JP5865745B2 - Light-emitting element mounting substrate and light-emitting device using the same - Google Patents
Light-emitting element mounting substrate and light-emitting device using the same Download PDFInfo
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Description
本発明は、高い反射性を有する発光素子搭載用基板、およびそれを用いた発光装置に関する。 The present invention relates to a light-emitting element mounting substrate having high reflectivity and a light-emitting device using the same.
近年、省エネ・環境保全の面から、液晶テレビを始めとして、液晶画面のバックライトや、一般家庭用照明のＬＥＤ（Light Emission Diode）化が進んでいる。ＬＥＤを発光素子とする発光装置は、蛍光灯や白熱電球に比較して寿命は約１０倍、電気代は約１／１０程度と、優れた点が多く、脚光を浴びている。 In recent years, from the viewpoint of energy saving and environmental conservation, LCD televisions and backlights for liquid crystal screens and LEDs (Light Emission Diodes) for general household lighting have been developed. Light-emitting devices using LEDs as light-emitting elements are attracting attention because they have many excellent features, such as about 10 times the life of fluorescent lamps and incandescent bulbs, and about 1/10 of the electricity bill.
従来より、この種の発光装置は、ＬＥＤタイプの発光素子を各種基板の上に実装し、その発光素子を各種基板の上に形成した電極パターンにワイヤボンディングあるいはバンプ実装によって接続した構成となっている。 Conventionally, this type of light-emitting device has a configuration in which LED-type light-emitting elements are mounted on various substrates, and the light-emitting elements are connected to electrode patterns formed on the various substrates by wire bonding or bump mounting. Yes.
その中で、高い反射性を有するだけでなく、従来の発光素子搭載用基板に用いられてきた合成樹脂に比べて、熱伝導性および機械的強度が高く、耐熱性や耐久性に優れ、長期間紫外線に曝されても劣化しないという理由から、アルミナセラミックスやガラスセラミックスを基材とした発光素子搭載用基板が注目されている。 Among them, not only has high reflectivity, but also has higher thermal conductivity and mechanical strength, superior heat resistance and durability, and longer than the synthetic resin used for conventional light emitting element mounting substrates. A light emitting element mounting substrate based on alumina ceramics or glass ceramics has attracted attention because it does not deteriorate even when exposed to ultraviolet rays for a period of time.
また、図８（ａ）（ｂ）に示されるように、発光素子搭載用基板１０１として、発光素子１０３から発せられる光の発光効率を高めるために、発光素子１０３が搭載される基板（基体部１０５）の表面に、発光素子１０３を囲繞する壁面１０６を有する、いわゆる枠体部１０７を設けたものが提案されている（例えば、特許文献１を参照）。 Further, as shown in FIGS. 8A and 8B, a substrate (base portion) on which the light emitting element 103 is mounted as the light emitting element mounting substrate 101 in order to increase the light emission efficiency of light emitted from the light emitting element 103. 105) has been proposed in which a so-called frame portion 107 having a wall surface 106 surrounding the light emitting element 103 is provided (see, for example, Patent Document 1).
さらに、このような発光素子搭載用基板１０１には、発光素子１０３からの白色光の発光強度を向上させるために、枠体部１０７の上面から内壁１０６にかけて、４６０ｎｍ付近の波長の反射率が最も高い銀（Ａｇ）の膜１０９を形成し、反射板として使用するものが提案されている（例えば、特許文献２を参照）。 Furthermore, in order to improve the light emission intensity of white light from the light emitting element 103, such a light emitting element mounting substrate 101 has the highest reflectance at a wavelength near 460 nm from the upper surface of the frame body portion 107 to the inner wall 106. A high silver (Ag) film 109 is formed and used as a reflector (for example, see Patent Document 2).
ところが、枠体部１０７の上面および内壁１０６のほぼ全面に銀の膜１０９を形成した構造にすると、発光強度は高められるものの、発光素子搭載用基板１０１を用いてＬＥＤ照明等の発光装置を製造する際のハンドリング時に、枠体部１０７の上面１０９や角部１１１に形成されている銀の膜１０９に欠けや傷などの損傷が発生しやすいという問題があった。 However, when the structure in which the silver film 109 is formed on the entire upper surface of the frame portion 107 and the inner wall 106 is used, the light emission intensity is increased, but a light emitting device such as an LED illumination is manufactured using the light emitting element mounting substrate 101. During handling, there is a problem that the silver film 109 formed on the upper surface 109 and the corners 111 of the frame body portion 107 is likely to be damaged such as chipping or scratching.
従って、本発明は、枠体部に形成された銀の膜の損傷の発生を防止できるとともに、発光強度を高くできる発光素子搭載用基板およびそれを用いた発光装置を提供することを目的とする。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a light emitting element mounting substrate capable of preventing the silver film formed on the frame portion from being damaged and increasing the light emission intensity, and a light emitting device using the same. .
本発明の発光素子搭載用基板は、ともにガラスセラミックス製の焼結体により構成され、中央部に発光素子の搭載面を有する基体部および該基体部上で前記搭載面を囲むように配置された枠体部と、該枠体部の内壁に形成された銀の膜と、を備えている発光素子搭載用基板であって、前記銀の膜が、前記枠体部の前記内壁における上端よりも下側の位置から前記搭載面の位置までの領域を覆うように設けられているとともに、前記内壁に面一に埋設されていることを特徴とする。また、本発明の発光素子搭載用基板は、ともにガラスセラミックス製の焼結体により構成され、中央部に発光素子の搭載面を有する基体部および該基体部上で前記搭載面を囲むように配置された枠体部と、該枠体部の内壁に形成された銀の膜と、を備えている発光素子搭載用基板であって、前記枠体部が対角線上の対向する位置に角部を有する矩形状を為しており、前記銀の膜が、前記枠体部の前記内壁における上端よりも下側の位置から前記搭載面の位置までの、前記角部に対向する部分を除く領域を覆うように設けられていることを特徴とする。
The light emitting element mounting substrate of the present invention is composed of a sintered body made of glass ceramics, and is disposed so as to surround the mounting surface on the base portion having a light emitting element mounting surface in the center. A light emitting element mounting substrate comprising a frame body and a silver film formed on an inner wall of the frame body, wherein the silver film is more than an upper end of the inner wall of the frame body It is provided so as to cover a region from a lower position to the position of the mounting surface, and is embedded in the inner wall flush . The substrate for mounting a light-emitting element of the present invention is composed of a sintered body made of glass ceramics, and has a base portion having a light-emitting element mounting surface at the center, and is disposed so as to surround the mounting surface on the base portion. And a silver film formed on an inner wall of the frame body portion, wherein the frame body portion has a corner portion at a diagonally opposite position. The silver film has a region excluding a portion facing the corner portion from a position below the upper end of the inner wall of the frame body portion to a position of the mounting surface. It is provided so that it may cover.
