JP5989416B2 - ロボットハンド - Google Patents
ロボットハンド Download PDFInfo
- Publication number
- JP5989416B2 JP5989416B2 JP2012138592A JP2012138592A JP5989416B2 JP 5989416 B2 JP5989416 B2 JP 5989416B2 JP 2012138592 A JP2012138592 A JP 2012138592A JP 2012138592 A JP2012138592 A JP 2012138592A JP 5989416 B2 JP5989416 B2 JP 5989416B2
- Authority
- JP
- Japan
- Prior art keywords
- work set
- robot hand
- cassette
- placement surface
- robot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/008—Gripping heads and other end effectors with sticking, gluing or adhesive means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
板状ワークを加工する加工装置は、ワークセットを収納するカセットと、カセットからワークセットを搬出及びカセットにワークセットを搬入するロボットハンドと、ワークセットを仮置きするための仮置きテーブルと、ワークセットを保持する加工テーブルと、加工テーブルに保持されたワークセットに加工を施す加工手段と、加工されたワークセットに洗浄を施す洗浄手段と、を少なくとも備えている。
2:ロボットハンド
20:載置面 21:落下防止爪 22:支持部
23:段差部 24:装着部
3:移動手段
30:支持台 31:アーム部 32:アーム部 33:保持部
4:カセット
40:側板 41:天板 42:底板 43:内壁 44:収納部 45:取っ手
5:環状フレーム 50,51:位置決め面 52,53:外周部 54:開口部
6:粘着テープ
7:板状ワーク
8:ワークセット 9a:前端部 9b:後端部
10:ロボットハンド 11:載置面 12:落下防止爪 13:段差部
Claims (2)
- 開口部を備える環状フレームの一方の面に粘着テープが貼着され該開口部を塞ぐ該粘着テープの粘着面に板状ワークが貼着されて構成されるワークセットをカセットの一対の側板の内壁の間に収納するロボットにおいて、該ロボットに装着するための装着部を備え、該ロボットに備えた移動手段によって駆動されて移動するロボットハンドであって、
該環状フレームは、該開口部を挟んで平行に切り欠いた一対の第1の位置決め面と、該一対の第1の位置決め面に直交する一対の第2の位置決め面とを外周部に備え、
該ロボットハンドは、
水平方向に自由度をもたせてワークセットが載置される載置面と、
該載置面の先端部に形成され、該載置面に載置されたワークセットの前端部を支持し、該載置面からの該ワークセットの落下を防止する落下防止爪と、
該落下防止爪に対応して該装着部の近傍に配置され、該一対の第2の位置決め面のうち該ワークセットの後端部に位置する一方の第2の位置決め面を支持する支持部と、を備えており、
該ロボットハンドに載置された該ワークセットをカセットに収納するとき、該移動手段の進行方向は、該カセットの該内壁と平行な方向であり、該進行方向から該ワークセットに外力が与えられ、該内壁と該フレームの外周とが接触した際に、該一対の第2の位置決め面のうち該ワークセットの該後端部の一方の第2の位置決め面が該支持部に支持され、該後端部の該支持部に支持された点を支点として該ワークセットが該載置面の上で回転して該ワークセットを該カセットに収納可能とするロボットハンド。 - 前記装着部の近傍において、少なくとも2つの支持部を配設している請求項1記載のロボットハンド。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012138592A JP5989416B2 (ja) | 2012-06-20 | 2012-06-20 | ロボットハンド |
TW102116198A TWI576223B (zh) | 2012-06-20 | 2013-05-07 | Manipulator |
KR1020130061196A KR101982354B1 (ko) | 2012-06-20 | 2013-05-29 | 로봇 핸드 |
US13/917,360 US8807616B2 (en) | 2012-06-20 | 2013-06-13 | Robot hand |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012138592A JP5989416B2 (ja) | 2012-06-20 | 2012-06-20 | ロボットハンド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014000654A JP2014000654A (ja) | 2014-01-09 |
JP5989416B2 true JP5989416B2 (ja) | 2016-09-07 |
Family
ID=49773795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012138592A Active JP5989416B2 (ja) | 2012-06-20 | 2012-06-20 | ロボットハンド |
Country Status (4)
Country | Link |
---|---|
US (1) | US8807616B2 (ja) |
JP (1) | JP5989416B2 (ja) |
KR (1) | KR101982354B1 (ja) |
TW (1) | TWI576223B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102130033B (zh) * | 2005-07-08 | 2014-05-14 | 交叉自动控制公司 | 工件支撑结构及其使用设备 |
WO2016187074A1 (en) * | 2015-05-19 | 2016-11-24 | Verselus, Llc | Apparatus for transporting an object from one location to another location in a manufacturing environment |
JP6534210B2 (ja) * | 2015-10-14 | 2019-06-26 | ローツェ株式会社 | テープフレーム搬送のためのエンドエフェクタ、及びこれを備える搬送ロボット |
CN105903880A (zh) * | 2016-05-20 | 2016-08-31 | 吴传涛 | 一种锻造时夹取毛坯件的自动机械臂 |
JP6782180B2 (ja) * | 2017-01-31 | 2020-11-11 | 川崎重工業株式会社 | 基板把持ハンド及び基板搬送装置 |
US10399231B2 (en) | 2017-05-22 | 2019-09-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Substrate handling contacts and methods |
US10553472B2 (en) * | 2018-06-22 | 2020-02-04 | Jabil Inc. | Apparatus, system and method for providing a bernoulli-based semiconductor wafer pre-aligner |
KR102204884B1 (ko) * | 2018-09-27 | 2021-01-19 | 세메스 주식회사 | 기판 반송 로봇 및 기판 처리 설비 |
JP7396815B2 (ja) | 2019-06-12 | 2023-12-12 | 株式会社ディスコ | ロボットハンド |
US11254015B2 (en) * | 2019-09-24 | 2022-02-22 | Thermo Crs Ltd. | Multi-axis gripper for lab automation robot |
CN112109095A (zh) * | 2020-09-21 | 2020-12-22 | 芯导精密(北京)设备有限公司 | 一种新型机械臂 |
WO2023200746A1 (en) * | 2022-04-13 | 2023-10-19 | Service Support Specialties, Inc. | Method and/or system for processing a substrate and robot apparatus therefor |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2508540B2 (ja) * | 1987-11-02 | 1996-06-19 | 三菱マテリアル株式会社 | ウェ―ハの位置検出装置 |
KR0152324B1 (ko) * | 1994-12-06 | 1998-12-01 | 양승택 | 웨이퍼 측면파지 이송 반도체 제조장치 |
US6322312B1 (en) * | 1999-03-18 | 2001-11-27 | Applied Materials, Inc. | Mechanical gripper for wafer handling robots |
US20020071756A1 (en) * | 2000-12-13 | 2002-06-13 | Gonzalez Jose R. | Dual wafer edge gripping end effector and method therefor |
US6752442B2 (en) * | 2001-11-09 | 2004-06-22 | Speedfam-Ipec Corporation | Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector |
KR100832772B1 (ko) * | 2006-05-22 | 2008-05-27 | 주식회사 나온테크 | 반도체이송장비 |
JP4698519B2 (ja) * | 2006-07-31 | 2011-06-08 | 日東電工株式会社 | 半導体ウエハマウント装置 |
JP2010098130A (ja) * | 2008-10-16 | 2010-04-30 | Hirata Corp | エンドイフェクタ |
JP2011035281A (ja) | 2009-08-05 | 2011-02-17 | Disco Abrasive Syst Ltd | ワーク収納機構および研削装置 |
JP2011135026A (ja) * | 2009-11-27 | 2011-07-07 | Disco Abrasive Syst Ltd | ワークユニットの保持方法および保持機構 |
JP2011131284A (ja) | 2009-12-22 | 2011-07-07 | Disco Abrasive Syst Ltd | 研削装置 |
TW201210764A (en) * | 2010-09-08 | 2012-03-16 | Jonas & Amp Redmann Automationstechnik Gmbh | Bernoulli gripper device having at least one Bernoulli gripper |
-
2012
- 2012-06-20 JP JP2012138592A patent/JP5989416B2/ja active Active
-
2013
- 2013-05-07 TW TW102116198A patent/TWI576223B/zh active
- 2013-05-29 KR KR1020130061196A patent/KR101982354B1/ko active IP Right Grant
- 2013-06-13 US US13/917,360 patent/US8807616B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWI576223B (zh) | 2017-04-01 |
KR101982354B1 (ko) | 2019-05-27 |
JP2014000654A (ja) | 2014-01-09 |
KR20130142915A (ko) | 2013-12-30 |
TW201402287A (zh) | 2014-01-16 |
US20130341946A1 (en) | 2013-12-26 |
US8807616B2 (en) | 2014-08-19 |
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