JP5909656B2 - 誘電体素子用基材とその製造方法、並びにこの誘電体素子用基材を用いた圧電体素子 - Google Patents
誘電体素子用基材とその製造方法、並びにこの誘電体素子用基材を用いた圧電体素子 Download PDFInfo
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 74
- 238000002955 isolation Methods 0.000 claims description 72
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical group [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 38
- 229910052804 chromium Inorganic materials 0.000 claims description 38
- 229910052742 iron Inorganic materials 0.000 claims description 37
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
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- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
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- 238000001947 vapour-phase growth Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
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- GJKFIJKSBFYMQK-UHFFFAOYSA-N lanthanum(3+);trinitrate;hexahydrate Chemical compound O.O.O.O.O.O.[La+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O GJKFIJKSBFYMQK-UHFFFAOYSA-N 0.000 description 2
- 229940078487 nickel acetate tetrahydrate Drugs 0.000 description 2
- OINIXPNQKAZCRL-UHFFFAOYSA-L nickel(2+);diacetate;tetrahydrate Chemical compound O.O.O.O.[Ni+2].CC([O-])=O.CC([O-])=O OINIXPNQKAZCRL-UHFFFAOYSA-L 0.000 description 2
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- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
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- VTCHZFWYUPZZKL-UHFFFAOYSA-N 4-azaniumylcyclopent-2-ene-1-carboxylate Chemical compound NC1CC(C(O)=O)C=C1 VTCHZFWYUPZZKL-UHFFFAOYSA-N 0.000 description 1
- 229910020851 La(NO3)3.6H2O Inorganic materials 0.000 description 1
- 229910017771 LaFeO Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
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- 230000008020 evaporation Effects 0.000 description 1
- KIXLEMHCRGHACT-UHFFFAOYSA-N hafnium(4+);methanolate Chemical compound [Hf+4].[O-]C.[O-]C.[O-]C.[O-]C KIXLEMHCRGHACT-UHFFFAOYSA-N 0.000 description 1
- HRDRRWUDXWRQTB-UHFFFAOYSA-N hafnium(4+);propan-2-olate Chemical compound [Hf+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] HRDRRWUDXWRQTB-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000001027 hydrothermal synthesis Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FYDKNKUEBJQCCN-UHFFFAOYSA-N lanthanum(3+);trinitrate Chemical compound [La+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O FYDKNKUEBJQCCN-UHFFFAOYSA-N 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 150000004684 trihydrates Chemical class 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
