JP5768902B2 - 電力変換装置 - Google Patents

電力変換装置 Download PDF

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Publication number
JP5768902B2
JP5768902B2 JP2013557254A JP2013557254A JP5768902B2 JP 5768902 B2 JP5768902 B2 JP 5768902B2 JP 2013557254 A JP2013557254 A JP 2013557254A JP 2013557254 A JP2013557254 A JP 2013557254A JP 5768902 B2 JP5768902 B2 JP 5768902B2
Authority
JP
Japan
Prior art keywords
heat transfer
heat
support plate
board
path forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013557254A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2013118222A1 (ja
Inventor
泰仁 田中
泰仁 田中
美里 柴田
美里 柴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP2013557254A priority Critical patent/JP5768902B2/ja
Publication of JPWO2013118222A1 publication Critical patent/JPWO2013118222A1/ja
Application granted granted Critical
Publication of JP5768902B2 publication Critical patent/JP5768902B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
JP2013557254A 2012-02-07 2012-12-10 電力変換装置 Expired - Fee Related JP5768902B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013557254A JP5768902B2 (ja) 2012-02-07 2012-12-10 電力変換装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012024317 2012-02-07
JP2012024317 2012-02-07
PCT/JP2012/007878 WO2013118222A1 (ja) 2012-02-07 2012-12-10 電力変換装置
JP2013557254A JP5768902B2 (ja) 2012-02-07 2012-12-10 電力変換装置

Publications (2)

Publication Number Publication Date
JPWO2013118222A1 JPWO2013118222A1 (ja) 2015-05-11
JP5768902B2 true JP5768902B2 (ja) 2015-08-26

Family

ID=48947031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013557254A Expired - Fee Related JP5768902B2 (ja) 2012-02-07 2012-12-10 電力変換装置

Country Status (3)

Country Link
JP (1) JP5768902B2 (zh)
CN (1) CN104011988A (zh)
WO (1) WO2013118222A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3544396B1 (en) 2016-11-17 2022-09-14 LG Innotek Co., Ltd. Dc-dc converter
JP7151361B2 (ja) 2018-10-15 2022-10-12 富士電機株式会社 半導体装置
JP6884241B1 (ja) * 2020-01-29 2021-06-09 三菱電機株式会社 半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0955459A (ja) * 1995-06-06 1997-02-25 Seiko Epson Corp 半導体装置
JP3378174B2 (ja) * 1997-06-30 2003-02-17 株式会社ピーエフユー 高発熱素子の放熱構造
JP4142227B2 (ja) * 2000-01-28 2008-09-03 サンデン株式会社 車両用電動圧縮機のモータ駆動用インバータ装置
JP2004072959A (ja) * 2002-08-09 2004-03-04 Hitachi Ltd 電力変換装置
JP4200850B2 (ja) * 2003-07-17 2008-12-24 株式会社デンソー 電動圧縮機
JP4687066B2 (ja) * 2004-10-25 2011-05-25 株式会社デンソー パワーｉｃ
JP2006121861A (ja) * 2004-10-25 2006-05-11 Fuji Electric Fa Components & Systems Co Ltd 電力変換装置
JP4816036B2 (ja) * 2005-12-01 2011-11-16 株式会社Ｉｈｉ インバータ装置
JP2007266527A (ja) * 2006-03-30 2007-10-11 Toyota Motor Corp 車両用インバータ装置
JP4909712B2 (ja) * 2006-11-13 2012-04-04 日立オートモティブシステムズ株式会社 電力変換装置

Also Published As

Publication number Publication date
CN104011988A (zh) 2014-08-27
JPWO2013118222A1 (ja) 2015-05-11
WO2013118222A1 (ja) 2013-08-15

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