JP5754372B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP5754372B2 JP5754372B2 JP2011284833A JP2011284833A JP5754372B2 JP 5754372 B2 JP5754372 B2 JP 5754372B2 JP 2011284833 A JP2011284833 A JP 2011284833A JP 2011284833 A JP2011284833 A JP 2011284833A JP 5754372 B2 JP5754372 B2 JP 5754372B2
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- JP
- Japan
- Prior art keywords
- semiconductor device
- manufacturing
- heating
- heat sink
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims description 65
- 238000004519 manufacturing process Methods 0.000 title claims description 39
- 238000010438 heat treatment Methods 0.000 claims description 49
- 229910000679 solder Inorganic materials 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 125000006850 spacer group Chemical group 0.000 description 6
- 238000003303 reheating Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Landscapes
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
放熱部を含む基板に第一加熱ステップを経て第一半田層により接合された半導体素子に第二半田層を介して放熱板を接合してなる半導体装置の製造方法であって、前記放熱板を前記第一加熱ステップに用いられる第一加熱手段とは異なる第二加熱手段により加熱する第二加熱ステップと、前記第二半田層に前記放熱板を載置する載置ステップを含むことを特徴とする。
2 リードフレーム(ヒートシンク:放熱部を含む基板)
3 半導体素子
4 ダイオード
5 ヒートシンク(放熱板)
6 ワイヤーボンディング
7 銅ブロック
W ワーク
S 半田
A 治具
B 治具
BS スペーサ
H1 ヒータ
H2 高周波加熱器
H3 ハンドヒータ
HD 組付けハンド
R 還元剤
Claims (8)
- 放熱部を含む基板に第一加熱ステップを経て第一半田層により接合された半導体素子に第二半田層を介して放熱板を接合してなる半導体装置の製造方法であって、前記放熱板を前記第一加熱ステップに用いられる第一加熱手段とは異なる第二加熱手段により加熱する第二加熱ステップと、前記第二半田層に前記放熱板を載置する載置ステップを含むことを特徴とする半導体装置の製造方法。
- 前記第二加熱ステップの後に、前記載置ステップを行うことを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記第二加熱手段は、前記第一加熱手段に比べて、急速な加熱が可能であることを特徴とする請求項2に記載の半導体装置の製造方法。
- 前記載置ステップで用いられる載置手段は、前記載置ステップの後において前記放熱板を押圧することを特徴とする請求項2又は3に記載の半導体装置の製造方法。
- 前記載置ステップの後に、前記第二加熱ステップを行うことを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記第二加熱手段は、前記載置ステップにおいて用いられる載置手段の一部をなすことを特徴とする請求項5に記載の半導体装置の製造方法。
- 前記第二加熱手段は、前記放熱板に対して非接触にて加熱が可能であることを特徴とする請求項5に記載の半導体装置の製造方法。
- 前記載置ステップで用いられる載置手段は、前記第二加熱ステップにおいて前記放熱板を押圧することを特徴とする請求項6又は7に記載の半導体装置の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011284833A JP5754372B2 (ja) | 2011-12-27 | 2011-12-27 | 半導体装置の製造方法 |
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---|---|---|---|
JP2011284833A JP5754372B2 (ja) | 2011-12-27 | 2011-12-27 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013135100A JP2013135100A (ja) | 2013-07-08 |
JP5754372B2 true JP5754372B2 (ja) | 2015-07-29 |
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JP2011284833A Active JP5754372B2 (ja) | 2011-12-27 | 2011-12-27 | 半導体装置の製造方法 |
Country Status (1)
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JP (1) | JP5754372B2 (ja) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003068959A (ja) * | 2001-08-22 | 2003-03-07 | Denso Corp | 半導体装置 |
JP4302607B2 (ja) * | 2004-01-30 | 2009-07-29 | 株式会社デンソー | 半導体装置 |
JP5029139B2 (ja) * | 2006-12-05 | 2012-09-19 | 株式会社豊田自動織機 | 車載用半導体装置及び車載用半導体装置の製造方法 |
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2011
- 2011-12-27 JP JP2011284833A patent/JP5754372B2/ja active Active
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