JP5638769B2 - 反射型マスクブランクの製造方法及び反射型マスクの製造方法 - Google Patents
反射型マスクブランクの製造方法及び反射型マスクの製造方法 Download PDFInfo
- Publication number
- JP5638769B2 JP5638769B2 JP2009115307A JP2009115307A JP5638769B2 JP 5638769 B2 JP5638769 B2 JP 5638769B2 JP 2009115307 A JP2009115307 A JP 2009115307A JP 2009115307 A JP2009115307 A JP 2009115307A JP 5638769 B2 JP5638769 B2 JP 5638769B2
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- Prior art keywords
- film
- reflective mask
- mask blank
- pattern
- reflective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000006096 absorbing agent Substances 0.000 claims description 92
- 239000000463 material Substances 0.000 claims description 60
- 230000008033 biological extinction Effects 0.000 claims description 44
- 229910052715 tantalum Inorganic materials 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 43
- 238000012546 transfer Methods 0.000 claims description 36
- 229910052796 boron Inorganic materials 0.000 claims description 26
- 229910052757 nitrogen Inorganic materials 0.000 claims description 21
- 229910052760 oxygen Inorganic materials 0.000 claims description 17
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 13
- 239000011651 chromium Substances 0.000 claims description 13
- 239000007789 gas Substances 0.000 claims description 9
- 150000004767 nitrides Chemical class 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000004544 sputter deposition Methods 0.000 claims description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- 150000003304 ruthenium compounds Chemical class 0.000 claims description 2
- 238000001459 lithography Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 256
- 239000000203 mixture Substances 0.000 description 21
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 18
- 230000000694 effects Effects 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 12
- 238000005530 etching Methods 0.000 description 10
- 238000007689 inspection Methods 0.000 description 10
- 230000000737 periodic effect Effects 0.000 description 10
- 229910052786 argon Inorganic materials 0.000 description 9
- 238000001755 magnetron sputter deposition Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- 238000010894 electron beam technology Methods 0.000 description 5
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 5
- 229910004535 TaBN Inorganic materials 0.000 description 4
- CXOWYMLTGOFURZ-UHFFFAOYSA-N azanylidynechromium Chemical compound [Cr]#N CXOWYMLTGOFURZ-UHFFFAOYSA-N 0.000 description 4
- 238000012790 confirmation Methods 0.000 description 4
- 238000012937 correction Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000001659 ion-beam spectroscopy Methods 0.000 description 4
- 230000007261 regionalization Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 229910001936 tantalum oxide Inorganic materials 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- ITWBWJFEJCHKSN-UHFFFAOYSA-N 1,4,7-triazonane Chemical compound C1CNCCNCCN1 ITWBWJFEJCHKSN-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910003071 TaON Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000007687 exposure technique Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- -1 oxynitrides Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 150000003482 tantalum compounds Chemical class 0.000 description 1
- 229910000500 β-quartz Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/52—Reflectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
- G03F1/58—Absorbers, e.g. of opaque materials having two or more different absorber layers, e.g. stacked multilayer absorbers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009115307A JP5638769B2 (ja) | 2009-02-04 | 2009-05-12 | 反射型マスクブランクの製造方法及び反射型マスクの製造方法 |
KR1020117003902A KR101676052B1 (ko) | 2009-02-04 | 2010-01-29 | 반사형 마스크 블랭크 및 반사형 마스크의 제조 방법 |
US13/122,024 US8389184B2 (en) | 2009-02-04 | 2010-01-29 | Reflective mask blank and method of manufacturing a reflective mask |