本発明の発光装置は、上記の発光素子搭載用基板の前記搭載部に発光素子を備えていることを特徴とする。 The light emitting device of the present invention is characterized in that a light emitting element is provided in the mounting portion of the light emitting element mounting substrate.
本発明によれば、枠体部に形成された銀の膜の損傷の発生を防止できるとともに、発光強度を高くできる発光素子搭載用基板およびそれを用いた発光装置を得ることができる。 ADVANTAGE OF THE INVENTION According to this invention, while being able to prevent generation | occurrence | production of the damage of the silver film | membrane formed in the frame part, the light emitting element mounting substrate which can make luminous intensity high, and a light-emitting device using the same can be obtained.
図１（ａ）（ｂ）は、本実施形態の発光素子搭載用基板の一例を模式的に示す断面模式図および平面図である。 FIGS. 1A and 1B are a schematic cross-sectional view and a plan view schematically showing an example of a light-emitting element mounting substrate according to the present embodiment.
本実施形態の発光素子搭載用基板は、発光素子を搭載するための搭載面１を有する基体部３と、その搭載面１を囲むように配置されている枠体部５とを備えており、これらの基体部３および枠体部５はいずれもガラスセラミックス製の焼結体により構成されている。 The light emitting element mounting substrate of the present embodiment includes a base portion 3 having a mounting surface 1 for mounting a light emitting element, and a frame body portion 5 disposed so as to surround the mounting surface 1. Both the base body portion 3 and the frame body portion 5 are made of a sintered body made of glass ceramics.
この枠体部５の内壁９には銀の膜１１が設けられているが、本実施形態における枠体部５は、銀の膜１１が枠体部５の内壁９における上端１３よりも下側の位置１５から基体部３の搭載面１の位置までの領域を覆う構成となっている。 Although the silver film 11 is provided on the inner wall 9 of the frame body part 5, the frame body part 5 in this embodiment is lower than the upper end 13 of the inner wall 9 of the frame body part 5. The region from the position 15 to the position of the mounting surface 1 of the base 3 is covered.
本実施形態の発光素子搭載用基板によれば、銀の膜１１が枠体部５の内壁９の上端１３（角部１９）よりも下側の位置１５から下方側に形成されているために、発光素子搭載用基板をハンドリングする際に、不意に硬い物に当てたり、落下させたりした場合などにも、枠体部５の内壁９の銀の膜１１には欠けや傷が発生し難い。これによりきれいな銀の膜１１を有し、発光強度の高い発光素子搭載用基板を得ることができる。 According to the light emitting element mounting substrate of this embodiment, the silver film 11 is formed on the lower side from the position 15 below the upper end 13 (corner portion 19) of the inner wall 9 of the frame body portion 5. When handling the light emitting element mounting substrate, the silver film 11 on the inner wall 9 of the frame 5 is less likely to be chipped or scratched even when it is suddenly applied to a hard object or dropped. . As a result, a light-emitting element mounting substrate having a clean silver film 11 and high emission intensity can be obtained.
ここで、枠体部５の内壁９における上端１３よりも下側の位置１５とは、内壁９の上端１３の平行な面に接しない程度の位置のことであり、目安としては、内壁９の上端１３から下方側に、銀の膜１１の平均厚みよりも長い距離とすることが望ましい。 Here, the position 15 below the upper end 13 of the inner wall 9 of the frame body portion 5 is a position that does not contact the parallel surface of the upper end 13 of the inner wall 9. The distance from the upper end 13 to the lower side is preferably longer than the average thickness of the silver film 11.
また、枠体部５の内壁９における銀の膜１１の下端１７となっている搭載面１の位置１７とは、基体部３の表面付近の高さにある位置のことを示すが、実装される発光素子のサイズや発光面の位置によっては、基体部３の表面から高い位置でも構わない。また、銀の膜１１は枠体部５の上面２１にも形成されていない。 In addition, the position 17 of the mounting surface 1 which is the lower end 17 of the silver film 11 on the inner wall 9 of the frame body part 5 indicates a position at a height near the surface of the base body part 3. Depending on the size of the light emitting element and the position of the light emitting surface, the position may be higher from the surface of the base 3. Further, the silver film 11 is not formed on the upper surface 21 of the frame 5.
また、銀の膜１１の平均厚みとは、枠体部５の内壁９の上端と搭載面１の位置１７である下端との間の中間付近における銀の膜の厚みのことである。 The average thickness of the silver film 11 is the thickness of the silver film in the vicinity of the middle between the upper end of the inner wall 9 of the frame 5 and the lower end, which is the position 17 of the mounting surface 1.
この場合、銀の膜１１の平均厚みは１〜２０μｍであるのが良い。銀の膜１１の平均厚みが１〜２０μｍであると、銀の膜１１のピンホール等の欠陥を無くすことができるとともに、枠体部５の内壁９からの突出量を小さくできるために、内壁９内においても銀の膜１１への損傷を防止でき、高い反射性を得ることが可能になる。 In this case, the average thickness of the silver film 11 is preferably 1 to 20 μm. When the average thickness of the silver film 11 is 1 to 20 μm, defects such as pinholes in the silver film 11 can be eliminated, and the amount of protrusion from the inner wall 9 of the frame 5 can be reduced. 9 can also prevent damage to the silver film 11 and obtain high reflectivity.
なお、枠体部５の内壁９における銀の膜１１による反射のばらつきを抑制できるという理由から、銀の膜１１の上端となっている上端１３よりも下がった位置１５は、内壁９を周回させた範囲において同一の高さとなっていることが望ましい。また、枠体部５の内壁９の上端１３である角部１９は丸みを帯びていることが望ましい。角部１９が丸みを帯びるような形状であると、角部１９の欠けなどの発生も防止することができ、これにより枠体部５の破損によって導かれる銀の膜１１の損傷をも低減させることができる。 The position 15 that is lower than the upper end 13 that is the upper end of the silver film 11 causes the inner wall 9 to circulate because the dispersion of reflection by the silver film 11 on the inner wall 9 of the frame 5 can be suppressed. It is desirable to have the same height in the range. Further, it is desirable that the corner portion 19 which is the upper end 13 of the inner wall 9 of the frame body portion 5 is rounded. When the corner portion 19 has a rounded shape, it is possible to prevent the corner portion 19 from being chipped, thereby reducing the damage to the silver film 11 that is induced by the breakage of the frame body portion 5. be able to.
