JP5834189B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 108
- 238000004519 manufacturing process Methods 0.000 title claims description 80
- 229910052751 metal Inorganic materials 0.000 claims description 181
- 239000002184 metal Substances 0.000 claims description 181
- 238000000034 method Methods 0.000 claims description 124
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- 239000000758 substrate Substances 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
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- 150000002736 metal compounds Chemical class 0.000 claims description 6
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- 230000006835 compression Effects 0.000 claims description 3
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- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 3
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 93
- 239000010949 copper Substances 0.000 description 63
- 230000008569 process Effects 0.000 description 47
- 238000000926 separation method Methods 0.000 description 43
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- 238000011049 filling Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 15
- 238000000151 deposition Methods 0.000 description 14
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 14
- 229910010271 silicon carbide Inorganic materials 0.000 description 12
- 238000001459 lithography Methods 0.000 description 11
- 239000010936 titanium Substances 0.000 description 10
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- 238000005229 chemical vapour deposition Methods 0.000 description 4
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- 238000001312 dry etching Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
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- 238000012545 processing Methods 0.000 description 4
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- 238000004088 simulation Methods 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000003917 TEM image Methods 0.000 description 2
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- 150000002902 organometallic compounds Chemical class 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- 229910000765 intermetallic Inorganic materials 0.000 description 1
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- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- -1 tungsten nitride Chemical class 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
- H01L21/76811—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures involving multiple stacked pre-patterned masks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Formation Of Insulating Films (AREA)
Description
以下に、第1の実施形態に係る半導体装置の製造方法について、図面を参照しながら説明する。
第1の実施形態は単層の金属膜109を用いる例を示したが、第2の実施形態は、金属膜123及び金属膜124の積層膜を用いている。その他の構成については第1の実施形態と同様である。
以下に、第3の実施形態に係る半導体装置の製造方法について、図面を参照しながら説明する。まず、図20(a)に示すように、半導体基板(図示せず)の表面に絶縁膜101を堆積した後、フォトリソグラフィー及びドライエッチングにより絶縁膜101の内部に配線溝102を形成する。
2 配線溝
3 バリア膜
4 Cu膜
5 下層配線
6 SiC素膜
7 SiOC膜
8 SiO2膜
9 TiN膜
10 レジスト
11 配線溝パターン
12 レジスト
13 ビアパターン
14 配線溝
14a 配線溝
14b 配線溝
14c 配線溝
14d 配線溝
14e 配線溝
14f 配線溝
15 ビアホール
16 バリア膜
17 Cu膜
18 上層配線
19 ビア
20 分離部
20a 分離部
20b 分離部
20c 分離部
20d 分離部
20e 分離部
20f 分離部
23r 領域
101 絶縁膜
102 配線溝
103 バリア膜
104 Cu膜
105 下層配線
106 SiC膜
107 SiOC膜
108 SiO2膜
109 金属膜
109A 改質金属膜
110 レジスト
111 配線溝パターン
112 レジスト
113 ビアパターン
114 配線溝
115 ビアホール
116 バリア膜
117 Cu膜
118 上層配線
119 ビア
120 配線溝
121 配線溝
122 分離部
123 金属膜
124 金属膜
Claims (13)
- 基板上に層間絶縁膜を形成する工程と、
前記層間絶縁膜上に第1のハードマスク形成膜を形成する工程と、
前記第1のハードマスク形成膜に熱処理又はプラズマ処理を実施し、前記第1のハードマスク形成膜を改質する工程と、
前記第1のハードマスク形成膜を改質する工程よりも後に、改質された第1のハードマスク形成膜に配線溝パターンを転写することにより、前記改質された第1のハードマスク形成膜からなる第1のハードマスクを形成する工程と、
前記第1のハードマスクを用いて前記層間絶縁膜をエッチングすることにより、前記層間絶縁膜に配線溝を形成する工程とを備え、
前記第1のハードマスク形成膜は、金属膜又は金属化合物膜からなり、
前記第1のハードマスク形成膜を改質する工程において、前記改質された第1のハードマスク形成膜を圧縮応力が0Pa以上且つ1000MPa以下の範囲内となるように改質する半導体装置の製造方法。 - 前記熱処理は、窒素雰囲気において、100℃以上且つ400℃以下の温度で行う請求項1に記載の半導体装置の製造方法。
- 前記プラズマ処理は、水素(H2)及び酸素(O2)を含む雰囲気において、100℃以上且つ400℃以下の温度で行なう請求項1に記載の半導体装置の製造方法。
- 前記第1のハードマスク形成膜を形成する工程よりも前に、クールダウンを行う工程をさらに備えている請求項1〜3のいずれか1項に記載の半導体装置の製造方法。
- 前記改質された第1のハードマスク形成膜の上に金属膜又は金属化合物膜からなる第2のハードマスク形成膜を積層する工程をさらに備え、
前記第1のハードマスクを形成する工程において、前記改質された第1のハードマスク形成膜及び前記第2のハードマスク形成膜に配線溝パターンを転写することにより、前記
改質された第1のハードマスク形成膜からなる第1のハードマスク及び前記第2のハードマスク形成膜からなる第2のハードマスクを形成し、
前記配線溝を形成する工程において、前記第1のハードマスク及び前記第2のハードマスクを用いて前記層間絶縁膜をエッチングすることにより、前記層間絶縁膜に配線溝を形成する請求項1〜4のいずれか1項に記載の半導体装置の製造方法。 - 前記改質された第1のハードマスク形成膜の結晶サイズは、前記第2のハードマスク形成膜の結晶サイズより小さい請求項5に記載の半導体装置の製造方法。
- 前記第2のハードマスク形成膜の圧縮応力は、前記改質された第1のハードマスク形成膜の圧縮応力よりも大きい請求項5又は6に記載の半導体装置の製造方法。
- 前記第2のハードマスク形成膜の密度は、前記改質された第1のハードマスク形成膜の密度よりも大きい請求項5〜7のいずれか1項に記載の半導体装置の製造方法。
- 前記配線溝を形成する工程よりも後の工程において、前記第2のハードマスクは完全に除去されているか又は厚さが5nm以下である請求項5〜8のいずれか1項に記載の半導体装置の製造方法。
- 前記第1のハードマスク形成膜及び前記第2のハードマスク形成膜は、同一元素から形成されている請求項5〜9のいずれか1項に記載の半導体装置の製造方法。
- 前記配線溝を形成する工程は、前記層間絶縁膜を含む分離部を介して互いに隣り合うように配置された少なくとも3つの前記配線溝を形成する工程を含む請求項1〜10のいずれか1項に記載の半導体装置の製造方法。
- 前記層間絶縁膜は、シリコンを含む化合物からなる請求項1〜11のいずれか1項に記載の半導体装置の製造方法。
- 前記層間絶縁膜は、比誘電率が2.5であるシリコンオキシカーバイド膜と比誘電率が3.0であるシリコンオキシカーバイド膜との積層膜を含む請求項12に記載の半導体装置の製造方法。
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Citations (6)
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