JP5730747B2 - 渦電流センサ並びに研磨方法および装置 - Google Patents
渦電流センサ並びに研磨方法および装置 Download PDFInfo
- Publication number
- JP5730747B2 JP5730747B2 JP2011257130A JP2011257130A JP5730747B2 JP 5730747 B2 JP5730747 B2 JP 5730747B2 JP 2011257130 A JP2011257130 A JP 2011257130A JP 2011257130 A JP2011257130 A JP 2011257130A JP 5730747 B2 JP5730747 B2 JP 5730747B2
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- JP
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- Prior art keywords
- coil
- sensor
- polishing
- eddy current
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims description 85
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
- B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
- G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
- G01N27/9006—Details, e.g. in the structure or functioning of sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011257130A JP5730747B2 (ja) | 2010-12-10 | 2011-11-25 | 渦電流センサ並びに研磨方法および装置 |
TW100144582A TWI592254B (zh) | 2010-12-10 | 2011-12-05 | 渦電流檢測器及研磨方法,以及其裝置 |
KR1020110130426A KR101661279B1 (ko) | 2010-12-10 | 2011-12-07 | 와전류 센서 및 연마 방법 및 장치 |
US13/313,407 US8657644B2 (en) | 2009-07-16 | 2011-12-07 | Eddy current sensor and polishing method and apparatus |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010275310 | 2010-12-10 | ||
JP2010275310 | 2010-12-10 | ||
JP2011257130A JP5730747B2 (ja) | 2010-12-10 | 2011-11-25 | 渦電流センサ並びに研磨方法および装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012135865A JP2012135865A (ja) | 2012-07-19 |
JP5730747B2 true JP5730747B2 (ja) | 2015-06-10 |
Family
ID=46673747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011257130A Active JP5730747B2 (ja) | 2009-07-16 | 2011-11-25 | 渦電流センサ並びに研磨方法および装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5730747B2 (ko) |
KR (1) | KR101661279B1 (ko) |
TW (1) | TWI592254B (ko) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5894833B2 (ja) * | 2012-03-30 | 2016-03-30 | 株式会社荏原製作所 | 渦電流センサ並びに研磨方法および装置 |
JP6027430B2 (ja) * | 2012-12-20 | 2016-11-16 | 日野自動車株式会社 | 往復動摩耗試験中の油膜厚測定方法 |
KR102326730B1 (ko) * | 2014-03-12 | 2021-11-17 | 가부시키가이샤 에바라 세이사꾸쇼 | 막 두께 측정값의 보정 방법, 막 두께 보정기 및 와전류 센서 |
JP6451262B2 (ja) * | 2014-11-28 | 2019-01-16 | 日立金属株式会社 | 磁石特性測定方法及び磁石特性測定装置 |
JP6590612B2 (ja) * | 2015-09-16 | 2019-10-16 | 株式会社荏原製作所 | 渦電流センサ |
TW201710029A (zh) | 2015-09-01 | 2017-03-16 | Ebara Corp | 渦電流檢測器 |
US10160089B2 (en) | 2015-10-01 | 2018-12-25 | Ebara Corporation | Polishing apparatus |
JP2017064899A (ja) | 2015-10-01 | 2017-04-06 | 株式会社荏原製作所 | 研磨装置 |
JP6779633B2 (ja) | 2016-02-23 | 2020-11-04 | 株式会社荏原製作所 | 研磨装置 |
US10788456B2 (en) | 2017-07-21 | 2020-09-29 | Industry-Academic Cooperation Foundation, Chosun University | Eddy current inspection device for nondestructive testing |
JP7141204B2 (ja) | 2017-10-19 | 2022-09-22 | 株式会社荏原製作所 | 研磨装置、及び研磨方法 |
JP7083279B2 (ja) * | 2018-06-22 | 2022-06-10 | 株式会社荏原製作所 | 渦電流センサの軌道を特定する方法、基板の研磨の進行度を算出する方法、基板研磨装置の動作を停止する方法および基板研磨の進行度を均一化する方法、これらの方法を実行するためのプログラムならびに当該プログラムが記録された非一過性の記録媒体 |
JP2020053550A (ja) | 2018-09-27 | 2020-04-02 | 株式会社荏原製作所 | 研磨装置、研磨方法、及び機械学習装置 |
JP7291558B2 (ja) * | 2019-07-03 | 2023-06-15 | 株式会社荏原製作所 | 渦電流センサ |
CN114367919A (zh) * | 2020-10-14 | 2022-04-19 | 长鑫存储技术有限公司 | 研磨控制方法、装置及存储介质 |
US20220281060A1 (en) * | 2021-03-03 | 2022-09-08 | Applied Materials, Inc. | Pressure signals with different frequencies during friction monitoring to provide spatial resolution |
CN114184670B (zh) * | 2021-12-14 | 2023-11-14 | 蚌埠中光电科技有限公司 | 一种tft-lcd、ltps玻璃铂金通道涡流检测装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5748404U (ko) * | 1980-09-04 | 1982-03-18 | ||
JP4451111B2 (ja) * | 2003-10-20 | 2010-04-14 | 株式会社荏原製作所 | 渦電流センサ |
JP4390614B2 (ja) * | 2004-01-16 | 2009-12-24 | 株式会社アルバック | 膜厚測定装置 |
JP4817687B2 (ja) | 2005-03-18 | 2011-11-16 | 株式会社荏原製作所 | 研磨装置 |
DE102006025356A1 (de) * | 2006-05-31 | 2007-12-06 | Siemens Ag | Verfahren zum Bestimmen der Schichtdicke einer elektrisch leitfähigen Beschichtung auf einem elektrisch leitfähigen Substrat |
TWI572441B (zh) * | 2008-08-05 | 2017-03-01 | 荏原製作所股份有限公司 | 硏磨方法及裝置 |
-
2011
- 2011-11-25 JP JP2011257130A patent/JP5730747B2/ja active Active
- 2011-12-05 TW TW100144582A patent/TWI592254B/zh active
- 2011-12-07 KR KR1020110130426A patent/KR101661279B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2012135865A (ja) | 2012-07-19 |
TW201236812A (en) | 2012-09-16 |
KR101661279B1 (ko) | 2016-09-29 |
TWI592254B (zh) | 2017-07-21 |
KR20120065243A (ko) | 2012-06-20 |
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