを支持するとともに、当該接着シートＡＳを含んで第１密閉空間ＳＰ１を形成可能な密閉空間形成手段２と、接着剤層ＡＤに光を発光する発光手段３と、密閉空間形成手段２で支持された一体物ＷＫの接着剤層ＡＤの位置を検出可能な検出手段４と、第１密閉空間ＳＰ１の圧力を制御して、ウェハＷＦおよび当該ウェハＷＦに対応する接着シートＡＳ部分が他の物体と接触することなく接着剤層ＡＤを所定の位置に位置決め可能な位置決め手段５とを備えている。
接着剤層ＡＤは、光硬化型（紫外線硬化型）の接着剤で構成され、所定波長（例えば、λ＝３６５ｎｍ）の光が照射されることによって硬化するように設計され、接着剤層ＡＤが硬化することでその接着力が低下してウェハＷＦから剥離しやすくなっている。また、一体物ＷＫは、接着シートＡＳを介してリングフレームＲＦと一体化されている。 In FIG. 1, a light irradiation apparatus 1 has a photoreactive adhesive layer AD on one surface of a base sheet BS, and is applied to an adhesive sheet AS having a size protruding from the outer edge of a wafer WF as an adherend. An apparatus that irradiates light on the adhesive layer AD and causes a photoreaction (a reaction that cures by light in the case of the present embodiment), which is an integrated object WK to which the wafer WF is attached. The integrated member WK is supported through the adhesive sheet region protruding from the outer edge, and light is emitted to the sealed space forming means 2 including the adhesive sheet AS and the first sealed space SP1 and the adhesive layer AD. The light emitting means 3, the detecting means 4 capable of detecting the position of the adhesive layer AD of the integrated object WK supported by the sealed space forming means 2, and the pressure of the first sealed space SP1 to control the wafer WF and the Corresponding to wafer WF Landing sheet AS portion and a positioning means 5 positionable adhesive layer AD in position without contact with other objects.
The adhesive layer AD is composed of a photo-curing type (ultraviolet curing type) adhesive, and is designed to be cured by being irradiated with light having a predetermined wavelength (for example, λ = 365 nm). By curing, the adhesive strength is reduced and the wafer WF is easily peeled off. The integrated object WK is integrated with the ring frame RF via the adhesive sheet AS.

密閉空間形成手段２は、駆動機器としての直動モータ２１の出力軸２２に支持された下部開口型の上ケース２３と、一体物ＷＫを下方から支持する円環状のリブ２４を備えた上部開口型の下ケース２５と、上ケース２３の内側上面端部に支持された付勢手段としての複数のコイルばね２６と、コイルばね２６の下端に支持され、リングフレームＲＦを上方から押さえ付ける円環状の上押さえ部材２７とを備え、下ケース２５と接着シートＡＳを含む一体物ＷＫとにより外気から遮断された第１密閉空間ＳＰ１が形成される。   The sealed space forming means 2 includes a lower opening type upper case 23 supported by an output shaft 22 of a linear motion motor 21 as a driving device, and an upper opening provided with an annular rib 24 that supports the integrated object WK from below. A lower case 25 of the mold, a plurality of coil springs 26 as urging means supported on the inner upper surface end of the upper case 23, and an annular shape supported by the lower end of the coil spring 26 and pressing the ring frame RF from above. A first sealed space SP1 is formed which is provided with the upper pressing member 27 and is shielded from the outside air by the lower case 25 and the integrated member WK including the adhesive sheet AS.

発光手段３は、上部開口型のケース３１の内部に配置された複数の光源３２と、複数の光源３２から発光された光を集光させて当該光源３２から所定距離離れた位置に紙面手前奥方向に線状のライン光ＬＬを形成する集光手段としてのレンズ３３と、ケース３１をそのスライダ３４で支持し、接着シートＡＳと光源３２とを相対移動させる移動手段であって駆動機器としてのリニアモータ３５とを備えている。なお、光源３２は、接着剤層ＡＤが硬化するように、所定波長（例えば、λ＝３６５ｎｍ）の光が照射可能に設けられている。   The light emitting means 3 includes a plurality of light sources 32 disposed inside the upper opening type case 31, and collects light emitted from the plurality of light sources 32 to a position away from the light source 32 by a predetermined distance. A lens 33 as a condensing unit that forms a linear line light LL in the direction, and a moving unit that supports the case 31 with its slider 34 and moves the adhesive sheet AS and the light source 32 relative to each other as a driving device. And a linear motor 35. In addition, the light source 32 is provided so that light of a predetermined wavelength (for example, λ = 365 nm) can be irradiated so that the adhesive layer AD is cured.

