JP5768902B2 - 電力変換装置 - Google Patents
電力変換装置 Download PDFInfo
- Publication number
- JP5768902B2 JP5768902B2 JP2013557254A JP2013557254A JP5768902B2 JP 5768902 B2 JP5768902 B2 JP 5768902B2 JP 2013557254 A JP2013557254 A JP 2013557254A JP 2013557254 A JP2013557254 A JP 2013557254A JP 5768902 B2 JP5768902 B2 JP 5768902B2
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- heat
- support plate
- board
- path forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013557254A JP5768902B2 (ja) | 2012-02-07 | 2012-12-10 | 電力変換装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012024317 | 2012-02-07 | ||
JP2012024317 | 2012-02-07 | ||
PCT/JP2012/007878 WO2013118222A1 (ja) | 2012-02-07 | 2012-12-10 | 電力変換装置 |
JP2013557254A JP5768902B2 (ja) | 2012-02-07 | 2012-12-10 | 電力変換装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013118222A1 JPWO2013118222A1 (ja) | 2015-05-11 |
JP5768902B2 true JP5768902B2 (ja) | 2015-08-26 |
Family
ID=48947031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013557254A Expired - Fee Related JP5768902B2 (ja) | 2012-02-07 | 2012-12-10 | 電力変換装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5768902B2 (zh) |
CN (1) | CN104011988A (zh) |
WO (1) | WO2013118222A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3544396B1 (en) | 2016-11-17 | 2022-09-14 | LG Innotek Co., Ltd. | Dc-dc converter |
JP7151361B2 (ja) | 2018-10-15 | 2022-10-12 | 富士電機株式会社 | 半導体装置 |
JP6884241B1 (ja) * | 2020-01-29 | 2021-06-09 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0955459A (ja) * | 1995-06-06 | 1997-02-25 | Seiko Epson Corp | 半導体装置 |
JP3378174B2 (ja) * | 1997-06-30 | 2003-02-17 | 株式会社ピーエフユー | 高発熱素子の放熱構造 |
JP4142227B2 (ja) * | 2000-01-28 | 2008-09-03 | サンデン株式会社 | 車両用電動圧縮機のモータ駆動用インバータ装置 |
JP2004072959A (ja) * | 2002-08-09 | 2004-03-04 | Hitachi Ltd | 電力変換装置 |
JP4200850B2 (ja) * | 2003-07-17 | 2008-12-24 | 株式会社デンソー | 電動圧縮機 |
JP4687066B2 (ja) * | 2004-10-25 | 2011-05-25 | 株式会社デンソー | パワーic |
JP2006121861A (ja) * | 2004-10-25 | 2006-05-11 | Fuji Electric Fa Components & Systems Co Ltd | 電力変換装置 |
JP4816036B2 (ja) * | 2005-12-01 | 2011-11-16 | 株式会社Ihi | インバータ装置 |
JP2007266527A (ja) * | 2006-03-30 | 2007-10-11 | Toyota Motor Corp | 車両用インバータ装置 |
JP4909712B2 (ja) * | 2006-11-13 | 2012-04-04 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
-
2012
- 2012-12-10 WO PCT/JP2012/007878 patent/WO2013118222A1/ja active Application Filing
- 2012-12-10 CN CN201280061290.XA patent/CN104011988A/zh active Pending
- 2012-12-10 JP JP2013557254A patent/JP5768902B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN104011988A (zh) | 2014-08-27 |
JPWO2013118222A1 (ja) | 2015-05-11 |
WO2013118222A1 (ja) | 2013-08-15 |
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