また、基体部３と枠体部５とは機械的強度を高くできるという点で一体的に形成されているのがよい。ここで、基体部３と枠体部５とが一体的に形成されているというのは、枠体部５と基体部３とが同時焼成されて焼結されたものという意味である。 Moreover, it is good for the base | substrate part 3 and the frame part 5 to be integrally formed by the point that mechanical strength can be made high. Here, the fact that the base body portion 3 and the frame body portion 5 are integrally formed means that the frame body portion 5 and the base body portion 3 are simultaneously fired and sintered.
また、この発光素子搭載用基板は基体部３と枠体部５とが同じ材質であるのがよい。基体部３と枠体部５とが同じ材質であると、同時焼成される際に、基体部３と枠体部５との焼結速度が近いことから発光素子搭載用基板の反りや変形を低減することができる。この場合、同じ材質というのは、基体部３および枠体部５に含まれる主成分のセラミック成分が同じであるという意味である。ここで、主成分とは、基体部３および枠体部５に含まれるガラス成分およびセラミック粒子のことをいい、それらを合わせた含有量が８０質量％以上である場合をいう。 In the light emitting element mounting substrate, the base body 3 and the frame body 5 are preferably made of the same material. When the base body 3 and the frame body 5 are made of the same material, when the base body 3 and the frame body 5 are sintered at the same time, the sintering speed of the base body 3 and the frame body 5 is close. Can be reduced. In this case, the same material means that the ceramic components of the main components contained in the base body portion 3 and the frame body portion 5 are the same. Here, the main component means a glass component and ceramic particles contained in the base body portion 3 and the frame body portion 5, and refers to a case where the combined content is 80% by mass or more.
また、本実施形態の発光素子搭載用基板では、銀の膜１１が内壁９に面一に埋設されていることが望ましい。銀の膜１１を内壁９に面一に埋設されたようにすると、銀の膜１１が枠体部５の内壁９から突出していないために、銀の膜１１が損傷する確率をさらに低減することができる。 Moreover, in the light emitting element mounting substrate of the present embodiment, it is desirable that the silver film 11 is embedded in the inner wall 9 flush. If the silver film 11 is embedded in the inner wall 9 flush, the probability that the silver film 11 is damaged because the silver film 11 does not protrude from the inner wall 9 of the frame 5 is further reduced. Can do.
この場合、銀の膜１１および内壁９からの光の反射性をさらに向上させることができるという理由から、銀の膜１１の表面および枠体部５の内壁９の表面粗さ（Ｒａ）が小さいことが望ましく、例えば、１０μｍ以下、特に、５μｍ以下であることが望ましい。 In this case, the surface roughness (Ra) of the surface of the silver film 11 and the inner wall 9 of the frame 5 is small because the light reflectivity from the silver film 11 and the inner wall 9 can be further improved. Desirably, for example, 10 μm or less, particularly 5 μm or less is desirable.
図２（ａ）（ｂ）は、本実施形態の他の発光素子搭載用基板の一例を模式的に示す断面模式図および平面図であり、銀の膜が枠体部の内壁に部分的に形成された構造を示すものである。また、図３は、図２（ｂ）のＡ部およびＢ部の拡大図である。 2A and 2B are a schematic cross-sectional view and a plan view schematically showing an example of another light-emitting element mounting substrate of the present embodiment, in which a silver film is partially on the inner wall of the frame portion. It shows the structure formed. FIG. 3 is an enlarged view of portions A and B in FIG.
図２に示す本実施形態の他の発光素子搭載用基板では、銀の膜１１は、内壁９を周回する方向に、銀の膜１１が設けられた部分１１ａと銀の膜１１が設けられていない部分１１ｂとが内壁９を周回する方向に交互に配置された構成となっており、さらに、銀の膜が設けられた部分１１ａと銀の膜が設けられていない部分１１ｂとは焼結体中の気孔率が異な
っており、銀の膜が設けられていない部分１１ｂの焼結体（図１（ｂ）におけるＢの領域）の気孔率が銀の膜が設けられた部分１１ａの焼結体（図１（ｂ）におけるＡの領域）の気孔率よりも高いことが望ましい。
In the other light emitting element mounting substrate shown in FIG. 2, the silver film 11 is provided with a portion 11 a provided with the silver film 11 and a silver film 11 in a direction around the inner wall 9. The non-parts 11b are alternately arranged in the direction around the inner wall 9, and the parts 11a provided with the silver film and the parts 11b provided with no silver film are sintered bodies. Sintering of the part 11a in which the porosity of the sintered body of the part 11b in which the porosity is different and the silver film is not provided (region B in FIG. 1B) is provided with the silver film It is desirable that the porosity is higher than that of the body (region A in FIG. 1B).
これにより、枠体部５の内壁９に銀の膜１１を有する場合でも、枠体部５の内壁９に形成する銀の膜１１が内壁９のほぼ全面ではなく部分的に形成されているために、枠体部５の内壁９の全面に銀の膜１１を形成する場合に比較して銀の膜１１のコスト低減を図ることができるとともに、枠体部５の内壁９に占める銀の膜１１の単位面積あたりの発光強度を高められる。 Thereby, even when the inner wall 9 of the frame body portion 5 has the silver film 11, the silver film 11 formed on the inner wall 9 of the frame body portion 5 is partially formed instead of the substantially entire surface of the inner wall 9. In addition, the cost of the silver film 11 can be reduced as compared with the case where the silver film 11 is formed on the entire inner wall 9 of the frame body part 5, and the silver film occupying the inner wall 9 of the frame body part 5. The emission intensity per unit area can be increased.
また、この発光素子搭載用基板では、枠体部５の銀の膜が設けられていない部分１１ｂの焼結体の気孔率が銀の膜が設けられた部分１１ａの焼結体の気孔率よりも高くなっているために、焼結体がガラスセラミックス製であっても焼結体中の気孔１２によって光を散乱させることができる。このため枠体部５の内壁９に部分的に銀の膜１１が設けられていなくても枠体部５の焼結体自体で高い反射率を得ることができる。 Moreover, in this light emitting element mounting substrate, the porosity of the sintered body of the part 11b in which the silver film of the frame part 5 is not provided is larger than the porosity of the sintered body of the part 11a in which the silver film is provided. Therefore, even if the sintered body is made of glass ceramics, light can be scattered by the pores 12 in the sintered body. For this reason, even if the silver film 11 is not partially provided on the inner wall 9 of the frame body part 5, a high reflectance can be obtained by the sintered body itself of the frame body part 5.
