JP5840115B2 - 表面が拡張したモジュールを有するスマートカード - Google Patents
表面が拡張したモジュールを有するスマートカード Download PDFInfo
- Publication number
- JP5840115B2 JP5840115B2 JP2012256477A JP2012256477A JP5840115B2 JP 5840115 B2 JP5840115 B2 JP 5840115B2 JP 2012256477 A JP2012256477 A JP 2012256477A JP 2012256477 A JP2012256477 A JP 2012256477A JP 5840115 B2 JP5840115 B2 JP 5840115B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- module
- support
- smart card
- indentation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007373 indentation Methods 0.000 claims description 15
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000005266 casting Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
2 カード
3 支持体
4 電子チップ
5 支持カード
6 第一のくぼみ
7 第二のくぼみ
Claims (2)
- モジュールを担持するカード(2)を備えたスマートカード(1)であり、該モジュールは、それ自身で少なくとも一つの電子チップ(4)を支持するリードフレーム(3)を含み、このリードフレーム(3)が前記カード(2)の表面に固定されているスマートカードであって、前記リードフレーム(3)が、前記表面上において、前記カード(2)の少なくとも一つの縁まで広がることにより、前記モジュールの少なくとも一つの縁がスマートカード(1)の少なくとも一つの縁に一致し、
前記リードフレーム(3)が前記カード(2)の全表面に広がっており、
前記スマートカード(1)が、支持カードに取り付けられた、取り外し可能なミニカードであることを特徴とするスマートカード(1)。 - 前記カード(2)が、一つまたは複数のチップ(4)を受け入れる、少なくとも一つのくぼみ(7)を備えていることを特徴とする、請求項1に記載のスマートカード。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR01/17054 | 2001-12-20 | ||
FR0117054A FR2834103B1 (fr) | 2001-12-20 | 2001-12-20 | Carte a puce a module de surface etendue |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009088155A Division JP2009187564A (ja) | 2001-12-20 | 2009-03-31 | 表面が拡張したモジュールを有するスマートカード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013058252A JP2013058252A (ja) | 2013-03-28 |
JP5840115B2 true JP5840115B2 (ja) | 2016-01-06 |
Family
ID=8871090
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003555433A Pending JP2005513654A (ja) | 2001-12-20 | 2002-12-18 | 表面が拡張したモジュールを有するスマートカード |
JP2009088155A Pending JP2009187564A (ja) | 2001-12-20 | 2009-03-31 | 表面が拡張したモジュールを有するスマートカード |
JP2012256477A Expired - Fee Related JP5840115B2 (ja) | 2001-12-20 | 2012-11-22 | 表面が拡張したモジュールを有するスマートカード |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003555433A Pending JP2005513654A (ja) | 2001-12-20 | 2002-12-18 | 表面が拡張したモジュールを有するスマートカード |
JP2009088155A Pending JP2009187564A (ja) | 2001-12-20 | 2009-03-31 | 表面が拡張したモジュールを有するスマートカード |
Country Status (10)
Country | Link |
---|---|
US (1) | US7686228B2 (ja) |
EP (1) | EP1459249B1 (ja) |
JP (3) | JP2005513654A (ja) |
CN (1) | CN100350426C (ja) |
AT (1) | ATE421129T1 (ja) |
AU (1) | AU2002364324A1 (ja) |
DE (1) | DE60230919D1 (ja) |
ES (1) | ES2321175T3 (ja) |
FR (1) | FR2834103B1 (ja) |
WO (1) | WO2003054790A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5163776B2 (ja) * | 2010-07-13 | 2013-03-13 | 株式会社デンソー | カードキー |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD691610S1 (en) | 2011-11-07 | 2013-10-15 | Blackberry Limited | Device smart card |
US8950681B2 (en) | 2011-11-07 | 2015-02-10 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) * | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
CN104778492B (zh) * | 2014-01-13 | 2018-03-23 | 全宏科技股份有限公司 | 智能型贴片安装卡及应用其的安装方法 |
WO2017030964A1 (en) | 2015-08-14 | 2017-02-23 | Matthew Stern | Two-piece transaction card construction |
DE102016106698A1 (de) * | 2016-04-12 | 2017-10-12 | Infineon Technologies Ag | Chipkarte und Verfahren zum Herstellen einer Chipkarte |
JP1647725S (ja) * | 2018-02-01 | 2019-12-09 | ||
EP4072849A1 (en) * | 2019-12-13 | 2022-10-19 | Covestro Intellectual Property GmbH & Co. KG | Layered structures with cutting lines |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60252992A (ja) * | 1984-05-30 | 1985-12-13 | Toshiba Corp | Icカ−ド |
FR2625000B1 (fr) * | 1987-12-22 | 1991-08-16 | Sgs Thomson Microelectronics | Structure de carte a puce |
JP3290986B2 (ja) * | 1991-05-10 | 2002-06-10 | ゲーアーオー ゲゼルシャフト フュア アウトマツィオーン ウント オルガニザツィオーン ミット ベシュレンクテル ハフツング | 壁面の厚さを部分的に薄くしたプラスチック成形物の製造方法及び製造装置 |
DE4218923A1 (de) * | 1992-06-10 | 1992-10-22 | Haiss Ulrich | Wertkarte mit elektronik-wert-chip |
JPH0789277A (ja) * | 1993-09-24 | 1995-04-04 | Canon Inc | 複合カードの製造方法 |
KR100355209B1 (ko) * | 1994-09-22 | 2003-02-11 | 로무 가부시키가이샤 | 비접촉형ic카드및그제조방법 |
US5671525A (en) * | 1995-02-13 | 1997-09-30 | Gemplus Card International | Method of manufacturing a hybrid chip card |
DE29503249U1 (de) * | 1995-03-08 | 1995-11-02 | Hafner, Thomas, 78048 Villingen-Schwenningen | Chipkarte mit Wechselchip |
US5975420A (en) * | 1995-04-13 | 1999-11-02 | Dai Nippon Printing Co., Ltd. | Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module |
CN2268276Y (zh) * | 1996-11-11 | 1997-11-19 | 深圳市艾柯电子有限公司 | 超大容量ic卡 |
JP3960645B2 (ja) * | 1996-12-27 | 2007-08-15 | ローム株式会社 | 回路チップ搭載カードおよび回路チップモジュール |
DE19703122C1 (de) * | 1997-01-29 | 1998-05-20 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung von Datenträgern |
JP4212068B2 (ja) * | 1997-05-19 | 2009-01-21 | ローム株式会社 | Icカードおよびicチップモジュール |
KR100330651B1 (ko) * | 1997-06-23 | 2002-03-29 | 사토 게니치로 | Ic카드용 모듈, ic카드, 및 ic카드용 모듈의 제조방법 |
JPH1134553A (ja) * | 1997-07-18 | 1999-02-09 | Rohm Co Ltd | Icモジュール、およびその製造方法、ならびにこれを備えたicカード |
US6106317A (en) * | 1997-09-26 | 2000-08-22 | Thomas & Betts International, Inc. | IC chip card connector with pivotally and linearly movable cover |
JP3687783B2 (ja) * | 1997-11-04 | 2005-08-24 | エルケ ツァケル | コンタクトレスチップカードを製造する方法およびコンタクトレスチップカード |
IL122250A (en) * | 1997-11-19 | 2003-07-31 | On Track Innovations Ltd | Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof |
FR2773900B1 (fr) * | 1998-01-22 | 2000-02-18 | Gemplus Card Int | Carte a circuit(s) integre(s) a contact, comportant une minicarte detachable |
US6193163B1 (en) * | 1998-08-31 | 2001-02-27 | The Standard Register Company | Smart card with replaceable chip |
JP4053667B2 (ja) * | 1998-09-14 | 2008-02-27 | 大日本印刷株式会社 | 板状枠体付きicキャリアおよびその製造方法 |
FR2783750B1 (fr) * | 1998-09-29 | 2000-10-13 | Schlumberger Ind Sa | Carte a module secable |
JP2000172814A (ja) * | 1998-12-02 | 2000-06-23 | Toppan Printing Co Ltd | 複合icモジュール及び複合icカード |
FR2788646B1 (fr) * | 1999-01-19 | 2007-02-09 | Bull Cp8 | Carte a puce munie d'une antenne en boucle, et micromodule associe |
DE19906570A1 (de) * | 1999-02-17 | 2000-08-24 | Giesecke & Devrient Gmbh | Tragbarer Datenträger mit herausnehmbarer Minichipkate |
FR2794264B1 (fr) * | 1999-05-27 | 2001-11-02 | Gemplus Card Int | Adaptateur pour dispositif electronique portable a circuit integre, de type carte a puce, d'un format reduit par rapport au format standard d'une mini-carte |
US6634565B2 (en) * | 2001-11-06 | 2003-10-21 | Litronic, Inc. | Smart card having additional connector pads |
US20030085288A1 (en) * | 2001-11-06 | 2003-05-08 | Luu Deniel V.H. | Contactless SIM card carrier with detachable antenna and carrier therefore |
-
2001
- 2001-12-20 FR FR0117054A patent/FR2834103B1/fr not_active Expired - Fee Related
-
2002
- 2002-12-18 JP JP2003555433A patent/JP2005513654A/ja active Pending
- 2002-12-18 AT AT02799098T patent/ATE421129T1/de not_active IP Right Cessation
- 2002-12-18 WO PCT/FR2002/004429 patent/WO2003054790A1/fr active Application Filing
- 2002-12-18 AU AU2002364324A patent/AU2002364324A1/en not_active Abandoned
- 2002-12-18 EP EP02799098A patent/EP1459249B1/fr not_active Expired - Lifetime
- 2002-12-18 CN CNB028254244A patent/CN100350426C/zh not_active Expired - Fee Related
- 2002-12-18 DE DE60230919T patent/DE60230919D1/de not_active Expired - Lifetime
- 2002-12-18 US US10/498,550 patent/US7686228B2/en not_active Expired - Fee Related
- 2002-12-18 ES ES02799098T patent/ES2321175T3/es not_active Expired - Lifetime
-
2009
- 2009-03-31 JP JP2009088155A patent/JP2009187564A/ja active Pending
-
2012
- 2012-11-22 JP JP2012256477A patent/JP5840115B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7686228B2 (en) | 2010-03-30 |
US20050001039A1 (en) | 2005-01-06 |
AU2002364324A1 (en) | 2003-07-09 |
DE60230919D1 (de) | 2009-03-05 |
FR2834103B1 (fr) | 2004-04-02 |
JP2005513654A (ja) | 2005-05-12 |
CN1605085A (zh) | 2005-04-06 |
JP2013058252A (ja) | 2013-03-28 |
FR2834103A1 (fr) | 2003-06-27 |
ATE421129T1 (de) | 2009-01-15 |
JP2009187564A (ja) | 2009-08-20 |
WO2003054790A1 (fr) | 2003-07-03 |
WO2003054790A8 (fr) | 2005-04-07 |
EP1459249B1 (fr) | 2009-01-14 |
EP1459249A1 (fr) | 2004-09-22 |
CN100350426C (zh) | 2007-11-21 |
ES2321175T3 (es) | 2009-06-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5840115B2 (ja) | 表面が拡張したモジュールを有するスマートカード | |
US7770800B2 (en) | SIM card packaging | |
JP4289689B2 (ja) | Icカード及びその製造方法 | |
CN102609753B (zh) | 识别身份的证件用的应答器嵌件和用于制造应答器嵌件的方法 | |
JP2000215292A (ja) | Icカ―ド | |
US20040238210A1 (en) | Electronic module with protective bump | |
US20110309152A1 (en) | Plastic card package and plastic card package manufacturing method | |
TW201638829A (zh) | 用於安裝先進智慧卡的輔助安裝結構 | |
JP2006309629A (ja) | Uim用icカードとuim及びuim用icカードの製造方法 | |
JP2005293383A (ja) | Uim用icカード | |
KR100938214B1 (ko) | 고용량 메모리칩 카드의 제조방법 | |
JP3468954B2 (ja) | Icカード | |
KR100572425B1 (ko) | 소형 카드의 제조 방법 및, 카드형 반도체 기억 장치의제조 방법 | |
JP3498800B2 (ja) | 半導体チップの支持部材の製造方法 | |
KR100284111B1 (ko) | 전도성접착필름을 사용한 비접촉식아이씨카드와 그 제조방법 | |
JP4641159B2 (ja) | Uim用icカード | |
JP2002230509A (ja) | Icカード | |
JP4428631B2 (ja) | 板状枠体付きuimとその製造方法 | |
JP4402420B2 (ja) | 板状枠体付きuimとその製造方法 | |
KR100284112B1 (ko) | 카드의 두께를 줄인 비접촉식아이씨카드와 그 제조방법 | |
KR100293418B1 (ko) | 비접촉식 아이씨 카드 제조 방법 | |
JPH06278394A (ja) | メモリカードの構造 | |
WO2005034031A1 (en) | Identification document | |
JPS63176197A (ja) | 携帯可能記憶媒体 | |
JP2005115837A (ja) | 板状枠体付きuimとその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130604 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130903 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130906 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20131003 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20131008 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20131101 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20131107 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131204 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20131224 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150805 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20151110 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5840115 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |