JP5940546B2 - Ledパッケージマウント - Google Patents
Ledパッケージマウント Download PDFInfo
- Publication number
- JP5940546B2 JP5940546B2 JP2013532791A JP2013532791A JP5940546B2 JP 5940546 B2 JP5940546 B2 JP 5940546B2 JP 2013532791 A JP2013532791 A JP 2013532791A JP 2013532791 A JP2013532791 A JP 2013532791A JP 5940546 B2 JP5940546 B2 JP 5940546B2
- Authority
- JP
- Japan
- Prior art keywords
- base
- led package
- arm
- arms
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000013011 mating Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 102000007469 Actins Human genes 0.000 description 1
- 108010085238 Actins Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
Claims (13)
- 第1の面と、前記第1の面との間に空間を画定する第2の面であって前記第1の面から間隔をあけて配置された第2の面を有する剛性のあるアームとを含むヒートシンクと、
基部を有するLEDパッケージであって、前記基部が、前記アームの第2の面と前記第1の面との間の前記空間に配置され、前記アームの第2の面が前記基部を前記第1の面に突き当てて留める力を前記基部に直接に加えるように前記アームが構成されるLEDパッケージと
を備え、
前記アームは、前端と後端であって、前記基部が当該前端に挿入され当該後端に向かって回転される前端と後端を有し、
前記アームの第2の面が、前記基部が前記空間に挿入されるにつれて前記基部を前記第1の面に押し付けるように増加する力を作用するように、前記前端では前記後端でよりも大きい距離で前記第1の面から離隔され、前記第1の面に対して角度をつけられたカム面を備える、発光ダイオード(LED)パッケージ取付装置。 - それぞれが第2の面を有する複数のアームをさらに含み、前記複数のアームのそれぞれが、前記第1の面の上に配置され、前記複数のアームの第2の面と前記第1の面との間の複数の空間を画定し、前記基部が前記複数の空間内に配置され、前記複数のアームの第2の面が前記基部を前記第1の面に突き当てて留める力を前記基部に直接に加えるように前記複数のアームが構成される、請求項1に記載の装置。
- 前記複数のアームが前記第1の面のまわりに等しく間隔をあけて配置される、請求項2に記載の装置。
- 前記複数のアームが向かい合う対として配置される、請求項2に記載の装置。
- 前記基部が、複数の切欠き部によって互いに間隔をあけて配置された複数の突起を備え、前記複数の切欠き部が前記複数のアームよりも幅が広い、請求項4に記載の装置。
- 前記アームが、前記基部と機械的に係合する突起を備える、請求項1に記載の装置。
- 前記アームが片持ち梁のように延びる、請求項1に記載の装置。
- 前記基部がある厚さを有し、前記アームの第2の面と前記第1の面との間の距離が前記基部の厚さよりも小さい、請求項1に記載の装置。
- 前記基部が、前記アームの下に延びる肩を備える、請求項1に記載の装置。
- 前記ヒートシンクが、互いに等しく間隔をあけて配置された4つのアームをさらに備える、請求項1に記載の装置。
- 前記基部が4つの肩を備え、前記4つの肩のうちの1つが前記4つのアームのそれぞれの下に設置される、請求項10に記載の装置。
- 前記第1の面に対する前記LEDパッケージの横方向位置を決めるように、前記LEDパッケージと係合するタブをさらに備える、請求項1に記載の装置。
- 前記基部上の噛合い係合部材と係合する係合部材を前記第1の面上にさらに備える、請求項1に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/901,034 | 2010-10-08 | ||
US12/901,034 US9279543B2 (en) | 2010-10-08 | 2010-10-08 | LED package mount |
PCT/US2011/026796 WO2012047305A1 (en) | 2010-10-08 | 2011-03-02 | Led package mount |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013539244A JP2013539244A (ja) | 2013-10-17 |
JP5940546B2 true JP5940546B2 (ja) | 2016-06-29 |
Family
ID=44231157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013532791A Expired - Fee Related JP5940546B2 (ja) | 2010-10-08 | 2011-03-02 | Ledパッケージマウント |
Country Status (6)
Country | Link |
---|---|
US (1) | US9279543B2 (ja) |
EP (1) | EP2625459B1 (ja) |
JP (1) | JP5940546B2 (ja) |
CN (1) | CN103201559B (ja) |
TW (1) | TW201215812A (ja) |
WO (1) | WO2012047305A1 (ja) |
Families Citing this family (5)
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JP4963736B2 (ja) * | 2010-10-28 | 2012-06-27 | 日本航空電子工業株式会社 | 照明装置 |
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EP2806209B1 (en) | 2013-05-24 | 2019-03-20 | Holophane Europe Ltd. | LED luminaire with multiple vents for promoting vertical ventilation |
CN110335551B (zh) * | 2019-05-21 | 2021-01-05 | 安徽明洋电子有限公司 | 一种led显示屏加工用屏幕封装设备及其操作方法 |
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-
2010
- 2010-10-08 US US12/901,034 patent/US9279543B2/en not_active Expired - Fee Related
-
2011
- 2011-03-02 CN CN201180048604.8A patent/CN103201559B/zh active Active
- 2011-03-02 EP EP11708161.2A patent/EP2625459B1/en active Active
- 2011-03-02 TW TW100106964A patent/TW201215812A/zh unknown
- 2011-03-02 JP JP2013532791A patent/JP5940546B2/ja not_active Expired - Fee Related
- 2011-03-02 WO PCT/US2011/026796 patent/WO2012047305A1/en active Application Filing
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US20120087137A1 (en) | 2012-04-12 |
TW201215812A (en) | 2012-04-16 |
EP2625459A1 (en) | 2013-08-14 |
CN103201559B (zh) | 2017-06-06 |
WO2012047305A1 (en) | 2012-04-12 |
JP2013539244A (ja) | 2013-10-17 |
EP2625459B1 (en) | 2017-10-18 |
US9279543B2 (en) | 2016-03-08 |
CN103201559A (zh) | 2013-07-10 |
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