なお、この実施形態の発光素子搭載用基板では、枠体部５の銀の膜が設けられていない部分１１ｂは、銀の膜が設けられた部分１１ａに比較して、例えば、断面視したときに、単位面積当たりに存在する気孔７の数が多くなっている。 In addition, in the light emitting element mounting substrate of this embodiment, when the part 11b in which the silver film of the frame part 5 is not provided is compared with the part 11a in which the silver film was provided, for example, when viewed in cross section In addition, the number of pores 7 present per unit area is increased.
ここで、焼結体の気孔率が異なるというのは、例えば、枠体部５の銀の膜が設けられた部分１１ａおよび銀の膜が設けられていない部分１１ｂのそれぞれの焼結体の気孔率を求めたときに、両者の気孔率の差が０．５％以上の差を有する場合をいう。 Here, the porosity of the sintered bodies is different because, for example, the pores of the respective sintered bodies of the portion 11a provided with the silver film and the portion 11b provided with no silver film of the frame body portion 5 are used. When the rate is obtained, the difference in porosity between the two is 0.5% or more.
一方、焼結体の気孔率に違いの無い構成というのは、例えば、枠体部５の銀の膜が設けられた部分１１ａおよび銀の膜が設けられていない部分１１ｂのそれぞれの焼結体の気孔率を求めたときに、両者の気孔率の差が０．２％以下である場合である。 On the other hand, the structure having no difference in the porosity of the sintered body is, for example, the respective sintered bodies of the portion 11a provided with the silver film and the portion 11b provided with no silver film of the frame portion 5. This is a case where the difference in porosity between the two is 0.2% or less.
このような発光素子搭載用基板を構成する基体部３および枠体部５は放熱性を高めることができるという理由から、焼結体の気孔率がいずれも５％以下であるのがよい。 Since the base body part 3 and the frame body part 5 constituting such a light emitting element mounting substrate can improve heat dissipation, the sintered body preferably has a porosity of 5% or less.
焼結体の気孔率は、断面研磨した試料の電子顕微鏡写真を用いて、まず、写真上に認められる気孔の総面積を画像解析により求め、次に、その気孔の総面積を写真の面積で除して求める。この場合、気孔は最大径が０．１μｍ以上であるものを選択することとし、それ以下の気孔は除くようにする。 The porosity of the sintered body is determined by image analysis of the total area of pores found on the photograph, using an electron micrograph of the sample whose cross-section is polished, and then the total area of the pores is the area of the photograph. Divide and seek. In this case, pores having a maximum diameter of 0.1 μm or more are selected, and pores smaller than that are excluded.
この場合も銀の膜１１は枠体部５の内壁９に面一に埋設されていることが望ましい。銀の膜１１が枠体部５の内壁９に面一に埋設されていると、銀の膜１１と枠体部５の内壁との間に段差を有しないことから、内壁からの不均一な光の反射を抑制することができ、光の反射率をさらに高めることができる。 Also in this case, it is desirable that the silver film 11 is embedded in the inner wall 9 of the frame body portion 5 in a flush manner. If the silver film 11 is embedded flush with the inner wall 9 of the frame body part 5, there is no step between the silver film 11 and the inner wall of the frame body part 5. Light reflection can be suppressed, and the light reflectance can be further increased.
また、本実施形態の発光素子搭載用基板では、例えば、図１（ａ）に示しているように、枠体部５は、搭載面１を囲繞する部分の内壁９が上側に開口径を大きくするようなすり鉢状であることが望ましい。枠体部５の内壁９が上記のような構造であると、すり鉢状をした枠体部５の開口部から広く光を反射させることが可能となる。 In the light emitting element mounting substrate of the present embodiment, for example, as shown in FIG. 1A, the frame 5 has a large opening diameter on the upper side of the inner wall 9 surrounding the mounting surface 1. It is desirable to have a mortar shape. When the inner wall 9 of the frame body portion 5 has the above-described structure, light can be widely reflected from the opening of the mortar-shaped frame body portion 5.
この場合、枠体部５の内壁９は搭載面１から上側に向けて凹状に湾曲していることが望ましい。枠体部５の内壁９が搭載面１から上側に向けて凹状に湾曲していると、内壁９が平坦となっている場合に比較して光の反射する面積を大きくできるために、銀の膜１１が枠体部５の内壁９に部分的に形成されている場合であっても発光素子から発せられた光の
反射率をさらに高めることができる。
In this case, it is desirable that the inner wall 9 of the frame body portion 5 is curved in a concave shape from the mounting surface 1 toward the upper side. If the inner wall 9 of the frame 5 is curved concavely from the mounting surface 1 toward the upper side, the light reflecting area can be increased compared to the case where the inner wall 9 is flat. Even when the film 11 is partially formed on the inner wall 9 of the frame 5, the reflectance of light emitted from the light emitting element can be further increased.
なお、この発光素子搭載用基板において、銀の膜１１の欠損した部分は、例えば、図２（ｂ）に示した位置に他に、図４に示すように、枠体部５の辺に向く位置に設けられていても良いが、より好ましくは、図２（ｂ）に示すように、枠体部５が、対角線上の対向する位置に角部５ｃを有する矩形状を為しており、銀の膜１１が、対向する角部５ｃの方向（図２（ｂ）に矢印Ｈで示す内壁９から法線方向）の部分５ｄを除く内壁９の領域に設けられていることが望ましい。 In this light emitting element mounting substrate, the missing portion of the silver film 11 faces, for example, the side of the frame 5 as shown in FIG. 4 in addition to the position shown in FIG. Although it may be provided at a position, more preferably, as shown in FIG. 2 (b), the frame body portion 5 has a rectangular shape having corner portions 5c at opposite positions on a diagonal line, The silver film 11 is desirably provided in the region of the inner wall 9 excluding the portion 5d in the direction of the opposing corner 5c (in the normal direction from the inner wall 9 indicated by the arrow H in FIG. 2B).
