JP5169501B2 - 電極用導電性ペーストおよび透明タッチパネル - Google Patents
電極用導電性ペーストおよび透明タッチパネル Download PDFInfo
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- JP5169501B2 JP5169501B2 JP2008145738A JP2008145738A JP5169501B2 JP 5169501 B2 JP5169501 B2 JP 5169501B2 JP 2008145738 A JP2008145738 A JP 2008145738A JP 2008145738 A JP2008145738 A JP 2008145738A JP 5169501 B2 JP5169501 B2 JP 5169501B2
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- Prior art keywords
- fine powder
- conductive paste
- conductive
- electrode
- tin oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002003 electrode paste Substances 0.000 title description 2
- 239000000843 powder Substances 0.000 claims description 110
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 28
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 28
- 229910001887 tin oxide Inorganic materials 0.000 claims description 28
- 239000002245 particle Substances 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 claims description 4
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 2
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical group CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims description 2
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 claims description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 2
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 description 21
- 239000004332 silver Substances 0.000 description 21
- 239000010944 silver (metal) Substances 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 229920000298 Cellophane Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000010946 fine silver Substances 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910000846 In alloy Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006072 paste Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
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- Conductive Materials (AREA)
Description
2、下部基材板
2´ 上部基材板
3、 下部導電層
3´ 上部導電層
4、 下部電極層
4´ 上部電極層
5 粘着材
6、6´ レジスト層
7 スペーサ
Claims (4)
- 透明導電性膜の電極用として使用される導電性ペーストであって、バインダー樹脂、導電性微粉末及び溶剤を必須成分とし、前記導電性微粉末が酸化錫微粉末0.2〜20質量%、銀微粉末99.8〜80質量%からなり、
前記バインダー樹脂が、ポリエステル樹脂、アクリル樹脂、フェノール樹脂、塩化ビニル酢酸ビニル共重合樹脂、ウレタン樹脂、エポキシ樹脂からなる群より選ばれる少なくとも一つであり、
前記溶剤が、エチルジグリコールアセテート、ブチルグリコールアセテート、ブチルジグリコールアセテート、ベンジルアルコール、イソホロンからなる群より選ばれる少なくとも一つであることを特徴とする電極用導電性ペースト。 - 前記酸化錫微粉末が、アンチモンドープされた酸化錫微粉末であることを特徴とする請求項1に記載の電極用導電性ペースト。
- 前記酸化錫微粉末の粒径が、5nm〜30μmであることを特徴とする請求項1または2のいずれかに記載の電極用導電性ペースト。
- 請求項1〜3のいずれかに記載される電極用導電性ペーストを用いて、透明導電性膜に電極層を形成したことを特徴とする透明タッチパネル。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008145738A JP5169501B2 (ja) | 2008-06-03 | 2008-06-03 | 電極用導電性ペーストおよび透明タッチパネル |
Applications Claiming Priority (1)
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---|---|---|---|
JP2008145738A JP5169501B2 (ja) | 2008-06-03 | 2008-06-03 | 電極用導電性ペーストおよび透明タッチパネル |
Publications (2)
Publication Number | Publication Date |
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JP2009295325A JP2009295325A (ja) | 2009-12-17 |
JP5169501B2 true JP5169501B2 (ja) | 2013-03-27 |
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JP2008145738A Active JP5169501B2 (ja) | 2008-06-03 | 2008-06-03 | 電極用導電性ペーストおよび透明タッチパネル |
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JP (1) | JP5169501B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140115316A (ko) * | 2012-01-19 | 2014-09-30 | 도레이 카부시키가이샤 | 도전 페이스트 및 도전 패턴의 제조 방법 |
JP6213204B2 (ja) * | 2013-12-13 | 2017-10-18 | 三菱マテリアル株式会社 | Ag下地層形成用ペースト |
JP6248619B2 (ja) * | 2013-12-25 | 2017-12-20 | 三菱マテリアル株式会社 | パワーモジュール用基板、およびその製造方法、パワーモジュール |
CN107735840B (zh) * | 2015-07-10 | 2020-08-11 | 东丽株式会社 | 导电糊剂、触摸传感器构件及导电图案的制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09286936A (ja) * | 1996-04-22 | 1997-11-04 | Sumitomo Metal Mining Co Ltd | 透明導電膜形成用塗布液、これを用いた透明導電膜及びその形成方法 |
KR100472496B1 (ko) * | 1997-07-23 | 2005-05-16 | 삼성에스디아이 주식회사 | 투명도전성조성물,이로부터형성된투명도전막및그제조방법 |
JP2003217348A (ja) * | 2002-01-21 | 2003-07-31 | Matsushita Electric Ind Co Ltd | 導電ペーストとその製造方法及びこれを用いた光透過性タッチパネル |
JP2006059720A (ja) * | 2004-08-20 | 2006-03-02 | Sony Corp | 導電性ペースト及びタッチパネル |
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- 2008-06-03 JP JP2008145738A patent/JP5169501B2/ja active Active
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JP2009295325A (ja) | 2009-12-17 |
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