PCT/JP2010/051204 WO2010090132A1 (ja) | 2009-02-04 | 2010-01-29 | 反射型マスクブランク及び反射型マスクの製造方法 |
TW099103374A TWI436159B (zh) | 2009-02-04 | 2010-02-04 | 反射型光罩基底及反射型光罩之製造方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009023957 | 2009-02-04 | ||
JP2009023957 | 2009-02-04 | ||
JP2009115307A JP5638769B2 (ja) | 2009-02-04 | 2009-05-12 | 反射型マスクブランクの製造方法及び反射型マスクの製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010206156A JP2010206156A (ja) | 2010-09-16 |
JP2010206156A5 JP2010206156A5 (ja) | 2012-06-21 |
JP5638769B2 true JP5638769B2 (ja) | 2014-12-10 |
Family
ID=42542029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009115307A Active JP5638769B2 (ja) | 2009-02-04 | 2009-05-12 | 反射型マスクブランクの製造方法及び反射型マスクの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8389184B2 (ko) |
JP (1) | JP5638769B2 (ko) |
KR (1) | KR101676052B1 (ko) |
TW (1) | TWI436159B (ko) |
WO (1) | WO2010090132A1 (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5971122B2 (ja) | 2011-02-01 | 2016-08-17 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク |
US20150079502A1 (en) * | 2012-03-14 | 2015-03-19 | Hoya Corporation | Mask blank and method of manufacturing a transfer mask |
WO2013136882A1 (ja) | 2012-03-14 | 2013-09-19 | Hoya株式会社 | マスクブランク、及び転写用マスクの製造方法 |
KR102165129B1 (ko) * | 2012-03-30 | 2020-10-13 | 호야 가부시키가이샤 | 마스크 블랭크용 기판, 다층 반사막 부착 기판, 반사형 마스크 블랭크, 반사형 마스크, 투과형 마스크 블랭크, 투과형 마스크 및 반도체 장치의 제조 방법 |
US9046781B2 (en) | 2013-03-15 | 2015-06-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method for reflective-type mask |
JP6408790B2 (ja) * | 2013-05-31 | 2018-10-17 | Hoya株式会社 | 反射型マスクブランク、反射型マスク及びその製造方法、並びに半導体装置の製造方法 |
JP6340800B2 (ja) * | 2014-01-24 | 2018-06-13 | 凸版印刷株式会社 | Euv露光用マスク及びその製造方法 |
US9357625B2 (en) * | 2014-07-07 | 2016-05-31 | Asml Netherlands B.V. | Extreme ultraviolet light source |
US9709884B2 (en) * | 2014-11-26 | 2017-07-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | EUV mask and manufacturing method by using the same |
JP7063075B2 (ja) * | 2017-04-17 | 2022-05-09 | Agc株式会社 | Euv露光用反射型マスクブランク、および反射型マスク |
US11150550B2 (en) | 2017-08-10 | 2021-10-19 | AGC Inc. | Reflective mask blank and reflective mask |
US10890842B2 (en) | 2017-09-21 | 2021-01-12 | AGC Inc. | Reflective mask blank, reflective mask, and process for producing reflective mask blank |
JP7250511B2 (ja) | 2018-12-27 | 2023-04-03 | Hoya株式会社 | 反射型マスクブランク、反射型マスク、及び半導体装置の製造方法 |
JP7346088B2 (ja) * | 2019-05-31 | 2023-09-19 | 株式会社トッパンフォトマスク | 反射型フォトマスクブランクス及び反射型フォトマスク |
KR102285099B1 (ko) * | 2020-01-08 | 2021-08-04 | 주식회사 에스앤에스텍 | 극자외선용 반사형 블랭크 마스크 및 포토마스크 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08213303A (ja) | 1995-02-03 | 1996-08-20 | Nikon Corp | 反射型x線マスク及びその製造法 |
JP3806702B2 (ja) * | 2002-04-11 | 2006-08-09 | Hoya株式会社 | 反射型マスクブランクス及び反射型マスク及びそれらの製造方法並びに半導体の製造方法 |
KR20070086692A (ko) * | 2002-04-11 | 2007-08-27 | 호야 가부시키가이샤 | 반사형 마스크 블랭크, 반사형 마스크 및 이들의 제조방법 |
JP4946296B2 (ja) * | 2006-03-30 | 2012-06-06 | 凸版印刷株式会社 | 反射型フォトマスクブランク及びその製造方法、反射型フォトマスク、並びに、半導体装置の製造方法 |
TWI444757B (zh) * | 2006-04-21 | 2014-07-11 | Asahi Glass Co Ltd | 用於極紫外光(euv)微影術之反射性空白光罩 |
JP5018212B2 (ja) * | 2007-04-26 | 2012-09-05 | 凸版印刷株式会社 | 反射型フォトマスクブランク及び反射型フォトマスク並びに半導体装置の製造方法 |
-
2009
- 2009-05-12 JP JP2009115307A patent/JP5638769B2/ja active Active
-
2010
- 2010-01-29 WO PCT/JP2010/051204 patent/WO2010090132A1/ja active Application Filing
- 2010-01-29 KR KR1020117003902A patent/KR101676052B1/ko active IP Right Grant
- 2010-01-29 US US13/122,024 patent/US8389184B2/en active Active
- 2010-02-04 TW TW099103374A patent/TWI436159B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20120057551A (ko) | 2012-06-05 |
KR101676052B1 (ko) | 2016-11-14 |
WO2010090132A1 (ja) | 2010-08-12 |
JP2010206156A (ja) | 2010-09-16 |
US20110281207A1 (en) | 2011-11-17 |
TW201102753A (en) | 2011-01-16 |
US8389184B2 (en) | 2013-03-05 |
TWI436159B (zh) | 2014-05-01 |
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