JP5950436B2 - 電子部品実装装置 - Google Patents
電子部品実装装置 Download PDFInfo
- Publication number
- JP5950436B2 JP5950436B2 JP2012007214A JP2012007214A JP5950436B2 JP 5950436 B2 JP5950436 B2 JP 5950436B2 JP 2012007214 A JP2012007214 A JP 2012007214A JP 2012007214 A JP2012007214 A JP 2012007214A JP 5950436 B2 JP5950436 B2 JP 5950436B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- illumination light
- imaging means
- nozzle
- suction nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005286 illumination Methods 0.000 claims description 65
- 238000003384 imaging method Methods 0.000 claims description 54
- 230000003287 optical effect Effects 0.000 claims description 37
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Operations Research (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
B1,B2 部品
C プリント基板
D 側方撮像手段の光学系
E 側方撮像手段の照明系
E1 スリット
F 側方撮像手段の視野
1 吸着ノズル
2 ノズル保持部材
3,4 ガイドレール
5 プリント基板
6 基台
7 側方撮像手段
7a CCDセンサ
7b 照明光源(照明系)
7c マスク(照明系)
7d スリット(照明系)
7e レンズ(光学系)
7f 反射ミラー(光学系)
Claims (2)
- 電子部品を吸着する吸着ノズルがノズル保持部材に上下方向に移動可能に設けられ、前記ノズル保持部材がプリント基板を載置する基台に対して水平面内で相対変位するとともに前記吸着ノズルが上下方向に移動することにより、吸着ノズルに吸着された電子部品をプリント基板上に実装するように構成された電子部品実装機であって、
吸着ノズルの先端部分を側方から撮像可能であり、その光学系及び照明系が前記ノズル保持部材に固定されている側方撮像手段を備え、
前記側方撮像手段は、その光学系の光軸が、吸着ノズルの吸着面に対し水平でなく、上方から所定の角度をなすように電子部品を撮像し、前記側方撮像手段の照明系は、上方から所定の角度をなすように電子部品を照明し、かつ、当該側方撮像手段の視野内において、吸着ノズルに吸着された電子部品には照明光が当たるが、プリント基板上の既設の電子部品には照明光が当たらないように照明光を発することを特徴とする電子部品実装装置。 - 前記側方撮像手段の照明系は、少なくとも2方向の照明光を発し、この2方向の照明光が吸着ノズルに吸着された電子部品の位置で交差するように照明光を発する、請求項1に記載の電子部品実装装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012007214A JP5950436B2 (ja) | 2012-01-17 | 2012-01-17 | 電子部品実装装置 |
KR1020120034226A KR101522286B1 (ko) | 2012-01-17 | 2012-04-03 | 전자 부품 실장 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012007214A JP5950436B2 (ja) | 2012-01-17 | 2012-01-17 | 電子部品実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013149672A JP2013149672A (ja) | 2013-08-01 |
JP5950436B2 true JP5950436B2 (ja) | 2016-07-13 |
Family
ID=48995164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012007214A Expired - Fee Related JP5950436B2 (ja) | 2012-01-17 | 2012-01-17 | 電子部品実装装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5950436B2 (ja) |
KR (1) | KR101522286B1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6415996B2 (ja) * | 2015-01-21 | 2018-10-31 | Juki株式会社 | 実装装置、荷重検出方法及びそのプログラム |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2562904B2 (ja) * | 1987-07-20 | 1996-12-11 | 日東工業株式会社 | プリント基板の電子部品有無検査装置 |
JP3358847B2 (ja) * | 1993-06-29 | 2002-12-24 | 三洋電機株式会社 | 部品実装機の制御装置 |
JP3101801B2 (ja) * | 1995-08-31 | 2000-10-23 | 本田技研工業株式会社 | 光学式測定装置の異常検査方法 |
JP4194159B2 (ja) * | 1999-01-05 | 2008-12-10 | 芝浦メカトロニクス株式会社 | 基板マーク認識機構 |
JP4409017B2 (ja) * | 1999-12-07 | 2010-02-03 | ヤマハ発動機株式会社 | 部品装着確認方法および同装置 |
JP4850693B2 (ja) * | 2006-12-28 | 2012-01-11 | ヤマハ発動機株式会社 | 部品認識装置、表面実装機および部品試験装置 |
JP5202100B2 (ja) * | 2008-05-20 | 2013-06-05 | 富士機械製造株式会社 | 撮像装置付保持装置 |
JP5385010B2 (ja) * | 2009-05-29 | 2014-01-08 | Juki株式会社 | 電子部品実装装置 |
-
2012
- 2012-01-17 JP JP2012007214A patent/JP5950436B2/ja not_active Expired - Fee Related
- 2012-04-03 KR KR1020120034226A patent/KR101522286B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2013149672A (ja) | 2013-08-01 |
KR101522286B1 (ko) | 2015-05-21 |
KR20130084583A (ko) | 2013-07-25 |
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