JP6043421B2 - 超高速レーザを用いたホイールの先端部の微小切欠の製造装置および方法 - Google Patents

超高速レーザを用いたホイールの先端部の微小切欠の製造装置および方法 Download PDF

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Publication number
JP6043421B2
JP6043421B2 JP2015503134A JP2015503134A JP6043421B2 JP 6043421 B2 JP6043421 B2 JP 6043421B2 JP 2015503134 A JP2015503134 A JP 2015503134A JP 2015503134 A JP2015503134 A JP 2015503134A JP 6043421 B2 JP6043421 B2 JP 6043421B2
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Japan
Prior art keywords
wheel
laser
tip
manufacturing
notch
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JP2015503134A
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English (en)
Japanese (ja)
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JP2015514018A (ja
Inventor
サチェ ジョウン
サチェ ジョウン
ヘソン イ
ヘソン イ
ヒュンキュ イ
ヒュンキュ イ
スクァン キム
スクァン キム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ehwa Diamond Industrial Co Ltd
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Ehwa Diamond Industrial Co Ltd
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Publication date
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Publication of JP2015514018A publication Critical patent/JP2015514018A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B23Q15/007—Automatic control or regulation of feed movement, cutting velocity or position of tool or work while the tool acts upon the workpiece
    • B23Q15/013—Control or regulation of feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
JP2015503134A 2012-04-05 2013-04-04 超高速レーザを用いたホイールの先端部の微小切欠の製造装置および方法 Active JP6043421B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020120035748A KR101334067B1 (ko) 2012-04-05 2012-04-05 초고속 레이저를 이용한 휠 선단부의 미세 노치 제작 장치 및 방법
KR10-2012-0035748 2012-04-05
PCT/KR2013/002808 WO2013151350A1 (en) 2012-04-05 2013-04-04 Apparatus and method of manufacturing micro-notches at the edge line portion of scribing wheel using ultrafast laser

Publications (2)

Publication Number Publication Date
JP2015514018A JP2015514018A (ja) 2015-05-18
JP6043421B2 true JP6043421B2 (ja) 2016-12-14

Family

ID=49300769

Family Applications (1)

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JP2015503134A Active JP6043421B2 (ja) 2012-04-05 2013-04-04 超高速レーザを用いたホイールの先端部の微小切欠の製造装置および方法

Country Status (4)

Country Link
JP (1) JP6043421B2 (ko)
KR (1) KR101334067B1 (ko)
CN (1) CN104203485B (ko)
WO (1) WO2013151350A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7454717B1 (ja) 2023-01-16 2024-03-22 株式会社アマダ レーザ加工システム

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* Cited by examiner, † Cited by third party
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KR101334067B1 (ko) * 2012-04-05 2013-12-06 이화다이아몬드공업 주식회사 초고속 레이저를 이용한 휠 선단부의 미세 노치 제작 장치 및 방법
CN107876975A (zh) * 2017-12-18 2018-04-06 深圳光韵达激光应用技术有限公司 一种复合片双头激光切割分片装置及分片加工方法
CN109175730B (zh) * 2018-10-31 2024-02-06 山东泰鹏智能家居股份有限公司 全移动式多卡盘切割装置及方法
CN110682007B (zh) * 2019-09-11 2021-12-17 前海晶方云(深圳)测试设备有限公司 一种芯片加工用切割装置
CN115415666A (zh) * 2022-09-07 2022-12-02 哈尔滨理工大学 一种铍材专用的激光辅助刻划和粉末回收装置

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JPS56157830A (en) * 1980-05-08 1981-12-05 Toshiba Corp Laser machining apparatus
GB8722087D0 (en) * 1987-09-19 1987-10-28 Cambridge Consultants Multiple cutter
JPH0537449U (ja) * 1991-10-25 1993-05-21 株式会社丸栄機械製作所 水晶板積層体研摩装置
JPH09192858A (ja) * 1996-01-11 1997-07-29 Olympus Optical Co Ltd 可撓性管の製造方法及び装置
US7723642B2 (en) * 1999-12-28 2010-05-25 Gsi Group Corporation Laser-based system for memory link processing with picosecond lasers
CN2431069Y (zh) * 2000-06-30 2001-05-23 陆建毅 电火花线切割机床贮丝筒的联轴器
KR100389003B1 (ko) * 2000-10-09 2003-06-25 삼성전자주식회사 디스크의 밸런싱장치 및 그 방법
JP2003251475A (ja) * 2002-03-01 2003-09-09 Sumitomo Heavy Ind Ltd レーザ加工方法
KR100621550B1 (ko) * 2004-03-17 2006-09-14 삼성전자주식회사 테이프 배선 기판의 제조방법
TWI380868B (zh) * 2005-02-02 2013-01-01 Mitsuboshi Diamond Ind Co Ltdl Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same
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JP2007136692A (ja) * 2005-11-15 2007-06-07 Tatsumi Yoda 装飾品レーザ加工方法
KR100847677B1 (ko) * 2007-01-24 2008-07-23 한국과학기술원 투명 유리를 이용한 레이저 미세 가공 장치
JP4848297B2 (ja) * 2007-02-19 2011-12-28 エンシュウ株式会社 外周体の周期構造体加工方法と外周体の周期構造体加工装置
DE102007045383A1 (de) * 2007-09-22 2008-07-17 Bohle Ag Verfahren zur Herstellung von Schneidrädchen
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KR101334067B1 (ko) * 2012-04-05 2013-12-06 이화다이아몬드공업 주식회사 초고속 레이저를 이용한 휠 선단부의 미세 노치 제작 장치 및 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7454717B1 (ja) 2023-01-16 2024-03-22 株式会社アマダ レーザ加工システム

Also Published As

Publication number Publication date
JP2015514018A (ja) 2015-05-18
KR101334067B1 (ko) 2013-12-06
CN104203485A (zh) 2014-12-10
CN104203485B (zh) 2016-06-08
KR20130113289A (ko) 2013-10-15
WO2013151350A1 (en) 2013-10-10

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