JP5814652B2 - レーザ照射装置及びレーザ照射方法 - Google Patents
レーザ照射装置及びレーザ照射方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
- B23K26/103—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam the laser beam rotating around the fixed workpiece
- B23K26/106—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam the laser beam rotating around the fixed workpiece inside the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/126—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of gases chemically reacting with the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Description
レーザ発振器:YAGレーザ発振器またはファイバレーザ発振器
レーザ出力:2.0kW
スポット径:φ0.2mm
施工速度:1.0m/min
流体:窒素、アルゴン
流量:30l/min
レーザ発振器:YAGレーザ発振器またはファイバレーザ発振器
レーザ出力:2.0kW
スポット径:φ0.3mm
施工速度:1.0m/min
流体:空気
流量:50l/min
Claims (8)
- レーザ光をレーザ光源から導いてレーザ光出射部から出射するレーザ光伝送機構と、
前記レーザ光出射部から出射されたレーザ光を集光する集光機構と、
前記集光機構を内部に収容し保持するともに、側面に、前記集光機構によって集光されたレーザ光を被加工物に照射するための開口部を有する筒状の筐体と、
流体供給源からの流体を前記筐体内に供給し、前記開口部から噴出させる流体供給機構と、
前記筺体に配設され、前記被加工物と当接されることによって前記集光機構と前記被加工物との距離を一定に保つ位置決め機構と、
前記開口から噴出した流体が、前記筐体と前記被加工物との間を前記筐体の軸方向に沿って流れるようにガイドし、前記筐体と前記被加工物との間にエジェクター効果を発生させるための流体ガイド機構とを具備し、
前記筺体の前記開口部とは対向する側に、前記流体供給機構によって供給された流体を噴出するための噴出口が配設されている
ことを特徴とするレーザ照射装置。 - レーザ光をレーザ光源から導いてレーザ光出射部から出射するレーザ光伝送機構と、
前記レーザ光出射部から出射されたレーザ光を集光する集光機構と、
前記集光機構を内部に収容し保持するともに、側面に、前記集光機構によって集光されたレーザ光を被加工物に照射するための開口部を有する筒状の筐体と、
流体供給源からの流体を前記筐体内に供給し、前記開口部から噴出させる流体供給機構と、
前記筺体に配設され、前記被加工物と当接されることによって前記集光機構と前記被加工物との距離を一定に保つ位置決め機構と、
前記開口から噴出した流体が、前記筐体と前記被加工物との間を前記筐体の軸方向に沿って流れるようにガイドし、前記筐体と前記被加工物との間にエジェクター効果を発生させるための流体ガイド機構とを具備し、
前記流体供給機構が、内部に流体が流通される第1環状部材と、内部に流体が流通される第2環状部材と、前記第1環状部材と前記第2環状部材とを連結する連結機構とを有する
ことを特徴とするレーザ照射装置。 - 請求項1又は2記載のレーザ照射装置であって、
前記流体ガイド機構は、前記筺体に配設された溝、又は、前記筺体に間隔を設けて平行するように配設された複数の堰によって構成されたことを特徴とするレーザ照射装置。 - 請求項1〜3いずれか1項記載のレーザ照射装置であって、
前記レーザ光伝送機構は、前記レーザ光出射部の前記集光機構に対する位置を変更可能とされていることを特徴とするレーザ照射装置。 - 請求項1〜4いずれか1項記載のレーザ照射装置であって、
前記流体供給機構が、屈曲可能な管状体を通じて流体を供給するよう構成されたことを特徴とするレーザ照射装置。 - 請求項1〜5いずれか1項記載のレーザ照射装置であって、
前記レーザ光伝送機構の手前に配設され、前記レーザ光伝送機構を介して伝送される反射光をモニターするための機構を有することを特徴とするレーザ照射装置。 - レーザ光をレーザ光源から導いてレーザ光出射部から出射するレーザ光伝送機構と、
前記レーザ光出射部から出射されたレーザ光を集光する集光機構と、
前記集光機構を内部に収容し保持するともに、側面に、前記集光機構によって集光されたレーザ光を被加工物に照射するための開口部を有する筒状の筐体と、
流体供給源からの流体を前記筐体内に供給し、前記開口部から噴出させる流体供給機構と、
前記筺体に配設され、前記被加工物と当接されることによって前記集光機構と前記被加工物との距離を一定に保つ位置決め機構と、
前記開口から噴出した流体が、前記筐体と前記被加工物との間を前記筐体の軸方向に沿って流れるようにガイドする流体ガイド機構とを具備し、
前記筺体の前記開口部とは対向する側に、前記流体供給機構によって供給された流体を噴出するための噴出口が配設されているレーザ照射装置を用い、
前記流体供給機構から供給された流体を、前記筺体の開口部から噴出させ前記流体ガイド機構に沿った流体の流れを形成することによって前記筺体を前記被加工物にエジェクター効果によって吸着させ、吸着させた状態で前記被加工物にレーザ光を照射する
ことを特徴とするレーザ照射方法。 - レーザ光をレーザ光源から導いてレーザ光出射部から出射するレーザ光伝送機構と、
前記レーザ光出射部から出射されたレーザ光を集光する集光機構と、
前記集光機構を内部に収容し保持するともに、側面に、前記集光機構によって集光されたレーザ光を被加工物に照射するための開口部を有する筒状の筐体と、
流体供給源からの流体を前記筐体内に供給し、前記開口部から噴出させる流体供給機構と、
前記筺体に配設され、前記被加工物と当接されることによって前記集光機構と前記被加工物との距離を一定に保つ位置決め機構と、
前記開口から噴出した流体が、前記筐体と前記被加工物との間を前記筐体の軸方向に沿って流れるようにガイドする流体ガイド機構とを具備し、
前記流体供給機構が、内部に流体が流通される第1環状部材と、内部に流体が流通される第2環状部材と、前記第1環状部材と前記第2環状部材とを連結する連結機構とを有するレーザ照射装置を用い、
前記流体供給機構から供給された流体を、前記筺体の開口部から噴出させ前記流体ガイド機構に沿った流体の流れを形成することによって前記筺体を前記被加工物にエジェクター効果によって吸着させ、吸着させた状態で前記被加工物にレーザ光を照射する
ことを特徴とするレーザ照射方法。
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JP2011138603A JP5814652B2 (ja) | 2011-06-22 | 2011-06-22 | レーザ照射装置及びレーザ照射方法 |
KR20120061918A KR20130028632A (ko) | 2011-06-22 | 2012-06-11 | 레이저 조사 장치 및 레이저 조사 방법 |
CN201210205710.9A CN102837127B (zh) | 2011-06-22 | 2012-06-18 | 激光照射装置及激光照射方法 |
US13/529,793 US9186751B2 (en) | 2011-06-22 | 2012-06-21 | Laser irradiation apparatus and laser irradiation method |
EP12173084.0A EP2537624B1 (en) | 2011-06-22 | 2012-06-22 | Laser irradiation apparatus and laser irradiation method |
KR1020140094188A KR101539704B1 (ko) | 2011-06-22 | 2014-07-24 | 레이저 조사 장치 및 레이저 조사 방법 |
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EP (1) | EP2537624B1 (ja) |
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JP6132424B2 (ja) * | 2013-02-28 | 2017-05-24 | 三菱重工業株式会社 | 二重管の継手方法 |
CN104480476B (zh) * | 2014-11-12 | 2017-02-22 | 江苏大学 | 一种金属损伤件激光热力组合再制造方法 |
WO2016075806A1 (ja) * | 2014-11-14 | 2016-05-19 | ギガフォトン株式会社 | 狭帯域化モジュール、狭帯域化レーザ装置、及び、狭帯域化モジュールを位置決めする方法 |
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CN102837127B (zh) | 2015-05-13 |
KR101539704B1 (ko) | 2015-07-28 |
JP2013006182A (ja) | 2013-01-10 |
US20120325790A1 (en) | 2012-12-27 |
KR20140100923A (ko) | 2014-08-18 |
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EP2537624A2 (en) | 2012-12-26 |
KR20130028632A (ko) | 2013-03-19 |
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