JP5711783B2 - Substrate coating agent - Google Patents
Substrate coating agent Download PDFInfo
- Publication number
- JP5711783B2 JP5711783B2 JP2013121032A JP2013121032A JP5711783B2 JP 5711783 B2 JP5711783 B2 JP 5711783B2 JP 2013121032 A JP2013121032 A JP 2013121032A JP 2013121032 A JP2013121032 A JP 2013121032A JP 5711783 B2 JP5711783 B2 JP 5711783B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- weight
- resin
- coating agent
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011248 coating agent Substances 0.000 title claims description 120
- 239000000758 substrate Substances 0.000 title claims description 118
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 62
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 39
- 229920005989 resin Polymers 0.000 claims description 39
- 239000004925 Acrylic resin Substances 0.000 claims description 31
- 229920000178 Acrylic resin Polymers 0.000 claims description 31
- 239000003086 colorant Substances 0.000 claims description 15
- 239000002562 thickening agent Substances 0.000 claims description 15
- 239000002904 solvent Substances 0.000 claims description 14
- 239000002518 antifoaming agent Substances 0.000 claims description 13
- 239000004417 polycarbonate Substances 0.000 claims description 10
- 229920000515 polycarbonate Polymers 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 239000000654 additive Substances 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 4
- 239000012736 aqueous medium Substances 0.000 claims description 3
- 230000003020 moisturizing effect Effects 0.000 claims description 3
- 238000000576 coating method Methods 0.000 description 59
- 239000010408 film Substances 0.000 description 55
- 238000003756 stirring Methods 0.000 description 30
- 239000000178 monomer Substances 0.000 description 22
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 21
- 238000009775 high-speed stirring Methods 0.000 description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 20
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 19
- -1 carbonate compound Chemical class 0.000 description 19
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 18
- 238000000034 method Methods 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 16
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 15
- 239000003755 preservative agent Substances 0.000 description 15
- 230000002335 preservative effect Effects 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 239000000243 solution Substances 0.000 description 13
- 239000002253 acid Substances 0.000 description 11
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- 238000007747 plating Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- 230000003628 erosive effect Effects 0.000 description 8
- 229920005862 polyol Polymers 0.000 description 8
- 150000003077 polyols Chemical class 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 239000003513 alkali Substances 0.000 description 7
- 150000002009 diols Chemical class 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000002202 Polyethylene glycol Substances 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 229920001223 polyethylene glycol Polymers 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 229940113115 polyethylene glycol 200 Drugs 0.000 description 5
- 230000002265 prevention Effects 0.000 description 5
- 230000001846 repelling effect Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- 239000004970 Chain extender Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- 239000004909 Moisturizer Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 125000000129 anionic group Chemical group 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000001333 moisturizer Effects 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 3
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 238000004945 emulsification Methods 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 3
- 239000003906 humectant Substances 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920005906 polyester polyol Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 2
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical class OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 description 2
- 229920006243 acrylic copolymer Polymers 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- INSRQEMEVAMETL-UHFFFAOYSA-N decane-1,1-diol Chemical compound CCCCCCCCCC(O)O INSRQEMEVAMETL-UHFFFAOYSA-N 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- GTZOYNFRVVHLDZ-UHFFFAOYSA-N dodecane-1,1-diol Chemical compound CCCCCCCCCCCC(O)O GTZOYNFRVVHLDZ-UHFFFAOYSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000007720 emulsion polymerization reaction Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- MHIBEGOZTWERHF-UHFFFAOYSA-N heptane-1,1-diol Chemical compound CCCCCCC(O)O MHIBEGOZTWERHF-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 125000003010 ionic group Chemical group 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002609 medium Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- FVXBCDWMKCEPCL-UHFFFAOYSA-N nonane-1,1-diol Chemical compound CCCCCCCCC(O)O FVXBCDWMKCEPCL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- NWPIOULNZLJZHU-UHFFFAOYSA-N (1,2,2,6,6-pentamethylpiperidin-4-yl) 2-methylprop-2-enoate Chemical compound CN1C(C)(C)CC(OC(=O)C(C)=C)CC1(C)C NWPIOULNZLJZHU-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- OZCMOJQQLBXBKI-UHFFFAOYSA-N 1-ethenoxy-2-methylpropane Chemical compound CC(C)COC=C OZCMOJQQLBXBKI-UHFFFAOYSA-N 0.000 description 1
- XXCVIFJHBFNFBO-UHFFFAOYSA-N 1-ethenoxyoctane Chemical compound CCCCCCCCOC=C XXCVIFJHBFNFBO-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-Tetramethylpiperidine Substances CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 1
- GWCJNVUIVCCXER-UHFFFAOYSA-N 2-(1-phenylprop-2-enoxymethyl)oxirane Chemical compound C=1C=CC=CC=1C(C=C)OCC1CO1 GWCJNVUIVCCXER-UHFFFAOYSA-N 0.000 description 1
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- LQZDDWKUQKQXGC-UHFFFAOYSA-N 2-(2-methylprop-2-enoxymethyl)oxirane Chemical compound CC(=C)COCC1CO1 LQZDDWKUQKQXGC-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- SJIXRGNQPBQWMK-UHFFFAOYSA-N 2-(diethylamino)ethyl 2-methylprop-2-enoate Chemical compound CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- XHZPRMZZQOIPDS-UHFFFAOYSA-N 2-Methyl-2-[(1-oxo-2-propenyl)amino]-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(C)(C)NC(=O)C=C XHZPRMZZQOIPDS-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- IXPWKHNDQICVPZ-UHFFFAOYSA-N 2-methylhex-1-en-3-yne Chemical compound CCC#CC(C)=C IXPWKHNDQICVPZ-UHFFFAOYSA-N 0.000 description 1
- BTVWZWFKMIUSGS-UHFFFAOYSA-N 2-methylpropane-1,2-diol Chemical compound CC(C)(O)CO BTVWZWFKMIUSGS-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- QZWKEPYTBWZJJA-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine-4,4'-diisocyanate Chemical compound C1=C(N=C=O)C(OC)=CC(C=2C=C(OC)C(N=C=O)=CC=2)=C1 QZWKEPYTBWZJJA-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- SBVKVAIECGDBTC-UHFFFAOYSA-N 4-hydroxy-2-methylidenebutanamide Chemical compound NC(=O)C(=C)CCO SBVKVAIECGDBTC-UHFFFAOYSA-N 0.000 description 1
- YKXAYLPDMSGWEV-UHFFFAOYSA-N 4-hydroxybutyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCO YKXAYLPDMSGWEV-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UNXHWFMMPAWVPI-QWWZWVQMSA-N D-Threitol Natural products OC[C@@H](O)[C@H](O)CO UNXHWFMMPAWVPI-QWWZWVQMSA-N 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- 206010059866 Drug resistance Diseases 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229920005692 JONCRYL® Polymers 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- IIGAAOXXRKTFAM-UHFFFAOYSA-N N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C Chemical compound N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C IIGAAOXXRKTFAM-UHFFFAOYSA-N 0.000 description 1
- HDONYZHVZVCMLR-UHFFFAOYSA-N N=C=O.N=C=O.CC1CCCCC1 Chemical compound N=C=O.N=C=O.CC1CCCCC1 HDONYZHVZVCMLR-UHFFFAOYSA-N 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- MBOZGLMBKQFIBB-UHFFFAOYSA-N N=C=O.OP(O)(=S)OC1=CC=CC=C1 Chemical compound N=C=O.OP(O)(=S)OC1=CC=CC=C1 MBOZGLMBKQFIBB-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920007962 Styrene Methyl Methacrylate Polymers 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 1
- ISCIXAIEDTZJCQ-UHFFFAOYSA-M [4-[[4-(dimethylamino)phenyl]-phenylmethylidene]cyclohexa-2,5-dien-1-ylidene]-dimethylazanium;2-hydroxy-2-oxoacetate;oxalic acid Chemical compound OC(=O)C(O)=O.OC(=O)C([O-])=O.C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 ISCIXAIEDTZJCQ-UHFFFAOYSA-M 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 125000005233 alkylalcohol group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- DFYKHEXCUQCPEB-UHFFFAOYSA-N butyl 2-methylprop-2-enoate;styrene Chemical compound C=CC1=CC=CC=C1.CCCCOC(=O)C(C)=C DFYKHEXCUQCPEB-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- MYWGVEGHKGKUMM-UHFFFAOYSA-N carbonic acid;ethene Chemical compound C=C.C=C.OC(O)=O MYWGVEGHKGKUMM-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- ZXJXZNDDNMQXFV-UHFFFAOYSA-M crystal violet Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1[C+](C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 ZXJXZNDDNMQXFV-UHFFFAOYSA-M 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- ARUKYTASOALXFG-UHFFFAOYSA-N cycloheptylcycloheptane Chemical compound C1CCCCCC1C1CCCCCC1 ARUKYTASOALXFG-UHFFFAOYSA-N 0.000 description 1
- PDXRQENMIVHKPI-UHFFFAOYSA-N cyclohexane-1,1-diol Chemical compound OC1(O)CCCCC1 PDXRQENMIVHKPI-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- LDCRTTXIJACKKU-ONEGZZNKSA-N dimethyl fumarate Chemical compound COC(=O)\C=C\C(=O)OC LDCRTTXIJACKKU-ONEGZZNKSA-N 0.000 description 1
- 229960004419 dimethyl fumarate Drugs 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- LZWYWAIOTBEZFN-UHFFFAOYSA-N ethenyl hexanoate Chemical compound CCCCCC(=O)OC=C LZWYWAIOTBEZFN-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 239000003349 gelling agent Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- GJIDOLBZYSCZRX-UHFFFAOYSA-N hydroxymethyl prop-2-enoate Chemical compound OCOC(=O)C=C GJIDOLBZYSCZRX-UHFFFAOYSA-N 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- DFENKTCEEGOWLB-UHFFFAOYSA-N n,n-bis(methylamino)-2-methylidenepentanamide Chemical compound CCCC(=C)C(=O)N(NC)NC DFENKTCEEGOWLB-UHFFFAOYSA-N 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- UTSYWKJYFPPRAP-UHFFFAOYSA-N n-(butoxymethyl)prop-2-enamide Chemical compound CCCCOCNC(=O)C=C UTSYWKJYFPPRAP-UHFFFAOYSA-N 0.000 description 1
- ULYOZOPEFCQZHH-UHFFFAOYSA-N n-(methoxymethyl)prop-2-enamide Chemical compound COCNC(=O)C=C ULYOZOPEFCQZHH-UHFFFAOYSA-N 0.000 description 1
- QNILTEGFHQSKFF-UHFFFAOYSA-N n-propan-2-ylprop-2-enamide Chemical compound CC(C)NC(=O)C=C QNILTEGFHQSKFF-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 1
- AQFWNELGMODZGC-UHFFFAOYSA-N o-ethylhydroxylamine Chemical group CCON AQFWNELGMODZGC-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 150000002897 organic nitrogen compounds Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- AZIQALWHRUQPHV-UHFFFAOYSA-N prop-2-eneperoxoic acid Chemical compound OOC(=O)C=C AZIQALWHRUQPHV-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- RWVGQQGBQSJDQV-UHFFFAOYSA-M sodium;3-[[4-[(e)-[4-(4-ethoxyanilino)phenyl]-[4-[ethyl-[(3-sulfonatophenyl)methyl]azaniumylidene]-2-methylcyclohexa-2,5-dien-1-ylidene]methyl]-n-ethyl-3-methylanilino]methyl]benzenesulfonate Chemical compound [Na+].C1=CC(OCC)=CC=C1NC1=CC=C(C(=C2C(=CC(C=C2)=[N+](CC)CC=2C=C(C=CC=2)S([O-])(=O)=O)C)C=2C(=CC(=CC=2)N(CC)CC=2C=C(C=CC=2)S([O-])(=O)=O)C)C=C1 RWVGQQGBQSJDQV-UHFFFAOYSA-M 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- UJMBCXLDXJUMFB-GLCFPVLVSA-K tartrazine Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)C1=NN(C=2C=CC(=CC=2)S([O-])(=O)=O)C(=O)C1\N=N\C1=CC=C(S([O-])(=O)=O)C=C1 UJMBCXLDXJUMFB-GLCFPVLVSA-K 0.000 description 1
- 239000004149 tartrazine Substances 0.000 description 1
- 235000012756 tartrazine Nutrition 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N tolylenediamine group Chemical group CC1=C(C=C(C=C1)N)N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
- C09D125/02—Homopolymers or copolymers of hydrocarbons
- C09D125/04—Homopolymers or copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
Description
本発明は基板コーティング剤に関し、より詳細には金属基板や銅張積層基板などの回路用基板（以下、基板と記す）の端面や該端面を含む周縁部などに塗布され、基板に塗布された部分を回路加工の際に使用される各種薬剤から保護することのできる基板コーティング剤に関する。 The present invention relates to a substrate coating agent. More specifically, the present invention is applied to an end surface of a circuit substrate (hereinafter referred to as a substrate) such as a metal substrate or a copper-clad laminated substrate, a peripheral portion including the end surface, and the like. The present invention relates to a substrate coating agent capable of protecting a portion from various chemicals used in circuit processing.
アルミニウム板などの金属板をベースにした基板（金属基板）は、放熱性や機械的強度に優れ、また重量部品の搭載が可能であり、電流容量を大きくできるという特徴がある。このような金属基板にエッチング処理などを施す回路加工では、酸やアルカリの薬剤が使用される。これら薬剤による金属基板の端面部分の浸食を防止するために、従来は金属基板の端面部分に浸食防止用テープを手作業で貼り、エッチング処理等を行った後に前記金属基板から浸食防止用テープを手作業ではがしていた。かかる方法では、前記浸食防止用テープ代が高く付くとともに、手作業のために人件費も高く付いていた。また作業効率も低いという課題があった。 A substrate (metal substrate) based on a metal plate such as an aluminum plate is excellent in heat dissipation and mechanical strength, can be equipped with heavy components, and has a feature that current capacity can be increased. In circuit processing in which an etching process or the like is performed on such a metal substrate, acid or alkali chemicals are used. In order to prevent erosion of the end surface portion of the metal substrate by these chemicals, conventionally, an erosion prevention tape is manually attached to the end surface portion of the metal substrate, and after the etching process or the like, the erosion prevention tape is applied from the metal substrate. It was peeled off manually. In such a method, the cost of the tape for erosion prevention is high, and the labor cost is high due to manual work. There was also a problem that work efficiency was low.
また、電子部品の実装用基板としては、上記金属基板の他、ガラスエポキシ部材を使用したプリント基板（いわゆるガラエポ基板）が広く使用されている。ガラエポ基板はガラス繊維布を重ねたものにエポキシ樹脂を含浸させたものであるため、ガラエポ基板を切断すると、エポキシ樹脂又はガラス繊維からなる細かい塵埃が発生する。このような細かい塵埃は基板回路の接触不良や品位の低下などを引き起こすおそれがある。そのため、基板の切断製造時に生じた塵埃は除去しておく必要がある。 Moreover, as a substrate for mounting electronic components, in addition to the metal substrate, a printed circuit board (so-called glass epoxy substrate) using a glass epoxy member is widely used. Since the glass epoxy substrate is obtained by impregnating an epoxy resin with a glass fiber cloth piled up, fine dust made of epoxy resin or glass fiber is generated when the glass epoxy substrate is cut. Such fine dust may cause poor contact of the circuit board and deterioration of the quality. Therefore, it is necessary to remove dust generated during the cutting and manufacturing of the substrate.
下記の特許文献１には、基板端面から発生する切断粉の飛散を防止するために、基板端面に紫外線硬化樹脂をコーティングし、紫外線照射により樹脂を硬化させる技術が開示されている。 Patent Document 1 below discloses a technique in which an ultraviolet curable resin is coated on the substrate end surface and the resin is cured by ultraviolet irradiation in order to prevent scattering of cutting powder generated from the substrate end surface.
また、下記の特許文献２には、回路加工時に使用する酸やアルカリによって金属板が侵されるのを防止するために、金属板ベースの基板の端面に紫外線硬化型樹脂を塗布し、紫外線照射により樹脂を硬化させることで、端面封止の効率を高める（熱硬化型よりも硬化時間を短縮する）技術が開示されている。 In addition, in Patent Document 2 below, in order to prevent the metal plate from being attacked by an acid or alkali used at the time of circuit processing, an ultraviolet curable resin is applied to the end surface of the metal plate base substrate, and ultraviolet irradiation is performed. A technique for improving the efficiency of end face sealing by curing the resin (shortening the curing time as compared with the thermosetting type) is disclosed.
一方、電子機器の薄形化や小型化に対応させるために、近年、厚みが数十μｍ〜数百μｍ程度の薄形の銅張積層基板（パッケージ基板とも言う）の需要が高まってきている。このような薄形基板に対しては、基板端面を保護するための樹脂を上記のように基板端面にのみ塗布することは容易ではなく、基板の端面を含む周縁部に、例えば額縁状に塗布するような形態が考えられる。 On the other hand, in order to cope with the thinning and miniaturization of electronic devices, in recent years, there has been an increasing demand for thin copper-clad laminates (also referred to as package substrates) having a thickness of several tens to several hundreds of μm. . For such a thin substrate, it is not easy to apply the resin for protecting the end surface of the substrate only to the end surface of the substrate as described above. For example, it is applied to the peripheral portion including the end surface of the substrate in a frame shape. Such a form is conceivable.
基板自体が非常に薄い場合、額縁状の塗膜を形成した基板を重ねた際に嵩張りやたわみが生じないように塗膜の厚さを十分に薄くしなければならない。また重ねた基板の取り扱いを容易なものにするためには、塗膜同士の剥離性が良好でなければならない。さらに薄い塗膜であっても回路加工で使用される酸やアルカリに対する十分な薬剤耐性を有していなければならない。これらの特性、すなわち、塗膜を薄く均一に形成することが容易で、硬化後の塗膜同士の剥離性が良好で、しかも薬剤耐性に優れるといった特性を満たすコーティング剤が開発されていないという課題があった。 When the substrate itself is very thin, the thickness of the coating film must be sufficiently reduced so that bulkiness and deflection do not occur when the substrates on which the frame-shaped coating film is formed are stacked. In addition, in order to facilitate handling of the stacked substrates, the peelability between the coating films must be good. Furthermore, even a thin coating film must have sufficient chemical resistance to acids and alkalis used in circuit processing. The problem that a coating agent that satisfies these characteristics, that is, it is easy to form a coating film thinly and uniformly, has good peeling properties between cured coating films, and has excellent drug resistance has not been developed. was there.
本発明は上記課題に鑑みなされたものであって、基板に塗膜を薄く均一に形成することが容易で、硬化後の塗膜同士の剥離性が良好で、かつ酸やアルカリなどの薬剤耐性に優れた基板コーティング剤を提供することを目的としている。 The present invention has been made in view of the above problems, and it is easy to form a thin film uniformly on a substrate, the peelability between cured films is good, and resistance to chemicals such as acid and alkali An object of the present invention is to provide an excellent substrate coating agent.
上記目的を達成するために、本発明者らが鋭意研究を重ねた結果、ウレタン樹脂、スチレン樹脂及び増粘剤を含有する基板コーティング液が、酸やアルカリなどの薬剤耐性に優れ、ハジキなどの塗膜欠陥が発生しにくく基板に塗膜を薄く均一に形成することが容易であり、かつ硬化後の塗膜同士の剥離性が良好であることを見出し、本発明を完成するに至った。 In order to achieve the above object, the present inventors have conducted extensive research. As a result, the substrate coating solution containing a urethane resin, a styrene resin, and a thickener is excellent in chemical resistance such as acid and alkali, It has been found that coating film defects are less likely to occur and it is easy to form a thin and uniform coating film on a substrate and that the cured coating films have good peelability, and the present invention has been completed.
すなわち、本発明に係る基板コーティング剤（１）は、溶剤に対し、ウレタン樹脂、スチレン樹脂及び増粘剤を含有し、前記溶剤が水系媒体であり、前記ウレタン樹脂、前記スチレン樹脂及び前記増粘剤が水性樹脂であることを特徴としている。 That is, the substrate coating agent (1) according to the present invention contains a urethane resin, a styrene resin, and a thickening agent with respect to the solvent, the solvent is an aqueous medium, and the urethane resin, the styrene resin, and the thickening agent. The agent is an aqueous resin .
上記基板コーティング剤（１）によれば、強酸性や強アルカリ性の薬剤耐性に優れ、ハジキなどの塗膜欠陥が発生しにくく基板に塗膜を薄く均一に形成することが容易であり、かつ硬化後の塗膜同士の剥離性が良好で、基板同士が引っ付くこともなく、コーティング後の基板の取り扱いを良好なものとすることができる。
したがって、上記基板コーティング剤を基板の端面や端面を含む周縁部に塗布することにより、その後の回路加工の際に基板端部から異物（塵埃等）が発生することを防止でき、基板の強度も高めることができる。また、基板端部をエッチング溶液やめっき溶液などから保護（基板の浸食を防止）することができ、従来使用していた浸食防止用テープなどを用いる必要がなくなり、加工コストを削減することができる。また、硬化後の塗膜同士の剥離性が良好であり、塗膜が形成された基板同士を重ねた場合でも、基板同士が塗膜部分で引っ付くこともなく、基板の取り扱い性を良好なものとすることができる。
また、前記溶剤が水系媒体（例えば水、又は水を主体とする媒体）であり、前記ウレタン樹脂、前記スチレン樹脂及び前記増粘剤が水性樹脂（例えば水性エマルジョン樹脂など）であるので、取り扱いが容易であり、安全性及び環境面に優れたものとすることができる。
According to the substrate coating agent (1), it has excellent resistance to strong acidic and strong alkaline chemicals, is less likely to cause coating film defects such as repelling, and can easily form a thin and uniform coating on the substrate, and is cured. The peelability between the subsequent coating films is good, the substrates are not attracted to each other, and the handling of the substrate after coating can be made good.
Therefore, by applying the substrate coating agent to the edge surface of the substrate or the peripheral portion including the end surface, foreign matter (dust etc.) can be prevented from being generated from the substrate edge during subsequent circuit processing, and the strength of the substrate can also be increased. Can be increased. Further, the edge of the substrate can be protected from the etching solution or plating solution (preventing erosion of the substrate), so that it is not necessary to use a tape for erosion prevention that has been conventionally used, and processing costs can be reduced. . Moreover, the peelability between the coating films after curing is good, and even when the substrates on which the coating films are formed are stacked, the substrates do not get stuck at the coating film portions, and the handling properties of the substrates are good. Can be.
In addition, since the solvent is an aqueous medium (for example, water or a medium mainly composed of water), and the urethane resin, the styrene resin, and the thickener are aqueous resins (for example, an aqueous emulsion resin), handling is easy. It is easy and can be excellent in safety and environmental aspects.
また本発明に係る基板コーティング剤（２）は、上記基板コーティング剤（１）において、前記ウレタン樹脂が、ポリカーボネート構造を有するウレタン樹脂を含有していることを特徴としている。 The substrate coating agent (2) according to the present invention is characterized in that, in the substrate coating agent (1), the urethane resin contains a urethane resin having a polycarbonate structure.
上記基板コーティング剤（２）によれば、前記ウレタン樹脂が、ポリカーボネート構造を有するウレタン樹脂を含有しているので、塗膜の耐久性を高めることができ、強酸性や強アルカリ性の薬剤耐性に非常に優れたコーティング剤とすることができる。 According to the said substrate coating agent (2), since the said urethane resin contains the urethane resin which has a polycarbonate structure, durability of a coating film can be improved and it is very resistant to a strong acidity or a strong alkaline chemical resistance. It can be set as the coating agent excellent in.
また本発明に係る基板コーティング剤（３）は、上記基板コーティング剤（１）又は（２）において、前記ウレタン樹脂が５〜３５質量％、前記スチレン樹脂が１〜１０質量％、前記増粘剤としてアクリル樹脂が０．１〜３質量％含まれていることを特徴としている。 The substrate coating agent (3) according to the present invention is the substrate coating agent (1) or (2), wherein the urethane resin is 5 to 35% by mass, the styrene resin is 1 to 10% by mass, and the thickener. It is characterized by containing 0.1 to 3% by mass of an acrylic resin.
上記基板コーティング剤（３）によれば、比較的粘度の高いものから低粘度のものであっても、上記した基板コーティング剤（１）の効果を発揮することができ、また前記増粘剤としてアクリル樹脂を含むことで、塗膜の強度を高めることができる。 According to the substrate coating agent (3), the effect of the substrate coating agent (1) can be exhibited even when the viscosity is relatively high to low, and as the thickener, By including the acrylic resin, the strength of the coating film can be increased.
