JP6050153B2 - Surface mount type low profile crystal oscillator - Google Patents

Surface mount type low profile crystal oscillator Download PDF

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JP6050153B2
JP6050153B2 JP2013046688A JP2013046688A JP6050153B2 JP 6050153 B2 JP6050153 B2 JP 6050153B2 JP 2013046688 A JP2013046688 A JP 2013046688A JP 2013046688 A JP2013046688 A JP 2013046688A JP 6050153 B2 JP6050153 B2 JP 6050153B2
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crystal
recess
crystal resonator
mounting
bottom wall
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JP2014175848A (en
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播磨　秀典
秀典 播磨
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Nihon Dempa Kogyo Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)

Description

本発明は、表面実装型の水晶発振器に係り、特に水晶振動子と、この水晶振動子と共に発振回路等を構成するＩＣチップを容器本体の凹部に並列に収容した表面実装型の低背水晶発振器に関する。   The present invention relates to a surface-mount type crystal oscillator, and more particularly to a surface-mount type low-profile crystal oscillator in which a crystal resonator and an IC chip that constitutes an oscillation circuit together with the crystal resonator are accommodated in a recess of a container body. About.

表面実装型の水晶発振器（以下、表面実装発振器とも称する）は小型・軽量であることから、例えば携帯電話で代表される携帯型の電子機器における周波数や時間の基準源として内蔵される。このようなものの一つに、容器本体の凹部に水晶振動子とＩＣチップを並列に収容してより低背化を図った表面実装発振器がある。ＩＣチップには、水晶振動子と共に発振器を構成する発振回路や出力回路、発振器の形式によっては温度補償回路や温度制御回路などが集積される。   A surface-mounted crystal oscillator (hereinafter also referred to as a surface-mounted oscillator) is small and light, and is built in as a frequency and time reference source in portable electronic devices represented by, for example, mobile phones. As one of such devices, there is a surface mount oscillator in which a quartz crystal resonator and an IC chip are accommodated in parallel in a concave portion of a container body to further reduce the height. An IC chip integrates an oscillation circuit and an output circuit that constitute an oscillator together with a crystal resonator, and a temperature compensation circuit and a temperature control circuit depending on the type of the oscillator.

このような水晶発振器の製造においては、容器本体に設けた凹部に水晶振動子とＩＣチップを搭載した後、容器本体の凹部を金属カバーにて密閉する。金属カバーは、水晶振動子を外部の温度、湿度の周囲条件の変動、塵埃侵入等を防止すると共に、外部の電磁波から遮蔽して発振周波数の変化を回避する。   In manufacturing such a crystal oscillator, a crystal resonator and an IC chip are mounted in a recess provided in the container body, and then the recess of the container body is sealed with a metal cover. The metal cover prevents fluctuations in ambient conditions of external temperature and humidity, dust intrusion, and the like, and shields the quartz vibrator from external electromagnetic waves to avoid a change in oscillation frequency.

水晶発振器の製造では、容器本体に設けた凹部に水晶振動子とＩＣチップを搭載し、凹部を金属カバーにて密閉後、水晶振動子の振動特性を測定する工程がある。この測定工程をパスしたものを製品として出荷する。   In manufacturing a crystal oscillator, there is a process of mounting a crystal resonator and an IC chip in a recess provided in a container body, and measuring the vibration characteristics of the crystal resonator after sealing the recess with a metal cover. Products that pass this measurement process are shipped as products.

