JP5917796B2 - Ledパッケージ装置 - Google Patents
Ledパッケージ装置 Download PDFInfo
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- JP5917796B2 JP5917796B2 JP2010159650A JP2010159650A JP5917796B2 JP 5917796 B2 JP5917796 B2 JP 5917796B2 JP 2010159650 A JP2010159650 A JP 2010159650A JP 2010159650 A JP2010159650 A JP 2010159650A JP 5917796 B2 JP5917796 B2 JP 5917796B2
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- resin mold
- led
- cup
- light
- cup portion
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- 239000011347 resin Substances 0.000 claims description 101
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- 230000000052 comparative effect Effects 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
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- 238000000465 moulding Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- CVEPFOUZABPRMK-UHFFFAOYSA-N 2-methylprop-2-enoic acid;styrene Chemical class CC(=C)C(O)=O.C=CC1=CC=CC=C1 CVEPFOUZABPRMK-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
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- 230000006866 deterioration Effects 0.000 description 1
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- 239000000945 filler Substances 0.000 description 1
- 235000019000 fluorine Nutrition 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002011 hydrophilic fumed silica Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
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- 229910052749 magnesium Inorganic materials 0.000 description 1
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- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002848 norbornenes Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- JUWGUJSXVOBPHP-UHFFFAOYSA-B titanium(4+);tetraphosphate Chemical compound [Ti+4].[Ti+4].[Ti+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O JUWGUJSXVOBPHP-UHFFFAOYSA-B 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Description
上記リードフレームは上記各LEDが搭載されるカップ部を備え、
上記各LEDが搭載されたカップ部内には、搭載された各LEDを覆うように光透過性の第1樹脂モールドが設けられ、
少なくとも上記カップ部の開口を覆うように、光透過性の第2樹脂モールドが形成され、
上記第1樹脂モールドと第2樹脂モールドは、相互に屈折率が異なっていることを要旨とする。
なお、ここでの屈折率は、真空を1.0としたときの絶対屈折率をいう。
ここで、良好な配光特性を得る理由としては、以下のことが推察される。まず、1種類の樹脂モールドでは赤色LED2Rの配光の特性を修正できなかったのに対し、2種類の樹脂モールドにより光の境界を設けることでレンズ効果が生じる。このレンズ効果により赤色LED2Rの配光特性が改善され、結果として全体としての配光特性が改善される。また、シリコーンがカップ部5よりもやや盛り上がることにより、凸レンズ効果が生まれ、その形状を変化させることにより、配光を制御することが出来る。
2R 赤色LED
2B 青色LED
2G 緑色LED
3 実装面
4 反射面
5 カップ部
6 脚部
7 端子部材
8 接続導線
10 樹脂モールド
11 第1樹脂モールド
12 第2樹脂モールド
Claims (2)
- 少なくとも3個以上の異なる波長のLEDと、各LEDが搭載されるリードフレームとを有するLEDパッケージ装置であって、
上記リードフレームは上記各LEDが搭載されるカップ部を備え、
上記各LEDが搭載されたカップ部内には、搭載された各LEDを覆うように光透過性の第1樹脂モールドが設けられ、
少なくとも上記カップ部の開口を覆うように、上記第1樹脂モールドと接触するように、光透過性の第2樹脂モールドが形成され、
上記第1樹脂モールドと第2樹脂モールドは、相互に屈折率が異なっていて、第2樹脂モールドの屈折率は、第1樹脂モールドの屈折率よりも大きく、
上記第1樹脂モールドは、その表面が、上記カップ部の開口縁と面一になるように設けられ、
上記第2樹脂モールドは、上記第1樹脂モールドの表面と接触する面と、上記接触する面の反対側を向く平坦な上面と、平坦な下面と、を有し、
上記リードフレームは、上記カップ部の長手方向を軸とした片側の第1上端縁、及び上記カップ部の長手方向を軸とした反対側の第2上端縁のそれぞれに延設された脚部と、上記第2上端縁の脚部と並ぶように設けられた端子部と、を含み、
上記脚部は、
上記第1上端縁及び第2上端縁のそれぞれに設けられ、上記カップ部の上端縁の高さで横方向に延びて上記カップ部を吊る第1部分と、
上記第1上端縁に設けられた第1部分の先端から下方に延びてカップ部を支える第2部分と、
上記第2部分の下端から再び横方向に延びて取り付け面に接する第1接触面を有する第3部分と、を有し、
上記端子部は、
上記第2上端縁に設けられた第1部分と対向し、上記カップ部の上端縁の高さよりも一段高い高さで横方向に延びて接続導線を介してLEDと電気的に接続される第4部分と、
上記第4部分の先端から下方に延びる第5部分と、
上記第5部分の下端から再び横方向に延びて取り付け面に接する第2接触面を有する第6部分と、を有し、
上記第2樹脂モールドは、上記第3部分の第1接触面以外の上記脚部の部分、及び上記第6部分の第2接触面以外の上記端子部の部分を覆って、上記第1接触面及び第2接触面のみが上記第2樹脂モールドから露出するように形成され、
上記第1接触面及び第2接触面は、上記第2樹脂モールドの下面の周縁に配置され、上記下面と面一である、
ことを特徴とするLEDパッケージ装置。 - 第1樹脂モールドには光拡散剤が含有されているが、第2樹脂モールドには光拡散剤が含有されていない請求項1に記載のLEDパッケージ装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010159650A JP5917796B2 (ja) | 2010-07-14 | 2010-07-14 | Ledパッケージ装置 |
KR1020137000797A KR101572466B1 (ko) | 2010-07-14 | 2011-07-12 | Led 패키지 장치 |
CN201180034440.3A CN102986045B (zh) | 2010-07-14 | 2011-07-12 | Led封装装置 |
DE112011102336T DE112011102336T5 (de) | 2010-07-14 | 2011-07-12 | LED Paketanordnung |
