JP5653281B2 - モジュール用ソケット - Google Patents
モジュール用ソケット Download PDFInfo
- Publication number
- JP5653281B2 JP5653281B2 JP2011093570A JP2011093570A JP5653281B2 JP 5653281 B2 JP5653281 B2 JP 5653281B2 JP 2011093570 A JP2011093570 A JP 2011093570A JP 2011093570 A JP2011093570 A JP 2011093570A JP 5653281 B2 JP5653281 B2 JP 5653281B2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- terminal
- fitting
- module
- male
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/193—Means for increasing contact pressure at the end of engagement of coupling part, e.g. zero insertion force or no friction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/76—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure with sockets, clips or analogous contacts and secured to apparatus or structure, e.g. to a wall
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connecting Device With Holders (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Description
11 ハウジング
13 切欠部
15 ストッパ凸部
15a、115a 当接端部
21 耳部
22 雄嵌合ロック部
23 雄側段部
23a 段部端面
51 導体パッド
53 突出端子
58 接続パッド
91 モジュール
93 突出脚部
95 突出部
101 雌コネクタ
111 枠体
112 縦枠部
113 突出脚部対応開口
114 接続凹部
115 前枠部
116 後枠部
117 カバーフィルム
117a、118a 端子対応開口
118 ベースフィルム
121 受入凹部
122 雌嵌合ロック部
122a 端部端面
150 接続シート部
151、151−1、151−2、151−3、151−4、151−5、151−6、151−7、151−8、151−9 導体パターン
152 パターン分離空間
153、153−1、153−2、153−3、153−4、153−5、153−6、153−7、153−8、153−9 受容端子
153a 基部
153a1 上側基部
153a2 下側基部
153c、964 接触部
153d、968 腕部
153d1 上側腕部
153d2 下側腕部
154 端子収容開口
154a 内側開口
154b 外側開口
158、158−1、158−2、158−3、158−4、158−5、158−6、158−7、158−8、158−9、962 テール部
159 固定用補助金具
801 カメラモジュール
811 本体部
812 レンズ筒
817 係止突起
911 ソケットハウジング
916 周壁部
917 底板部
918 コンタクト挿入溝
961 コンタクト
971 シールド部材
977 弾性係止片
991 基板
Claims (5)
- (a)モジュールを実装部材に実装するためのモジュール用ソケットであって、
(b)平板状のハウジング、該ハウジングの嵌合側面に配設された第1導体パターン、及び、該第1導体パターンの表面から突出する雄端子を含む平板状の第1コネクタと、
(c)板状金属から形成され、前記雄端子を弾性的に挟持する雌端子を含む平板状の第2コネクタとを有し、
(d)前記雌端子は、板状金属から成る第2導体パターンをパターニングすることによって形成され、その内側に形成された内側開口を含むとともに、前記第2導体パターンにおける雌端子の周囲の部分に接続されている基部と、互いに対向する一対の接触部と、該接触部と前記基部とを連結する腕部とを含み、
(e)前記対向する一対の接触部同士の間隔は、前記内側開口の幅寸法及び前記雄端子の幅寸法より小さく、前記雌端子が雄端子と係合すると、前記一対の接触部が前記雄端子を両側から弾性的に挟持し、
(f)前記第1コネクタ及び第2コネクタの一方がモジュールに取付けられ、他方が実装部材に取付けられることを特徴とするモジュール用ソケット。 - 前記第1コネクタ及び第2コネクタは、相互の嵌合側面同士を対向させた後、スライドさせることによって嵌合する請求項1に記載のモジュール用ソケット。
- 前記第2コネクタは、周囲を囲む枠体と、該枠体によって周囲を画定された偏平な接続凹部とを含み、
前記第1コネクタは、前記接続凹部に収容される請求項1又は2に記載のモジュール用ソケット。 - 前記第1コネクタは幅方向外側に延出する雄嵌合ロック部を含み、
該雄嵌合ロック部が前記枠体に形成された雌嵌合ロック部と係合して、前記第1コネクタと第2コネクタとの嵌合状態をロックする請求項3に記載のモジュール用ソケット。 - 前記第2コネクタは周囲を囲む枠体を含んでおらず、
前記第1コネクタは嵌合側面から突出する雄嵌合ロック部を含み、
該雄嵌合ロック部が前記第2コネクタに形成された雌嵌合ロック部と係合して、前記第1コネクタと第2コネクタとの嵌合状態をロックする請求項1又は2に記載のモジュール用ソケット。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011093570A JP5653281B2 (ja) | 2011-04-20 | 2011-04-20 | モジュール用ソケット |
CN2012201728864U CN202564756U (zh) | 2011-04-20 | 2012-04-20 | 模块插座 |
US13/451,747 US8801439B2 (en) | 2011-04-20 | 2012-04-20 | Module socket |
TW101207424U TWM455280U (zh) | 2011-04-20 | 2012-04-20 | 模組插槽 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011093570A JP5653281B2 (ja) | 2011-04-20 | 2011-04-20 | モジュール用ソケット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012226973A JP2012226973A (ja) | 2012-11-15 |
JP5653281B2 true JP5653281B2 (ja) | 2015-01-14 |
Family
ID=47175251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011093570A Expired - Fee Related JP5653281B2 (ja) | 2011-04-20 | 2011-04-20 | モジュール用ソケット |
Country Status (4)
Country | Link |
---|---|
US (1) | US8801439B2 (ja) |
JP (1) | JP5653281B2 (ja) |
CN (1) | CN202564756U (ja) |
TW (1) | TWM455280U (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10586771B2 (en) | 2013-12-16 | 2020-03-10 | Utac Headquarters Pte, Ltd | Conductive shield for semiconductor package |
US10242934B1 (en) | 2014-05-07 | 2019-03-26 | Utac Headquarters Pte Ltd. | Semiconductor package with full plating on contact side surfaces and methods thereof |
JP6222739B2 (ja) * | 2014-05-30 | 2017-11-01 | 日本航空電子工業株式会社 | コネクタ |
US10269686B1 (en) | 2015-05-27 | 2019-04-23 | UTAC Headquarters PTE, LTD. | Method of improving adhesion between molding compounds and an apparatus thereof |
JP6567954B2 (ja) * | 2015-10-28 | 2019-08-28 | 株式会社エンプラス | 電気部品用ソケット |
US9805955B1 (en) * | 2015-11-10 | 2017-10-31 | UTAC Headquarters Pte. Ltd. | Semiconductor package with multiple molding routing layers and a method of manufacturing the same |
US10276477B1 (en) | 2016-05-20 | 2019-04-30 | UTAC Headquarters Pte. Ltd. | Semiconductor package with multiple stacked leadframes and a method of manufacturing the same |
CN106850882B (zh) * | 2016-12-20 | 2020-03-24 | Oppo广东移动通信有限公司 | 支架组件及移动终端 |
CN108574159B (zh) * | 2017-03-10 | 2020-08-07 | 唐虞企业股份有限公司 | 连接器及其制造方法 |
CN207925714U (zh) * | 2018-02-07 | 2018-09-28 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
CN113036479A (zh) * | 2019-12-09 | 2021-06-25 | 富士康(昆山)电脑接插件有限公司 | 电连接器、电连接器组合及其锁扣组件 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6014A (en) * | 1849-01-09 | Stop-motion for drawing-frames | ||
JPH0472739U (ja) * | 1990-11-02 | 1992-06-26 | ||
EP0445808B1 (en) * | 1990-03-07 | 1994-11-23 | Sony Corporation | Radio telephone apparatus |
US6181032B1 (en) * | 1999-07-14 | 2001-01-30 | Black & Decker Inc. | Releasably connecting power packs to electrical appliances |
US7101211B2 (en) * | 2004-04-27 | 2006-09-05 | Hewlett-Packard Development Company, L.P. | Shroud for pin and socket connection |
US20060110968A1 (en) * | 2004-11-22 | 2006-05-25 | International Business Machines Corporation | Flexible tab for releasing an integrated circuit held within a ZIF socket |
TWM275555U (en) * | 2004-12-24 | 2005-09-11 | Hon Hai Prec Ind Co Ltd | Electrical connector assembly |
JP2007026765A (ja) | 2005-07-13 | 2007-02-01 | Smk Corp | カメラモジュールの基板取付構造 |
-
2011
- 2011-04-20 JP JP2011093570A patent/JP5653281B2/ja not_active Expired - Fee Related
-
2012
- 2012-04-20 US US13/451,747 patent/US8801439B2/en not_active Expired - Fee Related
- 2012-04-20 TW TW101207424U patent/TWM455280U/zh not_active IP Right Cessation
- 2012-04-20 CN CN2012201728864U patent/CN202564756U/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20120295484A1 (en) | 2012-11-22 |
CN202564756U (zh) | 2012-11-28 |
US8801439B2 (en) | 2014-08-12 |
TWM455280U (zh) | 2013-06-11 |
JP2012226973A (ja) | 2012-11-15 |
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