JP6045920B2 - エッチングマスク用組成物およびパターン形成方法 - Google Patents
エッチングマスク用組成物およびパターン形成方法 Download PDFInfo
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- JP6045920B2 JP6045920B2 JP2013006544A JP2013006544A JP6045920B2 JP 6045920 B2 JP6045920 B2 JP 6045920B2 JP 2013006544 A JP2013006544 A JP 2013006544A JP 2013006544 A JP2013006544 A JP 2013006544A JP 6045920 B2 JP6045920 B2 JP 6045920B2
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- 238000009835 boiling Methods 0.000 claims description 10
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- 150000001896 cresols Chemical class 0.000 description 1
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 1
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 1
- KVFDZFBHBWTVID-UHFFFAOYSA-N cyclohexanecarbaldehyde Chemical compound O=CC1CCCCC1 KVFDZFBHBWTVID-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- WYACBZDAHNBPPB-UHFFFAOYSA-N diethyl oxalate Chemical compound CCOC(=O)C(=O)OCC WYACBZDAHNBPPB-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- UYAAVKFHBMJOJZ-UHFFFAOYSA-N diimidazo[1,3-b:1',3'-e]pyrazine-5,10-dione Chemical compound O=C1C2=CN=CN2C(=O)C2=CN=CN12 UYAAVKFHBMJOJZ-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229940093476 ethylene glycol Drugs 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- OVWYEQOVUDKZNU-UHFFFAOYSA-N m-tolualdehyde Chemical compound CC1=CC=CC(C=O)=C1 OVWYEQOVUDKZNU-UHFFFAOYSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- FXLOVSHXALFLKQ-UHFFFAOYSA-N p-tolualdehyde Chemical compound CC1=CC=C(C=O)C=C1 FXLOVSHXALFLKQ-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 229940100595 phenylacetaldehyde Drugs 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229940116423 propylene glycol diacetate Drugs 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02366—Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
図1(A)に示すように、シリコン基板や銅、ニッケル、アルミ等の金属基板またはシリコン基板上に当該金属膜、SiO2等の酸化膜もしくはSiN等の窒化膜等が堆積された太陽電池用基板10の上に上述のエッチングマスク用組成物を用いて、スクリーン印刷法、インクジェット印刷法、ロールコート印刷法、凸版印刷法、凹版印刷法、オフセット印刷法などの印刷法を用いてマスクパターン20を形成する。なお、マスクパターン20を形成前に、必要に応じて基板の前処理を行ってもよい。前処理としては溌液性層を形成する工程が挙げられ、例えば特開2009−253145号公報に記載の工程が挙げられる。続いて、マスクパターン20を加熱して、マスクパターン20をベークする。加熱条件は、エッチングマスク用組成物の成分や、マスクパターン20の膜厚等によって適宜設定されるが、たとえば、200℃、3分間である。
表1に、実施例1−11および比較例1−12のエッチングマスク用組成物の成分を示す。実施例1−11および比較例1−12のエッチングマスク用組成物に用いられるノボラック樹脂1、ノボラック樹脂2は、それぞれ、質量平均分子量12000(m/p=60/40)、質量平均分子量2100(m/p=36/64)のノボラック樹脂である。表2は、実施例1−11、比較例5−12に用いられたフィラーの詳細を示す。また、表3は、実施例1、2、4−11、比較例3−12に用いられた界面活性剤の詳細を示す。
表1に示す各成分の組み合わせにより、実施例1−11および比較例1−12のエッチングマスク用組成物からなるインクを作製した。
作製した各インクをスクリーン印刷法により、シリコン基板に印刷し、印刷デザイン幅として100μm幅、150μmおよび200μm幅の3パターンを形成した。形成したパターンは、200℃のホットプレートにおいて3分間乾燥した。得られたパターンの仕上がり線幅を計測し、印刷性を確認した。印刷性に関する結果を以下のように分類した。印刷性について得られた結果を表4に示す。
◎(良好):全てのパターンの印刷にじみが20μm以下
○(可):印刷にじみが20μm以下のパターンが2つ
×(不良):印刷にじみが20μm以下のパターンが1つまたは0
なお、印刷にじみは、以下の式により算出される。
印刷にじみ=仕上がり線幅−印刷デザイン幅
E型粘度計(東機産業製、RE550型粘度計)を用いて、各インクの粘度カーブを計測し、下記式に基づいて粘度指数を算出した。
粘度指数=1rpm時の粘度/15rmp時の粘度
得られた粘度指数について以下のように分類し、チクソトロピー性を評価した。チクソトロピー性について得られた結果を表4に示す。
◎(良好):粘度指数3.0以上
○(可):粘度指数2.0以上3.0未満
×(不良):粘度指数2.0未満
上述した実施例1、8−10、参考例12−14の各インクについて、スクリーン印刷を7ショット連続して実施し、印刷安定性を確認した。印刷安定性に関する結果について、印刷擦れなく印刷できたショット数を表5に示す。なお、実施例9、10については、溶剤の沸点は、2種類の溶剤の沸点および混合比から求めた平均沸点である。
実施例1−11の各インクをスクリーン印刷法により、シリコン基板に印刷し、100μm幅および200μm幅のパターンを形成した。形成したパターンを、200℃のホットプレートにおいて3分間乾燥した。形成したパターンの耐酸性を確認するために、5%フッ酸水溶液(条件1)あるいは10%硫酸水溶液(条件2)に浸漬し、パターンの表面状態を光学顕微鏡により観察した。その結果、実施例1−11の各インクは、条件1、条件2ともに、膜状態に変化がなく、パターンの剥がれやクラックの発生が生じないことが確認された。
Claims (4)
- ノボラック樹脂(A)100質量部と、
SiO2粒子(B)20〜100質量部と、
溶剤(C)と、
を含み、
前記溶剤(C)は、沸点が190℃以上の溶剤(C1)を70質量%以上含む、非感光性の、太陽電池用基板のエッチングマスク用組成物。 - SiO2粒子(B)が親水性である請求項1に記載のエッチングマスク組成物。
- シリコン系、アクリル系またはフッ素系の界面活性剤(D)をさらに備える請求項1または2に記載のマスク用組成物。
- 基板上に、請求項1乃至3のいずれか1項に記載の太陽電池用基板のエッチングマスク用組成物を用いて印刷法によりマスクパターンを形成する工程と、
マスクパターンをベークする工程と、
基板をエッチングし、マスクパターンを転写する工程と、
マスクパターンを除去する工程と
を含むパターン形成方法。
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JP2013006544A JP6045920B2 (ja) | 2013-01-17 | 2013-01-17 | エッチングマスク用組成物およびパターン形成方法 |
TW102141263A TWI585146B (zh) | 2013-01-17 | 2013-11-13 | Composition for etching mask and pattern forming method |
KR1020140003951A KR20140093618A (ko) | 2013-01-17 | 2014-01-13 | 에칭 마스크용 조성물 및 패턴 형성 방법 |
CN201410016449.7A CN103941545B (zh) | 2013-01-17 | 2014-01-14 | 蚀刻掩模用组合物及图案形成方法 |
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KR (1) | KR20140093618A (ja) |
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US20170306172A1 (en) * | 2014-10-02 | 2017-10-26 | Daicel Corporation | Silver particle coating composition |
KR101984112B1 (ko) | 2019-03-18 | 2019-05-31 | (주)세우인코퍼레이션 | 투 스텝 에칭 방식에 의한 갭 마스크 제조방법 |
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KR102048786B1 (ko) | 2019-07-26 | 2019-11-27 | (주)세우인코퍼레이션 | 유기물 증착 효율을 높일 수 있는 엠보싱 텐션 마스크 제조방법 |
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KR20140093618A (ko) | 2014-07-28 |
JP2014136765A (ja) | 2014-07-28 |
TWI585146B (zh) | 2017-06-01 |
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