JP5621796B2 - 搬送システム - Google Patents
搬送システム Download PDFInfo
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- JP5621796B2 JP5621796B2 JP2012018981A JP2012018981A JP5621796B2 JP 5621796 B2 JP5621796 B2 JP 5621796B2 JP 2012018981 A JP2012018981 A JP 2012018981A JP 2012018981 A JP2012018981 A JP 2012018981A JP 5621796 B2 JP5621796 B2 JP 5621796B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
- F21V23/0471—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor detecting the proximity, the presence or the movement of an object or a person
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- G—PHYSICS
- G08—SIGNALLING
- G08G—TRAFFIC CONTROL SYSTEMS
- G08G1/00—Traffic control systems for road vehicles
- G08G1/07—Controlling traffic signals
- G08G1/08—Controlling traffic signals according to detected number or speed of vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
- F21W2111/02—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for roads, paths or the like
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/39—Robotics, robotics to robotics hand
- G05B2219/39082—Collision, real time collision avoidance
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45032—Wafer manufacture; interlock, load-lock module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/30—End effector
- Y10S901/40—Vacuum or mangetic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
- Y10T29/53365—Multiple station assembly apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
- Y10T29/5337—Means to interrelatedly feed plural work parts from plural sources without manual intervention including assembly pallet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53435—Means to assemble or disassemble including assembly pallet
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Description
2 搬送室
3 収納容器
4 ウェハ
5 開閉装置
7 排他領域
10 搬送ロボット
11 本体部
20 アーム部
21 第1アーム部
22 第2アーム部
23 ハンド
30 ロボット制御装置
31 通信I/F
32 記憶部
32a 排他領域情報
33 制御部
33a 軌跡生成部
33b 判定部
33c 出力部
33d 取得部
33e 指示部
40 上位サーバ
Claims (9)
- 薄板状ワークの収納容器を開閉する開閉装置が取り付けられた壁面の内側に前記開閉装置の動作用の領域である排他領域を有する搬送室と、
前記薄板状ワークを移載するロボットハンドを末端部に具備して水平方向に作動するアーム部を有し、前記アーム部を最も短くなるように折り畳んだ状態で旋回させた場合に旋回中心からの最遠端が描く軌跡が前記開閉装置に分断されることなく前記排他領域内を通過可能となるように前記搬送室内に設置されるロボットと、
前記ロボットハンドの軌跡を生成する軌跡生成部と、
前記軌跡生成部によって生成される前記ロボットハンドの軌跡に基づいて前記アーム部の一部が前記排他領域に含まれるか否かを判定する判定部と、
前記判定部によって前記アーム部の一部が前記排他領域に含まれると判定された場合に、前記開閉装置が前記排他領域内で動作する前記収納容器の蓋体の着脱動作を禁止するための信号を出力する出力部と
を備え、
前記ロボットは、
前記アーム部の各アームの基端と先端との回転軸を結ぶ直線が互いに重なり、前記ロボットハンドの回転軸と前記薄板状ワーク載置中心とを結ぶ直線が前記各アームの前記直線に重なる姿勢を折り畳み姿勢とし、前記折り畳み姿勢が前記開閉装置の取り付けられた前記壁面と対向する対向壁面および前記排他領域のいずれにも干渉しないように前記対向壁面に対して一定の角度を有した状態を待機姿勢とするとともに、前記旋回中心が前記対向壁面側に寄った位置であり、かつ、前記折り畳み姿勢で前記旋回中心まわりに旋回したならば前記アーム部の一部が前記対向壁面と干渉する位置に設置され、
前記判定部は、
所定のタイミングごとに前記アーム部の一部が前記対向壁面に衝突するか否かを判定すること
を特徴とする搬送システム。 - 前記判定部は、
前記各アームの所定の位置に仮想図形を想定し、前記仮想図形が前記排他領域内に含まれるか否かによって前記アーム部の一部が前記排他領域に含まれると判定すること
を特徴とする請求項1に記載の搬送システム。 - 前記仮想図形を想定する前記各アームの所定の位置は、前記各アームの回転軸と、前記各アームの回転軸間の中心であること
を特徴とする請求項2に記載の搬送システム。 - 前記仮想図形は、予め設定可能な径を有する円形であり、前記予め設定可能な径が少なくとも前記各アームの外形を含有するように設定されること
を特徴とする請求項2または3に記載の搬送システム。 - 前記判定部は、
前記ロボットハンドが前記薄板状ワークを保持しているか否かを示す情報に応じて、前記薄板状ワークを保持している場合は、前記アーム部の一部に前記薄板状ワーク外形を加えた範囲が前記排他領域に含まれるか否かを判定すること
を特徴とする請求項1〜4のいずれか一つに記載の搬送システム。 - 前記判定部は、
少なくとも前記アーム部が所定の搬送命令を実行する前までに、前記所定の搬送命令を実行すると前記アーム部が前記排他領域へ侵入するか否かを判定し、
前記出力部は、
前記アーム部が侵入する場合、前記アーム部が前記排他領域へ侵入するあるいは侵入していることを示す信号を出力し、
前記開閉装置の前記排他領域内での動作を制限すること
を特徴とする請求項1〜5のいずれか一つに記載の搬送システム。 - 前記開閉装置の動作状況を取得する取得部と、
前記取得部によって前記開閉装置が動作する旨の前記動作状況が取得された場合に、前記アーム部を前記排他領域から待避させた前記待機姿勢をとるように前記ロボットに対して指示する指示部と
をさらに備えることを特徴とする請求項1に記載の搬送システム。 - 前記所定のタイミングは、前記ロボットハンドを動作させる動作命令を前記ロボットへ指示する直前ごとであること
を特徴とする請求項1に記載の搬送システム。 - 前記所定のタイミングは、前記ロボットが動作中の所定の周期ごとであること
を特徴とする請求項1に記載の搬送システム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012018981A JP5621796B2 (ja) | 2012-01-31 | 2012-01-31 | 搬送システム |
TW102100554A TWI492328B (zh) | 2012-01-31 | 2013-01-08 | 移送系統 |
US13/742,348 US8924118B2 (en) | 2012-01-31 | 2013-01-16 | Transfer system |
KR1020130006059A KR101427514B1 (ko) | 2012-01-31 | 2013-01-18 | 반송 시스템 |
CN2013100207464A CN103227133A (zh) | 2012-01-31 | 2013-01-21 | 传送*** |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012018981A JP5621796B2 (ja) | 2012-01-31 | 2012-01-31 | 搬送システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013157562A JP2013157562A (ja) | 2013-08-15 |
JP5621796B2 true JP5621796B2 (ja) | 2014-11-12 |
Family
ID=48837525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012018981A Active JP5621796B2 (ja) | 2012-01-31 | 2012-01-31 | 搬送システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US8924118B2 (ja) |
JP (1) | JP5621796B2 (ja) |
KR (1) | KR101427514B1 (ja) |
CN (1) | CN103227133A (ja) |
TW (1) | TWI492328B (ja) |
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JP5059729B2 (ja) * | 2008-09-30 | 2012-10-31 | 株式会社日立ハイテクコントロールシステムズ | ウェーハ搬送ロボット及びウェーハ搬送装置 |
JP5316521B2 (ja) * | 2010-03-31 | 2013-10-16 | 株式会社安川電機 | 基板搬送システム、基板処理システムおよび基板搬送ロボット |
JP5498241B2 (ja) * | 2010-04-28 | 2014-05-21 | 株式会社ダイヘン | ワーク搬送システム |
KR20110122007A (ko) | 2010-05-03 | 2011-11-09 | 주식회사 나인벨 | 다축으로 스트로크가 조절되는 아암이 구성된 기판 반송장치 |
JP5541299B2 (ja) * | 2012-01-31 | 2014-07-09 | 株式会社安川電機 | 搬送システム |
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- 2013-01-16 US US13/742,348 patent/US8924118B2/en active Active
- 2013-01-18 KR KR1020130006059A patent/KR101427514B1/ko active IP Right Grant
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US20130195601A1 (en) | 2013-08-01 |
KR20130088767A (ko) | 2013-08-08 |
TW201342516A (zh) | 2013-10-16 |
JP2013157562A (ja) | 2013-08-15 |
US8924118B2 (en) | 2014-12-30 |
KR101427514B1 (ko) | 2014-08-08 |
CN103227133A (zh) | 2013-07-31 |
TWI492328B (zh) | 2015-07-11 |
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