JP5762668B2 - Polishing pad - Google Patents
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- JP5762668B2 JP5762668B2 JP2008335184A JP2008335184A JP5762668B2 JP 5762668 B2 JP5762668 B2 JP 5762668B2 JP 2008335184 A JP2008335184 A JP 2008335184A JP 2008335184 A JP2008335184 A JP 2008335184A JP 5762668 B2 JP5762668 B2 JP 5762668B2
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Description
本発明は、半導体装置の製造プロセスにおけるウェーハの研磨に使用される研磨パッドに関する。 The present invention relates to a polishing pad used for polishing a wafer in a semiconductor device manufacturing process.
従来ＩＣ（Integrated Circuit）、ＬＳＩ（Large Scale Integration）、ＶＬＳＩ（
Very Large Scale Integration）等の半導体を用いた集積回路の原材料となるシリコンウェーハ等の極めて高い平面度や平行度が要求される板状の材料の製造工程において、精密な寸法精度を得るための平面加工は、回転可能な定盤、あるいは表面に研磨パッドを貼付した回転可能な定盤によるラッピング加工機あるいはポリシング加工機によって行われる。
Conventional IC (Integrated Circuit), LSI (Large Scale Integration), VLSI (
Planes for obtaining precise dimensional accuracy in the manufacturing process of plate-like materials that require extremely high flatness and parallelism, such as silicon wafers, which are the raw materials of integrated circuits using semiconductors such as Very Large Scale Integration) The processing is performed by a lapping machine or a polishing machine using a rotatable surface plate, or a rotatable surface plate with a polishing pad attached to the surface.
単結晶であるウェーハには、その結晶方向を示すために必ずオリエンテーションフラット、あるいはノッチ部が形成されている。特に、近年は、製品の収率や歩留まりを上げるために、ウェーハ表面積のロスがオリエンテーションフラットよりも少ないノッチ部を形成することが多い。 An orientation flat or notch portion is always formed on a single crystal wafer to indicate the crystal direction. In particular, in recent years, in order to increase product yield and yield, notch portions in which the loss of the wafer surface area is less than that of the orientation flat are often formed.
ノッチ部は、ウェーハの最外周周縁のエッジ部分に形成された小さい切り込み状の部分であり、切り込みがＵ字形の形状のもの、及びＶ字形の形状のものの２通りのものが有る。シリコンウェーハの加工においては、その表面部分の加工とともにその周縁のエッジ部分も、チッピング防止やダストの巻き込みを防止することを目的として、鈍角を持つように、または円弧状のプロファイルを持つように面取りされた上で、鏡面加工が施される。 The notch portion is a small cut portion formed at the edge portion of the outermost peripheral edge of the wafer, and there are two types of cuts, a U-shaped shape and a V-shaped shape. In the processing of silicon wafers, the edge of the peripheral edge as well as the surface of the silicon wafer are chamfered so as to have an obtuse angle or an arc-like profile for the purpose of preventing chipping and preventing dust entrainment. Then, a mirror finish is applied.
ウェーハのノッチ部を研磨するための研磨パッドは、合成繊維の不織布を原材料とし、樹脂が処理されたもの等が用いられている。しかし従来の研磨パッドでは、ノッチ研磨時のせん断力によって、短時間で、研磨中に合成繊維や不織布が突出して使用ができなくなる事態を招くことになる。特に、ノッチ部とウェーハ外周とが交わる端面において、研磨パッドの磨耗は激しく、研磨パッドの寿命が短くなる。このため、コスト管理が激化する昨今において、研磨性能と長寿命化の要求は大きくなっている。 As a polishing pad for polishing a notch portion of a wafer, a non-woven fabric of synthetic fiber is used as a raw material and a resin is processed. However, in the conventional polishing pad, the shearing force at the time of notch polishing causes a situation in which the synthetic fiber or the nonwoven fabric protrudes during polishing and cannot be used in a short time. In particular, at the end surface where the notch portion and the wafer outer periphery intersect, the polishing pad is heavily worn, and the life of the polishing pad is shortened. For this reason, in recent years when cost management is intensifying, demands for polishing performance and longer life are increasing.
このようなノッチ研磨用の研磨パッドとして、例えば、外周部が、不織布またはスウェードタイプの材料からなる内側の軟質パッド層と、ポリウレタンからなる外側の硬質パッド層の２層タイプの研磨パッドがある（例えば、特許文献１参照。） As such a polishing pad for notch polishing, there is, for example, a two-layer type polishing pad whose outer peripheral portion is an inner soft pad layer made of a nonwoven fabric or a suede type material and an outer hard pad layer made of polyurethane ( For example, see Patent Document 1.)
ノッチ研磨において、研磨パッドの外周部がせん断力によって、磨耗しながら形状変化を引き起こし、変形した研磨パッドがノッチ部の更に外側のウェーハ鏡面部などに接触することによって生じるオーバーポリッシュと呼ばれる、不具合が発生することを防ぐために、研磨パッドとしてダイヤモンドドレッサー等を用いて、パッド形状の修正が行われている。 In notch polishing, the outer peripheral part of the polishing pad is worn by shearing force, causing a shape change while being worn, and a defect called overpolish caused by contact of the deformed polishing pad with the wafer mirror surface part outside the notch part, etc. In order to prevent the occurrence, the pad shape is corrected using a diamond dresser or the like as a polishing pad.
特許文献１に開示される研磨パッドは、外側に磨耗しにくい硬質パッドを用いることでパットの形状変形が抑制され、それによってオーバーポリッシュを抑制している。 The polishing pad disclosed in Patent Document 1 uses a hard pad that is hard to be worn on the outside, thereby suppressing deformation of the pad shape, thereby suppressing overpolishing.
しかしながら、特許文献１に開示される研磨パッドは、内側の軟質パッド層には不織布又はスウェードタイプの材料が用いられ、外側の硬質パッド層にはポリウレタンが用いられ、異なる材料を貼り合わせた２層構造である。このため、微小な面積に荷重の掛かるノッチ研磨では、異なる材料の変形量の違いによって発生する歪や、層間へのスラリーの浸透や研磨パッドの磨耗などを原因とした、軟質パッド層と硬質パッド層の貼り合わせ部の剥がれが避けられないため、製品寿命が短くなるという問題がある。 However, in the polishing pad disclosed in Patent Document 1, a non-woven fabric or a suede type material is used for the inner soft pad layer, and polyurethane is used for the outer hard pad layer. Structure. For this reason, in notch polishing where a load is applied to a small area, the soft pad layer and the hard pad are caused by distortion caused by the difference in deformation amount of different materials, slurry penetration between layers, abrasion of the polishing pad, etc. There is a problem that the product life is shortened because peeling of the laminated portion of the layers is inevitable.
また、ノッチ部の形状に柔軟に追従して研磨し、優れた研磨性能を得るためには、内側の軟質層と外側の硬質層の厚みのバランスを保つ必要があり、硬質層の厚みに制限がある。この点、使用中の研磨環境下では、研磨パッドの磨耗および変形が避けられないため、使用中に硬質層の厚みを正確に測定して、製品寿命を判断することが困難であり、安全を考慮して、本来の製品寿命より早めに、交換せざるを得ないという問題がある。同様に、パッド形状の修正も、この厚み制限内でしか実施することができない。 In addition, it is necessary to keep the balance between the thickness of the inner soft layer and the outer hard layer in order to achieve excellent polishing performance by flexibly following the shape of the notch, and the thickness of the hard layer is limited. There is. In this respect, since the wear and deformation of the polishing pad are unavoidable in the polishing environment during use, it is difficult to accurately measure the thickness of the hard layer during use and determine the product life. Considering this, there is a problem that it must be replaced earlier than the original product life. Similarly, pad shape modification can only be performed within this thickness limit.
本発明は、上記問題点を解決するためになされたもので、特にノッチ部およびその周辺部の研磨に好適で、かつ、製品寿命の長い研磨パッドを提供することを目的とする。 The present invention has been made to solve the above problems, and an object of the present invention is to provide a polishing pad that is particularly suitable for polishing the notch portion and its peripheral portion and has a long product life.
本発明は、ウェーハのノッチ部を研磨するための研磨パッドにおいて、
研磨パッドの内層部と外層部とで、密度に違いのある三層構造を有し、
三層構造は、基材である不織布にウレタン樹脂を含浸して、外層部の樹脂密度と内層部の樹脂密度とを異ならせることによって層間に構造的な境目がない、厚み方向に樹脂密度の高い外層部、外層部よりも樹脂密度の低い内層部、樹脂密度が高い外層部からなる三層構造であって、不織布の繊維とウレタン樹脂とが一体となって硬化し、外層部の強度が内層部よりも高い三層構造であることを特徴とする研磨パッドである。
The present invention provides a polishing pad for polishing a notch portion of a wafer,
The inner layer part and outer layer part of the polishing pad have a three-layer structure with different densities,
Three-layer structure is impregnated with a urethane resin to the nonwoven fabric as a base material, structural boundary between the layers by varying the resin density of the resin density and the inner portion of the outer layer portion is not name, the resin density in the thickness direction A three-layer structure consisting of a high outer layer part, an inner layer part having a lower resin density than the outer layer part, and an outer layer part having a higher resin density , and the nonwoven fabric fibers and urethane resin harden together, and the strength of the outer layer part Is a polishing pad characterized by having a three-layer structure higher than the inner layer portion .
本発明によれば、研磨パッドの内層部と外層部とで、密度に違いのある三層構造を有し、基材である不織布にウレタン樹脂を含浸して、外層部の樹脂密度と内層部の樹脂密度とを異ならせることによって、構造的な境目がなく、厚み方向に樹脂密度の高い外層部、外層部よりも樹脂密度の低い内層部、樹脂密度が高い外層部からなる三層構造であって、不織布の繊維とウレタン樹脂とが一体となって硬化し、外層部の強度が内層部よりも高い三層構造を形成することによって、研磨による磨耗および、ドレッシング時の形状変形を抑制し、特にノッチ部およびその周辺部の研磨に好適で、かつ、寿命の長い研磨パッドを提供することができる。
According to the present invention, the inner layer portion and the outer layer portion of the polishing pad have a three-layer structure with different densities, and the nonwoven fabric that is the base material is impregnated with the urethane resin so that the resin density of the outer layer portion and the inner layer portion by varying the resin density of, without structural boundaries, in the thickness direction higher outer layer portion of the resin density, low inner layer portion of the resin density than the outer layer portion, a three-layer structure in which the resin density of the higher layer unit Therefore , non-woven fabric fibers and urethane resin are united and cured to form a three-layer structure in which the strength of the outer layer part is higher than that of the inner layer part , thereby suppressing wear due to polishing and shape deformation during dressing. In particular, it is possible to provide a polishing pad that is suitable for polishing notches and their peripheral portions and has a long life.
以下、本発明の実施形態について説明する。
図１は、本発明の実施形態である研磨パッド１の構成を示す模式図である。
Hereinafter, embodiments of the present invention will be described.
FIG. 1 is a schematic diagram showing a configuration of a polishing pad 1 according to an embodiment of the present invention.
研磨パッド１は、樹脂密度の高い外層部２と、外層部２よりも樹脂密度の低い内層部３とを有する。なお、図面では、研磨パッド１の構成が分かり易いように、外層部２と内層部３との境界を明示しているが、以下の製造方法にも示すように、研磨パッド１は、不織布にウレタン樹脂を含浸させ、凝固して得られるものであり、外層部２と内層部３との間に、図に示すような明確な境界が存在するわけではない。
次に研磨パッド１の製造方法の一例を説明する。
The polishing pad 1 has an outer layer portion 2 having a high resin density and an inner layer portion 3 having a resin density lower than that of the outer layer portion 2. In the drawing, the boundary between the outer layer portion 2 and the inner layer portion 3 is clearly shown so that the configuration of the polishing pad 1 is easy to understand. However, as shown in the following manufacturing method, the polishing pad 1 is made of a non-woven fabric. It is obtained by impregnating and solidifying a urethane resin, and there is no clear boundary between the outer layer portion 2 and the inner layer portion 3 as shown in the figure.
Next, an example of the manufacturing method of the polishing pad 1 will be described.
（１）ウレタン樹脂と溶媒の含浸溶液混合工程
本工程では、含浸溶液を混合する。湿式のウレタン樹脂を、ジメチルホルムアミド（ＤＭＦ）などの溶媒に混合して、ウレタン樹脂を溶解させて、含浸溶液としてのウレタン樹脂溶液を製造する。
(1) Impregnation solution mixing step of urethane resin and solvent In this step, the impregnation solution is mixed. A wet urethane resin is mixed with a solvent such as dimethylformamide (DMF) to dissolve the urethane resin, thereby producing a urethane resin solution as an impregnation solution.
含浸溶液としてのウレタン樹脂としては、ポリエステル系あるいはポリエーテル系、ポリカーボネート系などのウレタン樹脂を用いることができ、異なる２種類のウレタン樹脂をブレンドしてもよい。 As the urethane resin as the impregnation solution, a urethane resin such as polyester, polyether or polycarbonate may be used, and two different types of urethane resins may be blended.
ウレタン樹脂を溶解させる溶媒としては、上述のジメチルホルムアミドの他、例えば、ジメチルスルホキシド、テトラヒドロフラン、ジメチルアセトアミド等の溶媒を用いることができる。 As a solvent for dissolving the urethane resin, in addition to the above dimethylformamide, for example, a solvent such as dimethylsulfoxide, tetrahydrofuran, dimethylacetamide or the like can be used.
（２）含浸工程
本工程では、研磨パッドの基材としてフェルト等の不織布を用い、ウレタン樹脂と溶媒の含浸溶液混合工程で混合した含浸溶液に含浸する。
(2) Impregnation step In this step, a non-woven fabric such as felt is used as the base material of the polishing pad, and the impregnation solution mixed in the impregnation solution mixing step of the urethane resin and the solvent is impregnated.
不織布としては、例えば、ポリエステル繊維、ナイロン繊維、ポリプロピレン繊維、ポリビニルアルコール繊維、ポリアミド繊維から選ばれる１種または２種以上の繊維を含むものであって、一様に均一な不織布を用いることができる。 As the nonwoven fabric, for example, one or two or more types of fibers selected from polyester fiber, nylon fiber, polypropylene fiber, polyvinyl alcohol fiber, and polyamide fiber can be used, and a uniformly uniform nonwoven fabric can be used. .
次に、含浸溶液を含浸させた不織布を凝固水中で凝固して、ウレタン樹脂を湿式凝固させて、樹脂密度の高い多孔質体で構成される外層部と、外層部よりも樹脂密度の低い多孔質体で構成される内層部とを形成する。 Next, the nonwoven fabric impregnated with the impregnation solution is coagulated in coagulated water, and the urethane resin is wet coagulated to form an outer layer portion composed of a porous body having a high resin density, and a porous material having a resin density lower than that of the outer layer portion. And an inner layer portion composed of a material.
その後、水で洗浄して含浸溶液の溶媒を除去した後、乾燥し、ウレタン樹脂が含浸、凝固した不織布の表裏面を平面研削(バフ)して多孔質体の研磨パッドを得る。前記凝固水は、不織布である基材にウレタン樹脂を固体化させ、定着するための液体であり、特に制限はないが、半導体デバイスなどの製造工程での使用を考慮すると、たとえば、純水、超純水、イオン交換水、蒸留水などが好ましく、必要に応じて、ＤＭＦを加えても良い。 Thereafter, the substrate is washed with water to remove the solvent of the impregnation solution, and then dried, and the front and back surfaces of the nonwoven fabric impregnated and solidified with the urethane resin are subjected to surface grinding (buffing) to obtain a porous polishing pad. The coagulated water is a liquid for solidifying and fixing a urethane resin on a base material that is a nonwoven fabric, and is not particularly limited, but considering use in a manufacturing process of a semiconductor device, for example, pure water, Ultrapure water, ion exchange water, distilled water, and the like are preferable, and DMF may be added as necessary.
図２は、本発明の実施形態に係る研磨パッド１の形状例を示す。図２（ａ）、図２（ｂ）いずれも上側が平面図、下側が断面図を示す。 FIG. 2 shows a shape example of the polishing pad 1 according to the embodiment of the present invention. 2A and 2B both show a plan view on the upper side and a sectional view on the lower side.
研磨布パッド全体の形状は、特に限定されないが、主にリング形状、円板形状などで作製される。研磨時にノッチ部と接触する周縁部の形状は、ノッチ部の切り欠き形状に合わせた形状とすることが好ましい。 Although the shape of the whole polishing pad is not particularly limited, it is mainly produced in a ring shape, a disk shape or the like. The shape of the peripheral edge that contacts the notch during polishing is preferably a shape that matches the notch shape of the notch.
図２（ａ）に示すように、研磨パッド１は、リング形状であり、周縁部の厚み方向の断面形状は、大略Ｖ字形状であり、先端部が平坦になっている。図２（ｂ）に示すように、研磨パッド１は、リング形状であり、周縁部の厚み方向の断面形状は、Ｕ字形状となっている。図２（ｃ）に示すように、研磨パッド１は、リング形状であり、周縁部の厚み方向の断面形状は、図２（ａ）に類似した大略Ｖ字形状であり、先端部が鋭角になっている。図２（ｄ）に示すように、研磨パッド１は、リング形状であり、周縁部の厚み方向の断面形状は、長方形状となっている。 As shown in FIG. 2A, the polishing pad 1 has a ring shape, the cross-sectional shape in the thickness direction of the peripheral edge portion is substantially V-shaped, and the tip portion is flat. As shown in FIG. 2B, the polishing pad 1 has a ring shape, and the cross-sectional shape in the thickness direction of the peripheral edge portion is a U-shape. As shown in FIG. 2 (c), the polishing pad 1 has a ring shape, and the cross-sectional shape in the thickness direction of the peripheral portion is substantially V-shaped similar to FIG. 2 (a), and the tip portion has an acute angle. It has become. As shown in FIG. 2D, the polishing pad 1 has a ring shape, and the cross-sectional shape in the thickness direction of the peripheral edge portion is a rectangular shape.
本発明によれば、一様に均一な不織布をウレタン樹脂溶液に含浸して凝固することによって、特に研磨パッドの表面から厚み方向に約１／３の深さまでの外層部で、ウレタン樹脂の密度が高くなり、外層部と内層部とで樹脂密度に差がある状態となる。さらに次工程で乾燥することによって、不織布と含浸樹脂とが一体となり硬化した状態となる。この構造により、不織布の繊維および、ウレタン樹脂が一体となることによって、それぞれ単体での場合を上回る強度が得られ、樹脂密度に応じて、外層部の強度が特に高くなる。 According to the present invention, by uniformly impregnating a urethane resin solution with a uniform non-woven fabric and solidifying it, the density of the urethane resin, particularly in the outer layer portion from the surface of the polishing pad to a depth of about 1/3 in the thickness direction. Becomes higher, and there is a difference in resin density between the outer layer portion and the inner layer portion. Furthermore, by drying in the next step, the nonwoven fabric and the impregnating resin are integrated and cured. By this structure, the fibers of the nonwoven fabric and the urethane resin are united to obtain strength higher than that of a single body, and the strength of the outer layer portion is particularly increased according to the resin density.
また、本発明の研磨パッドの製造方法としては、不織布にウレタン樹脂を厚み方向一方側から含浸させ、所定深さまで含浸させたのち、不織布を反転して不織布の他方側から含浸させることで両面を含浸させる方法、ウレタン樹脂を含浸後に外部から熱を加えて外層部を硬化させる方法、または、内層部を両側から外層部で挟む三層構造において、単なる貼り合わせではなく、内層部と外層部との接合面を熱や化学成分などで溶着し、層間をシームレス化する方法などを用いても良い。 In addition, as a method for producing the polishing pad of the present invention, the nonwoven fabric is impregnated with urethane resin from one side in the thickness direction, impregnated to a predetermined depth, and then the nonwoven fabric is inverted and impregnated from the other side of the nonwoven fabric. In the method of impregnation, the method of curing the outer layer part by applying heat from the outside after impregnation with urethane resin, or the three-layer structure in which the inner layer part is sandwiched between the outer layer parts from both sides Alternatively, a method may be used in which the joint surfaces are welded with heat or chemical components to make the layers seamless.
（実施例）
実施例には、不織布にポリエステル繊維（ＥＸＢＳ１０００Ｌ、金井重要工業製）を用い、含浸樹脂にウレタン樹脂（Ｌ−３１５、三井武田製）を用いて、研磨パッドを作成した。実施例の研磨パッドの断面写真を図３（ａ）に示す。
(Example)
In the examples, a polishing pad was prepared using polyester fibers (EXBS1000L, manufactured by Kanai Kangyo Kogyo Co., Ltd.) as the nonwoven fabric and urethane resin (L-315, manufactured by Mitsui Takeda) as the impregnating resin. A cross-sectional photograph of the polishing pad of the example is shown in FIG.
（比較例）
比較例には、既存の製品ＧＳ１８０（ローム・アンド・ハース製）を用いた。比較例の研磨パッドの断面写真を図３（ｂ）に示す。
(Comparative example)
In the comparative example, an existing product GS180 (made by Rohm and Haas) was used. A cross-sectional photograph of the polishing pad of the comparative example is shown in FIG.
（評価方法）
パッド寿命は、ノッチ研磨において、実施例と比較例とを比較し、研磨パッドが破断するまでの相対時間を示している。
(Evaluation method)
In the notch polishing, the pad life indicates a relative time until the polishing pad breaks by comparing the example and the comparative example.
波形状不良率は、ＣＣＤカメラを用いて撮影した画像に基づいて、欠陥検査の相対値を示している。 The waveform defect rate indicates a relative value of defect inspection based on an image photographed using a CCD camera.
空壁の面積率は、画像処理部分において空壁部が占める割合（％）であり、画像処理ソフト（ＷｉｎＲＯＯＦ、三谷商事製）を用いて算出し、樹脂密度として評価する。 The area ratio of the vacant wall is a ratio (%) of the vacant wall portion in the image processing portion, and is calculated using image processing software (WinROOF, manufactured by Mitani Corp.) and evaluated as a resin density.
＜ＷｉｎＲＯＯＦ測定条件＞
コントラスト：１００、明るさ：５０、閾値：０−２００、測定面積：厚み方向にて３等分。
<WinROOF measurement conditions>
Contrast: 100, brightness: 50, threshold: 0-200, measurement area: equally divided into three in the thickness direction.
表１は、上記評価方法を用いて、本発明に係る実施例と比較例について、厚み方向にて空壁の面積率を評価した結果を示す。 Table 1 shows the results of evaluating the area ratio of the vacant wall in the thickness direction for the examples and comparative examples according to the present invention using the above evaluation method.
表２は、上記評価方法を用いて、本発明に係る実施例と比較例について、ノッチ研磨試験を行った結果を示す。 Table 2 shows the results of a notch polishing test performed on the examples and comparative examples according to the present invention using the above evaluation method.
図４は、ノッチ研磨の概略を示す図を示す。ノッチ研磨では、リング状の研磨パッド１を研磨パッド治具４によって保持するとともに回転させ、ウェーハ５のノッチ部に研磨パッド１の周縁部を接触させることで研磨を行う。 FIG. 4 is a diagram showing an outline of notch polishing. In the notch polishing, the ring-shaped polishing pad 1 is held by the polishing pad jig 4 and rotated, and polishing is performed by bringing the peripheral portion of the polishing pad 1 into contact with the notch portion of the wafer 5.
＜研磨条件＞
研磨パッド回転数：７００ｒｐｍ
加工圧力：１．５ｋｇ／ｃｍ２
スラリー：エッジミラーＶ（ニッタ・ハース株式会社製）
<Polishing conditions>
Polishing pad rotation speed: 700 rpm
Processing pressure: 1.5kg / cm2
Slurry: Edge mirror V (made by Nitta Haas Co., Ltd.)
表１から明らかなように、実施例の空壁の面積率は外層部が、内層部より低くなっていることより、樹脂密度は外層部が内層部よりも高くなっていることがわかる。これに対し、比較例は、空壁の面積率が厚み方向で差が無く、さらに全体的に空壁の面積率が実施例よりも高いため、実施例よりも樹脂密度が低くなっている。このため、実施例の外層部の強度が高くなっていることがわかる。 As is apparent from Table 1, the area ratio of the empty wall in the example is that the outer layer portion is lower than the inner layer portion, and therefore the resin density is higher in the outer layer portion than in the inner layer portion. On the other hand, in the comparative example, there is no difference in the area ratio of the empty wall in the thickness direction, and the area ratio of the empty wall is higher than that of the example as a whole, so that the resin density is lower than that of the example. For this reason, it turns out that the intensity | strength of the outer-layer part of an Example is high.
表２から明らかなように、結果として、本発明に係る研磨パッドの寿命は比較例に比べ、１．３倍に向上し、波形状不良率は約半分に低減することができた。これは、研磨パッドの外層において樹脂密度を高く含浸して凝固することによって、樹脂の耐摩耗性を高め、研磨パッドの寿命を延ばすだけでなく、波形状不良の原因となる研磨パッドの変形が、樹脂密度の高い外層部によって低減することができたことを示している。 As is apparent from Table 2, as a result, the life of the polishing pad according to the present invention was improved 1.3 times as compared with the comparative example, and the waveform defect rate could be reduced to about half. This is because the outer layer of the polishing pad is impregnated with a high resin density and solidifies, thereby improving the abrasion resistance of the resin and extending the life of the polishing pad, as well as the deformation of the polishing pad causing a wave shape defect. This indicates that the outer layer portion having a high resin density can be reduced.
また、ウェーハのノッチ部に応じて変形量が大きくなる周縁部に対しては、従来の異なる材料による２層構造のような極端な変形とは異なり、外層部の内側にて樹脂密度の低い内層部が境目の無い一体構造にてサポートすることにより、樹脂密度に応じた緩やかな変形を起こし、ノッチの形状に研磨パッドが追従し、研磨パッド内の応力の集中を防ぐことが可能である。 Also, for the peripheral portion where the amount of deformation increases according to the notch portion of the wafer, unlike the conventional extreme deformation such as a two-layer structure made of different materials, the inner layer having a low resin density inside the outer layer portion. By supporting the unit with a solid structure with no boundary, it is possible to cause a gentle deformation according to the resin density, the polishing pad follows the shape of the notch, and prevent stress concentration in the polishing pad.
このように、研磨パッドの外層部の樹脂密度が高くなり、内側層の密度が低くなり多孔質を形成するウレタン樹脂を用いて、研磨パッドの磨耗を抑制することによって、波型状不良率を低減することができる。また、外層部と内層部とを一体構造とすることによって、強度が向上し、また、樹脂密度に応じた緩やかな変形によって、製品寿命を延ばすことが可能となった。 In this way, the resin density in the outer layer portion of the polishing pad is increased, the density of the inner layer is decreased, and the urethane resin that forms a porous layer is used to suppress the abrasion of the polishing pad. Can be reduced. In addition, the outer layer portion and the inner layer portion have an integrated structure, so that the strength is improved, and the product life can be extended by gradual deformation according to the resin density.
また、樹脂密度の違いが、構造的に境目無く得られることによって、本発明に係る研磨パッドは、ダイヤモンドドレッサーなどを用いて、パッド形状の修正が可能であり、パッドの寿命を延ばすことが可能である。 In addition, since the difference in resin density can be obtained without any structural boundary, the polishing pad according to the present invention can be modified with a diamond dresser or the like, and the life of the pad can be extended. It is.
また、パッド寿命が長いことによって、研磨中の研磨パッドの、ウェーハの反対側にドレッサーを設置することにて、研磨しながら、同時に研磨パッド形状の修正も可能となる。 In addition, since the pad life is long, the polishing pad shape can be simultaneously corrected while polishing by installing a dresser on the opposite side of the wafer to the polishing pad being polished.
なお、本発明は上記実施形態に限定されず、本発明の要旨を逸脱しない範囲において設計変更可能なことは言うまでもない。 Needless to say, the present invention is not limited to the above-described embodiment, and the design can be changed without departing from the gist of the present invention.
１ 研磨パッド
２ 外層部
３ 内層部
1 Polishing pad 2 Outer layer part 3 Inner layer part
Claims (1)
研磨パッドの内層部と外層部とで、密度に違いのある三層構造を有し、
三層構造は、基材である不織布にウレタン樹脂を含浸して、外層部の樹脂密度と内層部の樹脂密度とを異ならせることによって層間に構造的な境目がない、厚み方向に樹脂密度の高い外層部、外層部よりも樹脂密度の低い内層部、樹脂密度が高い外層部からなる三層構造であって、不織布の繊維とウレタン樹脂とが一体となって硬化し、外層部の強度が内層部よりも高い三層構造であることを特徴とする研磨パッド。 In the polishing pad for polishing the notch portion of the wafer,
The inner layer part and outer layer part of the polishing pad have a three-layer structure with different densities,
Three-layer structure is impregnated with a urethane resin to the nonwoven fabric as a base material, structural boundary between the layers by varying the resin density of the resin density and the inner portion of the outer layer portion is not name, the resin density in the thickness direction high outer layer of a low inner layer portion of the resin density than the outer layer portion, a three-layer structure in which the resin density of the high layer unit, a non-woven fiber and the urethane resin is cured together, the strength of the outer layer portion A polishing pad characterized by having a three-layer structure having a height higher than that of the inner layer portion .
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| JP5478956B2 (en) * | 2009-06-26 | 2014-04-23 | ニッタ・ハース株式会社 | Polishing pad for notch polishing |
| JP7091575B2 (en) * | 2017-03-03 | 2022-06-28 | スピードファム株式会社 | Notch part polishing pad and its manufacturing method |
| JP7295624B2 (en) * | 2018-09-28 | 2023-06-21 | 富士紡ホールディングス株式会社 | Polishing pad, method for producing same, and method for producing abrasive product |
| JP7328838B2 (en) * | 2019-09-10 | 2023-08-17 | 富士紡ホールディングス株式会社 | Polishing pad, method for producing same, and method for producing abrasive product |
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| JPH10308369A (en) * | 1997-05-01 | 1998-11-17 | Nitomatsuku Ii R Kk | Notch part polishing device and polishing materials which are used for that device |
| JP2001001270A (en) * | 1999-06-17 | 2001-01-09 | Sumitomo Osaka Cement Co Ltd | Polishing pad |
| JP2004087647A (en) * | 2002-08-26 | 2004-03-18 | Nihon Micro Coating Co Ltd | Grinder pad and its method |
| JP2004223684A (en) * | 2003-01-27 | 2004-08-12 | Toshiba Ceramics Co Ltd | Wafer notch polishing pad |
| JP4526987B2 (en) * | 2005-03-22 | 2010-08-18 | 株式会社イノアックコーポレーション | Manufacturing method of polishing buff material |
| JP2006319045A (en) * | 2005-05-11 | 2006-11-24 | Nitta Haas Inc | Polishing cloth |
| JP5348966B2 (en) * | 2008-08-21 | 2013-11-20 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Polishing pad |
| JP2010108968A (en) * | 2008-10-28 | 2010-05-13 | Nitmac Er Co Ltd | Notch polishing apparatus |
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