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- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Description
図1は、本発明の実施の形態1における圧電体素子の構造の一例を示す断面図である。圧電体素子1は、誘電体素子用基材5と、誘電体素子用基材5の主面に順次積層された圧電体層6と上部電極層7とで構成されている。誘電体素子用基材5は、一対の対向する主面を有する基板2と、基板2の少なくとも一方の主面上に、順次積層された拡散層3Aと、第1隔離層3と、下部電極層4とで構成されている。すなわち、圧電体層6は下部電極層4に積層されている。
図5は本発明の実施の形態2における圧電体素子の構造の一例を示す断面図である。圧電体素子11において、誘電体素子用基材15は、第1隔離層3と下部電極層4との間に第2隔離層8を有する。これ以外は、実施の形態1で説明した圧電体素子1、誘電体素子用基材5と同様の構造を有している。
2 基板
3 第1隔離層
3A 拡散層
4 下部電極層
5,15 誘電体素子用基材
6 圧電体層
7 上部電極層
8 第2隔離層
Claims (12)
- 第1金属元素と第2金属元素とを含む基板と、
前記基板上に設けられた拡散層と、
前記拡散層上に、前記拡散層と一体に設けられた第1隔離層と、
前記第1隔離層の、前記拡散層と反対側に設けられ、前記第1隔離層によって前記拡散層と隔離された下部電極層と、を備え、
前記拡散層は、前記第1隔離層と同じ組成材料に対し、前記基板から拡散された前記第1金属元素と前記第2金属元素とを含み、
前記第1隔離層は前記第1金属元素と前記第2金属元素とを含まず、
前記拡散層の熱膨張係数は、前記基板から前記第1隔離層に向かって単調減少している、
誘電体素子用基材。 - 前記基板から前記第1隔離層に向かう方向において、前記拡散層の前記第1金属元素の濃度勾配と前記第2金属元素の濃度勾配とが異なっている、
請求項1記載の誘電体素子用基材。 - 前記第1金属元素は鉄であり、前記第2金属元素はクロムである、
請求項1記載の誘電体素子用基材。 - 前記基板から前記第1隔離層に向かう方向において、クロムの拡散距離が鉄の拡散距離より大きい、
請求項3記載の誘電体素子用基材。 - 前記第1隔離層はシリコン酸化物で形成されている、
請求項1記載の誘電体素子用基材。 - 前記第1隔離層と前記下部電極層との間に設けられ、前記第1隔離層よりも大きな熱膨張係数を有するとともに、前記第1隔離層よりも前記第1金属元素と前記第2金属元素の拡散が小さい第2隔離層をさらに備えた、
請求項1記載の誘電体素子用基材。 - 第1金属元素と第2金属元素とを含む基板上に中間層を形成するステップと、
前記基板から前記第1金属元素と前記第2金属元素とを拡散させて、前記中間層内に前記基板に隣接する拡散層を形成するとともに、前記中間層の前記基板と反対側に前記第1金属元素と前記第2金属元素とを含まない第1隔離層を形成するステップと、
前記第1隔離層の、前記拡散層と反対側に下部電極層を形成するステップと、を備え、
前記拡散層の熱膨張係数が、前記基板から前記第1隔離層に向かって単調減少するように、前記拡散層を形成する、
誘電体素子用基材の製造方法。 - 前記基板から前記第1隔離層に向かう方向において、前記第1金属元素の濃度勾配と前記第2金属元素の濃度勾配とが異なるように前記拡散層を形成する、
請求項7記載の誘電体素子用基材の製造方法。 - 前記中間層を形成する際には、前記中間層を形成するための前駆体溶液を前記基板に塗布して前駆体膜を形成し、
前記拡散層を形成する際には、加熱、冷却することで前記前駆体膜を結晶化させるとともに、前記基板から前記前駆体膜に前記第1金属元素と前記第2金属元素とを拡散させる、
請求項7記載の誘電体素子用基材の製造方法。 - 前記第1金属元素は鉄であり、前記第2金属元素はクロムである、
請求項7記載の誘電体素子用基材の製造方法。 - 請求項1記載の誘電体素子用基材と、
前記誘電体素子用基材の前記下部電極層上に設けられた圧電体層と、
前記圧電体層上に設けられた上部電極層と、を備えた、
圧電体素子。 - 前記基板の熱膨張係数が、前記圧電体層の熱膨張係数よりも大きい、
請求項11記載の圧電体素子。
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PCT/JP2012/002615 WO2012144185A1 (ja) | 2011-04-21 | 2012-04-16 | 誘電体素子用基材とその製造方法、並びにこの誘電体素子用基材を用いた圧電体素子 |
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JPWO2014080577A1 (ja) * | 2012-11-26 | 2017-01-05 | パナソニックIpマネジメント株式会社 | 赤外線検出装置 |
KR101514193B1 (ko) * | 2013-03-27 | 2015-04-21 | 엔지케이 인슐레이터 엘티디 | 복합 기판 및 탄성파 디바이스 |
US20160209273A1 (en) * | 2013-11-14 | 2016-07-21 | Panasonic Intellectual Property Management Co., Ltd. | Infrared radiation detection element, infrared radiation detection device, and piezoelectric element |
JP6367331B2 (ja) * | 2014-06-20 | 2018-08-01 | 株式会社アルバック | 多層膜及びその製造方法 |
KR20160015805A (ko) * | 2014-07-31 | 2016-02-15 | 삼성전기주식회사 | Pzt계 압전 세라믹 재료 및 이를 이용한 압전 소자 |
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