PCT/JP2011/066294 WO2012008600A1 (ja) | 2010-07-14 | 2011-07-12 | Ledパッケージ装置 |
TW100124971A TWI527270B (zh) | 2010-07-14 | 2011-07-14 | 發光二極體封裝裝置 |
HK13107338.1A HK1180453A1 (zh) | 2010-07-14 | 2013-06-24 | 封裝裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010159650A JP5917796B2 (ja) | 2010-07-14 | 2010-07-14 | Ledパッケージ装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015184994A Division JP6076429B2 (ja) | 2015-09-18 | 2015-09-18 | Ledパッケージ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012023189A JP2012023189A (ja) | 2012-02-02 |
JP5917796B2 true JP5917796B2 (ja) | 2016-05-18 |
Family
ID=45469593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010159650A Active JP5917796B2 (ja) | 2010-07-14 | 2010-07-14 | Ledパッケージ装置 |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5917796B2 (ja) |
KR (1) | KR101572466B1 (ja) |
CN (1) | CN102986045B (ja) |
DE (1) | DE112011102336T5 (ja) |
HK (1) | HK1180453A1 (ja) |
TW (1) | TWI527270B (ja) |
WO (1) | WO2012008600A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102853341A (zh) * | 2012-09-07 | 2013-01-02 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | Led彩色贴片模组、led彩色贴片装置及其加工工艺 |
JP6188408B2 (ja) * | 2013-05-07 | 2017-08-30 | 三菱電機株式会社 | Led表示素子および映像表示装置 |
KR101483010B1 (ko) * | 2013-07-29 | 2015-01-19 | 주식회사 굿엘이디 | Led 패키지 |
JP6544076B2 (ja) | 2014-12-26 | 2019-07-17 | 日亜化学工業株式会社 | 発光装置 |
TWI570965B (zh) * | 2015-02-26 | 2017-02-11 | 友達光電股份有限公司 | 發光裝置和顯示器 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0563068U (ja) * | 1992-01-31 | 1993-08-20 | シャープ株式会社 | 樹脂封止型発光体 |
JP3235470B2 (ja) * | 1996-06-18 | 2001-12-04 | 日亜化学工業株式会社 | 光半導体装置及びそれを用いた発光装置 |
JP3967459B2 (ja) * | 1998-05-29 | 2007-08-29 | ローム株式会社 | 半導体装置 |
JP2002198570A (ja) * | 2000-12-26 | 2002-07-12 | Toyoda Gosei Co Ltd | 固体光素子 |
JP2002280617A (ja) * | 2001-03-19 | 2002-09-27 | Matsushita Electric Ind Co Ltd | 照明装置 |
JP4282344B2 (ja) * | 2003-02-28 | 2009-06-17 | シチズン電子株式会社 | 発光ダイオード |
TW200614548A (en) * | 2004-07-09 | 2006-05-01 | Matsushita Electric Ind Co Ltd | Light-emitting device |
JP2007116131A (ja) * | 2005-09-21 | 2007-05-10 | Sanyo Electric Co Ltd | Led発光装置 |
US7473939B2 (en) * | 2006-01-06 | 2009-01-06 | Formosa Epitaxy Incorporation | Light-emitting diode structure with transparent window covering layer of multiple films |
KR100867519B1 (ko) * | 2006-02-02 | 2008-11-07 | 삼성전기주식회사 | 발광 다이오드 모듈 |
JP5357379B2 (ja) * | 2006-02-23 | 2013-12-04 | パナソニック株式会社 | 発光装置 |
TWI321857B (en) * | 2006-07-21 | 2010-03-11 | Epistar Corp | A light emitting device |
JP5028562B2 (ja) * | 2006-12-11 | 2012-09-19 | 株式会社ジャパンディスプレイイースト | 照明装置及びこの照明装置を用いた表示装置 |
JP2008187031A (ja) * | 2007-01-30 | 2008-08-14 | Okaya Electric Ind Co Ltd | 半導体チップ収納用の放熱パッケージ |
US9061450B2 (en) * | 2007-02-12 | 2015-06-23 | Cree, Inc. | Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding |
JP4924113B2 (ja) * | 2007-03-08 | 2012-04-25 | 豊田合成株式会社 | 発光装置及び発光装置の製造方法 |
KR100855065B1 (ko) * | 2007-04-24 | 2008-08-29 | 삼성전기주식회사 | 발광 다이오드 패키지 |
-
2010
- 2010-07-14 JP JP2010159650A patent/JP5917796B2/ja active Active
-
2011
- 2011-07-12 WO PCT/JP2011/066294 patent/WO2012008600A1/ja active Application Filing
- 2011-07-12 DE DE112011102336T patent/DE112011102336T5/de not_active Withdrawn
- 2011-07-12 KR KR1020137000797A patent/KR101572466B1/ko active IP Right Grant
- 2011-07-12 CN CN201180034440.3A patent/CN102986045B/zh active Active
- 2011-07-14 TW TW100124971A patent/TWI527270B/zh active
-
2013
- 2013-06-24 HK HK13107338.1A patent/HK1180453A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
HK1180453A1 (zh) | 2013-10-18 |
DE112011102336T5 (de) | 2013-04-18 |
WO2012008600A1 (ja) | 2012-01-19 |
CN102986045B (zh) | 2016-05-18 |
KR20130072236A (ko) | 2013-07-01 |
KR101572466B1 (ko) | 2015-11-27 |
TW201232839A (en) | 2012-08-01 |
CN102986045A (zh) | 2013-03-20 |
JP2012023189A (ja) | 2012-02-02 |
TWI527270B (zh) | 2016-03-21 |
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