JP5857819B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP5857819B2 JP5857819B2 JP2012059713A JP2012059713A JP5857819B2 JP 5857819 B2 JP5857819 B2 JP 5857819B2 JP 2012059713 A JP2012059713 A JP 2012059713A JP 2012059713 A JP2012059713 A JP 2012059713A JP 5857819 B2 JP5857819 B2 JP 5857819B2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- sealing member
- opening
- view
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007789 sealing Methods 0.000 claims description 54
- 230000002093 peripheral effect Effects 0.000 description 10
- 238000000465 moulding Methods 0.000 description 6
- 238000012856 packing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Casings For Electric Apparatus (AREA)
- Telephone Set Structure (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
図1〜図5は、実施例にかかる電子機器を示す図である。図1は正面図であり、図2は正面側から見た斜視図であり、図3は背面側から見た斜視図であり、図4は分解斜視図であり、図5は図3において蓋体を外した様子を示す斜視図である。
図15は、図1の切断線A−Aにおける断面図である。図16は、図1の切断線B−Bにおける断面図である。図15及び図16に示すように、封止部材3の第1のリング部11は、第2の筐体5の外周縁に沿って、封止部材形成用の凹部13と向かい合う箇所に設けられた受け部16に接触する。それによって、第1の筐体2と第2の筐体5との間が封止される。
電子機器1の一例として、例えば携帯電話機やスマートフォンが挙げられる。ここでは、スマートフォンに適用した例について説明する。
2 第1の筐体
3 封止部材
4 開口部
5 第2の筐体
6 蓋体
7 被収納物
Claims (3)
- 被収納物を収納する開口部を有する第1の筐体と、
前記第1の筐体と合わせられる第2の筐体と、
前記開口部を塞ぐ蓋体と、
前記第1の筐体と一体成形された状態で、前記第1の筐体の前記開口部の周囲と前記蓋体との間、及び前記第1の筐体と前記第2の筐体との間を封止し、かつ前記開口部に前記被収納物が収納されたときに前記被収納物の側面に接触している封止部材と、
を備えることを特徴とする電子機器。 - 前記封止部材は、前記被収納物の側面の複数箇所において部分的に接触していることを特徴とする請求項1に記載の電子機器。
- 前記封止部材は、前記被収納物の側面の全周または略全周にわたって接触していることを特徴とする請求項1に記載の電子機器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012059713A JP5857819B2 (ja) | 2012-03-16 | 2012-03-16 | 電子機器 |
EP12198482.7A EP2640174A3 (en) | 2012-03-16 | 2012-12-20 | Electronic device and sealed structure |
US13/726,108 US9338910B2 (en) | 2012-03-16 | 2012-12-22 | Electronic device and sealed structure |
CN201310012180.0A CN103313563B (zh) | 2012-03-16 | 2013-01-14 | 电子装置和密封结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012059713A JP5857819B2 (ja) | 2012-03-16 | 2012-03-16 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013197137A JP2013197137A (ja) | 2013-09-30 |
JP5857819B2 true JP5857819B2 (ja) | 2016-02-10 |
Family
ID=47665823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012059713A Active JP5857819B2 (ja) | 2012-03-16 | 2012-03-16 | 電子機器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9338910B2 (ja) |
EP (1) | EP2640174A3 (ja) |
JP (1) | JP5857819B2 (ja) |
CN (1) | CN103313563B (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9243164B1 (en) | 2012-02-21 | 2016-01-26 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
US9051465B1 (en) | 2012-02-21 | 2015-06-09 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
JP6051103B2 (ja) * | 2013-05-23 | 2016-12-27 | 富士通株式会社 | 防水構造及び電子機器 |
US10148000B2 (en) | 2015-09-04 | 2018-12-04 | Apple Inc. | Coupling structures for electronic device housings |
US9907191B2 (en) | 2015-09-30 | 2018-02-27 | Apple Inc. | Multi-part electronic device housing having contiguous filled surface |
DE102015015707A1 (de) * | 2015-12-07 | 2017-06-08 | Testo SE & Co. KGaA | Gehäuse für ein elektronisches Gerät und Baukasten für ein Gehäuse |
US10372166B2 (en) * | 2016-07-15 | 2019-08-06 | Apple Inc. | Coupling structures for electronic device housings |
KR102356940B1 (ko) | 2017-01-26 | 2022-01-28 | 삼성에스디아이 주식회사 | 배터리 팩 |
JP6950796B2 (ja) * | 2017-10-05 | 2021-10-13 | カシオ計算機株式会社 | 電池モジュールの製造方法 |
CN108243587B (zh) * | 2018-02-05 | 2020-01-14 | Oppo广东移动通信有限公司 | 中框组件、中框组件加工方法及电子装置 |
DE102018104370B4 (de) * | 2018-02-27 | 2020-12-03 | Amazonen-Werke H. Dreyer Gmbh & Co. Kg | Vorrichtung zum Abdichten einer Ausnehmung in einem Objekt |
KR102642314B1 (ko) * | 2018-12-06 | 2024-03-04 | 삼성전자주식회사 | 방수구조를 갖는 전자장치 |
US11838432B2 (en) | 2019-12-03 | 2023-12-05 | Apple Inc. | Handheld electronic device |
US11784673B2 (en) | 2020-09-16 | 2023-10-10 | Apple Inc. | Electronic device housing having a radio-frequency transmissive component |
US11769940B2 (en) | 2021-09-09 | 2023-09-26 | Apple Inc. | Electronic device housing with integrated antenna |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5363276A (en) * | 1993-09-01 | 1994-11-08 | Ncr Corporation | Apparatus for containing and supporting electronic components |
JP3156494B2 (ja) * | 1994-04-01 | 2001-04-16 | セイコーエプソン株式会社 | デジタルマルチメータ |
JPH08250866A (ja) * | 1995-03-09 | 1996-09-27 | Kokusai Electric Co Ltd | 小型機器のケース構造 |
JP2007312255A (ja) * | 2006-05-19 | 2007-11-29 | Casio Hitachi Mobile Communications Co Ltd | 電子機器における電池収納部の防水構造及び電池パック |
KR100810266B1 (ko) * | 2006-12-14 | 2008-03-06 | 삼성전자주식회사 | 보강 부재를 구비하는 휴대용 단말기 |
KR101441568B1 (ko) * | 2008-01-11 | 2014-09-25 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 조립방법 |
CN101626673A (zh) * | 2009-05-31 | 2010-01-13 | 珠海东之尼电子科技有限公司 | 遥控器的防水装置 |
JP5182277B2 (ja) | 2009-12-03 | 2013-04-17 | 富士通モバイルコミュニケーションズ株式会社 | 電子機器 |
JP2011250076A (ja) * | 2010-05-26 | 2011-12-08 | Kyocera Corp | 携帯電子機器 |
KR20120071751A (ko) * | 2010-12-23 | 2012-07-03 | 엘지디스플레이 주식회사 | 디스플레이 장치 |
US8687351B2 (en) * | 2011-03-31 | 2014-04-01 | Patientsafe Solutions, Inc. | Scanning jacket for a handheld device |
CN202160361U (zh) * | 2011-06-20 | 2012-03-07 | 深圳富泰宏精密工业有限公司 | 电子装置前盖及具有该前盖的电子装置 |
-
2012
- 2012-03-16 JP JP2012059713A patent/JP5857819B2/ja active Active
- 2012-12-20 EP EP12198482.7A patent/EP2640174A3/en not_active Withdrawn
- 2012-12-22 US US13/726,108 patent/US9338910B2/en active Active
-
2013
- 2013-01-14 CN CN201310012180.0A patent/CN103313563B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2640174A2 (en) | 2013-09-18 |
CN103313563B (zh) | 2016-02-24 |
JP2013197137A (ja) | 2013-09-30 |
US20130242477A1 (en) | 2013-09-19 |
US9338910B2 (en) | 2016-05-10 |
EP2640174A3 (en) | 2017-04-05 |
CN103313563A (zh) | 2013-09-18 |
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