JP5828068B2 - Ledユニット - Google Patents
Ledユニット Download PDFInfo
- Publication number
- JP5828068B2 JP5828068B2 JP2011135651A JP2011135651A JP5828068B2 JP 5828068 B2 JP5828068 B2 JP 5828068B2 JP 2011135651 A JP2011135651 A JP 2011135651A JP 2011135651 A JP2011135651 A JP 2011135651A JP 5828068 B2 JP5828068 B2 JP 5828068B2
- Authority
- JP
- Japan
- Prior art keywords
- wavelength conversion
- conversion member
- light
- led unit
- mounting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Description
2 光源
3 実装基板
4 波長変換部材
4a 鍔部
5 放熱板
6 反射板
Claims (3)
- 光源と、
前記光源が実装される実装基板と、
前記光源を覆うように前記実装基板上に設けられ、前記光源からの出射光の波長を異なる波長に変換する波長変換部材と、
前記波長変換部材の熱を前記実装基板へ放熱する放熱板と、を備え、
前記波長変換部材は、ドーム状に構成され、
前記放熱板は、前記波長変換部材の下部外周面に接し、
前記波長変換部材は、その下部に外方に延びる鍔部を有し、
前記鍔部が、前記放熱板により押さえられていることを特徴とするLEDユニット。 - 前記波長変換部材の下部端面が、前記実装基板に接していることを特徴とする請求項1に記載のLEDユニット。
- 前記波長変換部材の下部内方に、前記光源から前記実装基板に沿った方向への出射光を前記波長変換部材へ反射する反射板が設けられていることを特徴とする請求項1又は請求項2に記載のLEDユニット。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011135651A JP5828068B2 (ja) | 2011-06-17 | 2011-06-17 | Ledユニット |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011135651A JP5828068B2 (ja) | 2011-06-17 | 2011-06-17 | Ledユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013004814A JP2013004814A (ja) | 2013-01-07 |
JP5828068B2 true JP5828068B2 (ja) | 2015-12-02 |
Family
ID=47673041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011135651A Active JP5828068B2 (ja) | 2011-06-17 | 2011-06-17 | Ledユニット |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5828068B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3032594A4 (en) | 2013-08-09 | 2017-01-25 | Koha Co., Ltd. | Light emitting device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060097385A1 (en) * | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
JP2006332618A (ja) * | 2005-04-25 | 2006-12-07 | Naoya Yanase | 電子部品実装基板、及びその電子部品実装基板の製造方法 |
JP5270991B2 (ja) * | 2008-07-23 | 2013-08-21 | パナソニック株式会社 | 発光装置および照明器具 |
WO2011004795A1 (ja) * | 2009-07-07 | 2011-01-13 | シーシーエス株式会社 | 発光装置 |
-
2011
- 2011-06-17 JP JP2011135651A patent/JP5828068B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2013004814A (ja) | 2013-01-07 |
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