JP5903168B2 - 接着フィルムを、ダイシングテープ上のプレカットされた半導体ウェハの形状に製造する方法 - Google Patents
接着フィルムを、ダイシングテープ上のプレカットされた半導体ウェハの形状に製造する方法 Download PDFInfo
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- JP5903168B2 JP5903168B2 JP2014547258A JP2014547258A JP5903168B2 JP 5903168 B2 JP5903168 B2 JP 5903168B2 JP 2014547258 A JP2014547258 A JP 2014547258A JP 2014547258 A JP2014547258 A JP 2014547258A JP 5903168 B2 JP5903168 B2 JP 5903168B2
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- 239000002313 adhesive film Substances 0.000 title claims description 69
- 238000000034 method Methods 0.000 title claims description 9
- 239000004065 semiconductor Substances 0.000 title description 14
- 238000004519 manufacturing process Methods 0.000 title description 9
- 239000000853 adhesive Substances 0.000 claims description 31
- 230000001070 adhesive effect Effects 0.000 claims description 31
- 238000010586 diagram Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/27003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the layer preform
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L2224/271—Manufacture and pre-treatment of the layer connector preform
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
- H01L2224/2743—Manufacturing methods by blanket deposition of the material of the layer connector in solid form
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
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- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
Claims (1)
- 接着フィルムの切り取られた切れ端をキャリア支持テープから取り除く方法であって、
前記方法は、
(a)支持キャリア、接着フィルムおよび剥離ライナがこの順にある集成体を提供するステップであって、前記集成体は、前記剥離ライナの方向から、前記剥離ライナを通り、前記接着フィルムを通って、前記支持キャリア中へ部分的に、形が切り込まれている、ステップと、
(b)前記切り込まれた形状周囲の前記接着フィルムを露出するように、前記切り込まれた形状周囲の前記接着フィルムから前記剥離ライナを取り除くステップと、
(c)前記切り込まれた形状周囲の前記露出した接着フィルム上、および前記切り込まれた形状の剥離ライナ上に仮接着シートを接着するステップであって、前記仮接着シートは、前記接着フィルムが前記支持キャリアに対して有するよりも高い接着力を前記接着フィルムに対して有し、かつ、前記仮接着シートは、前記剥離ライナが前記接着フィルムに対して有するよりも高い接着力を前記剥離ライナに対して有する、ステップと、
(d)前記露出した接着フィルムおよび前記残された剥離ライナに接着した前記仮接着シートを取り外すステップであって、これによって前記接着フィルムが前記支持キャリアから取り除かれると共に、前記剥離ライナが前記切り込まれた形状の接着フィルムから取り除かれ、前記支持キャリア上に前記切り込まれた形状の接着フィルムが残されるステップと、
を含む方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161576100P | 2011-12-15 | 2011-12-15 | |
US61/576,100 | 2011-12-15 | ||
PCT/US2012/065982 WO2013089982A1 (en) | 2011-12-15 | 2012-11-20 | Method of preparing an adhesive film into a precut semiconductor wafer shape on a dicing tape |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015500391A JP2015500391A (ja) | 2015-01-05 |
JP5903168B2 true JP5903168B2 (ja) | 2016-04-13 |
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ID=48613079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014547258A Active JP5903168B2 (ja) | 2011-12-15 | 2012-11-20 | 接着フィルムを、ダイシングテープ上のプレカットされた半導体ウェハの形状に製造する方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20140290843A1 (ja) |
EP (1) | EP2791967A4 (ja) |
JP (1) | JP5903168B2 (ja) |
KR (1) | KR101449909B1 (ja) |
CN (1) | CN103999195B (ja) |
TW (1) | TW201332001A (ja) |
WO (1) | WO2013089982A1 (ja) |
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KR102675134B1 (ko) * | 2020-03-31 | 2024-06-12 | 동우 화인켐 주식회사 | 도전성 필름 적층체 및 이의 제조 방법 |
JP7021687B2 (ja) * | 2020-07-01 | 2022-02-17 | 住友ベークライト株式会社 | 半導体素子保護用粘着テープおよび半導体素子保護用粘着テープの製造方法 |
KR102602263B1 (ko) | 2021-10-01 | 2023-11-16 | 거림테크 주식회사 | 무기재테이프 형상가공장치 |
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US5372883A (en) * | 1990-03-20 | 1994-12-13 | Staystik, Inc. | Die attach adhesive film, application method and devices incorporating the same |
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JPH05143001A (ja) * | 1991-11-25 | 1993-06-11 | Sekisui Chem Co Ltd | シート状物の部分剥離方法 |
US7169643B1 (en) * | 1998-12-28 | 2007-01-30 | Seiko Epson Corporation | Semiconductor device, method of fabricating the same, circuit board, and electronic apparatus |
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JP3544362B2 (ja) * | 2001-03-21 | 2004-07-21 | リンテック株式会社 | 半導体チップの製造方法 |
JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
JP2005162818A (ja) * | 2003-12-01 | 2005-06-23 | Hitachi Chem Co Ltd | ダイシングダイボンドシート |
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US7541203B1 (en) * | 2008-05-13 | 2009-06-02 | International Business Machines Corporation | Conductive adhesive for thinned silicon wafers with through silicon vias |
MY160284A (en) * | 2009-05-12 | 2017-02-28 | Denki Kagaku Kogyo Kk | Adhesive, adhesive sheet, and process for producing electronic components |
JP2011009425A (ja) * | 2009-06-25 | 2011-01-13 | Sumitomo Bakelite Co Ltd | 半導体素子の製造方法および半導体装置の製造方法 |
WO2011109442A2 (en) * | 2010-03-02 | 2011-09-09 | Oliver Steven D | Led packaging with integrated optics and methods of manufacturing the same |
JP5423563B2 (ja) * | 2010-04-23 | 2014-02-19 | デクセリアルズ株式会社 | 半導体チップの製造方法 |
JP2012236899A (ja) * | 2011-05-11 | 2012-12-06 | Hitachi Chemical Co Ltd | 接着シートの製造方法 |
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2012
- 2012-11-20 CN CN201280058432.7A patent/CN103999195B/zh active Active
- 2012-11-20 KR KR1020147015810A patent/KR101449909B1/ko active IP Right Grant
- 2012-11-20 EP EP12857913.3A patent/EP2791967A4/en not_active Withdrawn
- 2012-11-20 JP JP2014547258A patent/JP5903168B2/ja active Active
- 2012-11-20 WO PCT/US2012/065982 patent/WO2013089982A1/en active Application Filing
- 2012-12-10 TW TW101146456A patent/TW201332001A/zh unknown
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2014
- 2014-06-12 US US14/303,008 patent/US20140290843A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
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KR20140077987A (ko) | 2014-06-24 |
CN103999195B (zh) | 2016-03-30 |
KR101449909B1 (ko) | 2014-10-13 |
CN103999195A (zh) | 2014-08-20 |
TW201332001A (zh) | 2013-08-01 |
US20140290843A1 (en) | 2014-10-02 |
WO2013089982A1 (en) | 2013-06-20 |
EP2791967A1 (en) | 2014-10-22 |
JP2015500391A (ja) | 2015-01-05 |
EP2791967A4 (en) | 2015-08-05 |
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