図４は、従来の表面実装型の低背水晶発振器の一構造例の説明図である。この低背水晶発振器１００は、平面視が略矩形で平箱形の外形を成す。なお、図４（a）は容器本体の縦断面図、図４（ｂ）は全体形状を説明する斜視図、図４（ｃ）は実装端子側からみた底面図である。この例の容器本体１は、平面視が矩形状をなす二枚の底壁層１a,１ｂと枠壁層１ｄの積層で凹部９を形成している。なお、底壁層と枠壁層の積層数は一例であり、図示したものに限定されるものではない。   FIG. 4 is an explanatory view of a structural example of a conventional surface-mount type low-profile crystal oscillator. This low-profile quartz oscillator 100 has a flat box shape with a substantially rectangular plan view. 4A is a longitudinal sectional view of the container body, FIG. 4B is a perspective view for explaining the overall shape, and FIG. 4C is a bottom view as viewed from the mounting terminal side. The container body 1 in this example has a recess 9 formed by stacking two bottom wall layers 1a and 1b and a frame wall layer 1d that are rectangular in plan view. In addition, the number of lamination | stacking of a bottom wall layer and a frame wall layer is an example, and is not limited to what was illustrated.

凹部９の内底面には、配線パターン（図示せず）に形成された水晶端子１１、電極パッド１０を具備している。水晶端子１１には水晶振動子２が搭載され、電極パッド１０にはＩＣチップ３が搭載されている。水晶振動子２は、水晶片（水晶ブランク）の両面に金属の蒸着等で形成された励振電極を有し、これらの励振電極のそれぞれから水晶片の一端に延長した電極を導電性接着剤５で水晶端子１１に固定して水晶振動子２としている。ＩＣチップ３は、その出力端子である複数のバンプ８を凹部９の底面の対応位置に配置された電極パッド１０に半田を用いた加熱溶着あるいは超音波加圧溶着で搭載されている。   A crystal terminal 11 and an electrode pad 10 formed in a wiring pattern (not shown) are provided on the inner bottom surface of the recess 9. A crystal resonator 2 is mounted on the crystal terminal 11, and an IC chip 3 is mounted on the electrode pad 10. The crystal unit 2 has excitation electrodes formed by vapor deposition of metal or the like on both sides of a crystal piece (crystal blank), and an electrode extending from each of these excitation electrodes to one end of the crystal piece is a conductive adhesive 5. Thus, the crystal unit 11 is fixed to the crystal terminal 11. The IC chip 3 has a plurality of bumps 8 serving as output terminals mounted on electrode pads 10 arranged at corresponding positions on the bottom surface of the recess 9 by heat welding using solder or ultrasonic pressure welding.

容器本体１の凹部９に水晶振動子２とＩＣチップ３を搭載後、当該凹部を金属カバー７で密閉する。金属カバー７の密閉は、凹部９の開口端面すなわち凹部９を形成する枠壁１ｄの端面に有する金属リング６に金属カバー７を圧着溶接して行われる。なお、金属リング６の下層（凹部９の開口端面）には高融点金属（タングステン、モリブデンなど）のメタライズ層を設けておく（図示せず）。   After mounting the crystal resonator 2 and the IC chip 3 in the recess 9 of the container body 1, the recess is sealed with a metal cover 7. Sealing of the metal cover 7 is performed by crimping and welding the metal cover 7 to the metal ring 6 provided on the opening end surface of the recess 9, that is, the end surface of the frame wall 1 d forming the recess 9. A metallized layer of a refractory metal (tungsten, molybdenum, etc.) is provided under the metal ring 6 (opening end face of the recess 9) (not shown).

底壁１ｂの背面（露出面）には平面実装用の端子（以下、単に実装端子とも称する）４を複数（ここでは４個：４ａ，４ｂ，４ｃ，４ｄ）有する。ＩＣチップ３と実装端子４との電気的接続はセラミックスシートに設けた内装導体パターンあるいはビアホール（図示せず）を通して、もしくは容器本体１の側壁面に設けた切り欠き（キャスタレーション）に形成した接続導体を通して行われる。図示の例では、底壁層の４角部に設けた角部切欠き（角部キャスタレーション）１７に形成した接続導体１８を用いている。   On the back surface (exposed surface) of the bottom wall 1b, there are a plurality (four in this case: 4a, 4b, 4c, 4d) of terminals for plane mounting (hereinafter also simply referred to as mounting terminals) 4. The electrical connection between the IC chip 3 and the mounting terminal 4 is made through an internal conductor pattern or via hole (not shown) provided on the ceramic sheet, or a notch (castellation) provided on the side wall surface of the container body 1. Done through conductors. In the illustrated example, connection conductors 18 formed at corner notches (corner castellations) 17 provided at the four corners of the bottom wall layer are used.

