JP5733743B2 - 光半導体装置 - Google Patents
光半導体装置 Download PDFInfo
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- JP5733743B2 JP5733743B2 JP2010279496A JP2010279496A JP5733743B2 JP 5733743 B2 JP5733743 B2 JP 5733743B2 JP 2010279496 A JP2010279496 A JP 2010279496A JP 2010279496 A JP2010279496 A JP 2010279496A JP 5733743 B2 JP5733743 B2 JP 5733743B2
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- 230000003287 optical effect Effects 0.000 title claims description 47
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- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000002245 particle Substances 0.000 description 29
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 19
- 230000017525 heat dissipation Effects 0.000 description 11
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- 229910010272 inorganic material Inorganic materials 0.000 description 9
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000005245 sintering Methods 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
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- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910005540 GaP Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
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- 239000004593 Epoxy Substances 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
に関する。
光拡散粒子及び無機蛍光体の平均粒子径とは、光拡散粒子及び無機蛍光体の一次粒子の平均粒子径のことであり、透過型電子顕微鏡TEMにて、画像に映った粒子100個の直径を測定し、それらの平均値を平均粒子径とする。
(波長変換層)
市販のシリコーンエラストマー(LR7665、旭化成ワッカーシリコーン社製)に、セリウム賦活YAG:Ce3+(平均粒子径9μm)を26重量%となるよう配合して混合したものを、PETフィルム(厚み50μm)の上に、アプリケーターを用いて厚み100μmに塗工し、100℃で5分加熱することにより成形した。得られた成形体は、抜型成形装置を用いて、8mm×8mmサイズ(厚み約100μm)の小片に切り出して、波長変換層を作製した。
アルミン酸イットリウム(YAG)(平均粒子径9μm)に、該無機材料の重量が20重量%となるように、バインダー樹脂としてのポリビニルアルコールを添加し、さらにイソプロピルアルコールを適量添加して、スラリー状溶液を調製した。次いで、得られたスラリー状溶液を成形後、焼結後の厚みが500μmになるように、1000℃で5時間加熱焼結して、無機高熱伝導層を作製した。なお、得られた無機高熱伝導層は、十分に冷めた後に、抜型成形装置を用いて8mm×8mmサイズに切断加工した。
凹型金型(底面8×8mm、高さ1.1mm)の底部に、前記で得られた波長変換層と無機高熱伝導層をこの順に載置し、その上に、封止樹脂層として、市販のシリコーンエラストマー(LR7665)に溶融シリカ粒子(FB-40S、電気化学工業社製、平均粒子径40μm)を50重量%となるよう配合して混合したものを充填した。その上から、青色LEDチップ(1mm×1mm×0.17mm高)が実装された基板を、充填された樹脂とLEDチップが対向するように載置した後、160℃で5分加熱して封止加工する。その後、室温下においても形状が変化しなくなるまで放置した後、金型をはずして光半導体装置を作製した。
実施例1において、無機高熱伝導層を以下に示すものに変更する以外は、実施例1と同様にして光半導体装置を作製した。
ガラス(平均粒子径5μm)に、該無機材料の重量が20重量%となるように、バインダー樹脂としてのポリビニルアルコールを添加し、さらにイソプロピルアルコールを適量添加して、スラリー状溶液を調製した。次いで、得られたスラリー状溶液を成形後、焼結後の厚みが35μmになるように、800℃で5時間加熱焼結して、無機高熱伝導層を作製した。なお、得られた無機高熱伝導層は、十分に冷めた後に、抜型成形装置を用いて8mm×8mmサイズに切断加工した。
実施例1において、封止樹脂層に溶融シリカ粒子を配合しない以外は、実施例1と同様にして光半導体装置を作製した。
実施例2において、封止樹脂層に溶融シリカ粒子を配合しない以外は、実施例2と同様にして光半導体装置を作製した。
実施例1において、無機高熱伝導層の厚みを500μmから300μmに変更する以外は、実施例1と同様にして光半導体装置を作製した。
実施例1において、無機高熱伝導層を使用しない以外は、実施例1と同様にして光半導体装置を作製した。
実施例1において、無機高熱伝導層を用いるかわりに、以下に示す低熱伝導層に変更する以外は、実施例1と同様にして光半導体装置を作製した。
市販のシリコーンエラストマー(LR7665)を、PETフィルム(厚み50μm)の上に、アプリケーターを用いて厚み100μmに塗工し、150℃で5分加熱することにより成形した後、抜型成形装置を用いて、8mm×8mmサイズ(厚み約100μm)の小片に切り出して、無機低熱伝導層とした。
実施例1において、無機高熱伝導層及び波長変換層を使用しない以外は、実施例1と同様にして光半導体装置(封止樹脂層のみを有する光半導体装置)を作製した。
非接触放射温度計(株式会社チノー製)を用いて、投入電流1Aにおける光半導体装置の最大温度を測定した。
瞬間マルチ測光システム(MCPD-3000、大塚電子社製)を用いて、投入電流1Aにおける光半導体装置の刺激値Y、XYZ表色系におけるxy色度図(CIE1931)を測定した。刺激値Yは、光半導体装置の輝度の指標であり、投入電流1Aにおいては、18000以上であると輝度に優れることを示す。
紫外可視スペクトル測定器(U4100、日立社製)を用いて、波長560nmに対する光透過率を測定して、光透過性を評価した。
2 LEDチップを埋設可能な封止樹脂層
3 無機高熱伝導層
4 無機蛍光体粉末を含有する波長変換層
5 凹型金型
Claims (1)
- 凹型金型内に、波長変換層と厚みが10〜1000μmである無機高熱伝導層をこの順に形成し、該無機高熱伝導層の上に封止樹脂を充填後、LEDチップが実装された基板を該封止樹脂内に埋設して、封止加工することを特徴とする、光半導体装置の製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010279496A JP5733743B2 (ja) | 2010-12-15 | 2010-12-15 | 光半導体装置 |
TW100146018A TWI508335B (zh) | 2010-12-15 | 2011-12-13 | 光學半導體裝置 |
US13/325,850 US8492791B2 (en) | 2010-12-15 | 2011-12-14 | Optical semiconductor device |
EP11193382.6A EP2466657A3 (en) | 2010-12-15 | 2011-12-14 | LED package |
CN2011104168544A CN102544312A (zh) | 2010-12-15 | 2011-12-14 | 光学半导体器件 |
KR1020110135467A KR20120067309A (ko) | 2010-12-15 | 2011-12-15 | 광반도체 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010279496A JP5733743B2 (ja) | 2010-12-15 | 2010-12-15 | 光半導体装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015046715A Division JP2015144301A (ja) | 2015-03-10 | 2015-03-10 | 光半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012129361A JP2012129361A (ja) | 2012-07-05 |
JP5733743B2 true JP5733743B2 (ja) | 2015-06-10 |
Family
ID=45217408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010279496A Expired - Fee Related JP5733743B2 (ja) | 2010-12-15 | 2010-12-15 | 光半導体装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8492791B2 (ja) |
EP (1) | EP2466657A3 (ja) |
JP (1) | JP5733743B2 (ja) |
KR (1) | KR20120067309A (ja) |
CN (1) | CN102544312A (ja) |
TW (1) | TWI508335B (ja) |
Families Citing this family (18)
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US20130016494A1 (en) * | 2010-01-11 | 2013-01-17 | Ingo Speier | Package for light emitting and receiving devices |
JP5751154B2 (ja) | 2011-12-14 | 2015-07-22 | 豊田合成株式会社 | 発光装置及びその製造方法 |
JP2013258209A (ja) * | 2012-06-11 | 2013-12-26 | Nitto Denko Corp | 封止シート、発光ダイオード装置およびその製造方法 |
CN104823289B (zh) * | 2012-11-28 | 2019-01-01 | 株式会社Lg化学 | 发光二极管 |
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WO2014104295A1 (ja) * | 2012-12-28 | 2014-07-03 | コニカミノルタ株式会社 | 発光装置 |
JP6081235B2 (ja) * | 2013-03-07 | 2017-02-15 | 株式会社東芝 | 白色発光装置 |
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CN105093776B (zh) * | 2014-05-13 | 2020-08-25 | 深圳光峰科技股份有限公司 | 波长转换装置、光源***及投影*** |
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US11121301B1 (en) | 2017-06-19 | 2021-09-14 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with cap wafers and their methods of manufacture |
CN111370563A (zh) * | 2018-12-25 | 2020-07-03 | 弗洛里光电材料(苏州)有限公司 | 复合荧光胶膜及其应用 |
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JP2010279496A (ja) | 2009-06-03 | 2010-12-16 | Fujifilm Corp | データ転送システム、送信装置、受信装置、放射線画像転送システム、および放射線画像診断システム |
US7855394B2 (en) * | 2009-06-18 | 2010-12-21 | Bridgelux, Inc. | LED array package covered with a highly thermal conductive plate |
-
2010
- 2010-12-15 JP JP2010279496A patent/JP5733743B2/ja not_active Expired - Fee Related
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2011
- 2011-12-13 TW TW100146018A patent/TWI508335B/zh not_active IP Right Cessation
- 2011-12-14 CN CN2011104168544A patent/CN102544312A/zh active Pending
- 2011-12-14 EP EP11193382.6A patent/EP2466657A3/en not_active Withdrawn
- 2011-12-14 US US13/325,850 patent/US8492791B2/en not_active Expired - Fee Related
- 2011-12-15 KR KR1020110135467A patent/KR20120067309A/ko not_active Application Discontinuation
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JP2012129361A (ja) | 2012-07-05 |
CN102544312A (zh) | 2012-07-04 |
TW201232856A (en) | 2012-08-01 |
KR20120067309A (ko) | 2012-06-25 |
US20120153345A1 (en) | 2012-06-21 |
EP2466657A2 (en) | 2012-06-20 |
TWI508335B (zh) | 2015-11-11 |
EP2466657A3 (en) | 2015-10-07 |
US8492791B2 (en) | 2013-07-23 |
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