JP5890125B2 - コネクタ - Google Patents
コネクタ Download PDFInfo
- Publication number
- JP5890125B2 JP5890125B2 JP2011181456A JP2011181456A JP5890125B2 JP 5890125 B2 JP5890125 B2 JP 5890125B2 JP 2011181456 A JP2011181456 A JP 2011181456A JP 2011181456 A JP2011181456 A JP 2011181456A JP 5890125 B2 JP5890125 B2 JP 5890125B2
- Authority
- JP
- Japan
- Prior art keywords
- contact member
- housing
- contacted
- terminal
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 73
- 230000003014 reinforcing effect Effects 0.000 claims description 51
- 238000005452 bending Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 description 10
- 230000002787 reinforcement Effects 0.000 description 8
- 239000011810 insulating material Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
- H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
- H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/42—Securing in a demountable manner
- H01R13/422—Securing in resilient one-piece base or case, e.g. by friction; One-piece base or case formed with resilient locking means
- H01R13/4223—Securing in resilient one-piece base or case, e.g. by friction; One-piece base or case formed with resilient locking means comprising integral flexible contact retaining fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/627—Snap or like fastening
- H01R13/6271—Latching means integral with the housing
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Description
3 ハウジング
5 ケース
7 ケースカバー(基板支持体)
9 回動支軸部
11 被係止部
13 端子
15 端子収容室
17 回動軸受け部
19 係止部
23 基板
25 被接触部
27 接触部材(接触部)
29 付勢部材(付勢部)
31 補強リブ
71 中央部位
73 第1の側方部位
75 第2の側方部位
77A 第1の延伸部位
77B 第2の延伸部位
Claims (5)
- 被接触部が設けられている基板と、
接触部材と、この接触部材が前記被接触部を押すように前記接触部材を付勢する付勢部材とを備えた端子と、
前記基板を支持するとともに、前記被接触部が前記接触部材で押されることによる前記基板の撓みを防止するための補強リブが設けられている基板支持体と、
を有することを特徴とするコネクタ。 - 被接触部が設けられている基板と、
接触部材と、この接触部材が前記被接触部を押すように前記接触部材を付勢する付勢部材とを備えた端子と、
回動支軸部と被係止部と前記端子が収容される端子収容室とが設けられているハウジングと、
回動軸受け部と係止部とが設けられており、前記回動軸受け部に前記ハウジングの回動支軸部が係合して前記ハウジングが回動し前記係止部に前記ハウジングの被係止部が係止されるように構成されているケースと、
前記ケースに一体的に設置され前記基板を支持するとともに、前記ハウジングの端子収容室に前記端子が収容され前記ハウジングの回動支軸部が前記ケースの回動軸受け部に係合して前記ハウジングが前記ケースに対して回動し前記ハウジングの被係止部が前記ケースの係止部に係止されたときに、前記基板の被接触部が前記端子の接触部材で押されることによる前記基板の撓みを防止するための補強リブが設けられているケースカバーと、
を有することを特徴とするコネクタ。 - 請求項1または請求項2に記載のコネクタにおいて、
前記接触部材が前記被接触部を押す方向から見ると、前記補強リブは、「ロ」字状に形成されており、前記接触部材が前記被接触部を押している部位が、前記補強リブの内側に存在していることを特徴とするコネクタ。 - 請求項1または請求項2に記載のコネクタにおいて、
前記接触部材が前記被接触部を押す方向から見ると、前記補強リブは、中央部位と第1の側方部位と第2の側方部位とで形成された「H」字状、中央部位と第1の側方部位と第2の側方部位とで形成された「コ」字状のいずれかの形状に形成されており、前記接触部材が前記被接触部を押している部位が、前記第1の側方部位と前記第2の側方部位との間であって前記「H」字もしくは前記「コ」字の内側に存在しており、前記「H」字状の補強リブの第1の側方部位は「H」字の左側の縦線に相当する部位であり、前記「H」字状の補強リブの第2の側方部位は「H」字の右側の縦線に相当する部位であり、前記「H」字状の補強リブの中央部位は「H」字の中央の横線に相当する部位であり、前記「コ」字状の補強リブの第1の側方部位は「コ」字の上側の横線に相当する部位であり、前記「コ」字状の補強リブの第2の側方部位は「コ」字の下側の横線に相当する部位であり、前記「コ」字状の補強リブの中央部位は「コ」字の縦線に相当する部位であることを特徴とするコネクタ。 - 請求項1または請求項2に記載のコネクタにおいて、
前記接触部材が前記被接触部を押す方向から見ると、前記補強リブは、第1の延伸部位と、この第1の延伸部位と平行に延びている第2の延伸部位とを備えた形状に形成されており、前記接触部材が前記被接触部を押している部位が、前記第1の延伸部位と前記第2の延伸部位との間に存在していることを特徴とするコネクタ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011181456A JP5890125B2 (ja) | 2011-08-23 | 2011-08-23 | コネクタ |
PCT/JP2012/004762 WO2013027330A1 (en) | 2011-08-23 | 2012-07-26 | Connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011181456A JP5890125B2 (ja) | 2011-08-23 | 2011-08-23 | コネクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013045549A JP2013045549A (ja) | 2013-03-04 |
JP5890125B2 true JP5890125B2 (ja) | 2016-03-22 |
Family
ID=46758987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011181456A Expired - Fee Related JP5890125B2 (ja) | 2011-08-23 | 2011-08-23 | コネクタ |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5890125B2 (ja) |
WO (1) | WO2013027330A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6887747B2 (ja) | 2015-04-28 | 2021-06-16 | タイコエレクトロニクスジャパン合同会社 | コネクタ |
JP6860713B2 (ja) * | 2020-02-04 | 2021-04-21 | タイコエレクトロニクスジャパン合同会社 | コネクタ組立体 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3395908B2 (ja) | 1991-09-03 | 2003-04-14 | アンプ インコーポレイテッド | Smt型dinコネクタ |
AT403334B (de) * | 1995-07-17 | 1998-01-26 | Akg Akustische Kino Geraete | Kontaktierung eines elektroakustischen wandlers |
JP3394180B2 (ja) * | 1998-03-26 | 2003-04-07 | 矢崎総業株式会社 | 計器用配線板の電気的接続方法及び電気的接続構造 |
JP5239926B2 (ja) * | 2009-02-16 | 2013-07-17 | 株式会社デンソー | 電子装置及びその製造方法 |
JP5600446B2 (ja) | 2010-03-03 | 2014-10-01 | パナソニック株式会社 | 電気自動車用充電スタンド |
-
2011
- 2011-08-23 JP JP2011181456A patent/JP5890125B2/ja not_active Expired - Fee Related
-
2012
- 2012-07-26 WO PCT/JP2012/004762 patent/WO2013027330A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2013027330A1 (en) | 2013-02-28 |
JP2013045549A (ja) | 2013-03-04 |
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