容器本体の凹部９を金属カバー７で密閉した後、水晶振動子２の振動特性を測定する。図４に示した従来例の水晶発振器では、容器本体１の側面の切り欠き１２を設けた検査端子１４に検査装置の探針（プローブ）を当てて測定を行う。プローブを当てるこの検査端子１４は、容器本体１の側壁に設けた側面切り欠き（サイドキャスタレーション）１２にメッキ等で形成され、水晶端子１１に電気的に接続されている。振動特性の測定は、この検査端子１４のそれぞれに枠壁の１ｄの横方向からプローブを押し当てて行う（特許文献１参照）。   After the recess 9 of the container body is sealed with the metal cover 7, the vibration characteristics of the crystal resonator 2 are measured. In the conventional crystal oscillator shown in FIG. 4, measurement is performed by applying a probe (probe) of an inspection apparatus to an inspection terminal 14 provided with a notch 12 on the side surface of the container body 1. The inspection terminal 14 to which the probe is applied is formed by plating or the like on a side notch (side castellation) 12 provided on the side wall of the container body 1 and is electrically connected to the crystal terminal 11. The measurement of the vibration characteristics is performed by pressing a probe from the lateral direction 1d of the frame wall to each of the inspection terminals 14 (see Patent Document 1).

また、図５は、従来の表面実装型の低背水晶発振器の他の構造例の説明図である。図５に示した他の従来例の水晶発振器では、その水晶振動子２の検査端子１４を底壁層に設けている。水晶振動子２の水晶端子１１とは底壁層を貫通するビアホール１３で接続している。ビアホール１３には電極柱が埋設されている。なお、底壁層には、上記検査端子１４の設置面と同じ面に表面実装端子４が設けられているため、検査端子部分の底壁の一部を除去して凹陥部を設け、その底面に検査端子１４のための導体層を設けている。この場合のプローブは水晶発振器の底面方向から弾圧させて接触させる（特許文献２参照）。   FIG. 5 is an explanatory diagram of another structural example of a conventional surface mount type low-profile crystal oscillator. In another conventional crystal oscillator shown in FIG. 5, the inspection terminal 14 of the crystal resonator 2 is provided on the bottom wall layer. A crystal terminal 11 of the crystal resonator 2 is connected by a via hole 13 penetrating the bottom wall layer. An electrode column is embedded in the via hole 13. In addition, since the surface mounting terminal 4 is provided on the same surface as the installation surface of the inspection terminal 14 in the bottom wall layer, a part of the bottom wall of the inspection terminal portion is removed to provide a recessed portion, and the bottom surface Is provided with a conductor layer for the inspection terminal 14. The probe in this case is brought into contact with the crystal oscillator from the bottom surface direction (see Patent Document 2).

特開２０１０−１４１８７５号公報JP 2010-141875 A 特開平０８−３０７１５３号公報Japanese Patent Laid-Open No. 08-307153

図４に示した前者の従来技術では、検査端子を水晶発振器の容器本体に対して横方向両側からプローブを弾圧して当接させるものであることから、安定した測定は難しく、正確な検査結果を得ることが難しい。また、図５に示した後者の従来技術では、検査端子を設ける底壁の一部に凹陥部を設けているため、底壁の強度が低下し、プローブの当接で底壁層にクラックなどのダメージが発生すると共に、容器本体全体の脆弱性を招く。これは、特に、本発明に係るような水晶振動子とＩＣチップを並列に配置した低背ではあるが平面方向の広がりが大きい水晶発振器などにおいて顕著となる。   In the former prior art shown in FIG. 4, the probe is pressed against the container body of the crystal oscillator from both sides in the lateral direction so that stable measurement is difficult and accurate test results are obtained. Difficult to get. Further, in the latter prior art shown in FIG. 5, since the recessed portion is provided in a part of the bottom wall where the inspection terminal is provided, the strength of the bottom wall is reduced, and the bottom wall layer is cracked by the contact of the probe. This causes damage and causes the entire container body to be vulnerable. This is particularly noticeable in a crystal oscillator or the like having a low profile but a large spread in the planar direction in which the crystal resonator and the IC chip according to the present invention are arranged in parallel.

この種の低背水晶発振器の用途には、ディスクリート部品として回路基板に実装するだけでなく、出荷後に客先において他の部品とモールドし、複合部品として用いられる場合もある。又、周辺部品保護のため、アンダーフィル樹脂を塗布する場合もある。単に底壁に凹陥部を設けて検査端子を配置した従来構造のままでは、これらの樹脂を介し、水晶端子間の容量が変化し、発振周波数がずれることがある。   This kind of low-profile crystal oscillator is used not only for mounting on a circuit board as a discrete component, but also as a composite component by molding with other components at the customer after shipment. In some cases, an underfill resin is applied to protect peripheral components. If the conventional structure is simply provided with a recess in the bottom wall and the inspection terminals are arranged, the capacitance between the crystal terminals may change via these resins, and the oscillation frequency may shift.

本発明の目的は、水晶振動子の検査端子の配置に起因する容器本体の機械的脆弱性を回避し、製造時における水晶振動子の検査作業を安定化すると共に、使用環境によって発振周波数に変化を招かない高信頼性の表面実装型の低背水晶発振器を提供することにある。   The object of the present invention is to avoid mechanical weakness of the container body due to the placement of the inspection terminal of the crystal resonator, stabilize the inspection operation of the crystal resonator during manufacture, and change the oscillation frequency depending on the use environment. An object of the present invention is to provide a highly reliable surface-mount type low-profile crystal oscillator that does not incur any problems.

（１）本発明に係る表面実装型の低背水晶発振器は、セラミックスからなる平面視矩形を有する底壁と枠壁との積層で形成される凹部を有する容器本体と、前記凹部に収容された水晶振動子と、前記凹部の底面に前記水晶振動子と並列に搭載され、当該水晶振動子と共に発振回路を構成する回路等を集積したＩＣチップを有する。   (1) A surface-mount type low-profile crystal oscillator according to the present invention is accommodated in a container body having a recess formed by laminating a bottom wall and a frame wall having a rectangular shape in a plan view made of ceramics, and the recess. A crystal resonator and an IC chip that is mounted in parallel with the crystal resonator on the bottom surface of the recess and integrates a circuit that constitutes an oscillation circuit together with the crystal resonator.

（２）前記凹部を密閉すると共に前記水晶振動子を外部電磁界から遮蔽する金属カバーと、前記容器本体を形成する前記底壁の前記金属カバーとは反対面である実装面に設けられた複数の実装端子を具備する。   (2) A plurality of metal covers that are provided on a mounting surface that is opposite to the metal cover that seals the concave portion and shields the crystal resonator from an external electromagnetic field, and the metal cover of the bottom wall that forms the container body. Mounting terminals.

（３）前記凹部には、前記水晶振動子を搭載する第１領域と前記ＩＣチップを搭載する第２領域とが設けられる。 (3) The concave portion is provided with a first region for mounting the crystal unit and a second region for mounting the IC chip.

（４）前記第１領域の底壁は前記第２領域の底壁よりも厚く形成される。 (4) The bottom wall of the first region is formed thicker than the bottom wall of the second region.

（５）前記実装面の前記第１領域に、当該実装面から凹陥した検査端子用凹部を有して前記検査端子用凹部内に前記水晶振動子の検査端子が設けられている。 (5) in the first region of the mounting surface, the inspection terminal of the crystal oscillator in the recess for the test terminals have a test terminal recess recessed from the mounting surface is provided.

（６）前記検査端子用凹部に熱硬化樹脂が充填・硬化されている。 (6) A thermosetting resin is filled and cured in the recess for the inspection terminal.

