JP5702675B2 - 半導体装置の作製方法 - Google Patents
半導体装置の作製方法 Download PDFInfo
- Publication number
- JP5702675B2 JP5702675B2 JP2011130107A JP2011130107A JP5702675B2 JP 5702675 B2 JP5702675 B2 JP 5702675B2 JP 2011130107 A JP2011130107 A JP 2011130107A JP 2011130107 A JP2011130107 A JP 2011130107A JP 5702675 B2 JP5702675 B2 JP 5702675B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- conductive material
- antenna coil
- semiconductor device
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Semiconductor Integrated Circuits (AREA)
- Details Of Aerials (AREA)
Description
101 基材
102 アンテナコイル
103 コンデンサ
106 凹部
107 ローラ
108 突起部
109 開口部
111 電極
112 電極
113 領域
114 接着剤
115 基材
116 支持基材
117 半導体集積回路チップ
121 リーダ/ライタ
123 半導体集積回路
124 アンテナコイル
128 給電点
Claims (4)
- アンテナコイルとコンデンサを有する半導体装置の作製方法において、
突起部を有するローラを、第1の厚さの基材に押しつけながら回転させ、
前記突起部を前記基材の第1の面に押しつけることにより、前記基材に、前記第1の厚さより薄い第2の厚さを有する前記コンデンサの誘電体を形成し、
前記基材に開口部を形成し、
前記基材の第1の面とは反対側の第2の面に支持基材を貼り付け、
前記第2の厚さを有する領域の第1の面上、前記開口部の内部、及び前記基材の第1の面上に、第1の導電性材料を形成し、
前記支持基材を前記基材の第2の面から分離し、
前記基材の第2の面上に、第2の導電性材料を形成し、
前記第1の導電材料及び前記第2の導電性材料を加熱することにより、前記アンテナコイル及び前記コンデンサの電極を形成することを特徴とする半導体装置の作製方法。 - 請求項1において、
前記第2の導電性材料は、前記第1の導電性材料と同じ材料であることを特徴とする半導体装置の作製方法。 - 請求項1又は2において、
前記第1の厚さは、1μm以上50μm以下であることを特徴とする半導体装置の作製方法。 - 請求項1乃至3のいずれか一項において、
前記突起部は、上面が平坦な形状を有することを特徴とする半導体装置の作製方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011130107A JP5702675B2 (ja) | 2010-06-18 | 2011-06-10 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010139426 | 2010-06-18 | ||
JP2010139426 | 2010-06-18 | ||
JP2011130107A JP5702675B2 (ja) | 2010-06-18 | 2011-06-10 | 半導体装置の作製方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012023721A JP2012023721A (ja) | 2012-02-02 |
JP2012023721A5 JP2012023721A5 (ja) | 2014-06-19 |
JP5702675B2 true JP5702675B2 (ja) | 2015-04-15 |
Family
ID=45328113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011130107A Expired - Fee Related JP5702675B2 (ja) | 2010-06-18 | 2011-06-10 | 半導体装置の作製方法 |
Country Status (2)
Country | Link |
---|---|
US (2) | US8528827B2 (ja) |
JP (1) | JP5702675B2 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130027170A1 (en) * | 2011-06-30 | 2013-01-31 | Analog Devices, Inc. | Isolated power converter with magnetics on chip |
US8558344B2 (en) | 2011-09-06 | 2013-10-15 | Analog Devices, Inc. | Small size and fully integrated power converter with magnetics on chip |
KR101862401B1 (ko) * | 2011-11-07 | 2018-05-30 | 삼성전기주식회사 | 적층형 인덕터 및 그 제조방법 |
US9520638B2 (en) * | 2013-01-15 | 2016-12-13 | Fitbit, Inc. | Hybrid radio frequency / inductive loop antenna |
KR101316891B1 (ko) * | 2013-04-03 | 2013-10-11 | 에스에스 주식회사 | 휴대 단말기 부착용 안테나 패치의 제조방법 그리고 이를 이용한 휴대 단말기 부착용 안테나의 제조방법 |
US9196964B2 (en) | 2014-03-05 | 2015-11-24 | Fitbit, Inc. | Hybrid piezoelectric device / radio frequency antenna |
US9750282B2 (en) * | 2014-09-12 | 2017-09-05 | Shenzhen Smoore Technology Limited | Electronic cigarette and air switch thereof |
US11580344B2 (en) * | 2015-01-09 | 2023-02-14 | Sri International | Authentication apparatus, system and methods using unclonable identifiers |
KR102483490B1 (ko) * | 2015-06-02 | 2022-12-30 | 도판 인사츠 가부시키가이샤 | 비접촉형 정보 매체 |
JP6586447B2 (ja) * | 2017-11-02 | 2019-10-02 | 株式会社エスケーエレクトロニクス | Lc共振アンテナ |
US11940477B2 (en) | 2018-01-12 | 2024-03-26 | University Of Notre Dame Du Lac | Methods and apparatus for determining electromagnetic exposure compliance of multi-antenna devices |
DE102018119331B4 (de) | 2018-08-08 | 2024-07-25 | Endress+Hauser Flowtec Ag | Herstellungsverfahren einer Spulenvorrichtung, Spulenvorrichtung, Messaufnehmer mit Spulenvorrichtung, Messgerät mit einem Messaufnehmer |
WO2020161552A1 (ja) | 2019-02-05 | 2020-08-13 | 株式会社半導体エネルギー研究所 | 表示装置および電子機器 |
USD926716S1 (en) * | 2019-07-31 | 2021-08-03 | Eryn Smith | Antenna pattern for a semiconductive substrate carrier |
USD913256S1 (en) * | 2019-07-31 | 2021-03-16 | Eryn Smith | Antenna pattern for a semiconductive substrate carrier |
USD1032613S1 (en) * | 2020-02-02 | 2024-06-25 | Federal Card Services, LLC | Smart card |
FR3125149A1 (fr) * | 2021-07-10 | 2023-01-13 | Yesitis | Dispositif comprenant une etiquette rfid utilisable au moins dans un four a micro-ondes et recipient ou emballage pourvu d’au moins un tel dispositif |
CN113877830B (zh) * | 2021-10-13 | 2023-04-25 | 广东顺力智能物流装备股份有限公司 | 基于红外成像图像识别的智能物流分拣***及分拣方法 |
Family Cites Families (21)
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JP3427663B2 (ja) | 1996-06-18 | 2003-07-22 | 凸版印刷株式会社 | 非接触icカード |
JP2002042083A (ja) | 2000-07-27 | 2002-02-08 | Hitachi Maxell Ltd | 非接触通信式情報担体 |
FR2818811A1 (fr) * | 2000-12-26 | 2002-06-28 | France Telecom | Antenne imprimee pastille compacte |
FR2826154B1 (fr) * | 2001-06-14 | 2004-07-23 | A S K | Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux |
JP4006585B2 (ja) | 2002-08-21 | 2007-11-14 | 三菱マテリアル株式会社 | Rfid用トランスポンダのアンテナコイル構造及び共振周波数の調整方法 |
JP2004116766A (ja) * | 2002-09-30 | 2004-04-15 | Koyo Seiko Co Ltd | 転がり摺動部材の製造方法およびそれにより得られた転がり摺動部材、並びにそれを用いた転がり軸受 |
JP4241147B2 (ja) * | 2003-04-10 | 2009-03-18 | ソニー株式会社 | Icカードの製造方法 |
JP2005025514A (ja) | 2003-07-02 | 2005-01-27 | Fcm Kk | アンテナ内蔵非接触型icカード用の導電性シートおよびアンテナ内蔵非接触型icカード |
JP2005032901A (ja) | 2003-07-10 | 2005-02-03 | Fcm Kk | 導電性シート |
JP2005243855A (ja) | 2004-02-25 | 2005-09-08 | Kyocera Corp | 配線基板 |
JP2005294051A (ja) * | 2004-03-31 | 2005-10-20 | Fujitsu Hitachi Plasma Display Ltd | プラズマディスプレイパネルの製造方法 |
JP2006042097A (ja) | 2004-07-29 | 2006-02-09 | Kyocera Corp | アンテナ配線基板 |
WO2006043685A1 (en) | 2004-10-19 | 2006-04-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having antenna and method for manufacturing thereof |
JP4789580B2 (ja) * | 2004-10-19 | 2011-10-12 | 株式会社半導体エネルギー研究所 | アンテナおよびその作製方法並びに当該アンテナを備えた半導体装置およびその作製方法 |
US20070268113A1 (en) * | 2004-11-05 | 2007-11-22 | Johnson Daniel R | Detunable Rf Tags |
US20090195386A1 (en) * | 2006-02-15 | 2009-08-06 | Johannes Maxmillian Peter | Electronic article surveillance marker |
WO2007105607A1 (en) | 2006-03-10 | 2007-09-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP2007324426A (ja) * | 2006-06-02 | 2007-12-13 | Hitachi Ltd | パターン形成方法、導体配線パターン |
JP2008003681A (ja) * | 2006-06-20 | 2008-01-10 | Tateyama Kagaku Kogyo Kk | 無線icタグとその製造方法 |
US20080217761A1 (en) * | 2007-03-08 | 2008-09-11 | Advanced Chip Engineering Technology Inc. | Structure of semiconductor device package and method of the same |
JP2008226070A (ja) * | 2007-03-15 | 2008-09-25 | Dainippon Printing Co Ltd | 絶縁性金属光沢層付き非接触icタグ |
-
2011
- 2011-06-10 US US13/157,645 patent/US8528827B2/en not_active Expired - Fee Related
- 2011-06-10 JP JP2011130107A patent/JP5702675B2/ja not_active Expired - Fee Related
-
2013
- 2013-08-05 US US13/958,816 patent/US9111195B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US9111195B2 (en) | 2015-08-18 |
US20130313329A1 (en) | 2013-11-28 |
US8528827B2 (en) | 2013-09-10 |
JP2012023721A (ja) | 2012-02-02 |
US20110309904A1 (en) | 2011-12-22 |
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