JP5888816B2 - Heat dissipation structure of electronic equipment - Google Patents

Heat dissipation structure of electronic equipment Download PDF

Info

Publication number
JP5888816B2
JP5888816B2 JP2012189914A JP2012189914A JP5888816B2 JP 5888816 B2 JP5888816 B2 JP 5888816B2 JP 2012189914 A JP2012189914 A JP 2012189914A JP 2012189914 A JP2012189914 A JP 2012189914A JP 5888816 B2 JP5888816 B2 JP 5888816B2
Authority
JP
Japan
Prior art keywords
resin
filled
heat
case
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012189914A
Other languages
Japanese (ja)
Other versions
JP2014049534A (en
Inventor
豊 小金
豊 小金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP2012189914A priority Critical patent/JP5888816B2/en
Publication of JP2014049534A publication Critical patent/JP2014049534A/en
Application granted granted Critical
Publication of JP5888816B2 publication Critical patent/JP5888816B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

この発明は、電子機器の放熱構造に関する。   The present invention relates to a heat dissipation structure for an electronic device.

従来、通電により発熱する電子部品（発熱部品）を基板に電気接続する構成の電子機器では、発熱部品をヒートシンク（放熱部材）に固定し、基板をヒートシンク上方に間隔をあけた位置に配する放熱構造が多く採用されている。
ところで、このような放熱構造を備える電子機器では、基板上に形成された回路（電子部品・配線等によって構成される回路）中にも、冷却を要する部分（要冷却部）が存在する。なお、要冷却部には、通電により発熱する熱源部分の他、前述したヒートシンク上の発熱部品や基板上の熱源部分によって加熱されることが好ましくない部分も含まれる。従来では、ヒートシンクと基板との隙間を放熱樹脂（熱伝導性に優れた材質の樹脂）で埋めることにより、基板上に形成された要冷却部の加熱を防ぐことが考えられている。 Conventionally, in an electronic device configured to electrically connect an electronic component (heat generating component) that generates heat when energized to a substrate, heat dissipation is performed by fixing the heat generating component to a heat sink (heat radiating member) and placing the substrate at a position above the heat sink. Many structures are adopted.
By the way, in an electronic apparatus provided with such a heat dissipation structure, there is a portion (cooling required portion) that needs to be cooled in a circuit (a circuit constituted by electronic components, wiring, etc.) formed on a substrate. In addition to the heat source portion that generates heat when energized, the cooling required portion includes a portion that is not preferably heated by the heat-generating component on the heat sink and the heat source portion on the substrate. Conventionally, it has been considered to prevent heating of the required cooling part formed on the substrate by filling the gap between the heat sink and the substrate with a heat radiating resin (a resin having a high thermal conductivity).

また、従来の電子機器には、例えば特許文献１のように、発熱部品や他の電子部品が搭載された基板を収容するケースに、ケース内空間を仕切る仕切り板を設けておき、発熱部品を分割された一つの空間に配した上で、この分割空間を放熱樹脂で充填したものもある。この構成では、発熱部品が放熱樹脂に埋設されることで、発熱部品の熱を放熱樹脂からケースに逃がすことが可能である。また、分割空間のみに樹脂が充填されることで、樹脂の充填量を減らし、電子機器の軽量化が図られている。   In addition, in a conventional electronic device, for example, as in Patent Document 1, a partition plate that partitions a space in a case is provided in a case that houses a substrate on which a heat generating component or another electronic component is mounted. Some are arranged in one divided space and the divided space is filled with a heat radiation resin. In this configuration, since the heat generating component is embedded in the heat radiating resin, the heat of the heat generating component can be released from the heat radiating resin to the case. In addition, since the resin is filled only in the divided space, the amount of resin filling is reduced, and the weight of the electronic device is reduced.

特開２００３−２４９７８０号公報JP 2003-249780 A

しかしながら、ヒートシンクと基板との隙間全体を放熱樹脂で埋めると、放熱樹脂の使用量が不必要に多くなるため、電子機器の重量が重くなる、という問題がある。特に、車載用の電子機器である場合には、車両全体の重量が重くなり、好ましくない。
特許文献１のように仕切り板を設ければ放熱樹脂の使用量を抑制できるものの、仕切り板は基板を収容するケースに一体に設けられるため、基板における発熱部品の配置に応じた形状のケースを製造する必要があり、汎用性が低い、という問題がある。 However, if the entire gap between the heat sink and the substrate is filled with the heat-dissipating resin, the amount of heat-dissipating resin is unnecessarily increased, which increases the weight of the electronic device. In particular, in the case of an in-vehicle electronic device, the weight of the entire vehicle is increased, which is not preferable.
Although the amount of heat radiation resin can be suppressed by providing a partition plate as in Patent Document 1, the partition plate is provided integrally with the case that accommodates the substrate. There is a problem that it is necessary to manufacture and versatility is low.

本発明は、上述した事情に鑑みたものであって、軽量化を図りながら汎用性も高い電子機器の放熱構造を提供することを目的とする。   The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a heat dissipation structure for an electronic device having high versatility while achieving weight reduction.

この課題を解決するために、本発明の電子機器の放熱構造は、少なくとも一方の主面に電子部品が搭載されて回路を形成した基板と、該基板の各主面に間隔をあけた位置に配された二つの放熱部材と、前記基板の各主面から各放熱部材まで延びる筒状に形成された二つの樹脂充填ケースと、各樹脂充填ケースに充填された放熱樹脂と、を備え、各樹脂充填ケースが、前記回路のうち冷却を要する要冷却部を囲むように配され、前記放熱樹脂が、各放熱部材側に位置する各樹脂充填ケースの第一端部において隙間なく充填され、かつ、前記基板側に位置する各樹脂充填ケースの第二端部において少なくとも前記要冷却部に接触し、各樹脂充填ケースの第一端部に、該樹脂充填ケースの径方向内側に延在する平板部が形成され、該平板部が、前記放熱部材に面接触可能であり、各樹脂充填ケースの前記平板部に、該平板部の厚さ方向に貫通する貫通孔が形成され、第一樹脂充填ケースの第一端部は、ネジの軸部が前記第一樹脂充填ケースの貫通孔に挿通された上で第一放熱部材に螺着されることで、前記第一放熱部材に固定され、第二樹脂充填ケースの第一端部は、ネジの軸部が第二放熱部材を貫通するネジ挿通孔に挿通された上で前記第二樹脂充填ケースの貫通孔に螺着されることで、前記第二放熱部材に固定され、前記基板に、該基板の厚さ方向に貫通して前記第一樹脂充填ケース内に連通する樹脂注入孔が形成されていることを特徴とする。 In order to solve this problem, a heat dissipation structure for an electronic device according to the present invention includes a substrate on which electronic components are mounted on at least one main surface to form a circuit, and a position spaced from each main surface of the substrate. with a two radiating member arranged, and two resin filling case formed in a cylindrical shape extending to the heat radiation members from each major surface of the substrate and heat dissipating resin filled in the resin filling case, the respective A resin-filled case is disposed so as to surround a cooling-required portion of the circuit that requires cooling, and the heat-dissipating resin is filled without a gap at a first end of each resin-filled case located on each heat-dissipating member side; and A flat plate extending inward in the radial direction of the resin-filled case at the first end of each resin-filled case at least in contact with the required cooling portion at the second end of each resin-filled case located on the substrate side Part is formed, and the flat plate part is A through-hole is formed in the flat plate portion of each resin-filled case, and the first end of the first resin-filled case has a shaft of a screw. The first resin-filled case is fixed to the first heat-dissipating member by being screwed into the first heat-dissipating member after the portion is inserted into the through hole of the first resin-filled case, The shaft portion of the screw is inserted into the screw insertion hole that penetrates the second heat radiating member and then screwed into the through hole of the second resin-filled case, so that the second heat radiating member is fixed to the substrate. A resin injection hole that penetrates in the thickness direction of the substrate and communicates with the first resin-filled case is formed .

上記放熱構造によれば、例えば要冷却部が通電により発熱しても、この熱を放熱樹脂から放熱部材に効率よく逃がすことが可能となる。また、例えば要冷却部の周囲に別の熱源が配されていても、この熱源の熱を樹脂充填ケース及び放熱樹脂を介して放熱部材に逃がすことも可能である。すなわち、要冷却部が別の熱源によって加熱されることも防止できる。   According to the heat radiating structure, for example, even if the required cooling part generates heat by energization, it is possible to efficiently release this heat from the heat radiating resin to the heat radiating member. Further, for example, even if another heat source is arranged around the cooling required portion, the heat of this heat source can be released to the heat radiating member via the resin filling case and the heat radiating resin. That is, it is possible to prevent the cooling required portion from being heated by another heat source.

さらに、放熱樹脂の使用量が樹脂充填ケースによって制限されて減少するため、電子機器の軽量化も図ることができる。
また、要冷却部の大きさや、基板と放熱部材との隙間に合わせたサイズの樹脂充填ケースを用意し、要冷却部の位置に合わせて樹脂充填ケースを配すればよいため、汎用性の高い放熱構造を提供することが可能となる。 Furthermore, since the amount of the heat radiating resin used is limited and reduced by the resin filling case, it is possible to reduce the weight of the electronic device.
Also, a resin-filled case with a size that matches the size of the required cooling part and the gap between the substrate and the heat dissipation member is prepared, and the resin-filled case needs to be arranged according to the position of the required cooling part. A heat dissipation structure can be provided.

また、上記放熱構造では、樹脂充填ケースを基板や放熱部材に取り付けた後に、樹脂充填ケース内に放熱樹脂を注入することが可能となる。
また、上記放熱構造によれば、容易かつ確実に樹脂充填ケースの第一端部を放熱部材に固定することができる。例えば、樹脂充填ケースの第一端部をネジ止めにより放熱部材に固定する場合には、ネジの頭と放熱部材との間に平板部を挟み込んだり、ネジの頭と平板部との間に放熱部材を挟み込むことで、容易かつ確実に樹脂充填ケースを固定できる。また、例えば、樹脂充填ケースの第一端部を接着によって放熱部材に固定する場合には、樹脂充填ケースと放熱部材との接着面積が平板部によって拡大するため、容易かつ確実に樹脂充填ケースを固定できる。
さらに、平板部が放熱部材に固定されることで、樹脂充填ケースから放熱部材に効率よく熱を逃がすことができる。 Moreover, in the said heat dissipation structure, after attaching a resin filling case to a board | substrate or a heat radiating member, it becomes possible to inject | pour heat dissipation resin in a resin filling case.
Moreover, according to the said heat radiating structure, the 1st end part of the resin filling case can be fixed to a heat radiating member easily and reliably. For example, when fixing the first end of the resin-filled case to the heat radiating member by screwing, a flat plate portion is sandwiched between the screw head and the heat radiating member, or heat is radiated between the screw head and the flat plate portion. By sandwiching the member, the resin-filled case can be fixed easily and reliably. Further, for example, when the first end of the resin filling case is fixed to the heat radiating member by bonding, the adhesive area between the resin filling case and the heat radiating member is expanded by the flat plate portion, so that the resin filling case can be easily and reliably attached. Can be fixed.
Furthermore, heat can be efficiently released from the resin-filled case to the heat radiating member by fixing the flat plate portion to the heat radiating member.

また、前記電子機器の放熱構造においては、前記樹脂充填ケースの第二端部がはんだによって前記基板に固定されているとよい。
上記放熱構造では、電子部品をはんだによって基板に固定する工程において、樹脂充填ケースも同時に基板に固定できる。すなわち、樹脂充填ケースを基板に対して効率よく固定することができる。 Moreover, in the heat dissipation structure of the electronic device, it is preferable that the second end portion of the resin-filled case is fixed to the substrate with solder.
In the heat dissipation structure, the resin-filled case can be fixed to the substrate at the same time in the step of fixing the electronic component to the substrate with solder. That is, the resin-filled case can be efficiently fixed to the substrate.

さらに、前記電子機器の放熱構造においては、前記樹脂充填ケースの第二端部に、該樹脂充填ケースの軸方向に突出して前記基板に挿通される接続突起が形成されていることが好ましい。
上記放熱構造では、樹脂充填ケースの接続突起を基板に差し込むことで、基板に対する樹脂充填ケースの位置決めを容易に行うことができる。 Furthermore, in the heat dissipation structure of the electronic device, it is preferable that a connection protrusion that protrudes in the axial direction of the resin filling case and is inserted through the substrate is formed at the second end portion of the resin filling case.
In the heat dissipation structure, the resin-filled case can be easily positioned with respect to the substrate by inserting the connection protrusions of the resin-filled case into the substrate.

さらに、前記電子機器の放熱構造においては、前記樹脂充填ケースの第一端部と前記放熱部材との間に、放熱シートあるいは放熱グリスが介在していると好ましい。   Furthermore, in the heat dissipation structure of the electronic device, it is preferable that a heat dissipation sheet or heat dissipation grease is interposed between the first end portion of the resin-filled case and the heat dissipation member.

上記放熱シートや放熱グリスは、樹脂充填ケースや放熱部材と比較して柔らかく変形可能であるため、寸法公差等によって樹脂充填ケースの第一端部と放熱部材との間に隙間が生じても、この隙間を放熱シートや放熱グリスによって埋めることができる。したがって、これら放熱シートや放熱グリスが無い場合（上記隙間がある場合）と比較して、樹脂充填ケースから放熱部材への放熱を効率よく行うことができる。   Since the heat dissipation sheet and the heat dissipation grease are soft and deformable compared to the resin-filled case and the heat-dissipating member, even if a gap occurs between the first end portion of the resin-filled case and the heat-dissipating member due to dimensional tolerance, This gap can be filled with a heat dissipation sheet or heat dissipation grease. Therefore, heat can be efficiently radiated from the resin-filled case to the heat radiating member as compared with the case where there is no heat radiating sheet or heat radiating grease (when the gap is present).

また、前記電子機器の放熱構造においては、前記樹脂充填ケースが、前記放熱樹脂よりも熱伝導率の高い材料によって形成されているとよい。
上記放熱構造では、要冷却部の周囲に配された別の熱源の熱が、樹脂充填ケースから放熱樹脂に伝達されるよりも、樹脂充填ケースにおいて優先的に拡散される。したがって、樹脂充填ケース内において放熱樹脂に接触する要冷却部が発熱部品の熱によって加熱されることを確実に防止できる。 In the heat dissipation structure of the electronic device, the resin-filled case may be formed of a material having a higher thermal conductivity than the heat dissipation resin.
In the heat dissipation structure, the heat of another heat source disposed around the cooling-required part is preferentially diffused in the resin filling case rather than being transmitted from the resin filling case to the heat dissipation resin. Therefore, it is possible to reliably prevent the required cooling portion that comes into contact with the heat radiating resin in the resin-filled case from being heated by the heat of the heat-generating component.

さらに、前記電子機器の放熱構造においては、前記樹脂充填ケース及び前記放熱部材が導電性を有し、前記基板の接地配線が、前記樹脂充填ケースを介して前記放熱部材に電気接続されていてもよい。   Furthermore, in the heat dissipation structure of the electronic device, the resin-filled case and the heat-dissipating member have conductivity, and the ground wiring of the substrate is electrically connected to the heat-dissipating member via the resin-filled case. Good.

上記構成では別途部品によって基板の接地配線を放熱部材に電気接続する必要が無くなるため、電子機器の構成部品点数を減らすことが可能となる。
また、樹脂充填ケースが接地されるため、基板に形成された回路の電位を安定させることができる。 In the above configuration, since it is not necessary to electrically connect the ground wiring of the substrate to the heat dissipation member by a separate component, the number of components of the electronic device can be reduced.
Further, since the resin-filled case is grounded, the potential of the circuit formed on the substrate can be stabilized.

本発明によれば、基板に形成された回路の要冷却部を効率よく冷却できると共に、電子機器の軽量化も図ることができ、さらに、放熱構造の汎用性向上も図ることができる。   ADVANTAGE OF THE INVENTION According to this invention, while being able to cool the required cooling part of the circuit formed in the board | substrate efficiently, the weight reduction of an electronic device can be achieved, Furthermore, the versatility improvement of a thermal radiation structure can also be aimed at.

本発明の一実施形態に係る電子機器の放熱構造を示す側断面図である。It is a sectional side view which shows the thermal radiation structure of the electronic device which concerns on one Embodiment of this invention. 図１の放熱構造に備える樹脂充填ケースを示す概略斜視図である。It is a schematic perspective view which shows the resin filling case with which the thermal radiation structure of FIG. 1 is equipped. 図２の樹脂充填ケースを折り曲げ加工により製造する場合に用いる金属平板を示す平面図である。It is a top view which shows the metal flat plate used when manufacturing the resin filling case of FIG. 2 by a bending process. 図１に記載の第一樹脂充填ケースを基板の上面側から見た状態を示す上面図である。It is a top view which shows the state which looked at the 1st resin filling case of FIG. 1 from the upper surface side of the board | substrate. 図１に示す放熱構造の変形例を示す側断面図である。It is a sectional side view which shows the modification of the thermal radiation structure shown in FIG. 図１に示す放熱構造の変形例を示す側断面図である。It is a sectional side view which shows the modification of the thermal radiation structure shown in FIG.

以下、図１〜４を参照して本発明の一実施形態について説明する。
図１に示すように、この実施形態に係る電子機器の放熱構造は、基板１と、二つの放熱部材２，３と、二つの樹脂充填ケース４，５と、放熱樹脂６とを備えている。
基板１には配線パターン（不図示）が形成されており、この配線パターンに電子部品７〜９が電気接続されることで回路が形成されている。本実施形態では、基板１の両主面（上面１ａ及び下面１ｂ）に電子部品（要冷却部）７，８が搭載されている。また、本実施形態では、第一放熱部材２に搭載された電子部品９（以下、発熱部品９と呼ぶ。）が基板１に電気接続されている。 Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the heat dissipation structure for an electronic device according to this embodiment includes a substrate 1, two heat dissipation members 2, 3, two resin-filled cases 4, 5, and a heat dissipation resin 6. .
A wiring pattern (not shown) is formed on the substrate 1, and a circuit is formed by electrically connecting electronic components 7 to 9 to the wiring pattern. In the present embodiment, electronic components (cooling required parts) 7 and 8 are mounted on both main surfaces (upper surface 1 a and lower surface 1 b) of the substrate 1. In the present embodiment, an electronic component 9 (hereinafter referred to as a heat generating component 9) mounted on the first heat radiating member 2 is electrically connected to the substrate 1.