（７）前記水晶振動子の検査端子と前記水晶振動子を搭載する水晶端子は、前記底壁を貫通するビアホールで電気的に接続されている。 (7) The inspection terminal of the crystal resonator and the crystal terminal on which the crystal resonator is mounted are electrically connected by a via hole penetrating the bottom wall.

（８）前記ＩＣチップは、発振回路に加えて温度補償回路を集積したものを用いることができる。   (8) As the IC chip, a chip in which a temperature compensation circuit is integrated in addition to an oscillation circuit can be used.

（９）なお、前記ＩＣチップとしては、温度制御回路など、既知の水晶発振器を構成する各種の付帯回路を集積したものとすることもできる。   (9) It should be noted that the IC chip may be one in which various auxiliary circuits constituting a known crystal oscillator such as a temperature control circuit are integrated.

（１０）本発明は、特許請求の範囲に記載された発明の技術思想を逸脱することなく、種々の変形が可能であることは言うまでもない。   (10) It goes without saying that the present invention can be variously modified without departing from the technical idea of the invention described in the claims.

上記の構成とした本発明に係る表面実装水晶発振器によれば、水晶振動子の検査端子の配置に起因する容器本体の機械的脆弱性が回避され、製造時における水晶振動子の検査作業の安定化が可能となり、使用環境によって発振周波数に変化を招かない高信頼性の表面実装型の低背水晶発振器が得られる。   According to the surface-mounted crystal oscillator according to the present invention having the above-described configuration, mechanical vulnerability of the container body due to the arrangement of the inspection terminal of the crystal resonator is avoided, and the inspection operation of the crystal resonator is stable during manufacturing. Therefore, a highly reliable surface-mount type low-profile crystal oscillator that does not change the oscillation frequency depending on the use environment can be obtained.

本発明に係る表面実装型の低背水晶発振器の一実施例の構造を説明する縦断面図である。It is a longitudinal cross-sectional view explaining the structure of one Example of the surface mount-type low-profile crystal oscillator based on this invention. 本発明に係る表面実装型の低背水晶発振器の一実施例の構造を説明する容器本体に有する凹部の平面図である。It is a top view of the recessed part which has in the container main body explaining the structure of one Example of the surface mount type low-profile crystal oscillator based on this invention. 本発明に係る表面実装型の低背水晶発振器の一実施例の構造を説明する容器本体の実装面の平面図である。It is a top view of the mounting surface of a container main body explaining the structure of one Example of the surface mount-type low-profile crystal oscillator based on this invention. 従来の表面実装型の低背水晶発振器の一構造例の説明図である。It is explanatory drawing of one structural example of the conventional surface mount type low-profile crystal oscillator. 従来の表面実装型の低背水晶発振器の他の構造例の説明図である。It is explanatory drawing of the other structural example of the conventional surface mount type low-profile crystal oscillator.

以下、本発明の実施形態について、図面を参照した実施例により詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図１は、本発明に係る表面実装型の低背発振器の一実施例の構造を説明する縦断面図である。また、図２は、図１の容器本体に有する凹部の平面図である。また、図３は、図１の水晶発振器を適用機器の回路基板などに実装する実装端子が設けられた実装面の平面図である。以下では、表面実装型の低背発振器を単に低背発振器とも称する。本実施例の低背発振器１００は、平面視矩形状とした積層セラミックスシート（グリーンシート）で構成される底壁１ａ,１ｂ，１ｃと枠壁１ｄからなる容器本体１に、水晶振動子２とＩＣチップ３を並列に並べて収容してなる。なお、底壁や枠壁の上記積層数は一例である。   FIG. 1 is a longitudinal sectional view for explaining the structure of an embodiment of a surface-mounted low-profile oscillator according to the present invention. FIG. 2 is a plan view of a recess provided in the container body of FIG. FIG. 3 is a plan view of a mounting surface provided with mounting terminals for mounting the crystal oscillator of FIG. 1 on a circuit board of an applied device. Hereinafter, the surface mount type low profile oscillator is also simply referred to as a low profile oscillator. The low-profile oscillator 100 according to the present embodiment includes a crystal resonator 2 and a container body 1 including bottom walls 1a, 1b, 1c and a frame wall 1d made of a laminated ceramic sheet (green sheet) having a rectangular shape in plan view. The IC chips 3 are accommodated in parallel. In addition, the said number of lamination | stacking of a bottom wall or a frame wall is an example.

容器本体１は、前記した従来例と同様の積層セラミックスシートで形成した底壁に枠壁を積層して形成した凹部９を有し、この凹部９に水晶振動子搭載領域ＡＲ１とＩＣチップ搭載領域ＡＲ２とを並列に設け、水晶振動子２とＩＣチップ３を横並びに収容する。本実施例では、容器本体１の凹部９を底壁１ａ,１ｂからなる底壁の水晶振動子搭載領域ＡＲ１にさらに底壁１ｃを追加して水晶振動子２の搭載空間を底上げして水晶振動子搭載領域ＡＲ１の強度をアップすると共に、当該水晶振動子２の搭載空間の高さをＩＣチップの搭載空間よりも小さくする。   The container body 1 has a recess 9 formed by laminating a frame wall on a bottom wall formed of a laminated ceramic sheet similar to the above-described conventional example. The recess 9 has a crystal resonator mounting area AR1 and an IC chip mounting area. AR2 is provided in parallel, and the crystal unit 2 and the IC chip 3 are accommodated side by side. In the present embodiment, the concave portion 9 of the container body 1 is further added to the crystal resonator mounting area AR1 of the bottom wall made up of the bottom walls 1a and 1b to raise the mounting space of the crystal resonator 2 to raise the crystal resonator 2 mounting space. The strength of the child mounting area AR1 is increased, and the height of the mounting space for the crystal resonator 2 is made smaller than the mounting space for the IC chip.

すなわち、水晶振動子２の搭載空間を構成する底壁はＩＣチップ３の搭載空間よりも厚く形成されている。水晶振動子２は、底壁１ｃの表面に設けた一対の水晶端子１１に導電性接着剤５で固定されている。実装面側の底壁１ｂには、検査端子を設けるための検査端子用凹部１６が形成されている。検査端子用凹部１６に露呈した実装面側の底壁１aには検査端子１４が設けられている。水晶端子１１は底壁に設けたビアホール１３を埋める電極柱１３ａを通して検査端子１４に接続されている。   That is, the bottom wall constituting the mounting space for the crystal resonator 2 is formed thicker than the mounting space for the IC chip 3. The crystal resonator 2 is fixed with a conductive adhesive 5 to a pair of crystal terminals 11 provided on the surface of the bottom wall 1c. A test terminal recess 16 for providing a test terminal is formed in the bottom wall 1b on the mounting surface side. An inspection terminal 14 is provided on the bottom wall 1 a on the mounting surface exposed to the inspection terminal recess 16. The crystal terminal 11 is connected to the inspection terminal 14 through an electrode column 13a filling a via hole 13 provided on the bottom wall.

検査端子用凹部１６は、検査端子１４に水晶振動子２の振動特性測定装置のプローブを用いて検査・測定作業を行った後、エポキシ樹脂を好適とする熱硬化性保護樹脂１５で埋め、底壁の機械的強度確保と測定端子１４が露出したままでは起こりうる実装後の周波数変動が抑制される。熱硬化性保護樹脂１５は、実装時のリフローでの加熱で完全硬化される。   After the inspection terminal 14 is inspected and measured using the probe of the vibration characteristic measuring device of the crystal resonator 2, the inspection terminal recess 16 is filled with a thermosetting protective resin 15 suitable for epoxy resin, The frequency fluctuation after mounting which can occur when the mechanical strength of the wall is secured and the measurement terminal 14 is exposed is suppressed. The thermosetting protective resin 15 is completely cured by heating during reflow during mounting.

容器本体１は、セラミックスシートの積層体を焼成して形成される。実装端子４（４ａ,4ｂ,4ｃ,4ｄ）は底壁１ｂの各角部に金属（タングステン：Ｗやモリブデン：Ｍoなどの高融点金属）を焼結したメタライズ層を形成後、電界メッキ等によってニッケル（Ｎi）膜と金（Ａu）膜を順次にメッキして形成される。   The container body 1 is formed by firing a laminate of ceramic sheets. The mounting terminals 4 (4a, 4b, 4c, 4d) are formed by forming a metallized layer by sintering a metal (a refractory metal such as tungsten: W or molybdenum: Mo) at each corner of the bottom wall 1b, and then by electroplating or the like. A nickel (Ni) film and a gold (Au) film are sequentially plated.

なお、水晶振動子２は、水晶片（水晶ブランク）の両主面に形成した励振電極を、例えばその一端部両側に引出電極を延出し、容器本体１の凹部９の底面に形成した水晶端子１１に固定される。この固定には、例えばエポキシ樹脂に銀粒子などの導電性フィラーを混入した導電性接着剤５を用いる。金属カバー７は、枠壁１ｄの開口端面に設けた金属リング６にシーム溶接によって金属カバー７を接合して密閉封入する。なお、図示していないが、開口端面の金属リング６の下地に高融点金属のメタライズ層が形成されている。このような構造は前記した従来のものと同様である。   The crystal resonator 2 is a crystal terminal formed on the bottom surface of the concave portion 9 of the container body 1 with the excitation electrodes formed on both main surfaces of a crystal piece (crystal blank) extending, for example, on both sides of one end thereof. 11 is fixed. For this fixing, for example, a conductive adhesive 5 in which a conductive filler such as silver particles is mixed in an epoxy resin is used. The metal cover 7 is hermetically sealed by joining the metal cover 7 to the metal ring 6 provided on the opening end face of the frame wall 1d by seam welding. Although not shown, a refractory metal metallization layer is formed on the base of the metal ring 6 on the opening end face. Such a structure is the same as the conventional one described above.

また、ＩＣチップ３と凹部９領域ＡＲ２との間を埋めて、所謂アンダーフィルと称する樹脂が充填することもできる。この樹脂をＩＣチップ３の背面（金属カバー７側の面）にも保護樹脂として塗布することできる。また、この背面の樹脂に替えて、ＩＣチップ３の背面に予め保護樹脂フィルムを設けておくこともできる。   In addition, the space between the IC chip 3 and the recess 9 area AR2 can be filled with a so-called underfill resin. This resin can also be applied as a protective resin to the back surface of the IC chip 3 (the surface on the metal cover 7 side). Further, instead of the resin on the back surface, a protective resin film can be provided in advance on the back surface of the IC chip 3.

本実施例の構成としたことにより、水晶振動子の検査端子を底壁に配置したことによる容器本体の機械的脆弱性が回避される。また、検査端子が底壁に設けたことで、水晶振動子の検査作業が容易になり、安定かつ正確な検査が可能となる。さらに、使用環境によって発振周波数に変化を招かない高信頼性の表面実装型の低背水晶発振器が得られる。   By adopting the configuration of the present embodiment, mechanical vulnerability of the container main body due to the arrangement of the inspection terminal of the crystal resonator on the bottom wall is avoided. In addition, since the inspection terminal is provided on the bottom wall, the inspection operation of the crystal unit is facilitated, and stable and accurate inspection is possible. Furthermore, a highly reliable surface-mount type low-profile crystal oscillator that does not change the oscillation frequency depending on the use environment can be obtained.

本発明は、上記実施例で説明した低背水晶発振器に限るものではなく、同様の構造を有する圧電部品、ＭＥＭＳ、その他の平面実装用の微小電子部品にも適用できる。   The present invention is not limited to the low-profile crystal oscillator described in the above embodiment, but can also be applied to piezoelectric parts having the same structure, MEMS, and other microelectronic parts for planar mounting.

１・・容器本体、２・・水晶振動子、３・・ＩＣチップ、４・・実装端子、５・・導電性接着剤、６・・金属リング、７・・金属カバー（蓋体）、８・・バンプ、９・・凹部、１０・・電極パッド、１１・・水晶端子、１２・・側面切り欠き、１３・・ビアホール、１３ａ・・電極柱、１４・・検査端子、１５・・保護樹脂、１６・・検査端子用凹部、１７・・角部切り欠き、１８・・接続導体、１００・・表面実装型の低背発振器。   1 .. Container body, 2 .. Crystal resonator, 3 .. IC chip, 4 .. Mounting terminal, 5 .. Conductive adhesive, 6 .. Metal ring, 7 .. Metal cover (lid), 8 ..Bump, 9 ..Recess, 10 ..Electrode pad, 11 ..Crystal terminal, 12 ..Side cut-out, 13 ..Via hole, 13 a ..Electrode pillar, 14 .. Inspection terminal, 15. , 16 .. Inspection terminal recess, 17 .. Corner notch, 18 .. Connection conductor, 100 .. Surface mount type low profile oscillator.

Claims (3)

セラミックスからなる平面視矩形を有する底壁と枠壁との積層で形成される凹部を有する容器本体と、前記凹部に収容された水晶振動子と、前記凹部の底面に前記水晶振動子と並列に搭載され、当該水晶振動子と共に発振回路を構成する回路等を集積したＩＣチップと、前記凹部を密閉すると共に前記水晶振動子を外部電磁界から遮蔽する金属カバーと、前記容器本体を形成する前記底壁の前記金属カバーとは反対面である実装面に設けられた複数の実装端子を具備する表面実装型の低背水晶発振器であって、
前記凹部には、前記水晶振動子を搭載する第１領域と前記ＩＣチップを搭載する第２領域とが設けられ、
前記第１領域の底壁は前記第２領域の底壁よりも厚く形成され、
前記実装面の前記第１領域に、当該実装面から凹陥した検査端子用凹部を有して前記検査端子用凹部内に前記水晶振動子の検査端子が設けられており、
前記検査端子用凹部に熱硬化樹脂が充填・硬化されていることを特徴とする表面実装型の低背水晶発振器。 A container main body having a recess formed by stacking a bottom wall and a frame wall having a rectangular shape in a plan view made of ceramics, a crystal resonator housed in the recess, and a bottom surface of the recess in parallel with the crystal resonator An IC chip that is mounted and integrated with a circuit that constitutes an oscillation circuit together with the crystal resonator, a metal cover that seals the concave portion and shields the crystal resonator from an external electromagnetic field, and the container body is formed. A surface mount type low-profile crystal oscillator comprising a plurality of mounting terminals provided on a mounting surface opposite to the metal cover of the bottom wall,
The recess is provided with a first region for mounting the crystal resonator and a second region for mounting the IC chip,
The bottom wall of the first region is formed thicker than the bottom wall of the second region,
In the first region of the mounting surface, and the inspection terminal of the crystal oscillator to the test terminal for the recess has a test terminal recess recessed from the mounting surface is provided,
A surface-mount type low-profile crystal oscillator, wherein the inspection terminal recess is filled and cured with a thermosetting resin. 請求項１において、
前記水晶振動子の検査端子と前記水晶振動子を搭載する水晶端子は、前記底壁を貫通するビアホールで電気的に接続されていることを特徴とする表面実装型の低背水晶発振器。 In claim 1,
A surface-mount type low-profile crystal oscillator, wherein the inspection terminal of the crystal resonator and the crystal terminal on which the crystal resonator is mounted are electrically connected by a via hole penetrating the bottom wall. 請求項１において、
前記ＩＣチップは温度補償回路を備えることを特徴とする請求項１又は２に記載の表面実装型の水晶発振器。 In claim 1,
The surface-mount type crystal oscillator according to claim 1, wherein the IC chip includes a temperature compensation circuit.
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