図２（ｂ）に示すように、枠体部５の角部５ｃは、その厚みｔ１が枠体部５の角部５ｃ以外の辺５ｅの厚みｔ２に比較して厚くなっている。このため枠体部５の角部５ｃは辺５ｅよりも光が透過しにくくなる。枠体部５の厚みが薄く、光の透過しやすい辺５ｅの内壁９に銀の膜１１を形成し、辺５ｅ側よりも光が透過しにくい角部５ｃに銀の膜１１を設けない構成にすると、枠体部５の角部５ｃが銀の膜が設けられていない部分１１ｂとなり、この銀の膜が設けられていない部分１１ｂは銀の膜が設けられている部分１１ａに比較して気孔率の高い焼結体となっており、このため光の透過をさらに抑制でき、逆に光の反射率を高めることができる。 As shown in FIG. 2B, the corner portion 5c of the frame body portion 5 has a thickness t1 that is thicker than the thickness t2 of the side 5e other than the corner portion 5c of the frame body portion 5. For this reason, the corner 5c of the frame 5 is less likely to transmit light than the side 5e. A structure in which the thickness of the frame portion 5 is thin and the silver film 11 is formed on the inner wall 9 of the side 5e where light is easily transmitted, and the silver film 11 is not provided on the corner portion 5c where light is less likely to transmit than the side 5e side. Then, the corner 5c of the frame part 5 becomes a portion 11b where the silver film is not provided, and the portion 11b where the silver film is not provided is compared with the portion 11a where the silver film is provided. The sintered body has a high porosity, so that light transmission can be further suppressed, and conversely, the light reflectance can be increased.
この場合、枠体部５の角部５ｃの厚みｔ１は１００〜１０００μｍ、辺５ｅの厚みｔ２は８０〜８００μｍであるのがよい。 In this case, the thickness t1 of the corner 5c of the frame 5 is preferably 100 to 1000 μm, and the thickness t2 of the side 5e is preferably 80 to 800 μm.
図５は、本実施形態の発光装置を示す断面模式図である。本実施形態の発光装置は、上述した発光素子搭載用基板の搭載部１に発光素子２０を備えていることを特徴とするものである。すなわち、この発光装置は、枠体部５の内壁９に形成された銀の膜１１が枠体部５の内壁９における上端１３よりも下側の位置１５から基体部３の搭載面１の位置１７までの領域を覆っているという特徴を有する基板を採用している。 FIG. 5 is a schematic cross-sectional view showing the light emitting device of this embodiment. The light emitting device of this embodiment is characterized in that the light emitting element 20 is provided in the mounting portion 1 of the light emitting element mounting substrate described above. That is, in the light emitting device, the silver film 11 formed on the inner wall 9 of the frame body part 5 is positioned on the mounting surface 1 of the base body part 3 from the position 15 below the upper end 13 of the inner wall 9 of the frame body part 5. A substrate having a feature of covering up to 17 regions is employed.
このような構成であると、発光装置を組み立てる際に、用いる発光素子搭載用基板を不意に硬い物に当てたり、落下させたりした場合などにおいても、枠体部５の内壁９の銀の膜１１には欠けや傷が発生し難いために、発光装置を組み立てる工程においても銀の膜１１はきれいな表面を維持でき、これにより発光強度の高い発光装置を得ることができる。 With such a configuration, even when the light emitting element mounting substrate used is unexpectedly applied to a hard object or dropped when the light emitting device is assembled, the silver film on the inner wall 9 of the frame body portion 5 is used. Since the chip 11 is less likely to be chipped or scratched, the silver film 11 can maintain a clean surface even in the process of assembling the light emitting device, whereby a light emitting device with high emission intensity can be obtained.
なお、本実施形態の発光素子搭載用基板には、必要に応じて、その表面や内部に、発光素子や外部電源と接続するための導体層を設けてもよい。 In addition, the light emitting element mounting substrate of this embodiment may be provided with a conductor layer for connecting to the light emitting element or an external power source on the surface or inside thereof as necessary.
次に、本実施形態の発光素子搭載用基板および発光装置の製造方法について説明する。図６は、本実施形態の発光素子搭載用基板の製造工程を示す模式図である。ここで、図６（ｃ）は図６（ｂ）のＧ−Ｇ線における断面図である。 Next, a method for manufacturing the light emitting element mounting substrate and the light emitting device of the present embodiment will be described. FIG. 6 is a schematic view showing a manufacturing process of the light emitting element mounting substrate of the present embodiment. Here, FIG.6 (c) is sectional drawing in the GG line of FIG.6 (b).
まず、図６（ａ）に示すように、基体部３および枠体部５を形成するためのシート状成形体２１を作製する。その組成は、例えば、ホウケイ酸ガラスなどのガラス粉末とＡｌ２Ｏ３粉末とを混合した混合粉末を用いる。 First, as shown in FIG. 6A, a sheet-like molded body 21 for forming the base portion 3 and the frame portion 5 is produced. For example, a mixed powder obtained by mixing glass powder such as borosilicate glass and Al 2 O 3 powder is used.
次に、この混合粉末に対して、有機バインダを溶媒とともに添加してスラリーや混練物を調製した後、これをプレス法、ドクターブレード法、圧延法、射出法などの成形方法を用いてシート状成形体２１を形成する。 Next, an organic binder is added to the mixed powder together with a solvent to prepare a slurry or a kneaded product, which is then formed into a sheet shape using a molding method such as a press method, a doctor blade method, a rolling method, or an injection method. Formed body 21 is formed.
次に、図６（ｂ）（ｃ）に示すように、シート状成形体２１の表面に銀の膜となる導体パターン２２を形成する。このとき導体パターン２２の厚みは、加圧後の変形や切れを防止し、下部のシート状成形体２１の密度を部分的に高められるという理由から平均値で１
０〜３０μｍであるのがよい。
Next, as shown in FIGS. 6B and 6C, a conductor pattern 22 that is a silver film is formed on the surface of the sheet-like molded body 21. At this time, the thickness of the conductor pattern 22 is 1 on average because it prevents deformation and breakage after pressurization and the density of the lower sheet-like molded body 21 can be partially increased.
It is good that it is 0-30 micrometers.
次に、図６（ｄ）に示すように、一方の面に凸部２３を有する金型を用意し、この金型を用いて、導体パターン２２を形成したシート状成形体２１をプレス成形し、凸部２３に対応する部分が凹部となる成形体２５を形成する。このプレス工程に用いる金型の凸部２３の底辺側の直径Ｄ１は、図６（ｄ）に示しているように、導体パターンの外周の直径Ｄ２よりも大きくなっている。金型の凸部２３の底辺側の直径Ｄ１と導体パターンの外周の直径Ｄ２とをこのような関係にすることにより、枠体部５の内壁６に形成された銀の膜１１が枠体部５の内壁９における上端１３よりも下側の位置１５から基体部３の搭載面１の位置１７までの領域を覆う構造とすることができる。 Next, as shown in FIG. 6D, a mold having a convex portion 23 on one surface is prepared, and the sheet-like molded body 21 on which the conductor pattern 22 is formed is press-molded using this mold. Then, a molded body 25 in which a portion corresponding to the convex portion 23 becomes a concave portion is formed. The diameter D 1 of the bottom side of the mold of the convex portion 23 used in the pressing step, as shown in FIG. 6 (d), is larger than the diameter D 2 of the outer periphery of the conductor pattern. The silver film 11 formed on the inner wall 6 of the frame body portion 5 is made to be a frame by making the diameter D 1 on the bottom side of the convex portion 23 of the mold and the diameter D 2 of the outer periphery of the conductor pattern in this relationship. A structure covering a region from a position 15 below the upper end 13 of the inner wall 9 of the body part 5 to a position 17 of the mounting surface 1 of the base body part 3 can be adopted.
この場合、加圧工程における加圧の圧力を高くすることによって、導体パターンがシート状成形体に埋設したものを得ることができ、このような成形体を用いることによって、銀の膜１１が内壁９に面一に埋設されている構造の発光素子搭載用基板を得ることができる。 In this case, by increasing the pressurizing pressure in the pressurizing step, it is possible to obtain a conductor pattern embedded in a sheet-like molded body. By using such a molded body, the silver film 11 is formed on the inner wall. Thus, a light emitting element mounting substrate having a structure embedded in the plane 9 can be obtained.
次に、これらの成形体２５を所定の温度条件で焼成することにより図１（ａ）（ｂ）に示す発光素子搭載用基板を得ることができる。 Next, the molded body 25 is fired under a predetermined temperature condition, whereby the light emitting element mounting substrate shown in FIGS. 1A and 1B can be obtained.
図７は、本実施形態の他の発光素子搭載用基板の製造工程を示す模式図であり、図２に示した発光素子搭載用基板の製造工程を示すものである。 FIG. 7 is a schematic view showing a manufacturing process of another light emitting element mounting substrate according to this embodiment, and shows a manufacturing process of the light emitting element mounting substrate shown in FIG.
図２に示した発光素子搭載用基板を得る場合には、図７（ａ）〜（ｄ）に示すような製造方法を採用する。図７（ａ）〜（ｄ）に示した製造方法では、図６（ｂ）とは異なり、導体パターンを部分的に欠損させたものをシート状成形体２１の表面に形成し、これを加圧する。これにより、図２（ａ）（ｂ）に示すような、銀の膜１１が分割、配置された構造を有する発光素子搭載用基板を得ることができる。この場合、金型の凸部２３によって加圧されたシート状成形体２１のうち、導体パターン２２の下部のシート状成形体２１の部分（図７（ｂ）の符号２３ａ）は、導体パターンの無い部分（図７（ｂ）の符号２３ｂ）に比較して加圧後に生密度が高くなっている。こうして、得られた発光素子搭載用基板は、成形体２５における導体パターンのある部分２３ａと導体パターンの無い部分２３ｂとで、それぞれの生密度に依存して焼成後において焼結状態が異なってくる。 When the light emitting element mounting substrate shown in FIG. 2 is obtained, a manufacturing method as shown in FIGS. 7A to 7D is employed. In the manufacturing method shown in FIGS. 7A to 7D, unlike in FIG. 6B, a part of the conductor pattern that is partially lost is formed on the surface of the sheet-like molded body 21, and this is added. Press. Thereby, a light emitting element mounting substrate having a structure in which the silver film 11 is divided and arranged as shown in FIGS. 2A and 2B can be obtained. In this case, of the sheet-like molded body 21 pressed by the convex portion 23 of the mold, the portion of the sheet-like molded body 21 below the conductor pattern 22 (reference numeral 23a in FIG. 7B) is the conductor pattern. The green density is higher after pressurization as compared to the portion (reference numeral 23b in FIG. 7B) that does not exist. Thus, the obtained light emitting element mounting board | substrate becomes different in a sintered state after baking by the part 23a with a conductor pattern in the molded object 25, and the part 23b without a conductor pattern depending on each green density. .
導体パターンの無い部分２３ｂのシート状成形体２１は生密度が低くなっており、成形体２５の状態で導体パターンのある部分２３ａのシート状成形体２１よりもガラス粉末およびセラミック粉末の接し方が弱いために、焼成過程においてもガラス粉末およびセラミック粉末の成分の拡散が導体パターン２２のある部分２３ａのシート状成形体２１のガラス粉末およびセラミック粉末に比べて遅い。このため導体パターンの無い部分２１ｂのシート状成形体２１は導体パターンのある部分２１ａのシート状成形体２１よりも緻密化が遅くなる。 The sheet-like molded body 21 of the portion 23b without the conductor pattern has a low density, and the glass powder and the ceramic powder are more in contact with the sheet-like molded body 21 of the portion 23a with the conductor pattern in the state of the molded body 25. Due to the weakness, the diffusion of the components of the glass powder and the ceramic powder is slower in the firing process as compared with the glass powder and the ceramic powder of the sheet-like molded body 21 of the portion 23a where the conductor pattern 22 is present. For this reason, densification of the sheet-like molded body 21 of the portion 21b without the conductor pattern is slower than the sheet-like molded body 21 of the portion 21a with the conductor pattern.
一方、導体パターンのある部分２１ａのシート状成形体２１は成形体２５の状態で導体パターンの無い部分２１ｂのシート状成形体２１に比較してガラス粉末およびセラミック粉末が強固に接しており生密度が高くなっている。このため焼成過程においてガラス粉末およびセラミック粉末の成分が拡散しやすく、これにより緻密化しやすくなる。 On the other hand, in the state of the molded body 25, the sheet-like molded body 21 of the portion 21a with the conductor pattern is in contact with the glass powder and the ceramic powder more firmly than the sheet-like molded body 21 of the portion 21b without the conductor pattern. Is high. For this reason, the components of the glass powder and the ceramic powder are easily diffused during the firing process, which facilitates densification.
その結果、成形体２５を焼結させたときに、導体パターンの無い部分２１ｂのシート状成形体２１は緻密化の度合いが小さいために焼結体中の気孔率が高くなり、一方、成形体２５の密度の高い方の導体パターンのある部分２１ａのシート状成形体２１は緻密化しやすいために焼結体の気孔率を低くすることができる。 As a result, when the molded body 25 is sintered, the sheet-shaped molded body 21 of the portion 21b having no conductor pattern has a low degree of densification, so that the porosity in the sintered body is increased. Since the sheet-like molded body 21 of the portion 21a having the higher conductor pattern 25 is easily densified, the porosity of the sintered body can be lowered.
こうして、枠体部５の内壁９を周回する方向に銀の膜が設けられた部分１１ａと銀の膜が設けられていない部分１１ｂとが交互に配置されており、銀の膜が設けられた部分１１ａと銀の膜が設けられていない部分１１ｂとは焼結体の気孔率が異なっており、さらに、銀の膜が設けられていない部分１１ｂの焼結体の気孔率は銀の膜が設けられた部分１１ａの焼結体の気孔率よりも高い発光素子搭載用基板を得ることができる。 Thus, the portions 11a provided with the silver film and the portions 11b not provided with the silver film are alternately arranged in the direction around the inner wall 9 of the frame body portion 5, and the silver film was provided. The porosity of the sintered body is different between the portion 11a and the portion 11b where the silver film is not provided, and the porosity of the sintered body of the portion 11b where the silver film is not provided is that of the silver film. A light emitting element mounting substrate higher than the porosity of the sintered body of the provided portion 11a can be obtained.
ホウケイ酸ガラス粉末を６０質量％とＡｌ２Ｏ３粉末を４０質量％の割合で混合した後、さらに、有機バインダーとしてアクリル系バインダーを１９質量％、ワックスとしてパラフィンワックスを３質量％、有機溶媒としてトルエンを混合してスラリーを調製した後、ドクターブレード法にて平均厚みが８００μｍのシート状成形体を作製した。 After mixing 60% by mass of borosilicate glass powder and 40% by mass of Al 2 O 3 powder, 19% by mass of acrylic binder as organic binder, 3% by mass of paraffin wax as wax, and as organic solvent After preparing a slurry by mixing toluene, a sheet-like molded article having an average thickness of 800 μm was prepared by a doctor blade method.
次に、得られたシート状成形体の表面に銀を主成分とする導体ペーストを用いてスクリーン印刷法により導体パターンを形成した。銀の膜の形状は表１に示すように、図１（ｂ）および図２（ｂ）の形状を用いた。試料Ｎｏ．４は枠体部の内壁の断面をその上端から下端にかけて湾曲としたものとした。導体パターンの形状が図２（ｂ）の場合（試料Ｎｏ．５）、銀の膜の欠損した部分の割合は、図２（ｂ）に示す銀の膜の形状で、外周側の円周の長さを１００％としたときに３０％になるようにした。 Next, a conductor pattern was formed on the surface of the obtained sheet-like molded body by a screen printing method using a conductor paste mainly composed of silver. As the shape of the silver film, as shown in Table 1, the shapes shown in FIGS. 1B and 2B were used. Sample No. No. 4 has a cross section of the inner wall of the frame body section curved from the upper end to the lower end. When the shape of the conductor pattern is FIG. 2 (b) (sample No. 5), the proportion of the missing portion of the silver film is the shape of the silver film shown in FIG. When the length is 100%, it is set to 30%.
次に、図６（ｄ）（図７（ｄ）に示す金型も図６（ｄ）と同じ）に示した構造の金型を用いて、８０℃の温度で加熱プレスを行い、切断して、図６（ｄ）（図７（ｄ））の金型の下部側に示されるような構造の成形体を形成した。試料Ｎｏ．２の導体パターンは加圧成形して得られた成形体の枠体部の内壁にスクリーン印刷法を用いて形成した。 Next, using the mold having the structure shown in FIG. 6 (d) (the mold shown in FIG. 7 (d) is the same as FIG. 6 (d)), it is heated and cut at a temperature of 80 ° C. Thus, a molded body having a structure as shown on the lower side of the mold in FIG. 6D (FIG. 7D) was formed. Sample No. The conductor pattern 2 was formed by screen printing on the inner wall of the frame portion of the molded body obtained by pressure molding.
次に、大気中、９１０〜９５０℃の温度にて１時間の焼成を行った。 Next, it baked for 1 hour at the temperature of 910-950 degreeC in air | atmosphere.
作製した発光素子搭載用基板はいずれも搭載面を囲繞する部分の内壁が上側に開口径を大きくするようなすり鉢状の形状となっており、いずれの試料も導体パターンは枠体部の内壁に面一になるように埋設されていた。 Each of the produced light emitting element mounting substrates has a mortar shape in which the inner wall of the portion surrounding the mounting surface has an opening diameter on the upper side, and the conductor pattern of each sample is formed on the inner wall of the frame body portion. It was buried to be flush with each other.
比較例として、シート状成形体の表面に、図８（ｂ）に示す形状の導体パターンを形成したものを同様の加熱条件にて作製した（試料Ｎｏ．１）。この試料Ｎｏ．１は銀の膜が枠体部の上面から内壁かけて全面に形成されたものであり、枠体部の内壁の銀の膜は枠体部の内壁に埋設されていなかった。 As a comparative example, a sheet-shaped molded body formed with a conductor pattern having the shape shown in FIG. 8B was produced under the same heating conditions (Sample No. 1). This sample No. No. 1 is a film in which a silver film is formed on the entire surface from the upper surface to the inner wall of the frame body portion, and the silver film on the inner wall of the frame body portion is not embedded in the inner wall of the frame body portion.
試料Ｎｏ．２〜５では、銀の膜の形成された領域が、枠体部の上端より約５μｍほど下側の位置から基体部の搭載面の高さの位置まで覆われたものであった。また、試料Ｎｏ．１〜５における銀の膜の平均厚みはいずれの試料も１５μｍであった。このうち試料Ｎｏ．１、３〜５における銀の膜は、その表面が平滑であり、また、表面粗さ（Ｒａ）が５μｍ以下であった。 Sample No. In Nos. 2 to 5, the region where the silver film was formed was covered from a position about 5 μm below the upper end of the frame body part to the height of the mounting surface of the base part. Sample No. The average thickness of the silver film in 1 to 5 was 15 μm for all samples. Of these, sample no. The silver films in 1 and 3 to 5 had a smooth surface and a surface roughness (Ra) of 5 μm or less.
得られた発光素子搭載用基板は、平面の面積が３ｍｍ×３ｍｍ、枠体部の厚み（基体部の表面の搭載部の高さにおける厚み）が３００μｍ、枠体部の搭載面からの高さが２００μであった。基体部の搭載面の領域の厚みは４００μｍであった。 The obtained light emitting element mounting substrate has a plane area of 3 mm × 3 mm, a thickness of the frame portion (a thickness at a height of the mounting portion on the surface of the base portion) of 300 μm, and a height from the mounting surface of the frame portion. Was 200 μm. The thickness of the region of the mounting surface of the base portion was 400 μm.
得られた発光素子搭載用基板について落下試験を行い、銀の膜の損傷の状態を観察した。落下試験後に損傷した状態というのは、倍率が２０〜５０倍の観察において、銀の膜に傷や欠けが見られたものとした。落下試験はＪＩＳ Ｃ００４４−１９９５の自然落下試験方法を用いて行った。落下の高さは１ｍ、落下の回数は２回とした。試料数は２０個と
した。
The obtained light-emitting element mounting substrate was subjected to a drop test, and the damage state of the silver film was observed. The damaged state after the drop test was that the silver film was scratched or chipped when observed at a magnification of 20 to 50 times. The drop test was performed using the natural drop test method of JIS C0044-1995. The height of the drop was 1 m, and the number of drops was two. The number of samples was 20.
焼結体の気孔率は、基板の枠体部を切断し、断面研磨した後、電子顕微鏡を用いて断面写真を撮り、その写真上の単位面積当たりの領域に認められる気孔の総面積を画像解析により求め、次に、その気孔の総面積を写真の単位面積で除して求めた。この場合、気孔は最大径が０．１μｍ以上であるものを選択し、それ以下の気孔は除くようにした。 The porosity of the sintered body is determined by cutting the frame part of the substrate, polishing the cross section, taking a cross-sectional photograph using an electron microscope, and imaging the total area of the pores recognized in the area per unit area on the photograph. It was obtained by analysis, and then obtained by dividing the total area of the pores by the unit area of the photograph. In this case, pores having a maximum diameter of 0.1 μm or more were selected, and pores smaller than that were excluded.
また、得られた発光素子搭載用基板の搭載面にＬＥＤ素子を実装し、この発光素子を導線で電源と結線し、銀の膜が図８に示した形状の発光素子搭載用基板（試料Ｎｏ．１）の発光強度を１００％としたときの各試料の発光強度比を求めた。発光強度評価は上記の落下試験を行っていない試料を別途準備して行った。結果を表１に示す。 Further, an LED element is mounted on the mounting surface of the obtained light emitting element mounting substrate, this light emitting element is connected to a power source with a conductive wire, and the silver film has the shape shown in FIG. The emission intensity ratio of each sample when the emission intensity of .1) was taken as 100% was determined. The light emission intensity was evaluated by separately preparing a sample not subjected to the above drop test. The results are shown in Table 1.
表１から明らかなように、枠体部の内壁に形成された銀の膜が枠体部の上端より下側の位置に形成された試料（試料Ｎｏ．２〜５）では、落下試験において損傷による不良の発生が無かった。 As is clear from Table 1, in the sample (sample Nos. 2 to 5) in which the silver film formed on the inner wall of the frame body portion is formed at a position below the upper end of the frame body portion, damage was caused in the drop test. There was no occurrence of defects.
銀の膜を加圧成形により形成した試料Ｎｏ．３、４は、銀の膜の表面粗さが小さくなり、同じ面積割合を持つ試料（試料Ｎｏ．２）との間で比較した場合に、発光強度が高かった。 Sample No. in which a silver film was formed by pressure molding. In Nos. 3 and 4, the surface roughness of the silver film was small, and the emission intensity was high when compared with the sample having the same area ratio (sample No. 2).
試料Ｎｏ．５は、枠体部の内壁に占める銀の膜の面積割合が試料Ｎｏ．３、４よりも３０％ほど低いものであったが発光強度は１３％程度の低下に止まり（試料Ｎｏ．５の発光強度（７９％）を試料Ｎｏ．３の発光強度（８８％）で除して求めた８７％を１００％から減じた値）、高い発光強度を維持していた。 Sample No. No. 5 shows that the area ratio of the silver film occupying the inner wall of the frame portion is the sample No. Although the emission intensity was about 30% lower than 3 and 4, the emission intensity was only reduced by about 13% (the emission intensity of sample No. 5 (79%) was divided by the emission intensity of sample No. 3 (88%)). As a result, 87% obtained by subtracting from 100% was maintained at a high emission intensity.
これに対して、試料Ｎｏ．１は銀の膜を枠体部の上面および角部に形成したものであったため、落下試験後に損傷が見られた。 In contrast, sample no. Since No. 1 was a silver film formed on the upper surface and corners of the frame, damage was observed after the drop test.
１・・・・・・・搭載面
３・・・・・・・基体部
５・・・・・・・枠体部
９・・・・・・・内壁
１１・・・・・・銀の膜
１１ａ・・・・・銀の膜が設けられた部分
１１ｂ・・・・・銀の膜が設けられていない部分
１３・・・・・・内壁の上端
１５・・・・・・内壁の上端から下側の位置
１７・・・・・・内壁における銀の膜の下端の位置
１９・・・・・・枠体部の上端における内壁側の角部
２１・・・・・・枠体部の上面
１１ａ・・・・・銀の膜が設けられた部分
１１ｂ・・・・・銀の膜が設けられていない部
１２・・・・・・気孔
２０・・・・・・発光素子
２１・・・・・・シート状成形体
２２・・・・・・導体パターン
２３・・・・・・凸部
２３ａ・・・・・導体パターンのある部分
２３ｂ・・・・・導体パターンの無い部分
２５・・・・・・成形体
Ｄ１・・・・・・金型の凸部２３の底辺側の直径
Ｄ２・・・・・・導体パターンの外周の直径
DESCRIPTION OF SYMBOLS 1 ... Mounting surface 3 .... Base part 5 .... Frame part 9 .... Inner wall 11 ... Silver film 11a: a portion 11b provided with a silver film 11: a portion 13 not provided with a silver film 13: an upper end 15 of the inner wall ... an upper end of the inner wall Lower position 17... Position 19 of the lower end of the silver film on the inner wall... Corner 21 on the inner wall side at the upper end of the frame body. 11a... Part 11b provided with a silver film... Part 12 provided with no silver film 12... Pore 20. ... Sheet-like molded product 22 ... Conductor pattern 23 ... Projection 23a ... Part 23b with conductor pattern ... Part 25 without conductor pattern ...・The outer periphery of the diameter of the bottom side of the diameter D 2 · · · · · · conductor pattern of ... molded body D 1 · · · · · · mold of the convex portion 23
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| JP2004259893A (en) * | 2003-02-25 | 2004-09-16 | Kyocera Corp | Package for housing light-emitting element and light-emitting device |
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