検出手段４は、複数の光学センサや撮像手段等で構成され、上ケース２３の内側上面に左右方向ならびに手前奥方向に整列配置されている。   The detection means 4 is composed of a plurality of optical sensors, imaging means, and the like, and is arranged on the inner upper surface of the upper case 23 in the left-right direction and the front-rear direction.

位置決め手段５は、図１中符号ＡＡに示すように、発光手段３で形成されたライン光ＬＬの焦点位置に接着剤層ＡＤを位置決めするものであり、下ケース２５の側壁２５Ａを貫通して第１密閉空間ＳＰ１に連通する配管５３を介して接続された加圧調整手段５１を備え、配管５３の途中に圧力検知手段５２が配置されて第１密閉空間ＳＰ１の圧力を検出できるようになっている。加圧調整手段５１は、加圧ポンプやタービン等の加圧手段と減圧ポンプや真空エジェクタ等の減圧手段とを備えている。   The positioning means 5 is for positioning the adhesive layer AD at the focal position of the line light LL formed by the light emitting means 3 as indicated by reference numeral AA in FIG. 1, and penetrates the side wall 25A of the lower case 25. A pressure adjusting means 51 connected via a pipe 53 communicating with the first sealed space SP1 is provided, and a pressure detection means 52 is arranged in the middle of the pipe 53 so that the pressure in the first sealed space SP1 can be detected. ing. The pressurizing adjustment unit 51 includes a pressurizing unit such as a pressurizing pump and a turbine, and a depressurizing unit such as a depressurizing pump and a vacuum ejector.

以上のような光照射装置１の動作としては、図１中二点鎖線で示すように、上ケース２３が上方に位置している状態で、人手または図示しない搬送手段等によって、一体物ＷＫのリングフレームＲＦ部分がリブ２４上に位置するように載置されると、密閉空間形成手段２が直動モータ２１を駆動し、上ケース２３の下面が下ケース２５の上面に密着するように当該上ケース２３を下降させる。この下降により、リングフレームＲＦが上押さえ部材２７に押圧され、一体物ＷＫの上下方向への移動が規制されるとともに、第１密閉空間ＳＰ１が形成される。このとき、接着シートＡＳおよびウェハＷＦは、図１中二点鎖線で示すように、それらの自重で下方に撓んだ状態となっている。   As the operation of the light irradiation apparatus 1 as described above, as indicated by a two-dot chain line in FIG. 1, the upper case 23 is positioned upward, and the integrated object WK is moved manually or by a conveying means (not shown). When the ring frame RF portion is placed so as to be positioned on the rib 24, the sealed space forming means 2 drives the linear motion motor 21, and the lower surface of the upper case 23 is in close contact with the upper surface of the lower case 25. The upper case 23 is lowered. By this lowering, the ring frame RF is pressed by the upper pressing member 27, the movement of the integrated object WK in the vertical direction is restricted, and the first sealed space SP1 is formed. At this time, the adhesive sheet AS and the wafer WF are bent downward due to their own weights, as indicated by a two-dot chain line in FIG.

次に、位置決め手段５が加圧調整手段５１を駆動し、第１密閉空間ＳＰ１に気体ＧＮを供給して第１密閉空間ＳＰ１の圧力を上昇させ、図１中実線で示すように、一体物ＷＫの接着シートＡＳおよびウェハＷＦを持ち上げる。このとき、検出手段４がウェハＷＦの位置を検出することで接着剤層ＡＤの位置を検出し、この検出データを基に位置決め手段５が加圧調整手段５１（加圧手段および減圧手段）を駆動し、第１密閉空間ＳＰ１の圧力を上昇または下降させて接着剤層ＡＤの位置がライン光ＬＬの焦点位置と一致するように制御する。これにより、接着剤層ＡＤをライン光ＬＬの焦点位置に確実に位置決めできる。
なお、圧力検知手段５２が検知する第１密閉空間ＳＰ１の圧力が設定値となったときに、接着剤層ＡＤの位置がライン光ＬＬの焦点位置と一致したと見なすように、構成してもよい。 Next, the positioning means 5 drives the pressure adjusting means 51 to supply the gas GN to the first sealed space SP1 to increase the pressure in the first sealed space SP1, and as shown by a solid line in FIG. The adhesive sheet AS of the WK and the wafer WF are lifted. At this time, the detecting means 4 detects the position of the wafer WF to detect the position of the adhesive layer AD, and the positioning means 5 detects the pressure adjusting means 51 (pressurizing means and depressurizing means) based on the detected data. It drives and raises or drops the pressure of 1st sealed space SP1, and it controls so that the position of adhesive bond layer AD corresponds with the focus position of line light LL. Thereby, the adhesive layer AD can be reliably positioned at the focal position of the line light LL.
In addition, when the pressure of 1st sealed space SP1 which the pressure detection means 52 detects becomes a set value, it may comprise so that it may consider that the position of adhesive bond layer AD corresponded with the focus position of line light LL. Good.

次いで、発光手段３が光源３２を発光し、ライン光ＬＬを形成するとともに、リニアモータ３５を駆動し、スライダ３４を図１中実線で示す位置から同図二点鎖線で示す位置に移動させてウェハＷＦに接着している接着剤層ＡＤを硬化させる。接着剤層ＡＤへのライン光ＬＬの照射が終了すると、発光手段３が光源３２を消灯し、リニアモータ３５を駆動し、スライダ３４を図１中実線で示す位置に復帰させる。その後、位置決め手段５が加圧調整手段５１を駆動し、第１密閉空間ＳＰ１の気体ＧＮを排出して第１密閉空間ＳＰ１の圧力を大気圧に戻した後、密閉空間形成手段２が直動モータ２１を駆動し、上ケース２３を図１中二点鎖線で示す上方に移動させる。そして、接着剤層ＡＤが硬化され当該接着剤層ＡＤの接着力が低下された一体物ＷＫは、図示しない搬送手段等によって次工程へ搬送され、以降上述と同様の動作が繰り返される。   Next, the light emitting means 3 emits the light source 32 to form the line light LL and drives the linear motor 35 to move the slider 34 from the position indicated by the solid line in FIG. 1 to the position indicated by the two-dot chain line in FIG. The adhesive layer AD bonded to the wafer WF is cured. When the irradiation of the line light LL to the adhesive layer AD is completed, the light emitting means 3 turns off the light source 32, drives the linear motor 35, and returns the slider 34 to the position indicated by the solid line in FIG. Thereafter, the positioning means 5 drives the pressurizing adjustment means 51 to discharge the gas GN in the first sealed space SP1 and return the pressure in the first sealed space SP1 to atmospheric pressure, and then the sealed space forming means 2 moves directly. The motor 21 is driven, and the upper case 23 is moved upward as indicated by a two-dot chain line in FIG. Then, the integrated object WK in which the adhesive layer AD is cured and the adhesive force of the adhesive layer AD is lowered is transported to the next process by a transporting unit or the like (not shown), and thereafter the same operation as described above is repeated.

以上のような実施形態によれば、第１密閉空間ＳＰ１の圧力を制御して、ウェハＷＦおよび当該ウェハＷＦに対応する接着シートＡＳ部分が他の物体に接触することなく接着剤層ＡＤを所定の位置に位置決めするため、被着体に衝撃を与えることなく接着剤層ＡＤに光を適切に照射することができる。   According to the embodiment as described above, the pressure in the first sealed space SP1 is controlled so that the adhesive layer AD is predetermined without contacting the wafer WF and the portion of the adhesive sheet AS corresponding to the wafer WF with other objects. Therefore, the adhesive layer AD can be appropriately irradiated with light without giving an impact to the adherend.

以上のように、本発明を実施するための最良の構成、方法等は、前記記載で開示されているが、本発明は、これに限定されるものではない。すなわち、本発明は、主に特定の実施形態に関して特に図示され、かつ説明されているが、本発明の技術的思想および目的の範囲から逸脱することなく、以上述べた実施形態に対し、形状、材質、数量、その他の詳細な構成において、当業者が様々な変形を加えることができるものである。また、上記に開示した形状、材質などを限定した記載は、本発明の理解を容易にするために例示的に記載したものであり、本発明を限定するものではないから、それらの形状、材質などの限定の一部もしくは全部の限定を外した部材の名称での記載は、本発明に含まれるものである。   As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

例えば、上ケース２３と接着シートＡＳを含む一体物ＷＫとにより外気から遮断された第２密閉空間ＳＰ２が形成される構成とし、位置決め手段５が図１中二点鎖線で示すように、上ケース２３の上壁２３Ａを貫通し、当該第２密閉空間ＳＰ２に連通する配管５６Ａを介して接続された減圧調整手段５４Ａと、配管５６Ａの途中に配置された圧力検知手段５５Ａとを有していてもよい。なお、減圧調整手段５４Ａは、加圧ポンプやタービン等の加圧手段と減圧ポンプや真空エジェクタ等の減圧手段を備えている。このような構成の場合、前記実施形態と同様に、接着シートＡＳおよびウェハＷＦがそれらの自重で下方に撓んだ状態において、位置決め手段５が減圧調整手段５４Ａを駆動し、第２密閉空間ＳＰ２の気体を排出して第２密閉空間ＳＰ２の圧力を低下させ、図１中実線で示すように、一体物ＷＫの接着シートＡＳおよびウェハＷＦを持ち上げることができる。このとき、検出手段４の検出データを基に、前記実施形態と同様にして位置決め手段５が減圧調整手段５４Ａを駆動し、接着剤層ＡＤの位置がライン光ＬＬの焦点位置と一致するように制御が行われる。なお、この場合も、圧力検知手段５５Ａが検知する第２密閉空間ＳＰ２の圧力が設定値となったときに、接着剤層ＡＤの位置がライン光ＬＬの焦点位置と一致したと見なすように、構成してもよい。
このような構成にすれば、加圧調整手段５１または減圧調整手段５４Ａのみで接着シートＡＳおよびウェハＷＦを持ち上げる構成と比べて、加圧調整手段５１または減圧調整手段５４Ａの負荷を低減できる。その上、光照射装置１を図１の状態から９０度回転させた状態（ウェハＷＦの面が上下方向となる状態）や１８０度回転させた状態（前記実施形態のウェハＷＦが上下反転した状態）ででも前記実施形態と同様の効果を得ることができる。 For example, the upper case 23 and the integrated member WK including the adhesive sheet AS form a second sealed space SP2 that is shielded from the outside air, and the positioning means 5 is indicated by a two-dot chain line in FIG. 23, a pressure reducing means 54A that passes through the upper wall 23A and is connected via a pipe 56A that communicates with the second sealed space SP2, and a pressure detection means 55A that is disposed in the middle of the pipe 56A. Also good. The decompression adjusting unit 54A includes a pressurizing unit such as a pressurizing pump and a turbine, and a decompressing unit such as a decompressing pump and a vacuum ejector. In the case of such a configuration, the positioning means 5 drives the decompression adjusting means 54A and the second sealed space SP2 in a state where the adhesive sheet AS and the wafer WF are bent downward due to their own weight, as in the above embodiment. Thus, the pressure in the second sealed space SP2 is reduced, and the adhesive sheet AS and the wafer WF of the integrated object WK can be lifted as shown by the solid line in FIG. At this time, based on the detection data of the detecting means 4, the positioning means 5 drives the decompression adjusting means 54A in the same manner as in the previous embodiment so that the position of the adhesive layer AD coincides with the focal position of the line light LL. Control is performed. In this case as well, when the pressure in the second sealed space SP2 detected by the pressure detection means 55A reaches the set value, the position of the adhesive layer AD is considered to coincide with the focal position of the line light LL. It may be configured.
With such a configuration, it is possible to reduce the load on the pressure adjustment unit 51 or the pressure reduction adjustment unit 54A compared to a configuration in which the adhesive sheet AS and the wafer WF are lifted only by the pressure adjustment unit 51 or the pressure reduction adjustment unit 54A. In addition, the light irradiation apparatus 1 is rotated 90 degrees from the state shown in FIG. 1 (the surface of the wafer WF is in the vertical direction) or 180 degrees (the wafer WF in the above embodiment is turned upside down). However, the same effect as in the above embodiment can be obtained.

また、第１密閉空間ＳＰ１および第２密閉空間ＳＰ２の少なくとも一方を加熱または冷却させることで、第１、第２密閉空間ＳＰ１、ＳＰ２の温度を制御して、ウェハＷＦおよび当該ウェハＷＦに対応する接着シートＡＳ部分が他の物体と接触することなく接着剤層ＡＤを所定の位置に位置決め可能な温度調整型の位置決め手段を設けてもよい。温度調整型の位置決め手段は、コイルヒータやヒートポンプ等の加熱手段、ペルチェ素子やヒートポンプ等の冷却手段を備え、第１、第２密閉空間ＳＰ１、ＳＰ２内を加熱することでそれらの体積を増大させることができ、冷却することでそれらの体積を減少させることができる。このような温度調整型の位置決め手段は、前記実施形態で示した圧力を制御する位置決め手段５に代えて採用してもよいし、位置決め手段５と併用して採用してもよい。
さらに、図１中二点鎖線で示すように、上ケース２３の内側上面にウェハＷＦに対応していない接着シート部分に当接可能に設けられ、接着剤層ＡＤを所定の位置に位置決めするときの位置決め補助部材としての複数のピン６１を設けてもよい。このような位置決め補助部材は、複数でも単数でもよく、１８０度間隔で２ヶ所に設けたり、４５度間隔で８ヶ所に設けたり、ピン６１以外に、円環状の丸棒や板１枚で構成したり、複数の部材で円環状となる円弧形状物等で構成してもよい。なお、位置決め補助部材は、ライン光ＬＬの焦点の位置や、接着シートＡＳの厚みの変化による接着剤層の位置の変化に対応できるように、例えば駆動機器からなる位置調整手段を備えることができる。
また、減圧調整手段５４Ａを設ける場合には、加圧調整手段５１を設けなくてもよく、この場合、第１密閉空間ＳＰ１は外気から遮断されない空間であってもよい。
さらに、加圧調整手段５１や減圧調整手段５４Ａが第１、第２密閉空間ＳＰ１、ＳＰ２に供給したり排出したりするものは、大気、混合ガス、単体ガス等の気体や、液体、ジェル状のものでもよい。
さらに、リングフレームＲＦと一体化されていない一体物ＷＫの接着シート領域を密閉空間形成手段２が支持するようにしてもよい。
また、付勢手段は、ゴムや樹脂等の弾性部材や駆動機器で構成してもよい。 In addition, by heating or cooling at least one of the first sealed space SP1 and the second sealed space SP2, the temperature of the first and second sealed spaces SP1 and SP2 is controlled to correspond to the wafer WF and the wafer WF. There may be provided a temperature adjusting type positioning means capable of positioning the adhesive layer AD at a predetermined position without the adhesive sheet AS portion coming into contact with another object. The temperature adjusting type positioning means includes heating means such as a coil heater and a heat pump, and cooling means such as a Peltier element and a heat pump, and increases the volume of the first and second sealed spaces SP1 and SP2 by heating them. And cooling can reduce their volume. Such temperature adjustment type positioning means may be employed instead of the positioning means 5 for controlling the pressure shown in the above embodiment, or may be employed in combination with the positioning means 5.
Further, as shown by a two-dot chain line in FIG. 1, when the adhesive layer AD is positioned at a predetermined position provided on the inner upper surface of the upper case 23 so as to be able to contact an adhesive sheet portion not corresponding to the wafer WF. A plurality of pins 61 as positioning assisting members may be provided. Such positioning assisting members may be plural or singular, and are provided at two locations at intervals of 180 degrees, at eight locations at intervals of 45 degrees, or constituted by an annular round bar or one plate other than the pins 61. Alternatively, it may be configured by an arcuate shape or the like that is circular with a plurality of members. In addition, the positioning auxiliary member can be provided with a position adjusting means including, for example, a driving device so as to cope with a change in the position of the adhesive layer due to a change in the position of the line light LL and the thickness of the adhesive sheet AS. .
Further, when the pressure reducing adjustment means 54A is provided, the pressure adjusting means 51 may not be provided. In this case, the first sealed space SP1 may be a space that is not blocked from the outside air.
Further, what the pressure adjusting means 51 and the pressure reducing means 54A supply to and discharge from the first and second sealed spaces SP1 and SP2 are gases such as air, mixed gas, single gas, liquid, gel It may be.
Further, the sealed space forming means 2 may support the adhesive sheet region of the integrated object WK that is not integrated with the ring frame RF.
Further, the urging means may be constituted by an elastic member such as rubber or resin, or a driving device.

さらに、発光手段３は、照射対象の形状に応じた広さを有する発光源を採用し、当該発光源を移動させることなく接着剤層ＡＤに一括で光を照射可能なものでもよい。
また、光源３２は、接着剤層ＡＤが硬化する波長に合わせて光源３２が発光する光の波長を適宜変更でき、例えば、４００ｎｍの光で光硬化する接着剤層ＡＤが採用された場合、光源３２は、４００ｎｍの光を発光できればよい。
さらに、光源３２は、接着剤層ＡＤが硬化する波長の光だけを照射できるものであってもよいし、接着剤層ＡＤが硬化する波長を含む光を照射できるものであってもよい。
また、光源３２は、ＬＥＤ（発光ダイオード、Light Emitting Diode）、高圧水銀ランプ、低圧水銀ランプ、蛍光灯、メタルハライドランプ、キセノンランプ、ハロゲンランプなどが例示でき、接着剤層に光反応を起こさせることができるもので構成されていれば、紫外線に限らず赤外線、自然光、マイクロ波等、他の光を照射可能なものであってよい。
さらに、光反応としては、光によって軟化する反応、光によって昇温、降温する反応、光によって接着力が増す反応等の他の反応であってもよい。
また、レンズ３３を設けずに、光源３２から発光された拡散光をそのまま接着剤層ＡＤに照射してもよい。
さらに、検出手段４を設けなくてもよいし、検出手段４を１個だけ設け、当該１個の検出手段４で検出した接着剤層ＡＤの位置がライン光ＬＬの焦点位置と一致したときに、接着剤層ＡＤ全域の位置がライン光ＬＬの焦点位置と一致したと見なしてもよい。
また、集光手段は、光源３２の下方に配置した凹面鏡や反射板等であってよい。 Further, the light emitting means 3 may employ a light emitting source having a width corresponding to the shape of the irradiation target, and can irradiate the adhesive layer AD collectively with light without moving the light emitting source.
The light source 32 can appropriately change the wavelength of light emitted from the light source 32 in accordance with the wavelength at which the adhesive layer AD is cured. For example, when the adhesive layer AD that is photocured with 400 nm light is employed, the light source 32 32 only needs to emit light of 400 nm.
Furthermore, the light source 32 may be capable of emitting only light having a wavelength at which the adhesive layer AD is cured, or may be capable of emitting light including a wavelength at which the adhesive layer AD is cured.
Examples of the light source 32 include an LED (Light Emitting Diode), a high pressure mercury lamp, a low pressure mercury lamp, a fluorescent lamp, a metal halide lamp, a xenon lamp, a halogen lamp, and the like. As long as it can be irradiated, other light such as infrared rays, natural light, and microwaves may be irradiated.
Furthermore, the photoreaction may be another reaction such as a reaction that softens by light, a reaction that raises or lowers temperature by light, or a reaction that increases adhesive strength by light.
Further, the diffused light emitted from the light source 32 may be directly applied to the adhesive layer AD without providing the lens 33.
Furthermore, the detection unit 4 may not be provided, or when only one detection unit 4 is provided and the position of the adhesive layer AD detected by the one detection unit 4 coincides with the focal position of the line light LL. The position of the entire adhesive layer AD may be considered to coincide with the focal position of the line light LL.
Further, the light condensing means may be a concave mirror, a reflecting plate or the like disposed below the light source 32.

さらに、本発明における接着シートＡＳおよび被着体の材質、種別、形状等は、特に限定されることはない。例えば、接着シートＡＳは、感圧接着性、感熱接着性等の接着形態に限定されることはなく、感熱接着性のものが採用された場合は、当該接着シートＡＳを加熱する適宜な加熱手段を設ければよい。また、このような接着シートＡＳは、例えば、接着剤層だけの単層のもの、基材シートと接着剤層との間に中間層を有するもの、基材シートの上面にカバー層を有する等３層以上のもの、更には、基材シートを接着剤層から剥離することのできる所謂両面接着シートのようなものであってもよく、両面接着シートは、単層又は複層の中間層を有するものや、中間層のない単層又は複層のものであってよい。また、被着体としては、例えば、食品、樹脂容器、シリコン半導体ウェハや化合物半導体ウェハ等の半導体ウェハ、回路基板、光ディスク等の情報記録基板、ガラス板、鋼板、陶器、木板または樹脂板等、任意の形態の部材や物品なども対象とすることができる。なお、接着シートＡＳを機能的、用途的な読み方に換え、例えば、情報記載用ラベル、装飾用ラベル、保護シート、ダイシングテープ、ダイアタッチフィルム、ダイボンディングテープ、記録層形成樹脂シート等の任意の形状の任意のシート、フィルム、テープ等を前述のような任意の被着体に貼付することができる。   Furthermore, the material, type, shape and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS is not limited to adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. When a heat-sensitive adhesive is used, an appropriate heating means for heating the adhesive sheet AS. May be provided. Such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, a cover layer on the upper surface of the base sheet, etc. Three or more layers, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer may be used. The double-sided adhesive sheet comprises a single-layer or multi-layer intermediate layer. It may be a single layer or a multilayer having no intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, earthenware, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

本発明における手段および工程は、それら手段および工程について説明した動作、機能または工程を果たすことができる限りなんら限定されることはなく、まして、前記実施形態で示した単なる一実施形態の構成物や工程に全く限定されることはない。例えば、密閉空間形成手段は、被着体の外縁からはみ出た接着シート領域を介して一体物を支持するとともに、当該接着シートを含んで外気から遮断された密閉空間を形成可能なものであれば、出願当初の技術常識に照らし合わせ、その技術範囲内のものであればなんら限定されることはない（他の手段および工程についての説明は省略する）。
また、前記実施形態における駆動機器は、回動モータ、直動モータ、リニアモータ、単軸ロボット、多関節ロボット等の電動機器、エアシリンダ、油圧シリンダ、ロッドレスシリンダおよびロータリシリンダ等のアクチュエータ等を採用することができる上、それらを直接的又は間接的に組み合せたものを採用することもできる（実施形態で例示したものと重複するものもある）。 The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, as long as the sealed space forming means can support an integrated object via an adhesive sheet region that protrudes from the outer edge of the adherend and can form a sealed space that includes the adhesive sheet and is shielded from the outside air. There is no limitation as long as it is within the technical scope in light of the common general technical knowledge at the time of filing (explanation of other means and steps is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

１…光照射装置
２…密閉空間形成手段
３…発光手段
５…位置決め手段
３３…レンズ（集光手段）
ＡＤ…接着剤層
ＡＳ…接着シート
ＬＬ…ライン光
ＳＰ１、ＳＰ２…第１、第２密閉空間
ＷＦ…ウェハ（被着体）
ＷＫ…一体物 DESCRIPTION OF SYMBOLS 1 ... Light irradiation apparatus 2 ... Sealed space formation means 3 ... Light emission means 5 ... Positioning means 33 ... Lens (Condensing means)
AD ... Adhesive layer AS ... Adhesive sheet LL ... Line light SP1, SP2 ... First and second sealed spaces WF ... Wafer (adhered body)
WK ... one thing

Claims (4)

光反応型の接着剤層を有し被着体の外縁からはみ出す大きさの接着シートに当該被着体が貼付された一体物を照射対象とし、前記接着剤層に光を照射して光反応を起こさせる光照射装置であって、
前記被着体の外縁からはみ出た接着シート領域を介して前記一体物を支持するとともに、当該接着シートを含んで外気から遮断された密閉空間を形成可能な密閉空間形成手段と、
接着剤層に前記光を照射する発光手段とを備え、
前記密閉空間に供給するまたは前記密閉空間から排出する気体および液体のうち少なくとも１つの量を制御して前記密閉空間の体積を変化させ、前記被着体および当該被着体に対応する接着シート部分が他の物体と接触することなく前記接着剤層を所定の位置に位置決め可能な位置決め手段を有することを特徴とする光照射装置。 An integrated object in which the adherend is pasted on an adhesive sheet that has a photoreactive adhesive layer and protrudes from the outer edge of the adherend is intended for irradiation, and the adhesive layer is irradiated with light for photoreaction. A light irradiation device for causing
A sealed space forming means capable of supporting the one-piece through an adhesive sheet region protruding from an outer edge of the adherend, and forming a sealed space that includes the adhesive sheet and is blocked from outside air;
A light emitting means for irradiating the adhesive layer with the light,
An adhesive sheet portion corresponding to the adherend and the adherend by changing the volume of the sealed space by controlling at least one amount of gas and liquid supplied to or discharged from the sealed space Has a positioning means capable of positioning the adhesive layer at a predetermined position without coming into contact with other objects. 光反応型の接着剤層を有し被着体の外縁からはみ出す大きさの接着シートに当該被着体が貼付された一体物を照射対象とし、前記接着剤層に光を照射して光反応を起こさせる光照射装置であって、
前記被着体の外縁からはみ出た接着シート領域を介して前記一体物を支持するとともに、当該接着シートを含んで外気から遮断された密閉空間を形成可能な密閉空間形成手段と、
接着剤層に前記光を照射する発光手段とを備え、
前記密閉空間の温度を制御して前記密閉空間の圧力を変化させ、前記被着体および当該被着体に対応する接着シート部分が他の物体と接触することなく前記接着剤層を所定の位置に位置決め可能な位置決め手段を有することを特徴とする光照射装置。 An integrated object in which the adherend is pasted on an adhesive sheet that has a photoreactive adhesive layer and protrudes from the outer edge of the adherend is intended for irradiation, and the adhesive layer is irradiated with light for photoreaction. A light irradiation device for causing
A sealed space forming means capable of supporting the one-piece through an adhesive sheet region protruding from an outer edge of the adherend, and forming a sealed space that includes the adhesive sheet and is blocked from outside air;
A light emitting means for irradiating the adhesive layer with the light,
The pressure of the sealed space is changed by controlling the temperature of the sealed space, and the adhesive layer is placed in a predetermined position without the adherend and the adhesive sheet portion corresponding to the adherend coming into contact with other objects. light irradiation device you further comprising a positioning means positionable. 光反応型の接着剤層を有し被着体の外縁からはみ出す大きさの接着シートに当該被着体が貼付された一体物を照射対象とし、前記接着剤層に光を照射して光反応を起こさせる光照射方法であって、
前記被着体の外縁からはみ出た接着シート領域を介して前記一体物を支持するとともに、当該接着シートを含んで外気から遮断された密閉空間を形成する工程と、
前記密閉空間に供給するまたは前記密閉空間から排出する気体および液体のうち少なくとも１つの量を制御して前記密閉空間の体積を変化させ、前記被着体および当該被着体に対応する接着シート部分が他の物体と接触することなく前記接着剤層を所定の位置に位置決めする工程と、
前記位置決めされた接着剤層に前記光を照射する工程とを備えることを特徴とする光照射方法。 An integrated object in which the adherend is pasted on an adhesive sheet that has a photoreactive adhesive layer and protrudes from the outer edge of the adherend is intended for irradiation, and the adhesive layer is irradiated with light for photoreaction. A light irradiation method for causing
Supporting the integrated object through an adhesive sheet region protruding from the outer edge of the adherend, and forming a sealed space that includes the adhesive sheet and is blocked from outside air;
An adhesive sheet portion corresponding to the adherend and the adherend by changing the volume of the sealed space by controlling at least one amount of gas and liquid supplied to or discharged from the sealed space Positioning the adhesive layer in place without contacting other objects;
And a step of irradiating the positioned adhesive layer with the light. 光反応型の接着剤層を有し被着体の外縁からはみ出す大きさの接着シートに当該被着体が貼付された一体物を照射対象とし、前記接着剤層に光を照射して光反応を起こさせる光照射方法であって、An integrated object in which the adherend is pasted on an adhesive sheet that has a photoreactive adhesive layer and protrudes from the outer edge of the adherend is intended for irradiation, and the adhesive layer is irradiated with light for photoreaction. A light irradiation method for causing
前記被着体の外縁からはみ出た接着シート領域を介して前記一体物を支持するとともに、当該接着シートを含んで外気から遮断された密閉空間を形成する工程と、  Supporting the integrated object through an adhesive sheet region protruding from the outer edge of the adherend, and forming a sealed space that includes the adhesive sheet and is blocked from outside air;
前記密閉空間の温度を制御して前記密閉空間の圧力を変化させ、前記被着体および当該被着体に対応する接着シート部分が他の物体と接触することなく前記接着剤層を所定の位置に位置決めする工程と、  The pressure of the sealed space is changed by controlling the temperature of the sealed space, and the adhesive layer is placed in a predetermined position without the adherend and the adhesive sheet portion corresponding to the adherend coming into contact with other objects. Positioning to
前記位置決めされた接着剤層に前記光を照射する工程とを備えることを特徴とする光照射方法。  And a step of irradiating the positioned adhesive layer with the light.
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