JP6018187B2 - ダイオード照明構成 - Google Patents
ダイオード照明構成 Download PDFInfo
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- JP6018187B2 JP6018187B2 JP2014514181A JP2014514181A JP6018187B2 JP 6018187 B2 JP6018187 B2 JP 6018187B2 JP 2014514181 A JP2014514181 A JP 2014514181A JP 2014514181 A JP2014514181 A JP 2014514181A JP 6018187 B2 JP6018187 B2 JP 6018187B2
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- 238000005286 illumination Methods 0.000 claims description 36
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/10—Protection of lighting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
- H05B45/54—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits in a series array of LEDs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
- H05B47/20—Responsive to malfunctions or to light source life; for protection
- H05B47/24—Circuit arrangements for protecting against overvoltage
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Lighting Device Outwards From Vehicle And Optical Signal (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
- Arrangements Of Lighting Devices For Vehicle Interiors, Mounting And Supporting Thereof, Circuits Therefore (AREA)
Description
Claims (13)
- 静電放電保護ダイオード構成と並列に接続された、少なくとも2つの露出した直列接続された発光ダイオードを有する、発光ダイオード構成と、
前記発光ダイオード構成の隣接する発光ダイオード間の相互接続に物理的に近接して延在する、静電放電逸らし構成と、
を有し、前記逸らし構成は、前記相互接続から低い電位の領域へと静電放電を逸らすように構成される、ダイオード照明構成。 - 前記静電放電逸らし構成は、前記相互接続と略並んで配置されたアンテナを有する、請求項1に記載のダイオード照明構成。
- 前記アンテナは、前記発光ダイオード構成の枠に設けられた金属ストリップを有する、請求項2に記載のダイオード照明構成。
- 前記発光ダイオード構成の発光ダイオードの周りに配置された包囲要素を有し、前記静電放電逸らし構成は、前記包囲要素の金属化された表面を有する、請求項1乃至3のいずれか一項に記載のダイオード照明構成。
- 前記包囲要素はコリメータを有する、請求項4に記載のダイオード照明構成。
- 前記静電放電逸らし構成は、前記コリメータの表面における反射性被覆を有する、請求項5に記載のダイオード照明構成。
- 前記静電放電逸らし構成と前記静電放電保護ダイオード構成のノードとの間の電気的接続を有する、請求項1乃至6のいずれか一項に記載のダイオード照明構成。
- 最大で3.0mm、より好適には最大で1.0mm、最も好適には最大で0.3mmの、前記相互接続と前記静電放電逸らし構成との間の間隙を有する、請求項1乃至7のいずれか一項に記載のダイオード照明構成。
- 前記静電放電逸らし構成は、2.0kV、より好適には8.0kV、最も好適には15.0kVまでの電圧サージに対処できる寸法とされる、請求項1乃至8のいずれか一項に記載のダイオード照明構成。
- 第2の発光ダイオード構成と直列に接続された第1の発光ダイオード構成を有し、前記静電放電逸らし構成は、前記第1の発光ダイオード構成の隣接する発光ダイオード間の少なくとも1つの相互接続、及び前記第2の発光ダイオード構成の隣接する発光ダイオード間の少なくとも1つの相互接続に対して物理的な近傍に延在する、請求項1乃至9のいずれか一項に記載のダイオード照明構成。
- 請求項1乃至10のいずれか一項に記載のダイオード照明構成を有する、自動車照明アセンブリ。
- 自動車照明ユニットの光透過性外側カバーのなかに配置されるように構成された、請求項11に記載の自動車照明アセンブリ。
- ダイオード照明構成を製造する方法であって、
少なくとも2つの露出した直列接続された発光ダイオードを有する発光ダイオード構成を、静電放電保護ダイオード構成と並列に接続するステップと、
前記発光ダイオード構成の隣接する発光ダイオード間の少なくとも1つの相互接続に物理的に近接して延在するように、静電放電逸らし構成を配置するステップと、
を有し、前記逸らし構成は、前記相互接続から低い電位の領域へと静電放電を逸らすように構成される、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11169059.0 | 2011-06-08 | ||
EP11169059 | 2011-06-08 | ||
PCT/IB2012/052707 WO2012168834A1 (en) | 2011-06-08 | 2012-05-30 | Diode lighting arrangement |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014519173A JP2014519173A (ja) | 2014-08-07 |
JP6018187B2 true JP6018187B2 (ja) | 2016-11-02 |
Family
ID=46397335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014514181A Active JP6018187B2 (ja) | 2011-06-08 | 2012-05-30 | ダイオード照明構成 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9343446B2 (ja) |
EP (1) | EP2718971B1 (ja) |
JP (1) | JP6018187B2 (ja) |
CN (1) | CN103563078B (ja) |
BR (1) | BR112013031155B1 (ja) |
ES (1) | ES2535831T3 (ja) |
RU (1) | RU2591041C2 (ja) |
WO (1) | WO2012168834A1 (ja) |
Families Citing this family (12)
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EP3105993B1 (en) * | 2014-02-14 | 2017-11-01 | OSRAM GmbH | Lighting system comprising a protection circuit, and corresponding method for protecting light sources from electrostatic discharges |
KR102371448B1 (ko) * | 2014-10-02 | 2022-03-08 | 삼성디스플레이 주식회사 | 광원 및 그것을 포함하는 표시 장치 |
DE102014116079A1 (de) * | 2014-11-04 | 2016-05-04 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
CN104617094B (zh) * | 2015-01-08 | 2018-04-17 | 电子科技大学 | 宽范围大电流高维持电压的双端esd集成保护器件及其制备方法 |
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2012
- 2012-05-30 RU RU2013158389/07A patent/RU2591041C2/ru active
- 2012-05-30 EP EP12730637.1A patent/EP2718971B1/en active Active
- 2012-05-30 ES ES12730637.1T patent/ES2535831T3/es active Active
- 2012-05-30 JP JP2014514181A patent/JP6018187B2/ja active Active
- 2012-05-30 WO PCT/IB2012/052707 patent/WO2012168834A1/en active Application Filing
- 2012-05-30 US US14/119,621 patent/US9343446B2/en active Active
- 2012-05-30 BR BR112013031155-0A patent/BR112013031155B1/pt active IP Right Grant
- 2012-05-30 CN CN201280027559.2A patent/CN103563078B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
BR112013031155B1 (pt) | 2020-10-27 |
US20140111894A1 (en) | 2014-04-24 |
JP2014519173A (ja) | 2014-08-07 |
CN103563078A (zh) | 2014-02-05 |
RU2013158389A (ru) | 2015-07-20 |
EP2718971A1 (en) | 2014-04-16 |
CN103563078B (zh) | 2017-08-25 |
WO2012168834A1 (en) | 2012-12-13 |
ES2535831T3 (es) | 2015-05-18 |
US9343446B2 (en) | 2016-05-17 |
BR112013031155A2 (pt) | 2017-02-07 |
EP2718971B1 (en) | 2015-03-11 |
RU2591041C2 (ru) | 2016-07-10 |
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