JP6028177B1 - 光源装置 - Google Patents
光源装置 Download PDFInfo
- Publication number
- JP6028177B1 JP6028177B1 JP2015253429A JP2015253429A JP6028177B1 JP 6028177 B1 JP6028177 B1 JP 6028177B1 JP 2015253429 A JP2015253429 A JP 2015253429A JP 2015253429 A JP2015253429 A JP 2015253429A JP 6028177 B1 JP6028177 B1 JP 6028177B1
- Authority
- JP
- Japan
- Prior art keywords
- light source
- source device
- led element
- light
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 74
- 239000011248 coating agent Substances 0.000 claims abstract description 63
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 63
- 239000011737 fluorine Substances 0.000 claims abstract description 63
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 62
- 238000000576 coating method Methods 0.000 claims abstract description 52
- 229910001873 dinitrogen Inorganic materials 0.000 claims abstract description 32
- 230000002093 peripheral effect Effects 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000000178 monomer Substances 0.000 claims description 23
- 125000004432 carbon atom Chemical group C* 0.000 claims description 14
- 238000006116 polymerization reaction Methods 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 11
- 229920001577 copolymer Polymers 0.000 claims description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 6
- 229910002601 GaN Inorganic materials 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 16
- 230000007423 decrease Effects 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 21
- 238000012360 testing method Methods 0.000 description 21
- 238000000034 method Methods 0.000 description 16
- 239000010410 layer Substances 0.000 description 15
- 239000007789 gas Substances 0.000 description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- 239000012298 atmosphere Substances 0.000 description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 10
- 239000004973 liquid crystal related substance Substances 0.000 description 10
- 230000009467 reduction Effects 0.000 description 8
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 7
- -1 acrylic ester Chemical class 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 239000002360 explosive Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 229920006268 silicone film Polymers 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 description 3
- 238000002042 time-of-flight secondary ion mass spectrometry Methods 0.000 description 3
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000005370 alkoxysilyl group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- CWIFAKBLLXGZIC-UHFFFAOYSA-N 1,1,2,2-tetrafluoro-1-(2,2,2-trifluoroethoxy)ethane Chemical compound FC(F)C(F)(F)OCC(F)(F)F CWIFAKBLLXGZIC-UHFFFAOYSA-N 0.000 description 1
- VBZBISQOWJYWCC-UHFFFAOYSA-N 2-(2-carboxypropan-2-yldiazenyl)-2-methylpropanoic acid Chemical compound OC(=O)C(C)(C)N=NC(C)(C)C(O)=O VBZBISQOWJYWCC-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010892 electric spark Methods 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000004968 peroxymonosulfuric acids Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V25/00—Safety devices structurally associated with lighting devices
- F21V25/12—Flameproof or explosion-proof arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Led Device Packages (AREA)
- Paints Or Removers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
<1> LED素子と、前記LED素子が実装される基板部と、前記LED素子の周りを囲みつつ前記LED素子の光出射方向に開口した形をなし、内側に前記LED素子が収容される周壁部と、前記LED素子が封入されるように前記周壁部の内側に充填される封入樹脂と、前記周壁部で囲まれた部分の前記封入樹脂の表面からなり、前記LED素子から出射された光を前記封入樹脂の外部に出射させる光出射面とを有するLEDパッケージと、前記LEDパッケージを収容し、窒素ガスが充填される収容室と、前記光出射面を覆うように前記LEDパッケージの表面に形成されるフッ素系コーティング膜とを有する光源装置である。
(フッ素系コーティング膜の作製)
メチルメタクリレート68g、n−ブチルアクリレート3.5g、2−エチルヘキシルアクリレート24g、パーフルオロブチルエチルアクリレート4g、メタクリル酸0.5g、1,1,2,3,3,4−ヘプタフルオロシクロペンタン(「ゼオローラH」、日本ゼオン株式会社製)150g及び重合開始剤として2,2’−アゾビスイソブチロニトリル(AIBN)0.1gを、内容積500mlのガラス製フラスコに入れた。撹拌羽根、蓋、冷却管及び温度計をフラスコにセットした後、回転数100rpmで撹拌した。次いで、フラスコ内を窒素で30分置換した後、熱湯を加え、ヒーターを80℃にセットして重合を開始した。重合を開始してから2時間後に、0.1gのジメチル2,2’−アゾビス(イソブチレート)をゼオローラH1gに溶解し重合液に加え、更に3時間重合を継続した。重合終了後、40℃まで冷却した後、「ゼオローラH」を650gと「AE−3000」(上記式(7)の化合物、旭硝子株式会社製)を1100g加えて撹拌し、フッ素系コーティング剤を得た。
液晶パネル(画面サイズ:12インチ、表示スクリーンの一例)6Aを備えた光源装置1Aを用意した。図4は、光源装置1Aの構成を模式的に表した断面図である。この光源装置1Aは、液晶パネル6Aに光を供給するエッジライト式のバックライト装置7Aを筐体(防爆容器)4A内の収容室3Aに備えており、そのようなバックライト装置7Aに、上記フッ素系コーティング剤からなるフッ素系コーティング膜21Aが形成されたLEDパッケージ22A(つまり、膜付きLEDパッケージ23A)が複数個利用されている。
上記光源装置1A内(収容室3A)を窒素ガスで満たした状態で、各LEDパッケージ22Aを最高輝度で点灯させ、そのような状態の液晶パネル6Aの画面中央の輝度を、所定時間毎に測定し、光源装置1Aの経時的な輝度低下を調べた。なお、輝度低下試験は、室温(23℃)で行った。図5は、光源装置1Aの輝度低下試験の内容を模式的に表した説明図である。
フッ素系コーティング膜21Aに代えて、以下に示されるシリコーン膜を形成したこと以外は、光源装置1Aと同じ構成の比較例1の光源装置1Xと、フッ素系コーティング膜21Aを形成していないこと以外は、光源装置1Aと同じ構成の比較例2の光源装置1Yとをそれぞれ用意し、実施例1の光源装置1Aと共に、実施例1の光源装置1Aと同じ条件で、輝度低下試験を行った。なお、光源装置1A、光源装置1X及び光源装置1Yには、同一の供給部5A(窒素ボンベ)からそれぞれ個別に用意されたゴムホースを介して窒素ガスを供給した。また、光源装置1X及び光源装置1Y内の各圧力は、光源装置1と同様、圧力調整弁70Aを利用して光源装置1X及び光源装置1Yからの各排ガスの圧力を調節し、300hPa(大気圧+300hPa)に設定した。
市販のシリコーンワニス(「FC−111」、ファインケミカルジャパン株式会社製)を、光源装置1AのLEDパッケージの表面(実施例1と同様の個所)に塗布し、その塗布物を乾燥させて、厚み10μmのシリコーン膜を形成した。
比較例2の光源装置1Yについて、上記輝度低下試験後(試験開始から408時間後)に、光源装置1Yから光源ユニットを取り出し、LEDパッケージのLED素子の状態を確認した。図8は、試験開始前のLEDパッケージ(塗膜なし)22Yの状態を光出射面側から撮影した拡大写真を示す図であり、図9は、試験開始から408時間後のLEDパッケージ(塗膜なし)22Yの状態を光出射面側から撮影した拡大写真を示す図である。図8に示されるように、試験開始前のLEDパッケージ22Yにおいて、LED素子25Yの表面(発光面)は黒化していない。これに対し、試験開始から408時間後のLEDパッケージ22Yにおいて、LED素子25Yの表面(発光面)は黒く変色していること(黒化)が確かめられた。
図10に示されるLEDパッケージ22YのLED素子25Yに形成された黒色層Nについて、TOF−SIMS(飛行時間型二次イオン質量分析法)を用いて分析(マッピング分析)した。分析結果(陽イオン質量イメージ)は、図11に示した。なお、図11に示される分析結果画像は、図10中に示される破線で囲まれた領域Rに対応する。また、図11に示される分析結果画像は、図10中の領域Rが90°右回転した状態に対応する。そのため、図11の右側は図10の上側に対応し、図11の上側は図10の左側に対応する。
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