また本発明に係る基板コーティング剤（４）は、上記基板コーティング剤（１）〜（３）のいずれかにおいて、さらに添加剤として保湿剤、濡れ性向上剤及び消泡剤のうちの少なくともいずれか一つを含有していることを特徴としている。 The substrate coating agent ( 4 ) according to the present invention is any one of the substrate coating agents (1) to ( 3 ), and further includes at least one of a moisturizing agent, a wettability improving agent and an antifoaming agent as an additive. It is characterized by containing one.
上記基板コーティング剤（４）によれば、前記添加剤により基板コーティング剤の性能をさらに向上させることができる。前記保湿剤を含むことにより塗膜の乾燥中及び乾燥後における塗膜のひび割れ等を防止する効果を高めることができる。また、前記濡れ性向上剤を含むことにより基板表面に対する濡れ性が高められ、塗布時の基板上でのハジキを防止することができ、塗布性を良好なものにすることができる。また前記消泡剤を含むことにより塗膜表面に気泡が生じるのを防止することができ、塗膜の泡痕の発生が防止でき、塗膜面の平滑性を高めることができる。 According to the said substrate coating agent ( 4 ), the performance of a substrate coating agent can further be improved with the said additive. By including the moisturizing agent, the effect of preventing cracking of the coating film during and after drying of the coating film can be enhanced. Moreover, the wettability with respect to a substrate surface is improved by containing the said wettability improvement agent, the repellency on the board | substrate at the time of application | coating can be prevented, and applicability | paintability can be made favorable. Moreover, it can prevent that a bubble produces on the coating-film surface by containing the said antifoamer, generation | occurrence | production of the bubble trace of a coating film can be prevented, and the smoothness of a coating-film surface can be improved.
また本発明に係る基板コーティング剤（５）は、上記基板コーティング剤（１）〜（４）のいずれかにおいて、さらに着色剤を含有していることを特徴としている。
上記基板コーティング剤（５）によれば、前記着色剤を含有しているので、基板に塗布された状態の良否などを目視で簡単に確認することができる。
The substrate coating agent ( 5 ) according to the present invention is characterized in that any one of the substrate coating agents (1) to ( 4 ) further contains a colorant.
According to the said substrate coating agent ( 5 ), since the said coloring agent is contained, the quality of the state apply | coated to the board | substrate can be confirmed easily visually.
以下、本発明に係る基板コーティング剤の実施の形態を説明するが、本発明の範囲はこれらの形態に限定されるものではない。
本発明に係る基板コーティング剤は、溶剤に対し、ウレタン樹脂、スチレン樹脂及び増粘剤を含有している。
Hereinafter, although the embodiment of the substrate coating agent concerning the present invention is described, the range of the present invention is not limited to these forms.
The substrate coating agent according to the present invention contains a urethane resin, a styrene resin, and a thickener with respect to the solvent.
本発明に係る基板コーティング剤に用いられるウレタン樹脂は、主鎖に複数のウレタン結合を有するポリマーの総称であり、通常、ポリオールと分子中に複数のイソシアネート基を有する化合物との反応によって得られる。ポリオールとしてはポリカーボネートポリオールまたはポリエステルポリオールが用いられる。 The urethane resin used in the substrate coating agent according to the present invention is a general term for polymers having a plurality of urethane bonds in the main chain, and is usually obtained by a reaction between a polyol and a compound having a plurality of isocyanate groups in the molecule. Polycarbonate polyol or polyester polyol is used as the polyol.
ポリカーボネートポリオールは、例えばカーボネート化合物とジオールとを反応させることにより得ることができる。カーボネート化合物としてはジメチルカーボネート、ジエチルカーボネート、ジフェニルカーボネート、エチレンカーボネート、ジエチレンカーボネートなどを挙げることができる。ジオールとしては、エチレングリコール、プロピレングリコール、ジエチレングリコール、１，４−ブタンジオール、１，５−ペンタンジオール、ネオペンチルグリコール、３−メチル−１，５−ペンタンジオール、１，６−ヘキサンジオール、ヘプタンジオール、オクタンジオール、ノナンジオール、デカンジオール、ドデカンジオールなどの脂肪族ジオール、シクロヘキサンジオール、水添キシリレングリコールなどの脂環式ジオール、キシリレングリコールなどの芳香族ジオールが挙げられる。 The polycarbonate polyol can be obtained, for example, by reacting a carbonate compound with a diol. Examples of the carbonate compound include dimethyl carbonate, diethyl carbonate, diphenyl carbonate, ethylene carbonate, and diethylene carbonate. Examples of the diol include ethylene glycol, propylene glycol, diethylene glycol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, 1,6-hexanediol, and heptanediol. And aliphatic diols such as octanediol, nonanediol, decanediol and dodecanediol, cycloaliphatic diols, alicyclic diols such as hydrogenated xylylene glycol, and aromatic diols such as xylylene glycol.
また、ポリエステルポリオールは、低分子のジオールとジカルボン酸とを縮合することにより得ることができる。低分子のジオールとしては、エチレングリコール、ジエチレングリコール、プロピレングリコール、ジプロピレングリコール、１，４−ブタンジオールなどが挙げられ、中でもエチレングリコール、プロピレングリコール、１，４−ブタンジオールが好適に用いられる。ジカルボン酸としては、コハク酸、グルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸などの脂肪族二塩基酸、イソフタル酸、テレフタル酸、ナフタレンジカルボン酸などの芳香族二塩基酸を用いることができる。
ポリカーボネートポリオールまたはポリエステルポリオールの分子量について特に制限はないが、通常、数平均分子量で７００〜４０００、より好ましくは１０００〜２５００である。
The polyester polyol can be obtained by condensing a low-molecular diol and a dicarboxylic acid. Examples of the low molecular weight diol include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, and 1,4-butanediol. Among them, ethylene glycol, propylene glycol, and 1,4-butanediol are preferably used. Examples of dicarboxylic acids include aliphatic dibasic acids such as succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, and sebacic acid, and aromatic dibasic acids such as isophthalic acid, terephthalic acid, and naphthalenedicarboxylic acid. Can be used.
Although there is no restriction | limiting in particular about the molecular weight of polycarbonate polyol or polyester polyol, Usually, it is 700-4000 in a number average molecular weight, More preferably, it is 1000-2500.
ポリイソシアネート化合物としては、芳香族、脂肪族及び脂環族のポリイソシアネート化合物が挙げられる。芳香族ジイソシアネート化合物としては、例えば、トリレンジイソシアネート、４，４−ジフェニルメタンジイソシアネート、キシリレンジイソシアネート、１，５−ナフタレンジイソシアネート、トルイジンジイソシアネート、フェニレンジイソシアネート、４，４−ジフェニルジイソシアネート、ジアニシジンジイソシアネート、４，４−ジフェニルエーテルジイソシアネート、トリフェニルメタントリイソシアネート、トリス（イソシアネートフェニール）チオホスフェート、テトラメチルキシレンジイソシアネートなどが挙げられる。脂肪族ジイソシアネート化合物としては、例えば、トリメチルヘキサメチレンジイソシアネート、ヘキサメチレンジイソシアネート、イソホロンジイソシアネート、水添４，４−ジフェニルメタンジイソシアネート、水添キシレンジイソシアネート、リジンジイソシアネート、リジンエステルトリイソシアネート、１，６，１１−ウンデカントリイソシアネート、１，８−ジイソシアネート−４−イソシナネートメチルオクタン、１，３，６−ヘキサメチレントリイソシアネート、ビシクロヘプタントリイイソシアネートなどが挙げられる。脂環族ジイソシアネートとしては、例えば、シクロヘキサンジイソシアネート、メチルシクロヘキサンジイソシアネートなどが挙げられる。これらは単独で用いても、複数種併用してもよい。 Examples of the polyisocyanate compound include aromatic, aliphatic and alicyclic polyisocyanate compounds. Examples of the aromatic diisocyanate compound include tolylene diisocyanate, 4,4-diphenylmethane diisocyanate, xylylene diisocyanate, 1,5-naphthalene diisocyanate, toluidine diisocyanate, phenylene diisocyanate, 4,4-diphenyl diisocyanate, dianisidine diisocyanate, 4, Examples include 4-diphenyl ether diisocyanate, triphenylmethane triisocyanate, tris (isocyanate phenyl) thiophosphate, and tetramethylxylene diisocyanate. Examples of the aliphatic diisocyanate compound include trimethylhexamethylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, hydrogenated 4,4-diphenylmethane diisocyanate, hydrogenated xylene diisocyanate, lysine diisocyanate, lysine ester triisocyanate, 1,6,11-undecane. Examples include triisocyanate, 1,8-diisocyanate-4-isocyanate methyloctane, 1,3,6-hexamethylene triisocyanate, and bicycloheptane triisocyanate. Examples of the alicyclic diisocyanate include cyclohexane diisocyanate and methylcyclohexane diisocyanate. These may be used alone or in combination.
ポリオールとジイソシアネートとの反応物は、必要に応じて鎖伸長剤を用いて、さらに分子量を増加させることができる。鎖伸長剤としては、イソシアネート基と反応性のある活性水素原子を含有する官能基を少なくとも２個含有する化合物を使用することができる。例えば、エチレングリコール、プロピレングリコール、ジエチレングリコール、１，４−ブタンジオール、１，５−ペンタンジオール、ネオペンチルグリコール、３−メチル−１，５−ペンタンジオール、１，６−ヘキサンジオール、ヘプタンジオール、オクタンジオール、ノナンジオール、デカンジオール、ドデカンジオールなどの脂肪族ジオール、シクロヘキサンジオール、脂環式ジオール、芳香族ジオール、エチレンジアミン、プロピレンジアミン、ヘキサメチレンジアミン、トリレンジアミン、キシリレンジアミン、ジフェニルジアミン、ジアミノジフェニルメタンなどのジアミンなどが挙げられる。 The reaction product of polyol and diisocyanate can be further increased in molecular weight by using a chain extender as required. As the chain extender, a compound containing at least two functional groups containing an active hydrogen atom reactive with an isocyanate group can be used. For example, ethylene glycol, propylene glycol, diethylene glycol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, 1,6-hexanediol, heptanediol, octane Aliphatic diols such as diol, nonanediol, decanediol, dodecanediol, cyclohexanediol, cycloaliphatic diol, aromatic diol, ethylenediamine, propylenediamine, hexamethylenediamine, tolylenediamine, xylylenediamine, diphenyldiamine, diaminodiphenylmethane And diamines.
本発明に係る基板コーティング剤におけるポリカーボネート構造を有するウレタン樹脂は、溶剤として有機溶剤を媒体とするものであってもよいが、好ましくは水を媒体とする。ウレタン樹脂を水に分散または溶解させるには、乳化剤を用いる強制乳化型、ウレタン樹脂中に親水性基を導入する自己乳化型あるいは水溶型等がある。特に、ウレタン樹脂の骨格中にイオン基を導入した自己乳化タイプが、液の貯蔵安定性や得られる塗膜の密着性などに優れており好ましい。また、導入するイオン基としては、カルボキシル基、スルホン酸、リン酸、ホスホン酸、第４級アンモニウム塩等、種々のものが挙げられるが、カルボキシル基が好ましい。 The urethane resin having a polycarbonate structure in the substrate coating agent according to the present invention may use an organic solvent as a solvent as a solvent, but preferably uses water as a medium. In order to disperse or dissolve the urethane resin in water, there are a forced emulsification type using an emulsifier, a self-emulsification type in which a hydrophilic group is introduced into the urethane resin, and a water-soluble type. In particular, the self-emulsification type in which an ionic group is introduced into the skeleton of the urethane resin is preferable because of excellent storage stability of the liquid and adhesion of the obtained coating film. Examples of the ionic group to be introduced include various groups such as a carboxyl group, sulfonic acid, phosphoric acid, phosphonic acid, quaternary ammonium salt, and the like, and a carboxyl group is preferable.
ウレタン樹脂にカルボキシル基を導入する方法としては、重合反応の各段階の中で種々の方法が取り得る。例えば、プレポリマー合成時に、カルボキシル基を持つ樹脂を共重合成分として用いる方法や、ポリオールやポリイソシアネート、鎖延長剤などの一成分としてカルボキシル基を持つ成分を用いる方法がある。
本発明で用いるウレタン樹脂としては、特にポリカーボネートポリオール、ポリイソシアネート、反応性水素原子を有する鎖長延長剤およびイソシアネート基と反応する基、およびアニオン性基を少なくとも１個有する化合物からなる樹脂が好ましい。
As a method for introducing a carboxyl group into a urethane resin, various methods can be taken in each stage of the polymerization reaction. For example, there are a method of using a carboxyl group-containing resin as a copolymer component during prepolymer synthesis, and a method of using a component having a carboxyl group as one component such as polyol, polyisocyanate, and chain extender.
The urethane resin used in the present invention is particularly preferably a resin composed of polycarbonate polyol, polyisocyanate, a chain extender having a reactive hydrogen atom, a group that reacts with an isocyanate group, and a compound having at least one anionic group.
ウレタン樹脂中のアニオン性基の量は、０．１重量％〜８重量％が好ましい。少ないアニオン性基量では、ウレタン樹脂の水溶性あるいは水分散性が悪く、多いアニオン性基量では、吸湿して相互に固着しやすくなるためである。
ウレタン樹脂中のポリカーボネート成分の含有量は、通常１０〜９０重量％であり、好ましくは２０〜７０重量％である。かかる含有量が１０重量％未満では、ウレタン樹脂の密着性改良効果に乏しくなることがあり、９０重量％を超えると塗布性が悪化することがある。
The amount of the anionic group in the urethane resin is preferably 0.1% by weight to 8% by weight. This is because when the amount of anionic group is small, the water solubility or water dispersibility of the urethane resin is poor, and when the amount of anionic group is large, the urethane resin absorbs moisture and is easily fixed to each other.
The content of the polycarbonate component in the urethane resin is usually 10 to 90% by weight, preferably 20 to 70% by weight. When the content is less than 10% by weight, the effect of improving the adhesiveness of the urethane resin may be poor, and when it exceeds 90% by weight, the coating property may be deteriorated.
なお、本発明におけるウレタン樹脂は、ガラス転移点（以下、Ｔｇと記載する）が１０℃以下、好ましくは、−１０℃以下であることが好ましい。Ｔｇが１０℃より高いものを使用した場合、易接着性が不十分となる場合がある。
本発明において、ウレタン樹脂としては市販のポリウレタン樹脂を用いることができ、ウレタン樹脂エマルジョンとして、例えば、ＤＩＣ（株）製の「ハイドラン」（商品名）等を挙げることができる。
The urethane resin in the present invention has a glass transition point (hereinafter referred to as Tg) of 10 ° C. or less, preferably −10 ° C. or less. When a material having a Tg higher than 10 ° C. is used, easy adhesion may be insufficient.
In the present invention, a commercially available polyurethane resin can be used as the urethane resin, and examples of the urethane resin emulsion include “Hydran” (trade name) manufactured by DIC Corporation.
本発明に係る基板コーティング剤に用いられる増粘剤には、アクリル樹脂、ゲル化剤（ゾル化剤）、高分子溶液などが採用され得る。これらは、塗布装置や塗布方法に適した粘度に調整するために添加される。これら増粘剤の中でもアクリル樹脂が、塗膜の強度も高めることができる点で好ましい。 As the thickener used in the substrate coating agent according to the present invention, an acrylic resin, a gelling agent (solating agent), a polymer solution, or the like may be employed. These are added in order to adjust the viscosity suitable for the coating apparatus and the coating method. Among these thickeners, an acrylic resin is preferable because it can increase the strength of the coating film.
アクリル樹脂は、アクリル酸、メタクリル酸及びこれらの誘導体を成分とするポリマーである。具体的には、例えばアクリル酸、メタクリル酸、メチルメタクリレート、エチルアクリレート、ブチルアクリレート、２−エチルヘキシルアクリレート、アクリルアミド、アクリロニトリル、ヒドロキシルアクリレートなどを主成分としてこれらと共重合可能なモノマー（例えばスチレン、ジビニルベンゼンなど）を共重合したポリマーである。 The acrylic resin is a polymer containing acrylic acid, methacrylic acid and derivatives thereof as components. Specifically, for example, acrylic acid, methacrylic acid, methyl methacrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, acrylamide, acrylonitrile, hydroxyl acrylate, etc. as main components and monomers copolymerizable therewith (for example, styrene, divinylbenzene) Etc.).
アクリル樹脂としては、アクリル単量体を用いて乳化重合した水分散アクリル樹脂を用いることが好ましい。水分散アクリル樹脂の原料となるアクリル単量体として、好ましくは、アクリル酸メチル、アクリル酸エチル、アクリル酸ｎ−ブチル、アクリル酸イソブチル、アクリル酸tert−ブチル、アクリル酸シクロヘキシル、アクリル酸２−エチルヘキシル、アクリル酸ラウリル、アクリル酸イソボルニル、メタクリル酸メチル、メタクリル酸エチル、メタクリル酸ｎ−ブチル、メタクリル酸イソブチル、メタクリル酸tert−ブチル、メタクリル酸シクロヘキシル、メタクリル酸２−エチルヘキシル、メタクリル酸ラウリル、メタクリル酸ベンジル、メタクリル酸イソボルニルなどの（メタ）アクリル酸アルキルエステル単量体、アクリル酸、メタクリル酸などのカルボキシル基含有アクリル単量体、アクリル酸２−ヒドロキシエチル、アクリル酸ヒドロキシプロピル、アクリル酸４−ヒドロキシブチル、メタクリル酸２−ヒドロキシエチル、メタクリル酸ヒドロキシプロピル、メタクリル酸４−ヒドロキシブチル、ポリエチレングリコールモノアクリレート、ポリエチレングリコールモノメタクリレート、ポリプロピレングリコールモノアクリレート、ポリプロピレングリコールモノメタクリレート、ポリテトラメチレングリコールモノアクリレート、ポリテトラメチレングリコールモノメタクリレートなどの水酸基含有アクリル単量体、Ｎ，Ｎ−ジメチルアミノエチルアクリレート、Ｎ，Ｎ−ジエチルアミノエチルアクリレート、Ｎ，Ｎ−ジメチルアミノエチルメタクリレート、Ｎ，Ｎ−ジエチルアミノエチルメタクリレートなどの３級アミノ基含有アクリル単量体、４−メタクリロイルオキシ−２，２，６，６−テトラメチルピペリジン、４−メタクリロイルオキシ−１，２，２，６，６−ペンタメチルピペリジンなどのヒンダードアミノ基含有アクリル単量体、アクリルアミド、Ｎ，Ｎ−ジメチルアクリルアミド、Ｎ−イソプロピルアクリルアミド、ヒドロキシメチルアクリルアミド、ヒドロキシエチルアクリルアミド、Ｎ，Ｎ−ジメチルアミノプロピルアクリルアミド、２−アクリルアミド−２−メチル−プロパンスルホン酸、ダイアセトンアクリルアミド、Ｎ−メトキシメチルアクリルアミド、Ｎ−エトキシメチルアクリルアミド、Ｎ−ブトキシメチルアクリルアミド、４−メタクリルアミドエチルエチレンウレアなどのアミド基含有アクリル単量体、２−メタクリロイルオキシエチル−エチレンウレアなどのウレア基含有アクリル単量体、アクリル酸グリシジル、アクリル酸メチルグリシジル、メタクリル酸グリシジル、メタクリル酸メチルグリシジル、ビニルベンジルグリシジルエーテルなどのエポキシ基含有アクリル単量体などを挙げることができる。この水分散アクリル樹脂は、これらのアクリル単量体が単独で構成されていても、２種類以上の混合物で構成されていてもよい。
以上のような単量体を乳化重合して得られる水分散アクリル樹脂を使用することが好ましい。好適な水分散アクリル樹脂の数平均分子量は、例えば５千〜２０万である。
As the acrylic resin, it is preferable to use a water-dispersed acrylic resin obtained by emulsion polymerization using an acrylic monomer. As an acrylic monomer used as a raw material for the water-dispersed acrylic resin, preferably, methyl acrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, tert-butyl acrylate, cyclohexyl acrylate, 2-ethylhexyl acrylate , Lauryl acrylate, isobornyl acrylate, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate, cyclohexyl methacrylate, 2-ethylhexyl methacrylate, lauryl methacrylate, benzyl methacrylate , (Meth) acrylic acid alkyl ester monomers such as isobornyl methacrylate, acrylic acid, carboxylic acid-containing acrylic monomers such as methacrylic acid, 2-hydroxyethyl acrylate, acrylic acid hydride Xylpropyl, 4-hydroxybutyl acrylate, 2-hydroxyethyl methacrylate, hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate, polyethylene glycol monoacrylate, polyethylene glycol monomethacrylate, polypropylene glycol monoacrylate, polypropylene glycol monomethacrylate, polytetra Hydroxyl-containing acrylic monomers such as methylene glycol monoacrylate and polytetramethylene glycol monomethacrylate, N, N-dimethylaminoethyl acrylate, N, N-diethylaminoethyl acrylate, N, N-dimethylaminoethyl methacrylate, N, N- Tertiary amino group-containing acrylic monomer such as diethylaminoethyl methacrylate, 4-methacryloylio Hindered amino group-containing acrylic monomers such as xyl-2,2,6,6-tetramethylpiperidine, 4-methacryloyloxy-1,2,2,6,6-pentamethylpiperidine, acrylamide, N, N- Dimethylacrylamide, N-isopropylacrylamide, hydroxymethylacrylamide, hydroxyethylacrylamide, N, N-dimethylaminopropylacrylamide, 2-acrylamido-2-methyl-propanesulfonic acid, diacetone acrylamide, N-methoxymethylacrylamide, N-ethoxy Amide group-containing acrylic monomers such as methylacrylamide, N-butoxymethylacrylamide, 4-methacrylamidoethylethyleneurea, and urea groups such as 2-methacryloyloxyethyl-ethyleneurea Acrylic monomers, glycidyl acrylate, methyl glycidyl acrylate, glycidyl methacrylate, methyl glycidyl methacrylate, an epoxy group-containing acrylic monomers such as vinylbenzyl glycidyl ether. The water-dispersed acrylic resin may be composed of these acrylic monomers alone or a mixture of two or more kinds.
It is preferable to use a water-dispersed acrylic resin obtained by emulsion polymerization of the above monomers. A suitable number average molecular weight of the water-dispersed acrylic resin is, for example, 5,000 to 200,000.
本発明で使用されるアクリル樹脂の具体例としては、（メタ）アクリル酸、クロトン酸、イタコン酸、マレイン酸、フマル酸等のカルボキシル基含有エチレン性不飽和単量体とメチル（メタ）アクリレート、エチル（メタ）アクリレート、スチレン等その他のエチレン性不飽和単量体との共重合体等が挙げられ、ポリカルボン酸系の増粘剤として使用される。 Specific examples of the acrylic resin used in the present invention include (meth) acrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid and other carboxyl group-containing ethylenically unsaturated monomers and methyl (meth) acrylate, Examples thereof include copolymers with other ethylenically unsaturated monomers such as ethyl (meth) acrylate and styrene, and are used as polycarboxylic acid thickeners.
本発明で使用されるアクリル樹脂の性状は特に制限されるものではなく、エマルジョン、水溶液などが挙げられる。本発明におけるアクリル樹脂は、コーティング液を所望の粘度まで増粘させて塗布作業性を向上させる為に使用され、コーティング剤に含まれる樹脂、添加剤種類、濃度等に応じて使用しやすい粘度まで調整するために使用される。
本発明においては、上記したアクリル樹脂に市販のアクリル樹脂を用いることができ、例えば、水分散アクリル樹脂として、ＤＩＣ（株）製の「ボンコート」（商品名）等を挙げることができる。
The properties of the acrylic resin used in the present invention are not particularly limited, and examples thereof include emulsions and aqueous solutions. The acrylic resin in the present invention is used to increase the viscosity of the coating liquid to a desired viscosity and improve the coating workability, and to a viscosity that is easy to use depending on the resin, additive type, concentration, etc. contained in the coating agent. Used to adjust.
In the present invention, a commercially available acrylic resin can be used as the above-mentioned acrylic resin. For example, as a water-dispersed acrylic resin, “Boncoat” (trade name) manufactured by DIC Corporation can be exemplified.
また、本発明に係る基板コーティング剤に用いられるスチレン樹脂には、スチレン単独重合体、または、α−メチルスチレン、ビニルトルエンもしくはジビニルベンゼン単量体単位を含有するスチレンとの共重合体、またはスチレンと共重合可能なその他の単量体との共重合体などが挙げられる。 The styrene resin used in the substrate coating agent according to the present invention includes a styrene homopolymer, a copolymer with styrene containing α-methylstyrene, vinyltoluene or divinylbenzene monomer units, or styrene. And copolymers with other monomers that can be copolymerized therewith.
スチレンと共重合可能な単量体としては酢酸ビニル、カプロン酸ビニルなどの炭素数２〜１８のビニルエステル類；アクリル酸、メタクリル酸、マレイン酸、フマル酸などの不飽和カルボン酸類；マレイン酸モノメチル、フマル酸ジメチルなどの不飽和カルボン酸エステル類；エチレン、１−ペンテンなどのオレフィン類；アリルグリシジルエーテル、メタリルグリシジルエーテルなどのエポキシ基含有不飽和化合物；イソブチルビニルエーテル、オクチルビニルエーテルなどのビニルエーテル類；アクリロニトリル、塩化ビニリデンなどが挙げられる。 Monomers copolymerizable with styrene include vinyl esters having 2 to 18 carbon atoms such as vinyl acetate and vinyl caproate; unsaturated carboxylic acids such as acrylic acid, methacrylic acid, maleic acid and fumaric acid; monomethyl maleate Unsaturated carboxylic esters such as dimethyl fumarate; olefins such as ethylene and 1-pentene; epoxy group-containing unsaturated compounds such as allyl glycidyl ether and methallyl glycidyl ether; vinyl ethers such as isobutyl vinyl ether and octyl vinyl ether; Examples include acrylonitrile and vinylidene chloride.
本発明においては、アクリルスチレン樹脂を用いることが好ましい。アクリルスチレン樹脂は、スチレンモノマーとアクリル酸エステルモノマーを重合することによって得られる樹脂である。スチレンモノマーとしては、スチレンやα−メチルスチレンなどが使用され得る。アクリル酸エステルモノマーとしては、アクリル酸メチル、アクリル酸エチル、アクリル酸プロピル、アクリル酸ブチル、アクリル酸２−エチルヘキシル、メタクリル酸メチル、メタクリル酸エチル、メタクリル酸プロピル、メタクリル酸ブチル、メタクリル酸２−エチルヘキシルなどが使用され得る。好適なアクリルスチレン樹脂としては、スチレン−メタクリル酸メチル共重合体、スチレン−アクリル酸ブチル共重合体、スチレン−メタクリル酸メチル−アクリル酸ブチル共重合体、スチレン−メタクリル酸ブチルなどが挙げられる。 In the present invention, it is preferable to use an acrylic styrene resin. The acrylic styrene resin is a resin obtained by polymerizing a styrene monomer and an acrylate monomer. As the styrene monomer, styrene, α-methylstyrene, or the like can be used. Examples of acrylic acid ester monomers include methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, 2-ethylhexyl methacrylate. Etc. can be used. Suitable acrylic styrene resins include styrene-methyl methacrylate copolymers, styrene-butyl acrylate copolymers, styrene-methyl methacrylate-butyl acrylate copolymers, styrene-butyl methacrylate, and the like.
本発明においては、上記したスチレン樹脂に市販のスチレン系樹脂を用いることができ、例えば、水系アクリルスチレン樹脂として、ＤＩＣ（株）製の「ボンコート」（商品名）等を挙げることができる。 In the present invention, a commercially available styrene resin can be used as the above-described styrene resin. For example, as a water-based acrylic styrene resin, “Boncoat” (trade name) manufactured by DIC Corporation can be exemplified.
本発明に係る基板コーティング剤に配合されるその他の添加剤としては、保湿剤、濡れ性向上剤、消泡剤、防腐剤及び着色剤などが挙げられる。
保湿剤としては、グリセリン、エチレングリコール、ジエチレングリコール、トリエチレングリコール、ポリエチレングリコール（分子量１００〜２０００）、プロピレングリコール、ジプロピレングリコール、トリプロピレングリコール、１，３−プロピレングリコール、イソプロピレングリコール、イソブチレングリコール、１，４−ブタンジオール、１，３−ブタンジオール、１，５−ペンタンジオール、１，６−ヘキサンジオール、メソエリスリトール、ペンタエリスリトール等が挙げられる。
本発明においては、その添加量を抑えるためにポリエチレングリコールを用いることが好ましい。例えば、昭和化学株式会社製のポリエチレングリコール２００などを使用することができる。
Examples of other additives blended in the substrate coating agent according to the present invention include humectants, wettability improvers, antifoaming agents, preservatives, and coloring agents.
As the humectant, glycerin, ethylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol (molecular weight 100 to 2000), propylene glycol, dipropylene glycol, tripropylene glycol, 1,3-propylene glycol, isopropylene glycol, isobutylene glycol, Examples include 1,4-butanediol, 1,3-butanediol, 1,5-pentanediol, 1,6-hexanediol, mesoerythritol, pentaerythritol and the like.
In the present invention, it is preferable to use polyethylene glycol in order to suppress the addition amount. For example, polyethylene glycol 200 manufactured by Showa Chemical Co., Ltd. can be used.
濡れ性向上剤としては、エチレングリコール、ポリエチレングリコールアルキルエーテル（アルキレン基の炭素数は２〜３）、ポリエチレングリコール（分子量１００〜８００）、アルキルスルホン酸（アルキレン基の炭素数は２〜３）、アクリル系共重合体、脂肪族アルコール（炭素数は１〜３）、アニオン系界面活性剤、フッ素系界面活性剤などから選択される。アクリル系共重合体としては、エーテル基含有アルキル（メタ）アクリレートモノマーとアルキル（メタ）アクリレートモノマーの共重合体を含有し、該共重合体の重量平均分子量が３０００〜２０００００であることが好ましく、より好ましくは５０００〜５００００である。なお、重量平均分子量は、例えばゲルパーミエーションクロマトグラフ法によりポリスチレン換算して求められる。 As the wettability improver, ethylene glycol, polyethylene glycol alkyl ether (alkylene group has 2 to 3 carbon atoms), polyethylene glycol (molecular weight 100 to 800), alkyl sulfonic acid (alkylene group carbon number 2 to 3), It is selected from acrylic copolymers, aliphatic alcohols (having 1 to 3 carbon atoms), anionic surfactants, fluorosurfactants and the like. The acrylic copolymer contains a copolymer of an ether group-containing alkyl (meth) acrylate monomer and an alkyl (meth) acrylate monomer, and the weight average molecular weight of the copolymer is preferably 3000 to 200000, More preferably, it is 5000-50000. In addition, a weight average molecular weight is calculated | required in polystyrene conversion, for example by the gel permeation chromatography method.
防腐剤（防カビ剤）としては、有機系防腐剤や銀イオンを含む製剤を用いることができる。有機系防腐剤には、有機窒素硫黄系化合物、有機芳香族系化合物又は有機窒素系化合物などを用いることができる。 As the preservative (antifungal agent), an organic preservative or a preparation containing silver ions can be used. As the organic preservative, an organic nitrogen sulfur compound, an organic aromatic compound, an organic nitrogen compound, or the like can be used.
着色剤としては、無機顔料、有機顔料、水性染料（有機）、油性染料（有機）、体質顔料などを用いることができる。具体的には、マイカ（雲母）、酸化鉄、酸化チタン、C.I.Pigment Black 7、C.I.Pigment Red 122、C.I.Pigment Orange 16、C.I.Pigment Green 7、C.I.Pigment Violet 23、Basic Green 4、Basic Violet 1、Basic Orenge 2、ダイレクトブルー 87、アシッド ブルー 90、C.I. Acid Yellow 23、C.I.Food.Yellow 3などが挙げられる。 As the colorant, inorganic pigments, organic pigments, aqueous dyes (organic), oily dyes (organic), extender pigments, and the like can be used. Specifically, mica (mica), iron oxide, titanium oxide, CIPigment Black 7, CIPigment Red 122, CIPigment Orange 16, CIPigment Green 7, CIPigment Violet 23, Basic Green 4, Basic Violet 1, Basic Orenge 2, Direct Blue 87, Acid Blue 90, CI Acid Yellow 23, CIFood.Yellow 3 and so on.
本発明に係る基板コーティング剤の溶媒としては、水や有機溶媒などが挙げられる。安全面や環境面を考慮すると、溶媒として水を用いることが好ましい。
また、水溶性有機溶剤としては、メチルアルコール、エチルアルコール、ｎ−プロピルアルコール、イソプロピルアルコール、ｎ−ブチルアルコール、ｓｅｃ−ブチルアルコール、ｔｅｒｔ−ブチルアルコール等の炭素数１〜４のアルキルアルコール類、エチレングリコール、プロピレングリコール、ブチレングリコール、ジエチレングリコール、トリエチレングリコール等、２〜６個の炭素原子を含むアルキレン基を持つアルキレングリコール類、グリセリン等の多価アルコール類、ポリアルキレングリコール類、アミド類、エーテル類等が挙げられる。
Examples of the solvent for the substrate coating agent according to the present invention include water and organic solvents. Considering safety and environmental aspects, it is preferable to use water as a solvent.
Examples of the water-soluble organic solvent include methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, sec-butyl alcohol, tert-butyl alcohol and other alkyl alcohols having 1 to 4 carbon atoms, ethylene Glycol, propylene glycol, butylene glycol, diethylene glycol, triethylene glycol, etc., alkylene glycols having an alkylene group containing 2 to 6 carbon atoms, polyhydric alcohols such as glycerin, polyalkylene glycols, amides, ethers Etc.
次に実施の形態に係る基板コーティング剤の調製方法について説明する。
所定の容器にウレタン樹脂、スチレン樹脂及び必要に応じて溶剤（例えば水など）をそれぞれ所定量入れ、攪拌機で混合する。低速（１〜１００ｒｐｍ）で混合しながら、さらに保湿剤、濡れ性向上剤及び防腐剤を所定量投入して混合する。次に着色剤を所定量投入し、その後増粘剤として、例えばアクリル樹脂を所定量投入する。その後、攪拌機の攪拌速度を高めて１時間程度の高速攪拌（２００〜５００ｒｐｍ）を行う。高速攪拌後、消泡剤を所定量投入し、攪拌機の攪拌速度を低速（１〜１００ｒｐｍ）に設定して３０分程度攪拌を行うことで基板コーティング剤を調製することができる。
Next, a method for preparing the substrate coating agent according to the embodiment will be described.
A predetermined amount of urethane resin, styrene resin and, if necessary, a solvent (for example, water) are put in a predetermined container, and mixed with a stirrer. While mixing at a low speed (1 to 100 rpm), a predetermined amount of a humectant, a wettability improver and a preservative is added and mixed. Next, a predetermined amount of colorant is added, and then a predetermined amount of acrylic resin, for example, is added as a thickener. Then, the stirring speed of the stirrer is increased and high speed stirring (200 to 500 rpm) is performed for about 1 hour. After high-speed stirring, a predetermined amount of antifoaming agent is added, and the substrate coating agent can be prepared by setting the stirring speed of the stirrer to low speed (1 to 100 rpm) and stirring for about 30 minutes.
なお、実施の形態に係る基板コーティング剤の好ましい粘度は、５０〜１２０Ｐａ・Ｓであり、膜厚を薄くする観点からより好ましくは、０．０１〜１．０Ｐａ・Ｓである。
基板コーティング剤の粘度を下げる場合は、溶剤（水）や上記した濡れ性向上剤の含量を適宜増やし、設定する粘度に応じて、ウレタン樹脂やスチレン樹脂の含量を減らし、増粘剤（アクリル樹脂など）を微量添加することにより、低濃度でも所望の効果が得られる基板コーティング剤を調製することができる。
In addition, the preferable viscosity of the substrate coating agent which concerns on embodiment is 50-120 Pa * S, More preferably, it is 0.01-1.0 Pa * S from a viewpoint of making a film thickness thin.
When reducing the viscosity of the substrate coating agent, increase the content of the solvent (water) and the above-mentioned wettability improver as appropriate, reduce the content of urethane resin and styrene resin according to the set viscosity, and increase the viscosity of the thickener (acrylic resin) Etc.) can be added to form a substrate coating agent that can provide the desired effect even at low concentrations.
以下、実施例によって本発明を具体的に説明するが、本発明はこれらの実施例に制限されるものではない。
（実施例１）
容器にウレタン樹脂（ＤＩＣ（株）製のハイドランＷＬＳ−２１３、平均粒径：１２０ｎｍ、伸び率：４００％、Ｔｇ：−３０℃、ウレタン樹脂濃度：約３５％、水：約６５％ 、ポリカーボネート由来の骨格含有）を８４．５重量部、スチレン樹脂（ＤＩＣ（株）製のボンコートＳＫ−１０５−Ｅ、固形分（アクリルスチレン樹脂濃度：約５５％、水：約４５％）を１０．０重量部それぞれ投入し、攪拌機で混合する。
低速（０〜１００ｒｐｍ）で混合しながら、保湿剤（昭和化学（株）製のポリエチレングリコール２００）を０．５重量部、濡れ性向上剤を０．５重量部、防腐剤を０．２重量部投入する。次に着色剤を２．０重量部投入し、その後アクリル樹脂（ＤＩＣ（株）製のボンコート３７５０−Ｅ、アクリル樹脂濃度：約２５％、水：約７５％）を１．５重量部投入する。その後、攪拌機の攪拌速度を高めて（２００〜５００ｒｐｍ）、１時間程度の高速攪拌を行う。なお前記濡れ性向上剤や防腐剤は、上述したものの中から適宜選択できる。
高速攪拌後、消泡剤（共栄社化学（株）製のアクアレンＳＢ−６３０）を０．５重量部投入し、攪拌機の攪拌速度を低速（０〜１００ｒｐｍ）に設定して、３０分程度攪拌を行うことで、実施例１に係る基板コーティング剤を調製した。
EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not restrict | limited to these Examples.
Example 1
Urethane resin in container (Hydran WLS-213 manufactured by DIC Corporation, average particle size: 120 nm, elongation: 400%, Tg: -30 ° C., urethane resin concentration: about 35%, water: about 65%, derived from polycarbonate 84.5 parts by weight of styrene resin (Boncoat SK-105-E manufactured by DIC Corporation), solid content (acrylic styrene resin concentration: about 55%, water: about 45%) 10.0 weights Add each part and mix with a stirrer.
While mixing at a low speed (0 to 100 rpm), 0.5 parts by weight of a moisturizer (polyethylene glycol 200 manufactured by Showa Chemical Co., Ltd.), 0.5 parts by weight of a wettability improver, and 0.2 parts by weight of a preservative Part. Next, 2.0 parts by weight of a coloring agent is added, and then 1.5 parts by weight of an acrylic resin (Boncoat 3750-E manufactured by DIC Corporation, acrylic resin concentration: about 25%, water: about 75%) is added. . Thereafter, the stirring speed of the stirrer is increased (200 to 500 rpm) and high speed stirring is performed for about 1 hour. In addition, the said wettability improvement agent and antiseptic | preservative can be suitably selected from what was mentioned above.
After high-speed stirring, 0.5 part by weight of antifoaming agent (Aqualene SB-630 manufactured by Kyoeisha Chemical Co., Ltd.) is added, the stirring speed of the stirrer is set to low speed (0 to 100 rpm), and stirring is performed for about 30 minutes. By performing, the substrate coating agent which concerns on Example 1 was prepared.
（実施例２）
容器にウレタン樹脂（ＤＩＣ（株）製のハイドランＷＬＳ−２１３）を９３．０重量部、スチレン樹脂（ＤＩＣ（株）製のボンコートＳＫ−１０５−Ｅ）を６．０重量部それぞれ投入し、攪拌機で混合する。
低速（１〜１００ｒｐｍ）で混合しながら、保湿剤（昭和化学（株）製のポリエチレングリコール２００）を０．５重量部、濡れ性向上剤を０．５重量部、防腐剤を０．２重量部投入する。次に着色剤を２．０重量部投入し、その後アクリル樹脂（ＤＩＣ（株）製のボンコート３７５０−Ｅ）を１．０重量部投入する。その後、攪拌機の攪拌速度を高めて（２００〜５００ｒｐｍ）、１時間程度の高速攪拌を行う。
高速攪拌後、消泡剤（共栄社化学（株）製のアクアレンＳＢ−６３０）を０．５重量部投入し、攪拌機の攪拌速度を低速（０〜１００ｒｐｍ）に設定して、３０分程度攪拌を行うことで、実施例２に係る基板コーティング剤を調製した。
(Example 2)
93.0 parts by weight of urethane resin (Hydran WLS-213 made by DIC Corporation) and 6.0 parts by weight of styrene resin (Boncoat SK-105-E made by DIC Corporation) were put into a container, respectively, and stirred. Mix with.
While mixing at a low speed (1 to 100 rpm), 0.5 parts by weight of a moisturizer (polyethylene glycol 200 manufactured by Showa Chemical Co., Ltd.), 0.5 parts by weight of a wettability improver, and 0.2 parts by weight of a preservative Part. Next, 2.0 parts by weight of a colorant is added, and then 1.0 part by weight of an acrylic resin (Boncoat 3750-E manufactured by DIC Corporation) is added. Thereafter, the stirring speed of the stirrer is increased (200 to 500 rpm) and high speed stirring is performed for about 1 hour.
After high-speed stirring, 0.5 part by weight of antifoaming agent (Aqualene SB-630 manufactured by Kyoeisha Chemical Co., Ltd.) is added, the stirring speed of the stirrer is set to low speed (0 to 100 rpm), and stirring is performed for about 30 minutes. By performing, the substrate coating agent which concerns on Example 2 was prepared.
（実施例３）
容器に溶剤（水）を４１．０重量部入れ、次にウレタン樹脂（ＤＩＣ（株）製のハイドランＷＬＳ−２１３）を４５．０重量部、スチレン樹脂（ＤＩＣ（株）製のボンコートＳＫ−１０５−Ｅ）を５．０重量部それぞれ投入し、攪拌機で混合する。
低速（１〜１００ｒｐｍ）で混合しながら、保湿剤（昭和化学（株）製のポリエチレングリコール２００）を０．５重量部、濡れ性向上剤を４．０重量部、防腐剤を０．２重量部投入する。次に着色剤を２．０重量部投入し、その後アクリル樹脂（ＤＩＣ（株）製のボンコート３７５０−Ｅ）を２．０重量部投入する。その後、攪拌機の攪拌速度を高めて（２００〜５００ｒｐｍ）、１時間程度の高速攪拌を行う。
高速攪拌後、消泡剤（共栄社化学（株）製のアクアレンＳＢ−６３０）を０．５重量部投入し、攪拌機の攪拌速度を低速（０〜１００ｒｐｍ）に設定して、３０分程度攪拌を行うことで、実施例３に係る基板コーティング剤を調製した。
(Example 3)
41.0 parts by weight of solvent (water) is placed in a container, and then 45.0 parts by weight of urethane resin (DIC Hydran WLS-213) and styrene resin (DIC Co., Ltd. Boncoat SK-105). -E) is added in an amount of 5.0 parts by weight and mixed with a stirrer.
While mixing at a low speed (1 to 100 rpm), 0.5 parts by weight of a moisturizer (polyethylene glycol 200 manufactured by Showa Chemical Co., Ltd.), 4.0 parts by weight of a wettability improver, and 0.2 parts by weight of a preservative Part. Next, 2.0 parts by weight of the coloring agent is added, and then 2.0 parts by weight of acrylic resin (Boncoat 3750-E manufactured by DIC Corporation) is added. Thereafter, the stirring speed of the stirrer is increased (200 to 500 rpm) and high speed stirring is performed for about 1 hour.
After high-speed stirring, 0.5 part by weight of antifoaming agent (Aqualene SB-630 manufactured by Kyoeisha Chemical Co., Ltd.) is added, the stirring speed of the stirrer is set to low speed (0 to 100 rpm), and stirring is performed for about 30 minutes. By performing, the substrate coating agent which concerns on Example 3 was prepared.
（実施例４）
容器に溶剤である水を５７．０重量部入れ、次にウレタン樹脂（ＤＩＣ（株）製のハイドランＷＬＳ−２１３）を３０．０重量部、スチレン樹脂（ＤＩＣ（株）製のボンコートＳＫ−１０５−Ｅ）を４．０重量部それぞれ投入し、攪拌機で混合する。
低速（１〜１００ｒｐｍ）で混合しながら、保湿剤（昭和化学（株）製のポリエチレングリコール２００）を０．５重量部、濡れ性向上剤を４．０重量部、防腐剤を０．２重量部投入する。次に着色剤を２．０重量部投入し、その後アクリル樹脂（ＤＩＣ（株）製のボンコート３７５０−Ｅ）を１．０重量部投入する。その後、攪拌機の攪拌速度を高めて（２００〜５００ｒｐｍ）、１時間程度の高速攪拌を行う。
高速攪拌後、消泡剤（共栄社化学（株）製のアクアレンＳＢ−６３０）を０．５重量部投入し、攪拌機の攪拌速度を低速（０〜１００ｒｐｍ）に設定して、３０分程度攪拌を行うことで、実施例４に係る基板コーティング剤を調製した。
Example 4
57.0 parts by weight of water as a solvent is put in a container, and then 30.0 parts by weight of urethane resin (Hydran WLS-213 manufactured by DIC Corporation) and Boncoat SK-105 manufactured by styrene resin (DIC Corporation). Add 4.0 parts by weight of -E) and mix with a stirrer.
While mixing at a low speed (1 to 100 rpm), 0.5 parts by weight of a moisturizer (polyethylene glycol 200 manufactured by Showa Chemical Co., Ltd.), 4.0 parts by weight of a wettability improver, and 0.2 parts by weight of a preservative Part. Next, 2.0 parts by weight of a colorant is added, and then 1.0 part by weight of an acrylic resin (Boncoat 3750-E manufactured by DIC Corporation) is added. Thereafter, the stirring speed of the stirrer is increased (200 to 500 rpm) and high speed stirring is performed for about 1 hour.
After high-speed stirring, 0.5 part by weight of antifoaming agent (Aqualene SB-630 manufactured by Kyoeisha Chemical Co., Ltd.) is added, the stirring speed of the stirrer is set to low speed (0 to 100 rpm), and stirring is performed for about 30 minutes. By performing, the substrate coating agent which concerns on Example 4 was prepared.
（比較例１）
容器にウレタン樹脂（ＤＩＣ（株）製のハイドランＷＬＳ−２１３）を９６．６重量部投入し、攪拌機で混合する。低速（１〜１００ｒｐｍ）で混合しながら、防腐剤を０．１重量部、シランカップリング剤を０．１重量部投入する。次に着色剤を２．０重量部投入し、その後アクリル樹脂（ＤＩＣ（株）製のボンコート３７５０−Ｅ）を０．８重量部投入する。その後、攪拌機の攪拌速度を高めて（２００〜５００ｒｐｍ）、１時間程度の高速攪拌を行う。
高速攪拌後、消泡剤（共栄社化学（株）製のアクアレンＳＢ−６３０）を０．５重量部投入し、攪拌機の攪拌速度を低速（０〜１００ｒｐｍ）に設定して、３０分程度攪拌を行うことで、比較例１に係る基板コーティング剤を調製した。
(Comparative Example 1)
96.6 parts by weight of urethane resin (Hydran WLS-213 manufactured by DIC Corporation) is put into a container and mixed with a stirrer. While mixing at a low speed (1 to 100 rpm), 0.1 part by weight of the preservative and 0.1 part by weight of the silane coupling agent are added. Next, 2.0 parts by weight of the colorant is added, and then 0.8 part by weight of acrylic resin (Boncoat 3750-E manufactured by DIC Corporation) is added. Thereafter, the stirring speed of the stirrer is increased (200 to 500 rpm) and high speed stirring is performed for about 1 hour.
After high-speed stirring, 0.5 part by weight of antifoaming agent (Aqualene SB-630 manufactured by Kyoeisha Chemical Co., Ltd.) is added, the stirring speed of the stirrer is set to low speed (0 to 100 rpm), and stirring is performed for about 30 minutes. By performing, the substrate coating agent which concerns on the comparative example 1 was prepared.
（比較例２）
容器にウレタン樹脂（ＤＩＣ（株）製のハイドランＷＬＳ−２１３）を８７．４重量部、ホットメルト接着剤１０．０重量部投入し、攪拌機で混合する。低速（１〜１００ｒｐｍ）で混合しながら、防腐剤を０．１重量部投入する。次に着色剤を２．０重量部投入する。その後、攪拌機の攪拌速度を高めて（２００〜５００ｒｐｍ）、１時間程度の高速攪拌を行う。
高速攪拌後、消泡剤（共栄社化学（株）製のアクアレンＳＢ−６３０）を０．５重量部投入し、攪拌機の攪拌速度を低速（０〜１００ｒｐｍ）に設定して、３０分程度攪拌を行うことで、比較例２に係る基板コーティング剤を調製した。
(Comparative Example 2)
A container is charged with 87.4 parts by weight of urethane resin (Hydran WLS-213 manufactured by DIC Corporation) and 10.0 parts by weight of hot melt adhesive and mixed with a stirrer. While mixing at a low speed (1 to 100 rpm), 0.1 part by weight of the preservative is added. Next, 2.0 parts by weight of the colorant is added. Thereafter, the stirring speed of the stirrer is increased (200 to 500 rpm) and high speed stirring is performed for about 1 hour.
After high-speed stirring, 0.5 part by weight of antifoaming agent (Aqualene SB-630 manufactured by Kyoeisha Chemical Co., Ltd.) is added, the stirring speed of the stirrer is set to low speed (0 to 100 rpm), and stirring is performed for about 30 minutes. By performing, the substrate coating agent which concerns on the comparative example 2 was prepared.
（比較例３）
容器にアクリル樹脂（BASFジャパン(株）製のJONCRYL PDX-7100、アクリル樹脂濃度：約３０％、水：約７０％）を９３．４重量部投入し、攪拌機で混合する。低速（１〜１００ｒｐｍ）で混合しながら、防腐剤を０．１重量部、シランカップリング剤を０．１重量部投入する。次に着色剤を２．０重量部投入し、その後アクリル樹脂（ＤＩＣ（株）製のボンコート３７５０−Ｅ）を４．０重量部投入する。その後、攪拌機の攪拌速度を高めて（２００〜５００ｒｐｍ）、１時間程度の高速攪拌を行う。
高速攪拌後、消泡剤（共栄社化学（株）製のアクアレンＳＢ−６３０）を０．５重量部投入し、攪拌機の攪拌速度を低速（０〜１００ｒｐｍ）に設定して、３０分程度攪拌を行うことで、比較例３に係る基板コーティング剤を調製した。
(Comparative Example 3)
93.4 parts by weight of acrylic resin (JONCRYL PDX-7100 manufactured by BASF Japan Ltd., acrylic resin concentration: about 30%, water: about 70%) is put into a container and mixed with a stirrer. While mixing at a low speed (1 to 100 rpm), 0.1 part by weight of the preservative and 0.1 part by weight of the silane coupling agent are added. Next, 2.0 parts by weight of a colorant is added, and then 4.0 parts by weight of an acrylic resin (Boncoat 3750-E manufactured by DIC Corporation) is added. Thereafter, the stirring speed of the stirrer is increased (200 to 500 rpm) and high speed stirring is performed for about 1 hour.
After high-speed stirring, 0.5 part by weight of antifoaming agent (Aqualene SB-630 manufactured by Kyoeisha Chemical Co., Ltd.) is added, the stirring speed of the stirrer is set to low speed (0 to 100 rpm), and stirring is performed for about 30 minutes. By performing, the substrate coating agent which concerns on the comparative example 3 was prepared.
（比較例４）
容器にウレタン樹脂（ＤＩＣ（株）製のハイドランＷＬＳ−２１３）を５４．０重量部、熱硬化性樹脂（ＤＩＣ（株）製のディックファインＥＮ−０２７４、固形分（エポキシ樹脂濃度：約２５％、水：約７５％）を４０．０重量部それぞれ投入し、攪拌機で混合する。
低速（０〜１００ｒｐｍ）で混合しながら、防腐剤を０．２重量部、ｐＨ調整剤を１．５重量部投入する。次に着色剤を２．０重量部投入し、その後アクリル樹脂（ＤＩＣ（株）製のボンコート３７５０−Ｅ）を１．８重量部投入する。その後、攪拌機の攪拌速度を高めて（２００〜５００ｒｐｍ）、１時間程度の高速攪拌を行う。
高速攪拌後、消泡剤（共栄社化学（株）製のアクアレンＳＢ−６３０）を０．５重量部投入し、攪拌機の攪拌速度を低速（０〜１００ｒｐｍ）に設定して、３０分程度攪拌を行うことで、比較例４に係る基板コーティング剤を調製した。
(Comparative Example 4)
54.0 parts by weight of urethane resin (Hydran WLS-213 manufactured by DIC Corporation), thermosetting resin (Dick Fine EN-0274 manufactured by DIC Corporation), solid content (epoxy resin concentration: about 25%) 40.0 parts by weight of water (about 75%).
While mixing at a low speed (0 to 100 rpm), 0.2 parts by weight of the preservative and 1.5 parts by weight of the pH adjuster are added. Next, 2.0 parts by weight of a colorant is added, and then 1.8 parts by weight of acrylic resin (Boncoat 3750-E manufactured by DIC Corporation) is added. Thereafter, the stirring speed of the stirrer is increased (200 to 500 rpm) and high speed stirring is performed for about 1 hour.
After high-speed stirring, 0.5 part by weight of antifoaming agent (Aqualene SB-630 manufactured by Kyoeisha Chemical Co., Ltd.) is added, the stirring speed of the stirrer is set to low speed (0 to 100 rpm), and stirring is performed for about 30 minutes. By performing, the substrate coating agent which concerns on the comparative example 4 was prepared.
（比較例５）
容器に酢酸ビニル樹脂（住化ケムテックス（株）製のスミカワレックス５２０ＨＱ、酢酸ビニル樹脂濃度：約４５％、水：約５５％）を９６．３重量部投入し、攪拌機で混合する。低速（０〜１００ｒｐｍ）で混合しながら、防腐剤を０．２重量部投入する。次に着色剤を２．０重量部投入し、その後アクリル樹脂（ＤＩＣ（株）製のボンコート３７５０−Ｅ）を１．０重量部投入する。その後、攪拌機の攪拌速度を高めて（２００〜５００ｒｐｍ）、１時間程度の高速攪拌を行う。
高速攪拌後、消泡剤（共栄社化学（株）製のアクアレンＳＢ−６３０）を０．５重量部投入し、攪拌機の攪拌速度を低速（０〜１００ｒｐｍ）に設定して、３０分程度攪拌を行うことで、比較例５に係る基板コーティング剤を調製した。
(Comparative Example 5)
96.3 parts by weight of vinyl acetate resin (Sumikawa Rex 520HQ manufactured by Sumika Chemtex Co., Ltd., vinyl acetate resin concentration: about 45%, water: about 55%) is put into a container and mixed with a stirrer. While mixing at low speed (0 to 100 rpm), 0.2 part by weight of the preservative is added. Next, 2.0 parts by weight of a colorant is added, and then 1.0 part by weight of an acrylic resin (Boncoat 3750-E manufactured by DIC Corporation) is added. Thereafter, the stirring speed of the stirrer is increased (200 to 500 rpm) and high speed stirring is performed for about 1 hour.
After high-speed stirring, 0.5 part by weight of antifoaming agent (Aqualene SB-630 manufactured by Kyoeisha Chemical Co., Ltd.) is added, the stirring speed of the stirrer is set to low speed (0 to 100 rpm), and stirring is performed for about 30 minutes. By performing, the substrate coating agent which concerns on the comparative example 5 was prepared.
（耐酸性・耐アルカリ性試験）
基板コーティング剤の耐酸性及び耐アルカリ性を確認するために、エッチング工程試験及びめっき工程試験を行った。
エッチング工程試験は、金属基板（厚さ約２ｍｍのアルミ基板）の端面に、上記した実施例１〜４及び比較例１〜５に係る基板コーティング剤を塗布（膜厚約３０〜５０μｍ）し、塗膜硬化後の金属基板を以下の（１）〜（４）の手順でエッチング処理し、エッチング処理前後の塗膜部分の状態をマイクロスコープで確認した。
（１）３％炭酸ナトリウム溶液：５０℃、０．５分処理
（２）塩化第二銅溶液：５０℃、１５分処理
（３）水酸化ナトリウム液：５０℃、１分処理
（４）水洗
その結果を表１に示す。塗膜の剥離がない場合を○、塗膜が一部剥離している場合を△、塗膜が殆ど剥離している場合を×とする３段階で評価した。
(Acid and alkali resistance test)
In order to confirm the acid resistance and alkali resistance of the substrate coating agent, an etching process test and a plating process test were performed.
In the etching process test, the substrate coating agent according to Examples 1 to 4 and Comparative Examples 1 to 5 described above was applied to the end face of a metal substrate (aluminum substrate having a thickness of about 2 mm) (film thickness of about 30 to 50 μm). The metal substrate after the coating film was cured was etched according to the following procedures (1) to (4), and the state of the coating film part before and after the etching process was confirmed with a microscope.
(1) 3% sodium carbonate solution: treated at 50 ° C for 0.5 minutes (2) cupric chloride solution: treated at 50 ° C for 15 minutes (3) sodium hydroxide solution: 50 ° C, treated for 1 minute (4) washed with water The results are shown in Table 1. The evaluation was made in three stages, with ◯ when there was no peeling of the coating film, Δ when the coating film was partially peeled, and x when the coating film was almost peeled off.
めっき工程試験は、銅貼積層板（厚さ約１００μｍ、縦横約５ｃｍ×７ｃｍ）の端面を含む周縁部に、上記した実施例１〜４及び比較例１〜５に係る基板コーティング剤を額縁状（縁幅約３ｍｍ）に塗布（膜厚約３０〜５０μｍ）し、塗膜硬化後の銅貼積層板を以下の（１）〜（７）の手順でめっき処理し、めっき処理前後の塗膜部分の状態をマイクロスコープで確認した。
（１）脱脂液（ＡＣＬ−００７：上村工業（株）製）：５０℃、５分処理
（２）酸処理（硫酸）：室温、１分処理
（３）ソフトエッチング溶液（過硫酸ナトリウム１００ｇ／Ｌ、硫酸１０ｍｌ／Ｌ）：室温、１分処理
（４）プレディップ溶液（硫酸１８ｍＬ／Ｌ）：室温、１分
（５）アクチベータ溶液（ＫＡＴ−４５０：上村工業（株）製、１００ｍｌ／Ｌ、硫酸１８ｍｌ／Ｌ）：３０℃、３分処理
（６）無電解ニッケルめっき（ニムデンＮＰＲ−４）：８０℃、ｐＨ４．６、５０分処理
（７）無電解金めっき（コブライトＴＳＢ−７２）：８０℃、５分処理を行い、ニッケルめっき被膜（７μｍ以上）と金めっき被膜（０．４μｍ以上）を形成し、めっき処理前後の塗膜部分の状態をマイクロスコープで確認した。
その結果を表１に示す。塗膜の剥離がない場合を○、塗膜が一部剥離している場合を△、塗膜が殆ど剥離している場合を×とする３段階で評価した。
In the plating process test, the above-described substrate coating agents according to Examples 1 to 4 and Comparative Examples 1 to 5 are framed on the peripheral portion including the end face of the copper-clad laminate (thickness: about 100 μm, length: width about 5 cm × 7 cm). (Edge width of about 3 mm) is applied (film thickness of about 30-50 μm), and the copper-clad laminate after the coating film is cured is plated according to the following procedures (1) to (7). The state of the part was confirmed with a microscope.
(1) Degreasing solution (ACL-007: manufactured by Uemura Kogyo Co., Ltd.): 50 ° C., 5 minutes treatment (2) Acid treatment (sulfuric acid): Room temperature, 1 minute treatment (3) Soft etching solution (sodium persulfate 100 g / L, sulfuric acid 10 ml / L): Room temperature, 1 minute treatment (4) Pre-dip solution (sulfuric acid 18 mL / L): Room temperature, 1 minute (5) Activator solution (KAT-450: Uemura Kogyo Co., Ltd., 100 ml / L) , Sulfuric acid 18 ml / L): 30 ° C., 3 minutes treatment (6) Electroless nickel plating (Nimden NPR-4): 80 ° C., pH 4.6, 50 minutes treatment (7) Electroless gold plating (Cobrite TSB-72) : Treated at 80 ° C. for 5 minutes to form a nickel plating film (7 μm or more) and a gold plating film (0.4 μm or more), and the state of the coating film part before and after the plating treatment was confirmed with a microscope.
The results are shown in Table 1. The evaluation was made in three stages, with ◯ when there was no peeling of the coating film, Δ when the coating film was partially peeled, and x when the coating film was almost peeled off.
また、上記銅貼積層板へ塗布した際の濡れ性の評価は、実施例１〜４及び比較例１〜５に係る基板コーティング剤の基板への塗布状態を目視で観察して行った。
その結果を表１に示す。上記銅貼積層板の端面及び周縁部にハジキがなく塗布できた場合を○、ハジキが少し発生していた場合を△、ハジキが多く発生していた場合を×とする３段階で評価した。
Moreover, evaluation of the wettability at the time of apply | coating to the said copper paste laminated board was performed by observing the application | coating state to the board | substrate of the board | substrate coating agent which concerns on Examples 1-4 and Comparative Examples 1-5 visually.
The results are shown in Table 1. The evaluation was made in three stages: ○ when the end face and peripheral edge of the copper-clad laminate could be applied without repelling, Δ when the repelling occurred a little, and x when the repelling occurred a lot.
また、実施例１〜４及び比較例１〜５に係る基板コーティング剤の銅貼積層板への塗布硬化後における塗膜の剥がれの有無について塗膜面を摩擦して観察した。
その結果を表１に示す。塗膜の剥がれがない場合を○、剥がれが少し発生した場合を△、剥がれが多く発生した場合を×とする３段階で評価した。
Moreover, the coating-film surface was rubbed and observed about the presence or absence of peeling of the coating film after the application | coating hardening to the copper-clad laminated board of the board | substrate coating agent which concerns on Examples 1-4 and Comparative Examples 1-5.
The results are shown in Table 1. The evaluation was made in three stages, with ◯ when the coating film was not peeled, Δ when the peeling occurred a little, and x when the peeling occurred a lot.
また、硬化後における塗膜同士の剥離性については、上記した銅貼積層板の周縁部に実施例１〜４及び比較例１〜５に係る基板コーティング剤を額縁状に塗布硬化したものを重ねて塗膜部分を密着させ、その剥離性（引っ付き具合）を観察した。
その結果を表１に示す。塗膜同士が引っ付かずに剥離できた場合を○、塗膜同士が少し引っ付いたが簡単に剥離できた場合を△、塗膜同士が引っ付き簡単に剥離できなかった場合を×とする３段階で評価した。
Moreover, about the peelability of the coating films after hardening, what coated and hardened the board | substrate coating agent which concerns on Examples 1-4 and Comparative Examples 1-5 in frame shape on the peripheral part of an above-described copper-clad laminated board is piled up. Then, the coating film part was brought into close contact, and the peelability (sticking condition) was observed.
The results are shown in Table 1. Three stages where ○ indicates that the coating films can be peeled off without sticking, △ indicates that the coating films are slightly stuck but can be easily peeled, and x indicates that the coating films cannot be easily peeled off. It was evaluated with.
上記表１から明らかなとおり、実施例１〜４に係る基板コーティング剤は、エッチング耐性やめっき耐性に優れ、強酸性や強アルカリ性の薬剤耐性に優れていた。特に実施例１の結果が良好であった。したがって、基板の塗布部分をエッチング溶液やめっき溶液などから保護（基板の浸食を防止）することができ、従来使用していた浸食防止用テープなどを用いる必要がなくなり、加工コストを削減することができる。 As is apparent from Table 1 above, the substrate coating agents according to Examples 1 to 4 were excellent in etching resistance and plating resistance, and were excellent in strong acid resistance and strong alkali resistance. In particular, the result of Example 1 was good. Therefore, the coated part of the substrate can be protected from the etching solution or plating solution (preventing erosion of the substrate), eliminating the need to use an erosion prevention tape that has been used in the past, and reducing processing costs. it can.
また、実施例１〜４に係る基板コーティング剤は、ハジキなどの塗膜欠陥が発生しにくく基板（金属基板や銅貼積層板）に塗膜を薄く均一に形成することが容易であり、かつ硬化後の塗膜は剥がれにくく、かつ塗膜同士の剥離性も良好であり、基板同士が引っ付くこともなく、コーティング後の基板の取り扱いが良好であった。 In addition, the substrate coating agent according to Examples 1 to 4 is less likely to cause coating film defects such as repelling, and it is easy to form a coating film thinly and uniformly on a substrate (metal substrate or copper-clad laminate), and The cured coating film was difficult to peel off, and the peelability between the coating films was good, and the substrates were not handled easily, and the coated substrate was handled well.
また、上記基板コーティング剤を塗布装置やブラシ等を用いて基板の端面や端面を含む周縁部に塗布することにより、その後の回路加工の際に基板端部から異物（塵埃等）が発生することを防止でき、また基板コーティング剤の塗膜により基板の強度も高めることができた。 In addition, when the substrate coating agent is applied to the edge surface of the substrate or a peripheral portion including the end surface using a coating device, a brush, or the like, foreign matters (dust etc.) are generated from the substrate edge during subsequent circuit processing. In addition, the strength of the substrate could be increased by the coating film of the substrate coating agent.
一方、比較例１〜５に係る基板コーティング剤によれば、強酸性や強アルカリ性の薬剤耐性が低く、塗膜欠陥が発生し、塗膜を薄く均一に形成することができなかった。また、硬化後の塗膜が剥がれやすいものや剥離性が低いものがあり、基板同士が引っ付き、コーティング後の基板の取り扱い性が悪かった。 On the other hand, according to the board | substrate coating agent which concerns on Comparative Examples 1-5, strong acidity and strong alkaline chemical resistance were low, the coating-film defect generate | occur | produced, and the coating film was not able to be formed thinly and uniformly. Moreover, there existed a thing with the coating film after hardening being easy to peel off, and a thing with low peelability, a board | substrate stuck, and the handleability of the board | substrate after coating was bad.
Claims (5)
前記溶剤が水系媒体であり、前記ウレタン樹脂、前記スチレン樹脂及び前記増粘剤が水性樹脂であることを特徴とする基板コーティング剤。 Contains urethane resin, styrene resin and thickener for solvent ,
The substrate coating agent, wherein the solvent is an aqueous medium, and the urethane resin, the styrene resin, and the thickener are aqueous resins .
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013121032A JP5711783B2 (en) | 2013-06-07 | 2013-06-07 | Substrate coating agent |
| KR1020130117620A KR101526065B1 (en) | 2013-06-07 | 2013-10-02 | Board coating agent |
| CN201310482969.2A CN104231897B (en) | 2013-06-07 | 2013-10-15 | Wiring board coating agent |
| TW102137650A TWI583750B (en) | 2013-06-07 | 2013-10-18 | Board coating agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013121032A JP5711783B2 (en) | 2013-06-07 | 2013-06-07 | Substrate coating agent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014237762A JP2014237762A (en) | 2014-12-18 |
| JP5711783B2 true JP5711783B2 (en) | 2015-05-07 |
Family
ID=52135177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013121032A Active JP5711783B2 (en) | 2013-06-07 | 2013-06-07 | Substrate coating agent |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5711783B2 (en) |
| KR (1) | KR101526065B1 (en) |
| CN (1) | CN104231897B (en) |
| TW (1) | TWI583750B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105368285B (en) * | 2015-11-17 | 2017-12-19 | 国家电网公司 | Anticorrosive super-pressure coatings of a kind of heat conduction and preparation method thereof |
| CN106189792A (en) * | 2016-08-30 | 2016-12-07 | 乐凯特科技铜陵有限公司 | The wiring board coating agent that a kind of electrical insulating property is excellent |
| KR101985470B1 (en) | 2017-05-18 | 2019-06-03 | (주)뉴라이트반도체 | A Coating Composition for a Substrate Frame and the Substrate Frame Coated by the Same |
| CN108165092A (en) * | 2018-01-10 | 2018-06-15 | 东莞智炜新材料股份有限公司 | A kind of aqueous PCB circuits alkali etching protection ink and preparation method thereof |
| CN112574522B (en) * | 2019-09-27 | 2022-09-13 | 上海飞凯材料科技股份有限公司 | Edge sealing material, preparation method and application thereof |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4045516A (en) * | 1973-02-08 | 1977-08-30 | W. R. Grace & Co. | Solid curable polyene compositions containing a polythiol |
| JPS63114197A (en) * | 1986-10-31 | 1988-05-19 | 三菱電機株式会社 | Manufacture of metal base printed wiring board |
| JPH05152729A (en) * | 1991-12-02 | 1993-06-18 | Hitachi Chem Co Ltd | Sealing method for end face of circuit board |
| JPH05283832A (en) * | 1992-03-30 | 1993-10-29 | Hitachi Chem Co Ltd | Edge-protected metal-base circuit board and manufacture thereof |
| JPH1022629A (en) * | 1996-07-01 | 1998-01-23 | Hitachi Chem Co Ltd | Manufacture of metallic base board fitted with protective film |
| GB0130651D0 (en) * | 2001-12-21 | 2002-02-06 | Ici Plc | Aqueous compositions containing polyurethane-acrylic hybrid polymer dispersions |
| US7008979B2 (en) * | 2002-04-30 | 2006-03-07 | Hydromer, Inc. | Coating composition for multiple hydrophilic applications |
| JP2005197443A (en) * | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | Method of manufacturing printed wiring board |
| US7473442B2 (en) * | 2005-09-14 | 2009-01-06 | Ppg Industries Ohio, Inc. | Multi-component, waterborne coating compositions, related coatings and methods |
| JP2007262241A (en) * | 2006-03-28 | 2007-10-11 | Daicel Chem Ind Ltd | Polyurethane resin and its coating film |
| DE102007011553A1 (en) * | 2007-03-09 | 2008-09-11 | Chemetall Gmbh | A method of coating metallic surfaces with an aqueous polymer-containing composition, the aqueous composition, and the use of the coated substrates |
| US7914895B2 (en) * | 2007-05-24 | 2011-03-29 | H.B. Fuller Company | Moisture curable hot melt adhesive composition |
| EP2271491A1 (en) * | 2008-04-30 | 2011-01-12 | MeadWestvaco Corporation | Water-based barrier coating compositions |
| CN102127345B (en) * | 2010-12-17 | 2013-04-10 | 武汉吉亨新材料科技有限公司 | Water-based coating composition, preparation method thereof and method for taking water-based coating composition as strippable coating protective film |
| CN102559078A (en) * | 2011-12-28 | 2012-07-11 | 广州鹿山新材料股份有限公司 | Hot melt adhesive membrane for bonding bi-metallic composite plate and preparing method thereof |
-
2013
- 2013-06-07 JP JP2013121032A patent/JP5711783B2/en active Active
- 2013-10-02 KR KR1020130117620A patent/KR101526065B1/en active IP Right Grant
- 2013-10-15 CN CN201310482969.2A patent/CN104231897B/en active Active
- 2013-10-18 TW TW102137650A patent/TWI583750B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014237762A (en) | 2014-12-18 |
| CN104231897B (en) | 2017-01-04 |
| KR20140143675A (en) | 2014-12-17 |
| CN104231897A (en) | 2014-12-24 |
| KR101526065B1 (en) | 2015-06-04 |
| TWI583750B (en) | 2017-05-21 |
| TW201446896A (en) | 2014-12-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5711783B2 (en) | Substrate coating agent | |
| TWI485220B (en) | Adhesive composition, adhesive film and surface protective film | |
| TWI495699B (en) | Adhesive composition and surface-protective adhesive film | |
| DE69832311T2 (en) | Pressure-sensitive adhesives for back-polishing silicon wafers | |
| JP5841536B2 (en) | Transparent adhesive tape, film laminate with metal thin film, cover panel-touch panel module laminate, cover panel-display panel module laminate, touch panel module-display panel module laminate, and image display device | |
| EP3031875B1 (en) | Electrically peelable adhesive agent composition, electrically peelable adhesive sheet, and method for using electrically peelable adhesive sheet | |
| JP6065036B2 (en) | Printing ink laminate | |
| CN101434133A (en) | Surface-treated metal plate | |
| EP3658637B1 (en) | Aqueous coating composition | |
| JP2017165025A (en) | Laminate and method for producing the same | |
| KR101653027B1 (en) | Light-scattering adhesive film, optical member and liquid crystal display device | |
| JPH07331118A (en) | Composition for coating and method of formation of coating film using the same | |
| JP6168080B2 (en) | Printing ink laminate | |
| CN111971170B (en) | Coated galvanized steel sheet | |
| CN105358649A (en) | Acrylic adhesive composition, manufacturing method of adhesive layer, polarizing film with adhesive layer, and crosslinking acceleration method of acrylic adhesive composition | |
| JP3068081B1 (en) | Aqueous resin composition | |
| JP7070182B2 (en) | Aqueous re-peelable adhesive and adhesive sheet | |
| JP2002302524A (en) | Method for producing polyurethane resin aqueous dispersion | |
| JP2742041B2 (en) | Method for producing composite aqueous dispersion and aqueous dispersion capable of forming composite film | |
| TW201702065A (en) | Plastic-coated galvanized metal sheet | |
| DE10252978A1 (en) | Chemically inert pressure sensitive adhesive with improved adhesion, process for its production and use | |
| JP2006104315A (en) | Aqueous acrylic-modified urethane resin and method for producing the same | |
| JP7112349B2 (en) | Painted galvanized steel sheet | |
| JP6946377B2 (en) | Resin coated metal plate | |
| JP4251273B2 (en) | Water-dispersible polyisocyanate composition and aqueous curable composition containing the composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141014 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150217 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150306 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5711783 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |