JP5643056B2 - 弾性波デバイス - Google Patents
弾性波デバイス Download PDFInfo
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- JP5643056B2 JP5643056B2 JP2010245452A JP2010245452A JP5643056B2 JP 5643056 B2 JP5643056 B2 JP 5643056B2 JP 2010245452 A JP2010245452 A JP 2010245452A JP 2010245452 A JP2010245452 A JP 2010245452A JP 5643056 B2 JP5643056 B2 JP 5643056B2
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- film
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- lower electrode
- upper electrode
- decoupler
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- 239000010408 film Substances 0.000 claims description 238
- 239000010409 thin film Substances 0.000 claims description 44
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 14
- 239000002356 single layer Substances 0.000 claims description 8
- 229910052691 Erbium Inorganic materials 0.000 claims description 6
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 claims description 6
- 229910052706 scandium Inorganic materials 0.000 claims description 6
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 229910052741 iridium Inorganic materials 0.000 claims description 4
- 229910052707 ruthenium Inorganic materials 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 38
- 238000004088 simulation Methods 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 13
- 230000007423 decrease Effects 0.000 description 10
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000010948 rhodium Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/582—Multiple crystal filters implemented with thin-film techniques
- H03H9/583—Multiple crystal filters implemented with thin-film techniques comprising a plurality of piezoelectric layers acoustically coupled
- H03H9/584—Coupled Resonator Filters [CFR]
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/582—Multiple crystal filters implemented with thin-film techniques
- H03H9/586—Means for mounting to a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/587—Air-gaps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/582—Multiple crystal filters implemented with thin-film techniques
- H03H9/586—Means for mounting to a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/589—Acoustic mirrors
Landscapes
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
k33 2=e33 2/(ε33・c33)
12 第1下部電極
14 第1圧電膜
16 第1上部電極
20 第2圧電薄膜共振子
22 第2下部電極
24 第2圧電膜
26 第2上部電極
30 デカプラ膜
50 基板
58 空隙
Claims (9)
- 基板上に設けられ、第1圧電膜と前記第1圧電膜を上下に挟む第1下部電極および第1上部電極とを含む第1圧電薄膜共振子と、
前記第1上部電極上に設けられたデカプラ膜と、
前記デカプラ膜上に設けられ、第2圧電膜と前記第2圧電膜を上下に挟む第2下部電極および第2上部電極とを含む第2圧電薄膜共振子と、
を具備し、
前記第1圧電膜および前記第2圧電膜は窒化アルミニウムにより形成されるとともに前記窒化アルミニウムの圧電定数を高める元素を含み、
前記第2圧電膜の前記元素の含有量は、前記第1圧電膜の前記元素の含有量より大きいことを特徴とする弾性波デバイス。 - 前記元素は、スカンジウムまたはエルビウムであることを特徴とする請求項1記載の弾性波デバイス。
- 第1圧電膜と前記第1圧電膜を上下に挟む第1下部電極および第1上部電極とを含む第1圧電薄膜共振子と、
前記第1上部電極上に設けられたデカプラ膜と、
前記デカプラ膜上に設けられ、第2圧電膜と前記第2圧電膜を上下に挟む第2下部電極および第2上部電極とを含む第2圧電薄膜共振子と、
を具備し、
前記第1上部電極および前記第2下部電極のそれぞれの膜厚は、前記第1下部電極および前記第2上部電極のそれぞれの膜厚より小さく、
前記デカプラ膜の音響インピーダンスは、5Mrayl以下であることを特徴とする弾性波デバイス。 - 前記デカプラ膜は単層膜であることを特徴とする請求項1から3のいずれか一項記載の弾性波デバイス。
- 前記デカプラ膜は、酸化シリコンを含むことを特徴とする請求項1から4のいずれか一項記載の弾性波デバイス。
- 前記第1下部電極、前記第1上部電極、前記第2下部電極および前記第2上部電極の音響インピーダンスは50Mrayl以上かつ120Mral以下であることを特徴とする請求項1から5のいずれか一項記載の弾性波デバイス。
- 前記第1下部電極、前記第1上部電極、前記第2下部電極および前記第2上部電極はIr、W、Ru、Rh、Mo、PtおよびTaの少なくとも1つを含むことを特徴とする請求項1から5のいずれか一項記載の弾性波デバイス。
- 前記第1下部電極との間に空隙が形成されるように設けられた基板を具備することを特徴とする請求項3記載の弾性波デバイス。
- 前記基板と前記第1下部電極との間に空隙が形成されていることを特徴とする請求項1または2記載の弾性波デバイス。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010245452A JP5643056B2 (ja) | 2010-11-01 | 2010-11-01 | 弾性波デバイス |
US13/240,407 US8841819B2 (en) | 2010-11-01 | 2011-09-22 | Acoustic wave device |
CN201110339535.8A CN102468818B (zh) | 2010-11-01 | 2011-11-01 | 声波器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010245452A JP5643056B2 (ja) | 2010-11-01 | 2010-11-01 | 弾性波デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012100029A JP2012100029A (ja) | 2012-05-24 |
JP5643056B2 true JP5643056B2 (ja) | 2014-12-17 |
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JP2010245452A Active JP5643056B2 (ja) | 2010-11-01 | 2010-11-01 | 弾性波デバイス |
Country Status (3)
Country | Link |
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US (1) | US8841819B2 (ja) |
JP (1) | JP5643056B2 (ja) |
CN (1) | CN102468818B (ja) |
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US9154111B2 (en) | 2011-05-20 | 2015-10-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Double bulk acoustic resonator comprising aluminum scandium nitride |
KR101823691B1 (ko) * | 2011-11-30 | 2018-01-30 | 엘지이노텍 주식회사 | 터치 패널 |
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JP5944813B2 (ja) * | 2012-11-08 | 2016-07-05 | 太陽誘電株式会社 | スイッチングデバイスおよびモジュール |
WO2014087799A1 (ja) * | 2012-12-05 | 2014-06-12 | 株式会社村田製作所 | 圧電部材、弾性波装置及び圧電部材の製造方法 |
JP5957376B2 (ja) * | 2012-12-18 | 2016-07-27 | 太陽誘電株式会社 | 圧電薄膜共振子 |
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2011
- 2011-09-22 US US13/240,407 patent/US8841819B2/en active Active
- 2011-11-01 CN CN201110339535.8A patent/CN102468818B/zh active Active
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Publication number | Publication date |
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CN102468818B (zh) | 2017-04-05 |
US20120104900A1 (en) | 2012-05-03 |
US8841819B2 (en) | 2014-09-23 |
JP2012100029A (ja) | 2012-05-24 |
CN102468818A (zh) | 2012-05-23 |
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