Claims (8)
- LED素子と、前記LED素子が実装される基板部と、前記LED素子の周りを囲みつつ前記LED素子の光出射方向に開口した形をなし、内側に前記LED素子が収容される周壁部と、前記LED素子が封入されるように前記周壁部の内側に充填される封入樹脂と、前記周壁部で囲まれた部分の前記封入樹脂の表面からなり、前記LED素子から出射された光を前記封入樹脂の外部に出射させる光出射面とを有するLEDパッケージと、
前記LEDパッケージを収容し、窒素ガスが充填される収容室と、
前記光出射面を覆うように前記LEDパッケージの表面に形成されるフッ素系コーティング膜とを有する光源装置。 - 前記フッ素系コーティング膜が、下記一般式(1)で表されるメタクリル酸エステルを49質量%以上74質量%以下と、下記一般式(2)で表される(メタ)アクリル酸エステルを16質量%以上31質量%以下と、下記一般式(3)で表されるフッ素含有モノマーを1質量%以上33質量%以下の割合で含むモノマー成分を、ランダム重合させて得られる数平均分子量が20000〜100000のフッ素系共重合体を、総炭素数が4〜8にハイドロフルオロカーボン及び総炭素数が4〜8のハイドロフルオロエーテルから選ばれる1種以上の溶剤に溶解してなるコーティング剤からなる請求項1に記載の光源装置。
- 前記フッ素系コーティング膜の厚みが、1μm以上である請求項1又は請求項2に記載の光源装置。
- 前記LEDパッケージが、前記封入樹脂中に分散され、前記LED素子から出射された光を吸収して、前記光とは異なる波長の光を放出する蛍光体を有する請求項1〜請求項3の何れか一項に記載の光源装置。
- 前記LED素子が、窒化ガリウム系半導体を含む請求項1〜請求項4の何れか一項に記載の光源装置。
- 前記収容室内に窒素ガスを供給する供給部を備える請求項1〜請求項5の何れか一項に記載の光源装置。
- 前記収容室の壁面に設けられ、前記LEDパッケージからの光を前記収容室側から外部に透過させる透過部を備える請求項1〜請求項6の何れか一項に記載の光源装置。
- 前記透過部が、前記LEDパッケージからの光を利用する表示スクリーンからなる請求項1〜請求項7の何れか一項に記載の光源装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015253429A JP6028177B1 (ja) | 2015-12-25 | 2015-12-25 | 光源装置 |
US15/284,741 US10302293B2 (en) | 2015-12-25 | 2016-10-04 | Light source device |
KR1020160132030A KR101880225B1 (ko) | 2015-12-25 | 2016-10-12 | 광원 장치 |
TW105134812A TWI610468B (zh) | 2015-12-25 | 2016-10-27 | 光源裝置 |
CN201610987013.1A CN106917963B (zh) | 2015-12-25 | 2016-11-09 | 光源装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015253429A JP6028177B1 (ja) | 2015-12-25 | 2015-12-25 | 光源装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6028177B1 true JP6028177B1 (ja) | 2016-11-16 |
JP2017117993A JP2017117993A (ja) | 2017-06-29 |
Family
ID=57326662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015253429A Active JP6028177B1 (ja) | 2015-12-25 | 2015-12-25 | 光源装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10302293B2 (ja) |
JP (1) | JP6028177B1 (ja) |
KR (1) | KR101880225B1 (ja) |
CN (1) | CN106917963B (ja) |
TW (1) | TWI610468B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202017105803U1 (de) * | 2017-09-25 | 2019-01-09 | Rehau Ag + Co | Leuchtvorrichtung |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014130963A (ja) * | 2012-12-28 | 2014-07-10 | Nichia Chem Ind Ltd | 発光装置 |
JP2015140351A (ja) * | 2014-01-27 | 2015-08-03 | 株式会社野田スクリーン | コーティング剤およびコーティング膜の形成方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002108563A (ja) | 2000-10-04 | 2002-04-12 | Asahi Eng Co Ltd | 内圧防爆構造の大型表示器 |
ATE383352T1 (de) * | 2001-10-30 | 2008-01-15 | Asahi Glass Co Ltd | Fluorsulfonylverbindungen und verfahren zur herstellung von davon abgeleiteten verbindungen |
DE102010001931A1 (de) * | 2010-02-15 | 2011-08-18 | Osram Gesellschaft mit beschränkter Haftung, 81543 | Lampe mit Gasfüllung |
US8297767B2 (en) * | 2010-09-07 | 2012-10-30 | Xicato, Inc. | LED-based illumination modules with PTFE color converting surfaces |