基板１に搭載される電子部品７，８は、通電により発熱するもの、あるいは、耐熱性の低いものであり、冷却を要する要冷却部である。本実施形態では、第一電子部品７が第一放熱部材２に対向する基板１の下面１ｂに搭載されている。また、第二電子部品８が第二放熱部材に対向する基板１の上面１ａに搭載されている。なお、図示例の第一電子部品７や第二電子部品８は、基板１に表面実装されるチップ部品であるが、例えば基板１にスルーホール実装されるリード部品であってもよい。   The electronic components 7 and 8 mounted on the substrate 1 are those that generate heat when energized, or those that have low heat resistance and require cooling. In the present embodiment, the first electronic component 7 is mounted on the lower surface 1 b of the substrate 1 facing the first heat radiating member 2. The second electronic component 8 is mounted on the upper surface 1a of the substrate 1 facing the second heat radiating member. The first electronic component 7 and the second electronic component 8 in the illustrated example are chip components that are surface-mounted on the substrate 1, but may be lead components that are mounted on the substrate 1 through holes.

第一放熱部材２は、アルミニウム等のように熱伝導性に優れた導電性材料を、例えば板状に形成して構成されている。この第一放熱部材２は、基板１の下面１ｂに間隔をあけた位置に配されている。これら基板１及び第一放熱部材２は、例えばネジ止め等によって相互に固定されている。本実施形態では、基板１の下面１ｂに対向する第一放熱部材２の上面２ａに、前述した発熱部品９が搭載されている。   The first heat radiating member 2 is configured by forming a conductive material having excellent thermal conductivity such as aluminum in a plate shape, for example. The first heat radiating member 2 is disposed at a position spaced from the lower surface 1 b of the substrate 1. The substrate 1 and the first heat radiating member 2 are fixed to each other by, for example, screwing or the like. In the present embodiment, the heat generating component 9 described above is mounted on the upper surface 2 a of the first heat radiating member 2 facing the lower surface 1 b of the substrate 1.

本実施形態の発熱部品９は、例えばパワートランジスタ等のように通電により発熱するものであり、本体部１１と、本体部１１から突出する電気接続用の外部端子１２を有して構成されている。
本体部１１は、例えば通電により発熱する半導体素子（不図示）を樹脂内に埋設して構成されている。この本体部１１は、ネジ止めや接着等によって第一放熱部材２の上面２ａに固定されている。一方、外部端子１２は、本体部１１から基板１に向けて突出している。この外部端子１２の先端部は、基板１の厚さ方向に貫通するスルーホール１３に挿通された上で、基板１の上面１ａにおいてはんだ１４で基板１に接合されている。これにより、発熱部品９が基板１の配線パターンに電気接続されている。 The heat generating component 9 of the present embodiment generates heat when energized, such as a power transistor, and has a main body 11 and an external terminal 12 for electrical connection protruding from the main body 11. .
The main body 11 is configured by, for example, embedding a semiconductor element (not shown) that generates heat when energized in a resin. The main body 11 is fixed to the upper surface 2a of the first heat radiating member 2 by screwing or bonding. On the other hand, the external terminal 12 protrudes from the main body 11 toward the substrate 1. The front end portion of the external terminal 12 is inserted into a through hole 13 penetrating in the thickness direction of the substrate 1, and is joined to the substrate 1 with solder 14 on the upper surface 1 a of the substrate 1. As a result, the heat generating component 9 is electrically connected to the wiring pattern of the substrate 1.

第二放熱部材３は、第一放熱部材２と同様に、例えば銅、アルミニウム等のように熱伝導性に優れた導電性材料からなり、基板１の上面１ａに間隔をあけた位置に配されている。本実施形態の第二放熱部材３は、第一放熱部材２の上面２ａや基板１を覆うカバーであり、例えばネジ止め等により第一放熱部材２に固定されている。   Similar to the first heat radiating member 2, the second heat radiating member 3 is made of a conductive material having excellent thermal conductivity, such as copper or aluminum, and is disposed at a position spaced apart from the upper surface 1a of the substrate 1. ing. The second heat radiating member 3 of the present embodiment is a cover that covers the upper surface 2a of the first heat radiating member 2 and the substrate 1, and is fixed to the first heat radiating member 2 by, for example, screwing or the like.

各樹脂充填ケース４，５は、図１，２に示すように、筒状に形成され、基板１から各放熱部材２，３まで延びるように配されている。
本実施形態では、各放熱部材２，３側に位置する各樹脂充填ケース４，５の軸方向の一端（第一端部２１，３１）に、樹脂充填ケース４，５の径方向に延在する平板部２３，３３が形成されている。この平板部２３，３３は、各放熱部材２，３に面接触可能となっている。本実施形態では、平板部２３，３３が径方向内側に延在している。すなわち、本実施形態の各樹脂充填ケース４，５は有底筒状に形成され、平板部２３，３３は各樹脂充填ケース４，５の底壁板部２３，３３となっている。底壁板部２３，３３には、その厚さ方向に貫通する貫通孔２４，３４が形成されている。 As shown in FIGS. 1 and 2, the resin-filled cases 4 and 5 are formed in a cylindrical shape and are arranged so as to extend from the substrate 1 to the heat radiating members 2 and 3.
In the present embodiment, the resin-filled cases 4 and 5 that are located on the side of the heat-dissipating members 2 and 3 extend in the radial direction of the resin-filled cases 4 and 5 at one axial end (first end portions 21 and 31). Flat plate portions 23 and 33 are formed. The flat plate portions 23 and 33 can come into surface contact with the heat radiating members 2 and 3. In the present embodiment, the flat plate portions 23 and 33 extend radially inward. That is, the resin-filled cases 4 and 5 of this embodiment are formed in a bottomed cylindrical shape, and the flat plate portions 23 and 33 are the bottom wall plate portions 23 and 33 of the resin-filled cases 4 and 5. The bottom wall plates 23 and 33 are formed with through holes 24 and 34 penetrating in the thickness direction.

第二樹脂充填ケース５の底壁板部３３は、ネジ４２を螺着できるように構成されている。本実施形態では、第二樹脂充填ケース５の底壁板部３３に形成された貫通孔３４自体がネジ孔となっている。また、貫通孔３４は、ネジ４２を確実に螺着できるように、円筒状のリブ３７によって底壁板部３３の厚さよりも長く形成されている。リブ３７は、底壁板部３３のうち貫通孔３４の周縁から第二樹脂充填ケース５の軸方向の他端（第二端部３２）側に向けて突出している。このリブ３７は、例えばバーリング加工やナット圧入により形成することが可能である。   The bottom wall plate portion 33 of the second resin-filled case 5 is configured so that a screw 42 can be screwed thereon. In the present embodiment, the through hole 34 itself formed in the bottom wall plate portion 33 of the second resin filled case 5 is a screw hole. Further, the through-hole 34 is formed longer than the thickness of the bottom wall plate portion 33 by a cylindrical rib 37 so that the screw 42 can be securely screwed. The rib 37 protrudes from the periphery of the through hole 34 in the bottom wall plate portion 33 toward the other end (second end portion 32) side of the second resin-filled case 5 in the axial direction. The rib 37 can be formed, for example, by burring or nut press-fitting.

また、本実施形態では、基板１側に位置する各樹脂充填ケース４，５の第二端部２２，３２に、樹脂充填ケース４，５の軸方向に突出する接続突起２５，３５が形成されている。接続突起２５，３５は、各樹脂充填ケース４，５を基板１に取り付ける際に基板１に挿通される部分である。接続突起２５，３５は、樹脂充填ケース４，５の周方向に間隔をあけて複数配されている。   Moreover, in this embodiment, the connection protrusions 25 and 35 which protrude in the axial direction of the resin filling cases 4 and 5 are formed in the 2nd end parts 22 and 32 of each resin filling case 4 and 5 located in the board | substrate 1 side. ing. The connection protrusions 25 and 35 are portions that are inserted into the substrate 1 when the resin-filled cases 4 and 5 are attached to the substrate 1. A plurality of connection protrusions 25 and 35 are arranged at intervals in the circumferential direction of the resin-filled cases 4 and 5.

以上のように構成される本実施形態の樹脂充填ケース４，５は、図示例のように平面視矩形の筒状に形成されてもよいが、例えば円筒状など任意の筒状に形成されてもよい。
また、樹脂充填ケース４，５は、例えば、金属製でもよいし樹脂製あってもよいが、放熱樹脂６よりも熱伝導率の高い材料によって形成されていることがより好ましい。また、樹脂充填ケース４，５は、導電性を有していることが好ましい。 The resin-filled cases 4 and 5 of the present embodiment configured as described above may be formed in a cylindrical shape having a rectangular shape in plan view as in the illustrated example, but are formed in an arbitrary cylindrical shape such as a cylindrical shape, for example. Also good.
The resin-filled cases 4 and 5 may be made of metal or resin, for example, but are more preferably formed of a material having a higher thermal conductivity than the heat radiation resin 6. Moreover, it is preferable that the resin filling cases 4 and 5 have conductivity.

樹脂充填ケース４，５が金属製である場合、樹脂充填ケース４，５は、例えば金属板に深絞り加工や折り曲げ加工を施すことで製造することが可能である。
例えば、図２に示す平面視矩形の有底筒状に形成された金属製の樹脂充填ケース４，５を折り曲げ加工により製造する場合には、例えば図３に示すように、打ち抜き加工等により底壁板部２３，３３の各辺に側壁部２６，３６を接続した金属平板を形成した後、底壁板部２３，３３と側壁部２６，３６との境界線において折り曲げればよい。なお、折り曲げ後の状態において隣り合う側壁部２６，３６の間に隙間がある場合には、樹脂充填ケース４，５内に充填される放熱樹脂６がこの隙間から外部に漏れ出さないように、溶接等によって隙間を埋めればよい。 When the resin-filled cases 4 and 5 are made of metal, the resin-filled cases 4 and 5 can be manufactured, for example, by subjecting a metal plate to deep drawing or bending.
For example, when the metal resin-filled cases 4 and 5 formed in a bottomed cylindrical shape having a rectangular shape in plan view shown in FIG. 2 are manufactured by bending, for example, as shown in FIG. After forming a metal flat plate in which the side wall portions 26 and 36 are connected to each side of the wall plate portions 23 and 33, the metal plate may be bent at the boundary line between the bottom wall plate portions 23 and 33 and the side wall portions 26 and 36. In addition, when there is a gap between the side wall portions 26 and 36 adjacent to each other in the state after the bending, the heat radiation resin 6 filled in the resin filling cases 4 and 5 is not leaked to the outside from the gap. What is necessary is just to fill a clearance gap by welding etc.

一方、例えば深絞り加工により金属製の樹脂充填ケース４，５を製造する場合には、前述したような隙間が生じないため、折り曲げ加工の場合と比較して、製造工程数が少ない、という利点がある。また、放熱樹脂６が外部に漏れ出すことを容易かつ確実に防止できるという利点もある。
樹脂充填ケース４，５が樹脂製である場合には、樹脂成形等により容易に製造することが可能である。なお、樹脂製の樹脂充填ケース４，５を図１のようにはんだ１５で基板１に固定する場合には、金属製の接続突起３５をインサート成形すればよい、あるいは、樹脂製の接続突起３５にスズメッキを施してもよい。 On the other hand, for example, when the metal resin-filled cases 4 and 5 are manufactured by deep drawing, the gap as described above does not occur, so that the number of manufacturing steps is small compared to the case of bending. There is. Further, there is an advantage that the heat radiation resin 6 can be easily and reliably prevented from leaking to the outside.
When the resin-filled cases 4 and 5 are made of resin, they can be easily manufactured by resin molding or the like. When the resin filled cases 4 and 5 made of resin are fixed to the substrate 1 with the solder 15 as shown in FIG. 1, the metal connection protrusions 35 may be insert-molded, or the resin connection protrusions 35 May be plated with tin.

以上のように構成される各樹脂充填ケース４，５の第一端部２１，３１は、各放熱部材２，３に固定され、また、第二端部２２，３２が基板１に固定されている。以下、放熱部材２，３や基板１に対する各樹脂充填ケース４，５の具体的な固定について説明する。   The first end portions 21 and 31 of the resin-filled cases 4 and 5 configured as described above are fixed to the heat radiating members 2 and 3, and the second end portions 22 and 32 are fixed to the substrate 1. Yes. Hereinafter, specific fixing of the resin-filled cases 4 and 5 to the heat dissipating members 2 and 3 and the substrate 1 will be described.

第一樹脂充填ケース４の第一端部２１は、第一放熱部材２に固定されている。本実施形態では、ネジ４１の軸部を第一樹脂充填ケース４の貫通孔２４に挿通させた上で、第一放熱部材２の上面２ａに形成されたネジ孔１６に螺着させている。これにより、第一樹脂充填ケース４の底壁板部２３がネジ４１の頭と第一放熱部材２の上面２ａとの間に挟み込まれ、第一樹脂充填ケース４が第一放熱部材２に固定される。
また、本実施形態では、第一樹脂充填ケース４の第一端部２１（底壁板部２３）と第一放熱部材２の上面２ａとの間に、放熱シート４３あるいは放熱グリス４４が挟み込まれている。これら放熱シート４３や放熱グリス４４は、第一樹脂充填ケース４や第一放熱部材２よりも柔らかく変形可能であるため、寸法公差等によって第一樹脂充填ケース４の第一端部２１と第一放熱部材２との間に生じた隙間を埋めることができる。 The first end 21 of the first resin-filled case 4 is fixed to the first heat radiating member 2. In the present embodiment, the shaft portion of the screw 41 is inserted into the through hole 24 of the first resin-filled case 4 and then screwed into the screw hole 16 formed in the upper surface 2 a of the first heat radiating member 2. Accordingly, the bottom wall plate portion 23 of the first resin filling case 4 is sandwiched between the head of the screw 41 and the upper surface 2 a of the first heat radiating member 2, and the first resin filling case 4 is fixed to the first heat radiating member 2. Is done.
In the present embodiment, the heat radiation sheet 43 or the heat radiation grease 44 is sandwiched between the first end portion 21 (bottom wall plate portion 23) of the first resin-filled case 4 and the upper surface 2a of the first heat radiation member 2. ing. The heat radiation sheet 43 and the heat radiation grease 44 are softer than the first resin filling case 4 and the first heat radiation member 2 and can be deformed. A gap formed between the heat radiating member 2 can be filled.

また、第一樹脂充填ケース４の第二端部２２は、基板１の下面１ｂに固定されている。これにより、第一樹脂充填ケース４が基板１の下面１ｂに搭載された第一電子部品７を囲んでいる。
本実施形態では、第一樹脂充填ケース４の接続突起２５が、基板１の厚さ方向に貫通するスルーホール１７に挿通された上で、基板１の上面１ａにおいてはんだ１５により接合されている。なお、接続突起２５が接合された状態において、基板１の下面１ｂと第一樹脂充填ケース４の第二端部２２との間に隙間が生じている場合には、この隙間が樹脂等からなる接着剤１８によって埋められる。 The second end portion 22 of the first resin filling case 4 is fixed to the lower surface 1 b of the substrate 1. Thereby, the first resin-filled case 4 surrounds the first electronic component 7 mounted on the lower surface 1 b of the substrate 1.
In the present embodiment, the connection protrusion 25 of the first resin-filled case 4 is inserted through the through hole 17 penetrating in the thickness direction of the substrate 1 and then joined by the solder 15 on the upper surface 1 a of the substrate 1. When a gap is formed between the lower surface 1b of the substrate 1 and the second end 22 of the first resin-filled case 4 in a state where the connection protrusions 25 are joined, the gap is made of resin or the like. Filled with adhesive 18.

以上のように第一放熱部材２及び基板１に固定された第一樹脂充填ケース４の内部空間は、図４に示すように、基板１に形成された樹脂注入孔１９を介して外部に連通している。樹脂注入孔１９は、第一電子部品７に隣り合う位置において、基板１の厚さ方向に貫通して形成されている。   As described above, the internal space of the first resin-filled case 4 fixed to the first heat radiating member 2 and the substrate 1 communicates with the outside through the resin injection hole 19 formed in the substrate 1 as shown in FIG. doing. The resin injection hole 19 is formed so as to penetrate in the thickness direction of the substrate 1 at a position adjacent to the first electronic component 7.

一方、図１に示すように、第二樹脂充填ケース５の第一端部３１は、第二放熱部材３に固定されている。本実施形態では、第二放熱部材３にその厚さ方向に貫通するネジ挿通孔（樹脂注入孔）２０にネジ４２の軸部を挿通させた上で、第二樹脂充填ケース５の貫通孔３４に螺着されている。これにより、第二放熱部材３がネジ４２の頭と第二樹脂充填ケース５の底壁板部３３との間に挟み込まれ、第二樹脂充填ケース５が第二放熱部材３に固定されている。
また、本実施形態では、第一樹脂充填ケース４の場合と同様に、第二樹脂充填ケース５の第一端部３１（底壁板部３３）と第二放熱部材３との間に放熱シート４３あるいは放熱グリス４４が挟み込まれているため、第二樹脂充填ケース５の第一端部３１と第二放熱部材３との間に生じる隙間を埋めることができる。 On the other hand, as shown in FIG. 1, the first end portion 31 of the second resin-filled case 5 is fixed to the second heat radiating member 3. In this embodiment, the shaft portion of the screw 42 is inserted into the screw insertion hole (resin injection hole) 20 that penetrates the second heat radiating member 3 in the thickness direction, and then the through hole 34 of the second resin filling case 5. It is screwed on. Thereby, the second heat radiating member 3 is sandwiched between the head of the screw 42 and the bottom wall plate portion 33 of the second resin filled case 5, and the second resin filled case 5 is fixed to the second heat radiating member 3. .
In the present embodiment, similarly to the case of the first resin filled case 4, the heat radiating sheet is provided between the first end portion 31 (bottom wall plate portion 33) of the second resin filled case 5 and the second heat radiating member 3. 43 or the heat radiation grease 44 is sandwiched, so that a gap generated between the first end portion 31 of the second resin-filled case 5 and the second heat radiation member 3 can be filled.

また、第二樹脂充填ケース５の第二端部３２は、基板１の上面１ａに固定されている。これにより、第二樹脂充填ケース５が基板１の上面１ａに搭載された第二電子部品８を囲んでいる。
本実施形態では、第二樹脂充填ケース５の接続突起３５が、基板１の厚さ方向に貫通するスルーホール１７に挿通された上で、基板１の下面１ｂにおいてはんだ１５により接合されている。なお、接続突起３５が接合された状態において、基板１の上面１ａと第二樹脂充填ケース５の第二端部３２との間に隙間が生じている場合には、この隙間が接着剤１８によって埋められる。 The second end portion 32 of the second resin-filled case 5 is fixed to the upper surface 1 a of the substrate 1. Thereby, the second resin-filled case 5 surrounds the second electronic component 8 mounted on the upper surface 1 a of the substrate 1.
In the present embodiment, the connection protrusion 35 of the second resin-filled case 5 is inserted through the through hole 17 penetrating in the thickness direction of the substrate 1 and then joined by the solder 15 on the lower surface 1 b of the substrate 1. When a gap is generated between the upper surface 1 a of the substrate 1 and the second end portion 32 of the second resin-filled case 5 in a state where the connection protrusion 35 is joined, the gap is formed by the adhesive 18. Buried.

なお、各樹脂充填ケース４，５が導電性を有している場合には、上述のように基板１及び各樹脂充填ケース４，５に固定された状態において、基板１の接地配線（不図示）が各樹脂充填ケース４，５を介して各放熱部材２，３に電気接続されているとよい。本実施形態では、はんだ１５によって基板１の接地配線と各樹脂充填ケース４，５とを電気接続することが可能である。また、ネジ４１，４２によって各樹脂充填ケース４，５と各放熱部材２，３とを電気接続することが可能である。   When the resin-filled cases 4 and 5 have conductivity, the ground wiring (not shown) of the substrate 1 is fixed to the substrate 1 and the resin-filled cases 4 and 5 as described above. ) Is preferably electrically connected to the heat dissipating members 2 and 3 through the resin-filled cases 4 and 5, respectively. In the present embodiment, the ground wiring of the substrate 1 and the resin-filled cases 4 and 5 can be electrically connected by the solder 15. Further, the resin-filled cases 4 and 5 and the heat radiating members 2 and 3 can be electrically connected by screws 41 and 42.

上述した各樹脂充填ケース４，５内に充填される放熱樹脂６は、例えばエポキシ樹脂である。この放熱樹脂６は、各放熱部材２，３側に位置する各樹脂充填ケース４，５の第一端部２１，３１において隙間なく充填され、各樹脂充填ケース４，５の第二端部２２，３２において各電子部品７，８に接触している。本実施形態では、放熱樹脂６が各樹脂充填ケース４，５内に隙間なく充填されている。これにより、放熱樹脂６が基板１の上面１ａ及び下面１ｂに接触し、各電子部品７，８が放熱樹脂６に埋設されている。   The heat radiation resin 6 filled in each of the resin filling cases 4 and 5 is, for example, an epoxy resin. The heat-dissipating resin 6 is filled in the first end portions 21 and 31 of the resin-filled cases 4 and 5 located on the heat-dissipating members 2 and 3 side without any gap, and the second end portions 22 of the resin-filled cases 4 and 5 are filled. , 32 are in contact with the electronic components 7, 8. In the present embodiment, the heat radiation resin 6 is filled in the resin filling cases 4 and 5 without any gaps. Thereby, the heat dissipation resin 6 comes into contact with the upper surface 1 a and the lower surface 1 b of the substrate 1, and the electronic components 7 and 8 are embedded in the heat dissipation resin 6.

以上のように構成される本実施形態の放熱構造では、例えば第一電子部品７や第二電子部品８が通電により発熱しても、この熱を放熱樹脂６から各樹脂充填ケース４，５を介して各放熱部材２，３に効率よく逃がすことが可能となる。なお、本実施形態では、各樹脂充填ケース４，５から、ネジ４１，４２や放熱シート４３、放熱グリス４４を介して放熱部材２，３に放熱することができる。
また、例えば図１のように、第一電子部品７や第二電子部品８の近傍に発熱部品９（別の熱源）が配されていても、この発熱部品９の熱を各樹脂充填ケース４，５や放熱樹脂６を介して各放熱部材２，３に逃がすことも可能である。すなわち、第一電子部品７や第二電子部品８が発熱部品９によって加熱されることも防止できる。
なお、樹脂充填ケース４，５の熱伝導率が放熱樹脂６よりも高ければ、発熱部品９の熱が樹脂充填ケース４，５から放熱樹脂６に伝達されるよりも、樹脂充填ケース４，５において優先的に拡散されるため、樹脂充填ケース４，５内において放熱樹脂６に接触する電子部品７，８が発熱部品９の熱によって加熱されることを確実に防止できる。 In the heat dissipation structure of the present embodiment configured as described above, for example, even if the first electronic component 7 or the second electronic component 8 generates heat by energization, this heat is transferred from the heat dissipation resin 6 to the resin-filled cases 4 and 5. Therefore, it is possible to efficiently escape to the heat radiating members 2 and 3. In this embodiment, heat can be radiated from the resin-filled cases 4 and 5 to the heat radiating members 2 and 3 through the screws 41 and 42, the heat radiating sheet 43, and the heat radiating grease 44.
Further, for example, as shown in FIG. 1, even if a heat generating component 9 (another heat source) is disposed in the vicinity of the first electronic component 7 or the second electronic component 8, the heat of the heat generating component 9 is transferred to each resin-filled case 4. , 5 and the heat radiating resin 6 can also escape to the heat radiating members 2, 3. That is, the first electronic component 7 and the second electronic component 8 can be prevented from being heated by the heat generating component 9.
If the thermal conductivity of the resin-filled cases 4 and 5 is higher than that of the heat-dissipating resin 6, the heat of the heat-generating component 9 is transferred from the resin-filled cases 4 and 5 to the heat-dissipating resin 6. In the resin-filled cases 4 and 5, the electronic components 7 and 8 that are in contact with the heat radiation resin 6 can be reliably prevented from being heated by the heat of the heat-generating component 9.

さらに、本実施形態の放熱構造によれば、各樹脂充填ケース４，５の第一端部２１，３１と各放熱部材２，３との間に生じる隙間が放熱シート４３や放熱グリス４４によって埋められるため、これら放熱シート４３や放熱グリス４４が無い場合（上記隙間がある場合）と比較して、樹脂充填ケース４，５から放熱部材２，３への放熱を効率よく行うことができる。   Furthermore, according to the heat dissipation structure of the present embodiment, the gap formed between the first end portions 21 and 31 of the resin filled cases 4 and 5 and the heat dissipation members 2 and 3 is filled with the heat dissipation sheet 43 and the heat dissipation grease 44. Therefore, heat can be efficiently radiated from the resin-filled cases 4 and 5 to the heat radiating members 2 and 3 as compared with the case where the heat radiating sheet 43 and the heat radiating grease 44 are not provided (when the gap is present).

また、本実施形態の放熱構造では、放熱樹脂６の使用量が各樹脂充填ケース４，５によって制限されて減少するため、電子機器の軽量化を図ることも可能となる。
さらに、本実施形態の放熱構造では、基板１に搭載される電子部品７，８の大きさや、基板１と各放熱部材２，３との隙間に合わせたサイズの樹脂充填ケース４，５を用意し、電子部品７，８の位置に合わせて樹脂充填ケース４，５を配すればよいため、汎用性の高い放熱構造を提供することが可能となる。 Further, in the heat dissipation structure of the present embodiment, the amount of the heat dissipation resin 6 used is limited by the resin-filled cases 4 and 5 so that the weight of the electronic device can be reduced.
Furthermore, in the heat dissipation structure of the present embodiment, resin-filled cases 4 and 5 having sizes that match the size of the electronic components 7 and 8 mounted on the substrate 1 and the gaps between the substrate 1 and the heat dissipation members 2 and 3 are prepared. Since the resin-filled cases 4 and 5 need only be arranged in accordance with the positions of the electronic components 7 and 8, it is possible to provide a highly versatile heat dissipation structure.

さらに、本実施形態の放熱構造において、基板１の接地配線が導電性を有する樹脂充填ケース４，５を介して放熱部材２，３に電気接続されていれば、別途部品によって基板１の接地配線を放熱部材２，３に電気接続する必要が無くなり、電子機器の構成部品点数を減らすことが可能となる。
また、樹脂充填ケース４，５が接地されるため、基板１に形成された回路の電位を安定させることができる。 Furthermore, in the heat dissipation structure of the present embodiment, if the ground wiring of the substrate 1 is electrically connected to the heat dissipation members 2 and 3 through the resin-filled cases 4 and 5 having conductivity, the ground wiring of the substrate 1 is separately provided by a component. Need not be electrically connected to the heat radiating members 2 and 3, and the number of components of the electronic device can be reduced.
Further, since the resin-filled cases 4 and 5 are grounded, the potential of the circuit formed on the substrate 1 can be stabilized.

さらに、本実施形態の放熱構造では、各樹脂充填ケース４，５内に連通する樹脂注入孔１９やネジ挿通孔２０が基板１や第二放熱部材３に形成されているため、各樹脂充填ケース４，５を基板１や第二放熱部材３に取り付けた後に、樹脂充填ケース４，５内に放熱樹脂６を注入することが可能となる。   Furthermore, in the heat dissipation structure of the present embodiment, since the resin injection hole 19 and the screw insertion hole 20 communicating with each of the resin filled cases 4 and 5 are formed in the substrate 1 and the second heat radiating member 3, each resin filled case After attaching 4, 5 to the substrate 1 or the second heat radiating member 3, the heat radiating resin 6 can be poured into the resin-filled cases 4, 5.

例えば、第一樹脂充填ケース４に放熱樹脂６を注入するためには、予め第一樹脂充填ケース４の第一端部２１をネジ４１によって第一放熱部材２の上面２ａに固定しておく。また、基板１の下面１ｂに配された第一電子部品７、及び、基板１に形成された樹脂注入孔１９が第一樹脂充填ケース４で囲まれるように、第一樹脂充填ケース４の第二端部２２をはんだ１５によって基板１の下面１ｂに固定しておく。さらに、必要に応じて第一樹脂充填ケース４の第二端部２２と基板１の下面１ｂとの隙間を接着剤１８により埋めておく。この状態では、第一樹脂充填ケース４内が樹脂注入孔１９のみを介して外部に連通するため、放熱樹脂６を樹脂注入孔１９から第一樹脂充填ケース４内に注入することができる。   For example, in order to inject the heat radiating resin 6 into the first resin filled case 4, the first end 21 of the first resin filled case 4 is fixed to the upper surface 2 a of the first heat radiating member 2 with a screw 41 in advance. In addition, the first resin-filled case 4 of the first resin-filled case 4 is surrounded by the first resin-filled case 4 so that the first electronic component 7 disposed on the lower surface 1 b of the substrate 1 and the resin injection hole 19 formed in the substrate 1 are surrounded. The two end portions 22 are fixed to the lower surface 1 b of the substrate 1 with the solder 15. Furthermore, the gap between the second end 22 of the first resin filling case 4 and the lower surface 1b of the substrate 1 is filled with an adhesive 18 as necessary. In this state, since the inside of the first resin filling case 4 communicates with the outside only through the resin injection hole 19, the heat radiation resin 6 can be injected into the first resin filling case 4 from the resin injection hole 19.

また、例えば、第二樹脂充填ケース５に放熱樹脂６を注入するためには、予め基板１の上面１ａに配された第二電子部品８が第二樹脂充填ケース５で囲まれるように、第二樹脂充填ケース５の第二端部３２をはんだ１５によって基板１の下面１ｂに固定しておく。また、必要に応じて第二樹脂充填ケース５の第二端部３２と基板１の上面１ａとの隙間を接着剤１８により埋めておく。さらに、第二放熱部材３のネジ挿通孔２０が第二樹脂充填ケース５の貫通孔３４に重なるように、第二放熱部材３を第二樹脂充填ケース５の第一端部３１上に配しておく。この状態では、第二樹脂充填ケース５内がネジ挿通孔２０のみを介して外部に連通するため、放熱樹脂６をネジ挿通孔２０から第二樹脂充填ケース５内に注入することができる。
なお、第二樹脂充填ケース５内に放熱樹脂６を充填した後には、第二樹脂充填ケース５の第一端部３１をネジ４２によって第二放熱部材３に固定すればよい。ただし、この固定は、ネジ４２の軸部を第二樹脂充填ケース５の貫通孔３４に羅着させる必要があるため、第二樹脂充填ケース５に注入された放熱樹脂６が硬化する前に行われることがより好ましい。 For example, in order to inject the heat radiation resin 6 into the second resin filling case 5, the second electronic component 8 previously arranged on the upper surface 1 a of the substrate 1 is surrounded by the second resin filling case 5. The second end portion 32 of the two resin-filled case 5 is fixed to the lower surface 1 b of the substrate 1 with the solder 15. Further, the gap between the second end portion 32 of the second resin filling case 5 and the upper surface 1 a of the substrate 1 is filled with an adhesive 18 as necessary. Further, the second heat radiating member 3 is arranged on the first end portion 31 of the second resin filled case 5 so that the screw insertion hole 20 of the second heat radiating member 3 overlaps the through hole 34 of the second resin filled case 5. Keep it. In this state, since the inside of the second resin filling case 5 communicates with the outside only through the screw insertion holes 20, the heat radiation resin 6 can be injected into the second resin filling case 5 from the screw insertion holes 20.
In addition, after filling the heat radiation resin 6 into the second resin filling case 5, the first end portion 31 of the second resin filling case 5 may be fixed to the second heat radiation member 3 with the screw 42. However, this fixing needs to be performed before the heat-dissipating resin 6 injected into the second resin-filled case 5 is cured because the shaft portion of the screw 42 needs to be attached to the through hole 34 of the second resin-filled case 5. More preferably.

さらに、本実施形態の放熱構造は、放熱樹脂６を、基板１の下面１ｂに配された第一樹脂充填ケース４の第二端部２２側の開口から第一樹脂充填ケース４内に注入し、また、基板１の上面１ａに配された第二樹脂充填ケース５の第一端部３１側の開口から第二樹脂充填ケース５内に注入するように構成されている。このため、基板１の向きを変えることなく、二つの樹脂充填ケース４，５内にそれぞれ放熱樹脂６を注入し、同時に硬化させることができる。すなわち、二つの樹脂充填ケース４，５内に放熱樹脂６を充填する工程を一括して短時間で実施することが可能となる。   Furthermore, in the heat dissipation structure of this embodiment, the heat dissipation resin 6 is injected into the first resin filling case 4 from the opening on the second end 22 side of the first resin filling case 4 disposed on the lower surface 1b of the substrate 1. The second resin filling case 5 arranged on the upper surface 1a of the substrate 1 is poured into the second resin filling case 5 from the opening on the first end portion 31 side. For this reason, without changing the direction of the board | substrate 1, the thermal radiation resin 6 can be inject | poured in the two resin filling cases 4 and 5, respectively, and can be hardened simultaneously. That is, the process of filling the heat radiating resin 6 in the two resin filling cases 4 and 5 can be performed in a short time in a lump.

また、本実施形態の放熱構造では、各樹脂充填ケース４，５の第二端部２２，３２がはんだ１５によって基板１に固定されているため、各樹脂充填ケース４，５を効率よく基板１に固定することが可能である。
本実施形態では、各樹脂充填ケース４，５が接続突起２５，３５を備えるため、例えば、電子部品７，８が表面実装されるチップ部品である場合、第二電子部品８をはんだによって基板１の上面１ａに固定する工程において、フローあるいはリフローはんだ付けにより第一樹脂充填ケース４を同時に基板１に固定することができる。また、第一電子部品７をはんだによって基板１の下面１ｂに固定する工程において、第二樹脂充填ケース５を同時に基板１に固定することができる。
また、例えば、電子部品がスルーホール実装されるリード部品である場合、第一電子部品７を基板１の下面１ｂに固定する工程において、第一樹脂充填ケース４を同時に基板１に固定することができる。また、第二電子部品８を基板１の上面１ａに固定する工程において、第二樹脂充填ケース５を同時に基板１に固定することができる。 Further, in the heat dissipation structure of the present embodiment, since the second end portions 22 and 32 of the resin filling cases 4 and 5 are fixed to the substrate 1 by the solder 15, the resin filling cases 4 and 5 are efficiently attached to the substrate 1. It is possible to fix to.
In the present embodiment, since the resin-filled cases 4 and 5 include the connection protrusions 25 and 35, for example, when the electronic components 7 and 8 are chip components that are surface-mounted, the second electronic component 8 is soldered to the substrate 1 by soldering. In the step of fixing to the upper surface 1a, the first resin-filled case 4 can be simultaneously fixed to the substrate 1 by flow or reflow soldering. In the step of fixing the first electronic component 7 to the lower surface 1b of the substrate 1 with solder, the second resin-filled case 5 can be fixed to the substrate 1 at the same time.
For example, when the electronic component is a lead component that is mounted through-hole, the first resin-filled case 4 can be simultaneously fixed to the substrate 1 in the step of fixing the first electronic component 7 to the lower surface 1 b of the substrate 1. it can. In the step of fixing the second electronic component 8 to the upper surface 1 a of the substrate 1, the second resin-filled case 5 can be fixed to the substrate 1 at the same time.

さらに、本実施形態の放熱構造では、各樹脂充填ケース４，５に接続突起２５，３５が形成されているため、各樹脂充填ケース４，５を基板１に取り付ける際に接続突起２５，３５を基板１に差し込むだけで、基板１に対する各樹脂充填ケース４，５の位置決めを容易に行うことができる。   Furthermore, in the heat dissipation structure of the present embodiment, the connection protrusions 25 and 35 are formed on the resin-filled cases 4 and 5, so the connection protrusions 25 and 35 are not attached when the resin-filled cases 4 and 5 are attached to the substrate 1. The resin-filled cases 4 and 5 can be easily positioned with respect to the substrate 1 simply by being inserted into the substrate 1.

また、本実施形態の放熱構造では、各樹脂充填ケース４，５の第一端部２１，３１に、底壁板部２３，３３が形成されている、すなわち、各樹脂充填ケース４，５が有底筒状に形成されている。このため、樹脂充填ケース４，５に底壁板部２３，３３が無い場合と比較して、容易かつ確実に各樹脂充填ケース４，５の第一端部２１，３１を各放熱部材２，３に固定することができる。本実施形態では、ネジ４１の頭と第一放熱部材２との間に第一樹脂充填ケース４の底壁板部２３を挟み込むことで、第一樹脂充填ケース４を容易に第一放熱部材２に固定できる。また、ネジ４２の頭と第二樹脂充填ケース５の底壁板部３３との間に第二放熱部材３を挟み込むことで、第二樹脂充填ケース５を容易に第二放熱部材３に固定できる。
さらに、各樹脂充填ケース４，５の底壁板部２３，３３が各放熱部材２，３に固定されることで、各樹脂充填ケース４，５から各放熱部材２，３に効率よく熱を逃がすことができる。 In the heat dissipation structure of the present embodiment, the bottom wall plate portions 23 and 33 are formed at the first end portions 21 and 31 of the resin filling cases 4 and 5, that is, the resin filling cases 4 and 5 are It is formed in a bottomed cylindrical shape. For this reason, compared with the case where the resin-filled cases 4 and 5 do not have the bottom wall plate portions 23 and 33, the first end portions 21 and 31 of the resin-filled cases 4 and 5 can be easily and reliably connected to the heat radiating members 2 and 2, respectively. 3 can be fixed. In the present embodiment, the first resin-filled case 4 can be easily attached to the first heat-dissipating member 2 by sandwiching the bottom wall plate portion 23 of the first resin-filled case 4 between the head of the screw 41 and the first heat-dissipating member 2. Can be fixed. Further, the second resin filled case 5 can be easily fixed to the second heat radiating member 3 by sandwiching the second heat radiating member 3 between the head of the screw 42 and the bottom wall plate portion 33 of the second resin filled case 5. .
Further, the bottom wall plate portions 23 and 33 of the resin filling cases 4 and 5 are fixed to the heat radiating members 2 and 3, so that heat is efficiently applied from the resin filling cases 4 and 5 to the heat radiating members 2 and 3. I can escape.

また、本実施形態の放熱構造では、ネジ４１，４２によって各樹脂充填ケース４，５が各放熱部材２，３に固定されるため、同一の放熱部材２，３に対して様々な形状や大きさの樹脂充填ケース４，５を固定することが可能である。したがって、さらに汎用性の高い放熱構造を提供できる。   Further, in the heat dissipation structure of the present embodiment, the resin-filled cases 4 and 5 are fixed to the heat dissipation members 2 and 3 by screws 41 and 42, so that various shapes and sizes of the same heat dissipation members 2 and 3 are provided. The resin-filled cases 4 and 5 can be fixed. Therefore, a more versatile heat dissipation structure can be provided.

以上、本発明の詳細について説明したが、本発明は上述した実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲において種々の変更を加えることができる。
例えば、放熱樹脂６は、上記実施形態のように第一樹脂充填ケース４内に隙間なく充填されることに限らず、少なくとも基板１に搭載された電子部品７に接触するように充填されればよい。したがって、放熱樹脂６は、例えば図５に示すように、基板１との間に隙間が生じるように充填されてもよい。この構成では、使用する放熱樹脂６の量をさらに減少できるため、電子機器の軽量化をさらに図ることが可能である。
なお、上記のように放熱樹脂６を第一樹脂充填ケース４内に充填する場合には、放熱樹脂６を注入する際に基板１と第一樹脂充填ケース４の第二端部２２との隙間から放熱樹脂６が漏れ出すことが無い。したがって、この隙間を接着剤１８によって埋める必要が無くなり、電子機器の製造を簡便に行うことができる。 Although the details of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.
For example, the heat-dissipating resin 6 is not limited to being filled in the first resin-filled case 4 without a gap as in the above-described embodiment, and may be at least filled with the electronic component 7 mounted on the substrate 1. Good. Therefore, for example, as shown in FIG. 5, the heat-dissipating resin 6 may be filled so that a gap is formed between the heat-dissipating resin 6 and the substrate 1. In this configuration, since the amount of the heat radiation resin 6 to be used can be further reduced, it is possible to further reduce the weight of the electronic device.
When the heat radiating resin 6 is filled in the first resin filling case 4 as described above, the gap between the substrate 1 and the second end 22 of the first resin filling case 4 when the heat radiating resin 6 is injected. Therefore, the heat radiation resin 6 does not leak out. Therefore, it is not necessary to fill this gap with the adhesive 18, and the electronic device can be easily manufactured.

また、各樹脂充填ケース４，５の第二端部２２，３２に形成される接続突起２５，３５は、上記実施形態のように樹脂充填ケース４，５の軸方向に突出することに限らず、例えば、樹脂充填ケース４，５の径方向外側に突出してもよい。この場合には、電子部品７，８を搭載した基板１の主面（上面１ａや下面１ｂ）上に接続突起２５，３５を配して、はんだ１５により基板１の主面に接合すればよい。
このような構成でも、上記実施形態の場合と同様に、各樹脂充填ケース４，５を効率よく基板１に固定することが可能である。例えば、電子部品７，８が表面実装されるチップ部品である場合、第一電子部品７をはんだで基板１の下面１ｂに固定する工程において、第一樹脂充填ケース４も同時に基板１に固定できる。また、第二電子部品８をはんだで基板１の上面１ａに固定する工程において、第二樹脂充填ケース５も同時に基板１に固定できる。 Further, the connection protrusions 25 and 35 formed on the second end portions 22 and 32 of the resin filling cases 4 and 5 are not limited to projecting in the axial direction of the resin filling cases 4 and 5 as in the above embodiment. For example, the resin-filled cases 4 and 5 may protrude outward in the radial direction. In this case, the connection protrusions 25 and 35 may be disposed on the main surface (upper surface 1 a and lower surface 1 b) of the substrate 1 on which the electronic components 7 and 8 are mounted, and bonded to the main surface of the substrate 1 with the solder 15. .
Even with such a configuration, the resin-filled cases 4 and 5 can be efficiently fixed to the substrate 1 as in the case of the above embodiment. For example, when the electronic components 7 and 8 are chip components that are surface-mounted, the first resin-filled case 4 can be simultaneously fixed to the substrate 1 in the step of fixing the first electronic component 7 to the lower surface 1b of the substrate 1 with solder. . In the step of fixing the second electronic component 8 to the upper surface 1a of the substrate 1 with solder, the second resin-filled case 5 can be fixed to the substrate 1 at the same time.

また、上記実施形態では、第二樹脂充填ケース５の底壁板部３３に形成された貫通孔３４自体がネジ孔となっているが、例えば図６に示すように、ネジ孔を有する筒状部材４５が、第二樹脂充填ケース５の貫通孔３４に圧入等により嵌め込まれていてもよい。   Moreover, in the said embodiment, although the through-hole 34 itself formed in the bottom wall board part 33 of the 2nd resin filling case 5 is a screw hole, as shown, for example in FIG. 6, the cylinder shape which has a screw hole The member 45 may be fitted into the through hole 34 of the second resin filled case 5 by press fitting or the like.

また、上記実施形態では、放熱部材２，３と樹脂充填ケース４，５の第一端部２１，３１とが、ネジ４１，４２及び放熱シート４３あるいは放熱グリス４４の両方によって接続されているが、例えば、ネジ４１，４２のみ、あるいは、放熱シート４３や放熱グリス４４のみによって接続されてもよい。また、放熱部材２，３と樹脂充填ケース４，５の第一端部２１，３１とは、例えば接着によって接続されてもよい。
なお、放熱部材２，３と樹脂充填ケース４，５の第一端部２１，３１とを放熱シート４３や放熱グリス４４のみによって接続する場合は、基板１や第二放熱部材３を第一放熱部材２に固定する力を利用して、樹脂充填ケース４，５を各放熱部材２，３に押し付けるようにすればよい。 Moreover, in the said embodiment, although the heat radiating members 2 and 3 and the 1st end parts 21 and 31 of the resin filling cases 4 and 5 are connected by both the screws 41 and 42 and the heat radiating sheet 43 or the heat radiating grease 44. For example, it may be connected only by the screws 41 and 42 or only by the heat radiating sheet 43 and the heat radiating grease 44. Moreover, the heat radiating members 2 and 3 and the first end portions 21 and 31 of the resin-filled cases 4 and 5 may be connected by, for example, adhesion.
When the heat radiating members 2 and 3 and the first end portions 21 and 31 of the resin-filled cases 4 and 5 are connected only by the heat radiating sheet 43 and the heat radiating grease 44, the substrate 1 and the second heat radiating member 3 are connected to the first heat radiating member. What is necessary is just to press the resin filling cases 4 and 5 against each heat radiating member 2 and 3 using the force fixed to the member 2. FIG.

また、第一樹脂充填ケース４の第一端部２１を接着によって第一放熱部材２に固定する場合、第一樹脂充填ケース４の底壁板部２３には貫通孔２４が形成されなくてもよい。
さらに、各樹脂充填ケース４，５の第一端部２１，３１を接着によって各放熱部材２，３に固定する場合、各樹脂充填ケース４，５の第一端部２１，３１に形成される平板部２３，３３は、上記実施形態のように径方向内側に延在することに限らず、例えば径方向外側に延在してもよい。 Further, when the first end portion 21 of the first resin filling case 4 is fixed to the first heat radiating member 2 by adhesion, the bottom wall plate portion 23 of the first resin filling case 4 does not have to be formed with the through hole 24. Good.
Further, when the first end portions 21 and 31 of the resin filled cases 4 and 5 are fixed to the heat radiating members 2 and 3 by bonding, the first end portions 21 and 31 of the resin filled cases 4 and 5 are formed. The flat plate portions 23 and 33 are not limited to extending radially inward as in the above-described embodiment, and may extend, for example, radially outward.

また、樹脂充填ケース４，５を接着によって放熱部材２，３に固定する場合、樹脂充填ケース４，５の第一端部２１，３１には平板部２３，３３が形成されていなくてもよい。ただし、樹脂充填ケース４，５が平板部２３，３３を有していれば、樹脂充填ケース４，５と放熱部材２，３との接着面積が平板部２３，３３によって拡大するため、容易かつ確実に樹脂充填ケース４，５を放熱部材２，３に固定できる、という利点がある。   Further, when the resin-filled cases 4 and 5 are fixed to the heat radiating members 2 and 3 by bonding, the flat plate portions 23 and 33 may not be formed on the first end portions 21 and 31 of the resin-filled cases 4 and 5. . However, if the resin-filled cases 4 and 5 have the flat plate portions 23 and 33, the bonding area between the resin-filled cases 4 and 5 and the heat radiating members 2 and 3 is enlarged by the flat plate portions 23 and 33. There is an advantage that the resin-filled cases 4 and 5 can be securely fixed to the heat radiating members 2 and 3.

さらに、放熱樹脂６には、上記実施形態のように基板１に搭載された電子部品７，８が接触することに限らず、少なくとも基板１に形成される回路のうち冷却を要する要冷却部が接触すればよい。このような要冷却部としては、電子部品７，８の他に、配線パターンのうち通電により発熱する部分（例えば配線パターンのうち電源電流など大きな電流が流れる部分）が挙げられる。
また、樹脂充填ケース４，５は、基板１の両主面（上面１ａ及び下面１ｂ）に配されることに限らず、少なくとも電子機器の要冷却部を囲むように少なくとも基板１の一方の主面（上面１ａあるいは下面１ｂ）に配されていればよい。 Furthermore, the heat-dissipating resin 6 is not limited to contact with the electronic components 7 and 8 mounted on the substrate 1 as in the above-described embodiment. Just touch. Examples of such a cooling required part include, in addition to the electronic components 7 and 8, a part of the wiring pattern that generates heat when energized (for example, a part of the wiring pattern through which a large current such as a power supply current flows).
Further, the resin-filled cases 4 and 5 are not limited to being arranged on both main surfaces (the upper surface 1a and the lower surface 1b) of the substrate 1, but at least one main surface of the substrate 1 so as to surround at least the cooling required portion of the electronic device. It suffices to be disposed on the surface (upper surface 1a or lower surface 1b).

１ 基板
１ａ 上面（主面）
１ｂ 下面（主面）
２ 第一放熱部材
３ 第二放熱部材
４ 第一樹脂充填ケース
５ 第二樹脂充填ケース
６ 放熱樹脂
７ 第一電子部品（要冷却部）
８ 第二電子部品（要冷却部）
１５ はんだ
１９ 樹脂注入孔
２０ ネジ挿通孔（樹脂注入孔）
２１，３１ 第一端部
２２，３２ 第二端部
２３，３３ 底壁板部（平板部）
２５，３５ 接続突起
４３ 放熱シート
４４ 放熱グリス 1 Substrate 1a Upper surface (main surface)
1b Bottom surface (main surface)
2 1st heat dissipation member 3 2nd heat dissipation member 4 1st resin filling case 5 2nd resin filling case 6 Heat dissipation resin 7 1st electronic component (cooling required part)
8 Second electronic components (cooling required)
15 Solder 19 Resin injection hole 20 Screw insertion hole (resin injection hole)
21, 31 First end portion 22, 32 Second end portion 23, 33 Bottom wall plate portion (flat plate portion)
25, 35 Connection protrusion 43 Heat dissipation sheet 44 Heat dissipation grease

Claims (6)

少なくとも一方の主面に電子部品が搭載されて回路を形成した基板と、該基板の各主面に間隔をあけた位置に配された二つの放熱部材と、前記基板の各主面から各放熱部材まで延びる筒状に形成された二つの樹脂充填ケースと、各樹脂充填ケースに充填された放熱樹脂と、を備え、
各樹脂充填ケースが、前記回路のうち冷却を要する要冷却部を囲むように配され、
前記放熱樹脂が、各放熱部材側に位置する各樹脂充填ケースの第一端部において隙間なく充填され、かつ、前記基板側に位置する各樹脂充填ケースの第二端部において少なくとも前記要冷却部に接触し、
各樹脂充填ケースの第一端部に、該樹脂充填ケースの径方向内側に延在する平板部が形成され、
該平板部が、前記放熱部材に面接触可能であり、
各樹脂充填ケースの前記平板部に、該平板部の厚さ方向に貫通する貫通孔が形成され、
第一樹脂充填ケースの第一端部は、ネジの軸部が前記第一樹脂充填ケースの貫通孔に挿通された上で第一放熱部材に螺着されることで、前記第一放熱部材に固定され、
第二樹脂充填ケースの第一端部は、ネジの軸部が第二放熱部材を貫通するネジ挿通孔に挿通された上で前記第二樹脂充填ケースの貫通孔に螺着されることで、前記第二放熱部材に固定され、
前記基板に、該基板の厚さ方向に貫通して前記第一樹脂充填ケース内に連通する樹脂注入孔が形成されていることを特徴とする電子機器の放熱構造。 A substrate formed with circuit on at least one major surface mounted electronic component, and two heat dissipating member disposed at a position spaced to each major surface of the substrate, the heat radiation from the main surface of the substrate Two resin-filled cases formed in a cylindrical shape extending to the member, and heat dissipation resin filled in each resin-filled case,
Each resin-filled case is arranged so as to surround a cooling required portion that needs cooling in the circuit,
The heat-dissipating resin is filled without a gap at the first end of each resin-filled case located on each heat-dissipating member side, and at least the cooling-required part at the second end of each resin-filled case located on the substrate side In contact with
A flat plate portion extending inward in the radial direction of the resin filling case is formed at the first end of each resin filling case,
The flat plate portion can come into surface contact with the heat radiating member,
A through-hole penetrating in the thickness direction of the flat plate portion is formed in the flat plate portion of each resin-filled case,
The first end of the first resin-filled case is screwed into the first heat-dissipating member after the shaft portion of the screw is inserted into the through-hole of the first resin-filled case. Fixed,
The first end portion of the second resin filling case is screwed into the through hole of the second resin filling case after the shaft portion of the screw is inserted into the screw insertion hole that penetrates the second heat radiating member. Fixed to the second heat dissipation member;
A heat dissipation structure for an electronic device, wherein a resin injection hole penetrating in the thickness direction of the substrate and communicating with the first resin-filled case is formed in the substrate. 前記樹脂充填ケースの第二端部がはんだによって前記基板に固定されていることを特徴とする請求項１に記載の電子機器の放熱構造。 2. The heat dissipation structure for an electronic device according to claim 1, wherein a second end portion of the resin-filled case is fixed to the substrate with solder. 前記樹脂充填ケースの第二端部に、該樹脂充填ケースの軸方向に突出して前記基板に挿通される接続突起が形成されていることを特徴とする請求項１または請求項２に記載の電子機器の放熱構造。 3. The electron according to claim 1, wherein a connection projection that protrudes in an axial direction of the resin filling case and is inserted through the substrate is formed at a second end portion of the resin filling case. Equipment heat dissipation structure. 前記樹脂充填ケースの第一端部と前記放熱部材との間に、放熱シートあるいは放熱グリスが介在していることを特徴とする請求項１から請求項３のいずれか一項に記載の電子機器の放熱構造。 4. The electronic device according to claim 1 , wherein a heat radiating sheet or heat radiating grease is interposed between the first end of the resin-filled case and the heat radiating member. 5. Heat dissipation structure. 前記樹脂充填ケースが、前記放熱樹脂よりも熱伝導率の高い材料によって形成されていることを特徴とする請求項１から請求項４のいずれか一項に記載の電子機器の放熱構造。 5. The heat dissipation structure for an electronic device according to claim 1 , wherein the resin-filled case is formed of a material having a higher thermal conductivity than the heat dissipation resin. 前記樹脂充填ケース及び前記放熱部材が導電性を有し、
前記基板の接地配線が、前記樹脂充填ケースを介して前記放熱部材に電気接続されていることを特徴とする請求項１から請求項５のいずれか一項に記載の電子機器の放熱構造。 The resin-filled case and the heat dissipation member have conductivity,
6. The heat dissipation structure for an electronic device according to claim 1 , wherein a ground wiring of the substrate is electrically connected to the heat dissipation member via the resin-filled case.
JP2012189914A 2012-08-30 2012-08-30 Heat dissipation structure of electronic equipment Expired - Fee Related JP5888816B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012189914A JP5888816B2 (en) 2012-08-30 2012-08-30 Heat dissipation structure of electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012189914A JP5888816B2 (en) 2012-08-30 2012-08-30 Heat dissipation structure of electronic equipment

Publications (2)

Publication Number Publication Date
JP2014049534A JP2014049534A (en) 2014-03-17
JP5888816B2 true JP5888816B2 (en) 2016-03-22

Family

ID=50608917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012189914A Expired - Fee Related JP5888816B2 (en) 2012-08-30 2012-08-30 Heat dissipation structure of electronic equipment

Country Status (1)

Country Link
JP (1) JP5888816B2 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567893A (en) * 1991-09-10 1993-03-19 Mitsubishi Electric Corp Local shielding method for circuit board
JPH06283884A (en) * 1993-03-25 1994-10-07 Nippon Chemicon Corp Shielded board and its shield process
JP2003234585A (en) * 2002-02-06 2003-08-22 Fujitsu Ten Ltd Heat radiating structure of electronic component

Also Published As

Publication number Publication date
JP2014049534A (en) 2014-03-17

Similar Documents

Publication Publication Date Title
JP6252871B2 (en) Circuit structure and electrical junction box
JP4638923B2 (en) Control device
US9795053B2 (en) Electronic device and method for manufacturing the electronic device
US20210105891A1 (en) Metal member-equipped circuit board, circuit assembly, and electrical junction box
US10820406B2 (en) Circuit structure and electrical junction box
JP2016152349A (en) Circuit structure
JP5846181B2 (en) Electronic control unit
JP6227937B2 (en) Electronic control device for vehicle
JP4433875B2 (en) Heat dissipating structure of heat generating component and method of manufacturing heat dissipating member in this heat dissipating structure
JP6354163B2 (en) Circuit board and electronic device
JP6255176B2 (en) Thermal management structure of electronic equipment
JP4452888B2 (en) Electronic circuit equipment
WO2016104110A1 (en) Circuit structure and electrical connection box
JP5888816B2 (en) Heat dissipation structure of electronic equipment
JP7056364B2 (en) Circuit structure and electrical junction box
WO2019216238A1 (en) Circuit structure and electrical connection box
JP2009238923A (en) Electronic equipment
WO2014208006A1 (en) Electronic device and method for manufacturing said electronic device
WO2021059914A1 (en) Electronic circuit device
WO2020246224A1 (en) Circuit structure and electrical connection box
JP2016076622A (en) Circuit board and electronic device
WO2019216366A1 (en) Circuit structure
JP2015012161A (en) Electronic device
JP2015056521A (en) Electronic system
JP2008277591A (en) Case structure for electronic equipment

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150114

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150911

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150924

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151120

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160119

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160215

R150 Certificate of patent or registration of utility model

Ref document number: 5888816

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees