JP5856972B2 - フェニルエステルを含む熱界面材料 - Google Patents
フェニルエステルを含む熱界面材料 Download PDFInfo
- Publication number
- JP5856972B2 JP5856972B2 JP2012538878A JP2012538878A JP5856972B2 JP 5856972 B2 JP5856972 B2 JP 5856972B2 JP 2012538878 A JP2012538878 A JP 2012538878A JP 2012538878 A JP2012538878 A JP 2012538878A JP 5856972 B2 JP5856972 B2 JP 5856972B2
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- JP
- Japan
- Prior art keywords
- thermal interface
- interface material
- material according
- epoxidized
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000463 material Substances 0.000 title claims description 34
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 title description 2
- 239000000203 mixture Substances 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 14
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 10
- 239000000539 dimer Substances 0.000 claims description 10
- 229930195729 fatty acid Natural products 0.000 claims description 10
- 239000000194 fatty acid Substances 0.000 claims description 10
- 150000004665 fatty acids Chemical class 0.000 claims description 10
- -1 phenyl ester Chemical class 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 3
- 239000011231 conductive filler Substances 0.000 claims 3
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 101710149792 Triosephosphate isomerase, chloroplastic Proteins 0.000 description 1
- 101710195516 Triosephosphate isomerase, glycosomal Proteins 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2205/00—Aspects relating to compounds used in compression type refrigeration systems
- C09K2205/10—Components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Thermal Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
Claims (12)
- 前記エポキシ化ダイマー脂肪酸および前記エポキシ化ナットシェルオイルの両者を含む、請求項1に記載の熱界面材料。
- 150℃で100時間の焼成後における熱インピーダンスが0.2℃・cm2/ワット以下である、請求項1または2に記載の熱界面材料。
- 前記熱伝導性フィラーが、アルミニウム粉末である、請求項1〜3のいずれか1項に記載の熱界面材料。
- 前記フェニルエステルが、全組成物の5〜35重量%の範囲の量で存在する、請求項1〜6のいずれか1項に記載の熱界面材料。
- 前記エポキシ化ダイマー脂肪酸が、全組成物の1〜10重量%の範囲の量で存在する、請求項1〜7のいずれか1項に記載の熱界面材料。
- 前記エポキシ化ナットシェルオイルが、全組成物の1〜10重量%の範囲の量で存在する、請求項1〜8のいずれか1項に記載の熱界面材料。
- 前記熱伝導性フィラーが、全組成物の50〜95重量%の範囲の量で存在する、請求項1〜9のいずれか1項に記載の熱界面材料。
- 半導体チップ、ヒートスプレッダー、およびそれらの間に請求項1〜10のいずれか1項に記載の熱界面材料を含む、組立品。
- ヒートスプレッダー、ヒートシンク、およびそれらの間に請求項1〜10のいずれか1項に記載の熱界面材料を含む、組立品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US26115209P | 2009-11-13 | 2009-11-13 | |
US61/261,152 | 2009-11-13 | ||
PCT/US2010/055924 WO2011059942A2 (en) | 2009-11-13 | 2010-11-09 | Thermal interface material with phenyl ester |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013510926A JP2013510926A (ja) | 2013-03-28 |
JP5856972B2 true JP5856972B2 (ja) | 2016-02-10 |
Family
ID=43992353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012538878A Expired - Fee Related JP5856972B2 (ja) | 2009-11-13 | 2010-11-09 | フェニルエステルを含む熱界面材料 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20120279697A1 (ja) |
EP (1) | EP2499211A4 (ja) |
JP (1) | JP5856972B2 (ja) |
KR (1) | KR101734603B1 (ja) |
CN (1) | CN102648266B (ja) |
TW (1) | TWI491722B (ja) |
WO (1) | WO2011059942A2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9157019B2 (en) * | 2013-03-26 | 2015-10-13 | Jiali Wu | Thermal conductivity improved composition with addition of nano particles used for interface materials |
WO2016196936A1 (en) * | 2015-06-04 | 2016-12-08 | Henkel IP & Holding GmbH | Thermally conductive interface formulations and methods thereof |
WO2023074258A1 (ja) * | 2021-10-28 | 2023-05-04 | 東洋紡株式会社 | 活性エステル化合物 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3650637B2 (ja) * | 1994-10-26 | 2005-05-25 | ジャパンエポキシレジン株式会社 | エポキシ樹脂組成物 |
JP2915379B2 (ja) * | 1996-06-18 | 1999-07-05 | レイセオン・カンパニー | 落下衝撃に耐える導電接着剤 |
JP2003327845A (ja) * | 2002-05-14 | 2003-11-19 | Japan U-Pica Co Ltd | 耐衝撃性成形材料組成物 |
US7108806B2 (en) * | 2003-02-28 | 2006-09-19 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability and good impact resistance for use in electronics devices |
JP2004266134A (ja) * | 2003-03-03 | 2004-09-24 | Kanegafuchi Chem Ind Co Ltd | ダイボンディング用樹脂ペースト及びそれを用いた発光ダイオード |
WO2004090938A2 (en) * | 2003-04-02 | 2004-10-21 | Honeywell International Inc. | Thermal interconnect and interface systems, methods of production and uses thereof |
US7551346B2 (en) * | 2003-11-05 | 2009-06-23 | E Ink Corporation | Electro-optic displays, and materials for use therein |
WO2004101677A1 (en) * | 2004-04-21 | 2004-11-25 | Achilles Corporation | Heat-resistant soft resinous sheet articles and compositions therefor |
US7312261B2 (en) * | 2004-05-11 | 2007-12-25 | International Business Machines Corporation | Thermal interface adhesive and rework |
US20070179232A1 (en) * | 2006-01-30 | 2007-08-02 | National Starch And Chemical Investment Holding Corporation | Thermal Interface Material |
US7825188B2 (en) * | 2006-12-19 | 2010-11-02 | Designer Molecules, Inc. | Thermoplastic elastomer with acyloxyphenyl hard block segment |
KR100829071B1 (ko) * | 2006-12-27 | 2008-05-19 | (주)디피아이 홀딩스 | 에폭시 수지, 이를 포함하는 에폭시 수지 조성물, 도료조성물 및 이를 이용한 도막의 형성 방법 |
WO2008124797A1 (en) * | 2007-04-09 | 2008-10-16 | Designer Molecules, Inc. | Curatives for epoxy compositions |
TW200934861A (en) * | 2008-02-01 | 2009-08-16 | Jun-Wei Su | Thermal interface material, manufacturing method thereof, and electronic device applying the material |
-
2010
- 2010-11-09 EP EP10830575.6A patent/EP2499211A4/en not_active Withdrawn
- 2010-11-09 CN CN201080051061.0A patent/CN102648266B/zh not_active Expired - Fee Related
- 2010-11-09 KR KR1020127015155A patent/KR101734603B1/ko active IP Right Grant
- 2010-11-09 JP JP2012538878A patent/JP5856972B2/ja not_active Expired - Fee Related
- 2010-11-09 WO PCT/US2010/055924 patent/WO2011059942A2/en active Application Filing
- 2010-11-11 TW TW099138861A patent/TWI491722B/zh not_active IP Right Cessation
-
2012
- 2012-05-11 US US13/469,679 patent/US20120279697A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2011059942A3 (en) | 2011-09-09 |
CN102648266B (zh) | 2014-10-22 |
EP2499211A4 (en) | 2018-01-17 |
KR101734603B1 (ko) | 2017-05-11 |
TWI491722B (zh) | 2015-07-11 |
EP2499211A2 (en) | 2012-09-19 |
US20120279697A1 (en) | 2012-11-08 |
WO2011059942A2 (en) | 2011-05-19 |
KR20120096505A (ko) | 2012-08-30 |
CN102648266A (zh) | 2012-08-22 |
TW201134934A (en) | 2011-10-16 |
JP2013510926A (ja) | 2013-03-28 |
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