JP6155473B2 (ja) * | 2012-08-20 | 2017-07-05 | 株式会社野田スクリーン | コーティング膜の形成方法およびコーティング剤 |
KR102355119B1 (ko) * | 2014-03-18 | 2022-01-26 | 주식회사 쿠라레 | 전자 디바이스 |
CN105090899A (zh) * | 2014-05-19 | 2015-11-25 | 江苏豪迈照明科技有限公司 | 管型基元led及其封装方法 |
-
2015
- 2015-12-25 JP JP2015253429A patent/JP6028177B1/ja active Active
-
2016
- 2016-10-04 US US15/284,741 patent/US10302293B2/en active Active
- 2016-10-12 KR KR1020160132030A patent/KR101880225B1/ko active IP Right Grant
- 2016-10-27 TW TW105134812A patent/TWI610468B/zh active
- 2016-11-09 CN CN201610987013.1A patent/CN106917963B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014130963A (ja) * | 2012-12-28 | 2014-07-10 | Nichia Chem Ind Ltd | 発光装置 |
JP2015140351A (ja) * | 2014-01-27 | 2015-08-03 | 株式会社野田スクリーン | コーティング剤およびコーティング膜の形成方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2017117993A (ja) | 2017-06-29 |
TWI610468B (zh) | 2018-01-01 |
US20170184295A1 (en) | 2017-06-29 |
CN106917963A (zh) | 2017-07-04 |
TW201724578A (zh) | 2017-07-01 |
KR101880225B1 (ko) | 2018-07-20 |
KR20170077021A (ko) | 2017-07-05 |
US10302293B2 (en) | 2019-05-28 |
CN106917963B (zh) | 2019-06-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102432033B1 (ko) | 수지 조성물, 차광막, 차광막의 제조 방법 및 격벽 구비 기판 | |
US10829670B2 (en) | Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device | |
WO2014156593A1 (ja) | 有機電子デバイス用素子封止用樹脂組成物、有機電子デバイス用素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置 | |
JP2011501219A5 (ja) | ||
WO2006080299A1 (ja) | 光機能性膜およびその製造方法 | |
JP6028177B1 (ja) | 光源装置 | |
JP2008021480A (ja) | 有機エレクトロルミネッセンス素子 | |
JP7007272B2 (ja) | 有機el表示素子用封止剤 | |
JPWO2005076058A1 (ja) | 液晶ディスプレイ用バックライト装置 | |
KR101957001B1 (ko) | 유기전계 발광소자용 충전재료 및 유기전계 발광소자의 밀봉방법 | |
JP4419635B2 (ja) | 感光性ペースト、プラズマディスプレイ用隔壁およびプラズマディスプレイ用透明誘電体パターンの製造方法ならびにプラズマディスプレイの製造方法 | |
JP3783673B2 (ja) | プラズマディスプレイの製造方法 | |
JP2013108057A (ja) | 熱硬化型水分捕獲体形成用組成物、水分捕獲体および電子デバイス | |
WO2012090961A1 (ja) | 発光装置、発光装置の製造方法、及び、塗布液 | |
JP2011181550A (ja) | 発光装置及びその製造方法 | |
JP6496214B2 (ja) | 表示素子用封止剤 | |
JP2007073279A (ja) | プラズマディスプレイ部材の誘電体層形成用ペーストおよびそれを用いたプラズマディスプレイパネル用部材の製造方法 | |
JP2011210533A (ja) | 熱硬化性誘電体ペーストおよびそれを用いたディスプレイ用部材の製造方法 | |
JP4605571B2 (ja) | 誘電体ペースト、ディスプレイ用部材の製造方法およびプラズマディスプレイパネル | |
JP2024019191A (ja) | 有機el表示素子用封止剤 | |
JP2012164540A (ja) | ガラスペーストおよびプラズマディスプレイパネル用部材の製造方法 | |
JP2017171792A (ja) | コーティング剤 | |
JP2006206918A (ja) | 光学材料用組成物、光学用材料およびその製造方法 | |
TW201831605A (zh) | 有機el顯示元件用密封劑 | |
JP2006286429A (ja) | 転写フィルムおよびプラズマディスプレイパネルの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160908 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160913 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6028177 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313115 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |