JP5610036B2 - Light emitting device - Google Patents

Description

本発明は、発光装置に関し、より詳細には発光素子を被覆する光反射性の被覆部材を備
えた発光装置に関する。 The present invention relates to a light-emitting device, and more particularly to a light-emitting device including a light-reflective coating member that covers a light-emitting element.

近年、光源として発光ダイオード（Light Emitting Diode：ＬＥＤ）やレーザダイオー
ド（Laser Diode：ＬＤ）等の半導体発光素子を搭載した発光装置が、各種の照明や表示
装置に利用されている。特に、これら半導体発光素子は消費電力が低く長寿命であるため
、電球や蛍光灯に代替可能な次世代照明の光源として注目を集めており、さらなる発光出
力および発光効率の向上が求められている。また、自動車のヘッドライト等の投光照明の
ように、配光特性に優れ、高輝度で且つ信頼性の高い光源も求められている。 2. Description of the Related Art In recent years, light-emitting devices equipped with semiconductor light-emitting elements such as light-emitting diodes (LEDs) and laser diodes (LDs) as light sources have been used for various lighting and display devices. In particular, these semiconductor light-emitting elements are attracting attention as light sources for next-generation lighting that can replace light bulbs and fluorescent lamps because of their low power consumption and long life, and further improvements in light emission output and light emission efficiency are required. . There is also a need for a light source that has excellent light distribution characteristics, high brightness, and high reliability, such as floodlights such as automobile headlights.

例えば特許文献１に開示された発光装置は、光取出側に開口したケース内にＬＥＤ素子
が載置されており、そのケース内に光反射粒子を含有するコーティング材が充填され、Ｌ
ＥＤ素子における光取出面を除く外面領域は、このコーティング材でもって被覆されてい
る。加えて、成形されたコーティング材の外面上に、ＬＥＤ素子の光取出面を覆うシート
状の蛍光体層が配設されており、該蛍光体層の表面を光出射面としている。この蛍光体層
は、ＬＥＤ素子からの一次光（青色光）を受けて励起されることにより、波長変換された
二次光（黄色光）を放射するＹＡＧ等の蛍光体を含む樹脂からなり、一次光と二次光との
混色によって光出射面から白色光を放出可能である。 For example, in the light emitting device disclosed in Patent Document 1, an LED element is placed in a case opened on the light extraction side, and a coating material containing light reflecting particles is filled in the case.
The outer surface area except the light extraction surface in the ED element is covered with this coating material. In addition, a sheet-like phosphor layer covering the light extraction surface of the LED element is disposed on the outer surface of the molded coating material, and the surface of the phosphor layer is used as a light emission surface. This phosphor layer is made of a resin containing a phosphor such as YAG that emits wavelength-converted secondary light (yellow light) by receiving and exciting primary light (blue light) from the LED element, White light can be emitted from the light exit surface by mixing the primary light and the secondary light.

また例えば特許文献２には、ＬＥＤチップに光透過性の接着剤により蛍光体チップを固
着したＬＥＤチップ組立体を、リードフレームのカップ部や絶縁性基板上に実装し、光散
乱剤を混合した保護層や封止樹脂により該ＬＥＤチップ組立体を封止した発光装置が開示
されている。 For example, in Patent Document 2, an LED chip assembly in which a phosphor chip is fixed to an LED chip with a light-transmitting adhesive is mounted on a cup portion of an lead frame or an insulating substrate, and a light scattering agent is mixed. A light-emitting device in which the LED chip assembly is sealed with a protective layer or a sealing resin is disclosed.

特開２００７−０１９０９６号公報JP 2007-019096 A 特開２００２−１４１５５９号公報JP 2002-141559 A 特開２００２−３０５３２８号公報JP 2002-305328 A

しかしながら、上記特許文献１に開示された発光装置では、ＬＥＤ素子から蛍光体層に
入射される光の入射角によって、蛍光体層内を伝搬する光の光路長が異なり、高角度の光
成分ほど蛍光体による波長変換量が相対的に大きくなる。このため、蛍光体層から発光さ
れる光の放射角度に依存して光の混色の割合が変化し、色ムラを生じる問題があった。 However, in the light emitting device disclosed in Patent Document 1, the optical path length of the light propagating in the phosphor layer differs depending on the incident angle of the light incident on the phosphor layer from the LED element. The amount of wavelength conversion by the phosphor is relatively large. For this reason, there is a problem in that the color mixture ratio of light changes depending on the emission angle of the light emitted from the phosphor layer, resulting in color unevenness.

また上記特許文献２に開示された発光装置では、ＬＥＤチップと蛍光体チップとを樹脂
材料からなる接着剤を用いて固着しており、ＬＥＤチップや蛍光体チップが発する光や熱
により接着剤が劣化することで、光損失や色度変化を生じるため、発光装置の信頼性が低
下する問題があった。他方、接着剤を介さずにＬＥＤチップと蛍光体チップとを離間させ
て配置すれば、このような問題を改善することができるが、蛍光体チップ表面での光反射
が増大し、蛍光体チップへの光結合効率が低下して、発光装置の発光効率が悪化してしま
う。さらに、ＬＥＤチップから出射されリードフレームのカップ部や絶縁性基板など実装
基体に入射する光成分は、該実装基体による光吸収の影響を受け、外部に有効に取り出さ
れず、光出力が低下する虞があった。 In the light emitting device disclosed in Patent Document 2, the LED chip and the phosphor chip are fixed using an adhesive made of a resin material, and the adhesive is applied by light or heat emitted from the LED chip or the phosphor chip. Deterioration causes light loss and chromaticity change, resulting in a problem that the reliability of the light emitting device is lowered. On the other hand, if the LED chip and the phosphor chip are arranged apart from each other without using an adhesive, such problems can be improved, but light reflection on the surface of the phosphor chip is increased, and the phosphor chip is increased. As a result, the light coupling efficiency of the light emitting device is deteriorated. In addition, light components emitted from the LED chip and incident on the mounting substrate such as the cup portion of the lead frame and the insulating substrate are affected by light absorption by the mounting substrate and are not effectively extracted to the outside, which may reduce the light output. was there.

そこで、本発明はかかる事情に鑑みてなされたものであり、蛍光体を含む波長変換部材
内を伝搬する光路長差による色ムラを低減し、樹脂からなる接着剤の劣化による信頼性の
低下を回避しながら、発光素子および波長変換部材から放出される光を効率良く外部に取
り出すことができる発光装置を提供することを目的とする。 Therefore, the present invention has been made in view of such circumstances, reducing color unevenness due to a difference in optical path length propagating in a wavelength conversion member including a phosphor, and reducing reliability due to deterioration of an adhesive made of resin. It is an object of the present invention to provide a light emitting device that can efficiently extract light emitted from the light emitting element and the wavelength conversion member to the outside while avoiding the problem.

本発明は、下記（１）〜（１４）の手段により上記課題を解決することができる。
（１） 半導体素子構造を有する発光素子と、光反射性材料を含有し、前記発光素子の出
射面を露出して、該側面を被覆する被覆部材と、前記発光素子から離間され、互いに対向
する発光面と、前記発光素子の出射表面からの光を受光する受光面と、を有する光透過部
材と、を備え、前記被覆部材は、前記発光素子と前記光透過部材の離間領域において、前
記発光素子の側面より前記光透過部材まで延在して、該延在部が前記離間領域を囲み、該
離間領域側表面に第１の反射面を有する発光装置。
（２） 前記離間領域は空隙であって、前記第１の反射面は、前記被覆部材と空隙との界
面に設けられる上記（１）に記載の発光装置。
（３） 前記第１の反射面は、凹面である上記（１）又は（２）に記載の発光装置。
（４） 前記第１の反射面は、凸曲面を有する請求項１又は２に記載の発光装置。
（５） 前記被覆部材は、前記光透過部材の側面を包囲する第２の反射面をその表面に有
する上記（１）〜（４）のいずれか１つに記載の発光装置。
（６） 前記被覆部材は、前記光透過部材の側面を被覆し、前記第２の反射面は、前記被
覆部材と前記光透過部材の側面との界面に設けられる上記（５）に記載の発光装置。
（７） 前記第２の反射面は、前記光透過部材の発光面より前方に延出した被覆部材の延
出部の表面に設けられている上記（５）又は（６）に記載の発光装置。
（８） 半導体素子構造を有する発光素子と、光反射性材料を含有し、前記発光素子の出
射面を露出して、該側面を被覆する被覆部材と、互いに対向する発光面と、前記発光素子
の出射表面からの光を受光する受光面と、を有し、前記発光素子の出射面に接合する光透
過部材と、を備え、前記被覆部材は、前記光透過部材の外側において、前記光透過部材の
側面から前記発光面より前方に延出して、該延出部が前記発光面を包囲し、該発光面側表
面と、前記光透過部材の側面とに第２の反射面を有する発光装置。
（９） 前記光透過部材の側面が、前記発光素子の外側の側面より、内側に設けられてい
る上記（８）に記載の発光装置。
（１０） 前記延出部は、該開口幅が前記発光面側より狭く、該延出部の前記第２の反射
面が発光面に対面するように傾斜して、該発光面の前方を一部覆っている上記（７）〜（
９）のいずれか１つに記載の発光装置。
（１１） 前記延出部は、該開口幅が前記発光面側より広く、該延出部の前記第２の反射
面が発光面より側方の外側に設けられている上記（７）〜（９）のいずれか１つに記載の
発光装置。
（１２） 前記光透過部材の発光面に接合し、該接合側に対向する表面の第２の発光面を
備えた透光性部材を有し、前記延出部は、前記透光性部材の側面を被覆しており、該側面
に前記第２の反射面が設けられている上記（１０）又は（１１）に記載の発光装置。
（１３） 前記光透過部材は、前記発光素子に励起される波長変換部材である上記（１）
〜（１２）のいずれか１つに記載の発光装置。
（１４） 前記波長変換部材は板状体である上記（１３）に記載の発光装置。 The present invention can solve the above problems by the following means (1) to (14).
(1) A light-emitting element having a semiconductor element structure, a light-reflective material, a light-emitting element exposed surface, a covering member that covers the side surface, and a distance between the light-emitting element and facing each other A light-transmitting member having a light-emitting surface and a light-receiving surface that receives light from an emission surface of the light-emitting element, and the covering member is configured to emit the light in a separation region between the light-emitting element and the light-transmitting member. A light-emitting device that extends from a side surface of the element to the light transmission member, the extending portion surrounds the separation region, and has a first reflection surface on a surface of the separation region.
(2) The light emitting device according to (1), wherein the separation region is a gap, and the first reflection surface is provided at an interface between the covering member and the gap.
(3) The light emitting device according to (1) or (2), wherein the first reflecting surface is a concave surface.
(4) The light emitting device according to claim 1 or 2, wherein the first reflecting surface has a convex curved surface.
(5) The light emitting device according to any one of (1) to (4), wherein the covering member has a second reflecting surface surrounding a side surface of the light transmitting member on a surface thereof.
(6) The light emitting unit according to (5), wherein the covering member covers a side surface of the light transmitting member, and the second reflecting surface is provided at an interface between the covering member and the side surface of the light transmitting member. apparatus.
(7) The light emitting device according to (5) or (6), wherein the second reflecting surface is provided on a surface of an extending portion of the covering member that extends forward from the light emitting surface of the light transmitting member. .
(8) A light-emitting element having a semiconductor element structure, a light-reflective material, a light-emitting surface that exposes an emission surface of the light-emitting element and covers the side surface, a light-emitting surface facing each other, and the light-emitting element A light-transmitting surface that receives light from the light-emitting surface of the light-emitting element, and a light-transmitting member that is bonded to the light-emitting surface of the light-emitting element, and the covering member is disposed outside the light-transmitting member and transmits the light. A light emitting device that extends forward from the light emitting surface from a side surface of the member, the extending portion surrounds the light emitting surface, and has a second reflecting surface on the light emitting surface side surface and the side surface of the light transmitting member .
(9) The light emitting device according to (8), wherein a side surface of the light transmitting member is provided on an inner side than an outer side surface of the light emitting element.
(10) The extending portion is inclined such that the opening width is narrower than the light emitting surface side, and the second reflecting surface of the extending portion faces the light emitting surface, and the front of the light emitting surface is The above (7) to (
9) The light-emitting device according to any one of
(11) The extending portion has the opening width wider than the light emitting surface side, and the second reflecting surface of the extending portion is provided on the outer side of the light emitting surface. 9) The light-emitting device according to any one of
(12) The light-transmitting member has a light-transmitting member that is bonded to the light-emitting surface of the light-transmitting member and has a second light-emitting surface that faces the bonding side, and the extending portion is formed of the light-transmitting member. The light-emitting device according to (10) or (11), wherein the side surface is covered and the second reflecting surface is provided on the side surface.
(13) The light transmission member is the wavelength conversion member excited by the light emitting element (1)
The light-emitting device as described in any one of-(12).
(14) The light emitting device according to (13), wherein the wavelength conversion member is a plate-like body.

本発明によれば、色ムラの少ない高出力発光が可能であり、高い発光効率と信頼性を合
わせ持つ発光装置を提供することができる。 According to the present invention, it is possible to provide a light emitting device capable of high-output light emission with little color unevenness and having both high light emission efficiency and reliability.

本発明の一実施の形態に係る発光装置の概略上面図（ｂ）と、そのＡ−Ａ断面における概略断面図（ａ）である。It is the schematic top view (b) of the light-emitting device which concerns on one embodiment of this invention, and the schematic sectional drawing (a) in the AA cross section. 本発明の一実施形態に係る発光装置の光源部周辺を説明する概略断面図である。It is a schematic sectional drawing explaining the light source part periphery of the light-emitting device which concerns on one Embodiment of this invention. 本発明の一実施の形態に係る発光素子の概略断面図である。It is a schematic sectional drawing of the light emitting element which concerns on one embodiment of this invention. 本発明の一実施の形態に係る発光装置の概略上面図（ｂ）と、そのＡ−Ａ断面における概略断面図（ａ）と、その光源部周辺を説明する概略断面図（ｃ）である。It is the schematic top view (b) of the light-emitting device which concerns on one embodiment of this invention, the schematic sectional drawing (a) in the AA cross section, and the schematic sectional drawing (c) explaining the light source part periphery. 本発明の一実施の形態に係る発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device which concerns on one embodiment of this invention. 本発明の一実施の形態に係る発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device which concerns on one embodiment of this invention. 本発明の一実施形態に係る発光装置の光源部周辺を説明する概略断面図である。It is a schematic sectional drawing explaining the light source part periphery of the light-emitting device which concerns on one Embodiment of this invention. 本発明の一実施形態に係る発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device which concerns on one Embodiment of this invention. 本発明の一実施形態に係る発光装置の光源部周辺を説明する概略断面図である。It is a schematic sectional drawing explaining the light source part periphery of the light-emitting device which concerns on one Embodiment of this invention.

以下、発明の実施の形態について適宜図面を参照して説明する。ただし、以下に説明す
る発光装置は、本発明の技術思想を具体化するためのものであって、本発明を以下のもの
に特定しない。特に、以下に記載されている構成部品の寸法、材質、形状、その相対的配
置等は特定的な記載がない限りは、本発明の範囲をそれのみに限定する趣旨ではなく、単
なる説明例にすぎない。なお、各図面が示す部材の大きさや位置関係等は、説明を明確に
するため誇張していることがある。さらに、本発明を構成する各要素は、複数の要素を同
一の部材で構成して一の部材で複数の要素を兼用する態様としてもよいし、逆に一の部材
の機能を複数の部材で分担して実現することもできる。また、以下に記載されている実施
の形態についても同様に、特に排除する記載が無い限りは各構成等を適宜組み合わせて適
用できる。 Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light-emitting device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described below are not intended to limit the scope of the present invention only to specific examples unless otherwise specified. Only. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing. Similarly, the embodiments described below can be applied by appropriately combining the components and the like unless otherwise specified.

＜実施の形態１＞
図１は、本発明の実施の形態１に係る発光装置の概略図であり、図１（ａ）は概略上面
図の図１（ｂ）のＡ−Ａにおける概略断面図であり、図２はその光源部周辺の概略断面図
である。図１，２に示す例の発光装置は、主として、発光素子１０と、発光素子から出射
された光を透過する光透過部材２０と、発光素子、光透過部材の一部を被覆する光反射性
の被覆部材４０，４５と、から構成されている。 <Embodiment 1>
FIG. 1 is a schematic view of a light emitting device according to Embodiment 1 of the present invention, FIG. 1 (a) is a schematic cross-sectional view taken along line AA of FIG. 1 (b), and FIG. It is a schematic sectional drawing around the light source part. The light emitting device of the example shown in FIGS. 1 and 2 mainly includes a light emitting element 10, a light transmitting member 20 that transmits light emitted from the light emitting element, and a light reflecting property that covers a part of the light emitting element and the light transmitting member. Covering members 40 and 45.

発光素子１０は、基板上に設けられた半導体素子構造を備え、基板の裏面を上面として
実装基板５０の配線５５上に導電性接着材６０により１個フリップチップ実装されている
。また実装基板５０上には、その発光素子１０を包囲するように、第１の枠体５１と、さ
らにその外側に第１の枠体５１より高い第２の枠体５２と、が設けられている。そして、
その第１の枠体５１の内側には、光反射性材料４６を含有する被覆部材４０が充填され、
発光素子１０の基板の裏面を光出射面として露出させて、発光素子１０の周部が該被覆部
材４０に被覆されている。これにより、発光素子１０から側方や下方に出射される光は、
光反射性の被覆部材４０によって素子の内部に反射され、効率良く該基板の裏面から取り
出すことができる。 The light emitting element 10 has a semiconductor element structure provided on a substrate, and one flip chip is mounted on the wiring 55 of the mounting substrate 50 by a conductive adhesive 60 with the back surface of the substrate as an upper surface. On the mounting substrate 50, a first frame 51 and a second frame 52 higher than the first frame 51 are provided outside the first frame 51 so as to surround the light emitting element 10. Yes. And
The inside of the first frame 51 is filled with a covering member 40 containing a light reflective material 46,
The periphery of the light emitting element 10 is covered with the covering member 40 with the back surface of the substrate of the light emitting element 10 exposed as a light emitting surface. Thereby, the light emitted from the light emitting element 10 to the side or downward is
It is reflected inside the element by the light-reflective coating member 40 and can be efficiently taken out from the back surface of the substrate.

第１の枠体５１上には、互いに対向する表面２１（発光面９０）および受光面２２を有
する１枚の板状の光透過部材２０が載置され第１の枠体５１を閉蓋し、受光面２２と発光
素子１０の出射面との間に離間領域３０が設けられている。この光透過部材２０は、第１
の枠体５１により発光素子１０と離間して配置されており、発光素子１０から出射される
光を受光面２２で受光、透過し、表面２１より装置外部に放出する。また光透過部材２０
は、発光素子１０から出射された光を一次光として、該一次光に励起されその波長変換光
である二次光を放出可能な蛍光体を含有する波長変換部材であってもよい。 On the first frame 51, a single plate-like light transmitting member 20 having a surface 21 (light emitting surface 90) and a light receiving surface 22 facing each other is placed, and the first frame 51 is closed. A separation region 30 is provided between the light receiving surface 22 and the light emitting surface of the light emitting element 10. The light transmitting member 20 is the first
The light beam emitted from the light emitting element 10 is received and transmitted by the light receiving surface 22 and emitted from the surface 21 to the outside of the apparatus. The light transmitting member 20
May be a wavelength conversion member containing a phosphor capable of emitting light emitted from the light emitting element 10 as primary light and emitting secondary light that is excited by the primary light and is wavelength-converted light thereof.

また被覆部材４０は、第１の枠体５１の内壁を該枠体上面まで這い上がって形成され、
素子の外側で裏面から前方に伸びて、素子の側面から上面に延在している。図のように光
透過部材の受光面２２に当接されると良い。さらに、その表面に第１の反射面３１が設け
られている。この第１の反射面３１は、凹曲面となっており、平面である場合に比して反
射面の面積が増え反射効率を向上でき、また、発光素子１０より幅広な光透過部材２０の
受光面２２に対して好適に光を反射させて光結合させることができる。すなわち、離間領
域３０が、受光面２２と出射面に加えて、被覆部材４０、その第１の反射面３１で囲まれ
た構造を有し、発光素子１０と光透過部材２０とが離間されることによる光結合効率の低
下を抑え、さらに被覆部材４０による散乱作用で、色ムラ、輝度ムラを好適に改善できる
。 The covering member 40 is formed by scooping up the inner wall of the first frame 51 to the upper surface of the frame,
It extends forward from the back surface outside the element, and extends from the side surface of the element to the top surface. As shown in the drawing, it is preferable to contact the light receiving surface 22 of the light transmitting member. Furthermore, the 1st reflective surface 31 is provided in the surface. The first reflecting surface 31 is a concave curved surface, and the area of the reflecting surface is increased and the reflection efficiency can be improved as compared to a flat surface, and the light receiving member 20 having a wider width than the light emitting element 10 can receive light. Light can be suitably reflected and coupled to the surface 22. That is, the separation region 30 has a structure surrounded by the covering member 40 and the first reflection surface 31 in addition to the light receiving surface 22 and the emission surface, and the light emitting element 10 and the light transmission member 20 are separated from each other. Accordingly, it is possible to suppress the decrease in optical coupling efficiency due to the above, and to suitably improve the color unevenness and the brightness unevenness by the scattering action by the covering member 40.

この発光素子１０の周囲に設けられた第１の反射面３１により、基板の裏面の出射面か
ら高角度方向に出射された光は、第１の枠体５１の内壁表面への入射による光吸収の影響
を受けずに、光透過部材の受光面２２側に反射され、光結合する。また第１の反射面３１
による光の散乱作用によって、光透過部材の受光面２２への入射角を低減することができ
る。よって、特に第１の反射面３１に対向する光透過部材２０の周縁部において光透過部
材２０への入射角が低減され、光透過部材２０が波長変換部材である場合には、波長変換
部材内の光路長差に起因して発生する色ムラを低減することができる。また、光透過部材
の受光面２２で反射された光（戻り光）、受光面２２から放出した二次光の一部も第１の
反射面３１に入射され、同様に光透過部材の受光面２２側に反射・散乱させ、再度受光面
２２に入射させることができ、光透過部材２０への光結合効率を高めることができる。 Light emitted in a high angle direction from the exit surface on the back surface of the substrate by the first reflecting surface 31 provided around the light emitting element 10 is absorbed by the incidence on the inner wall surface of the first frame 51. Without being influenced by the light, it is reflected to the light receiving surface 22 side of the light transmitting member and optically couples. Also, the first reflecting surface 31
The incident angle of the light transmitting member on the light receiving surface 22 can be reduced by the light scattering action of the light transmitting member. Therefore, particularly when the incident angle to the light transmission member 20 is reduced at the peripheral portion of the light transmission member 20 facing the first reflection surface 31, and the light transmission member 20 is a wavelength conversion member, Color unevenness caused by the difference in optical path length can be reduced. Further, the light reflected by the light receiving surface 22 of the light transmitting member (return light) and a part of the secondary light emitted from the light receiving surface 22 are also incident on the first reflecting surface 31, and similarly, the light receiving surface of the light transmitting member. The light can be reflected and scattered on the side 22 and can be incident again on the light receiving surface 22, and the light coupling efficiency to the light transmitting member 20 can be increased.

また、本実施の形態１において、光透過部材の受光面２２と発光素子１０との間の離間
領域３０は空隙となっており、第１の反射面３１は被覆部材３０と、その空隙、空隙中の
空気などの気体との界面に設けられている。一般的に樹脂材料で構成される接着剤などを
介さず、発光素子１０と光透過部材２０とが空隙３０により離間されて配置されているこ
とで、光や熱によって接着剤、さらに光透過部材２０が劣化し、信頼性が低下することを
回避することができる。空隙３０により離間されている場合、光透過部材の受光面２２で
の光反射が増加するが、第１の反射面３１によって戻り光を再び反射させることにより、
光透過部材２０への光結合効率の低下を抑制することができる。従って、第１の反射面３
１が、発光素子１０の出射面より光反射率が高いことが好ましく、さらに光散乱作用が高
いことが好ましい。 Further, in the first embodiment, the separation region 30 between the light receiving surface 22 of the light transmitting member and the light emitting element 10 is a gap, and the first reflecting surface 31 is the covering member 30, the gap, and the gap. It is provided at the interface with gas such as air. In general, the light emitting element 10 and the light transmitting member 20 are arranged apart from each other by a gap 30 without using an adhesive composed of a resin material. It can be avoided that 20 deteriorates and the reliability decreases. When separated by the gap 30, the light reflection at the light receiving surface 22 of the light transmitting member increases, but by reflecting the return light again by the first reflecting surface 31,
A decrease in the efficiency of light coupling to the light transmitting member 20 can be suppressed. Therefore, the first reflecting surface 3
1 is preferably higher in light reflectivity than the emission surface of the light emitting element 10, and more preferably has a high light scattering effect.

さらに、第１の枠体５１と第２の枠体５２の間には、上記と同様に光反射性の被覆部材
４５が充填されており、その表面に第２の反射面３２が設けられている。本実施の形態１
において、被覆部材４５は、光透過部材の表面２１を露出して、光透過部材２０の側面を
被覆しており、第２の反射面３２ａが光透過部材２０の側面と被覆部材４５の界面に設け
られている。これにより、光透過部材２０の側面から側方に漏れ出す光を上方に反射させ
、高輝度の発光を実現することができる。また光透過部材２０が波長変換部材である場合
、その周縁部、側方では、発光素子１０からの一次光成分が不足し波長変換された二次光
成分が多い光が放出される虞があるが、このような側方への光を第２の反射面３２により
内部に反射させることで、一次光と二次光の混色を促進し、色ムラを低減することができ
る。また光透過部材２０の側面を被覆し、表面２１を露出させることで、該発光装置１０
０の主たる光取り出しの窓部（発光面９０）とする面発光型の発光装置が形成され、光透
過部材の表面２１の形状に依存して、該発光装置１００の配光を制御することができる。 Further, a light-reflective coating member 45 is filled between the first frame 51 and the second frame 52 in the same manner as described above, and the second reflection surface 32 is provided on the surface thereof. Yes. Embodiment 1
The covering member 45 exposes the surface 21 of the light transmitting member to cover the side surface of the light transmitting member 20, and the second reflecting surface 32 a is at the interface between the side surface of the light transmitting member 20 and the covering member 45. Is provided. Thereby, the light which leaks to the side from the side surface of the light transmission member 20 is reflected upward, and high-luminance light emission can be realized. Further, when the light transmitting member 20 is a wavelength conversion member, there is a risk that light having a large amount of the secondary light component that has undergone wavelength conversion due to shortage of the primary light component from the light emitting element 10 may be emitted from the periphery and the side. However, by reflecting such lateral light to the inside by the second reflecting surface 32, color mixing of the primary light and the secondary light can be promoted, and color unevenness can be reduced. Further, by covering the side surface of the light transmitting member 20 and exposing the surface 21, the light emitting device 10.
A surface light emitting type light emitting device is formed with a main light extraction window portion (light emitting surface 90) of 0, and the light distribution of the light emitting device 100 can be controlled depending on the shape of the surface 21 of the light transmitting member. it can.

また被覆部材４５は、第２の枠体５２の内壁を該枠体の上面近傍まで這い上がって形成
され、光透過部材２０と第２の枠体５２との間、すなわち光透過部材２０の外側で、その
発光面９０より前方に延出した延出部を有しており、第２の反射面３２はその延出部の表
面まで形成されている。これにより、光透過部材の発光面９０より高角度に放出される光
を上方に反射させ、発光装置１００の正面輝度をさらに高めることができる。なお、この
延出部の第２の反射面３２ｂは凹曲面であって、凸曲面である場合より比較的広い配光を
得ることができる。また、上述のように光透過部材２０が波長変換部材である場合、高角
度の一次光ほど波長変換部材中を伝搬する光路長が長くなり波長変換量が大きくなるため
、発光面９０からの高角度の出射光は二次光成分が多くなる虞があるが、この延出部の表
面に形成される第２の反射面３２ｂにより装置内側に散乱させることで、一次光と二次光
の混色を促進し、さらに色ムラを低減することができる。 The covering member 45 is formed by scooping up the inner wall of the second frame 52 to the vicinity of the upper surface of the frame, and between the light transmitting member 20 and the second frame 52, that is, outside the light transmitting member 20. Thus, it has an extending portion extending forward from the light emitting surface 90, and the second reflecting surface 32 is formed up to the surface of the extending portion. Thereby, the light emitted at a higher angle than the light emitting surface 90 of the light transmitting member can be reflected upward, and the front luminance of the light emitting device 100 can be further increased. Note that the second reflecting surface 32b of the extending portion is a concave curved surface, and a relatively wide light distribution can be obtained as compared with the case of the convex curved surface. Further, when the light transmitting member 20 is a wavelength conversion member as described above, the higher the primary light, the longer the optical path length that propagates through the wavelength conversion member and the greater the wavelength conversion amount. The emitted light at an angle may have a large amount of secondary light component, but by scattering the light to the inside of the apparatus by the second reflecting surface 32b formed on the surface of the extending portion, the mixed color of the primary light and the secondary light And color unevenness can be further reduced.

以上、説明したように、本発明の発光装置は、凹部を備えた被覆部材とその凹部の底に
、被覆部材に少なくとも側面が被覆された光源部の発光素子があり、その凹部内、それを
閉じる蓋のように閉蓋した光透過部材が設けられて、複合的な光源部となっている。その
複合光源部内の離間領域内、すなわち光源部と光透過部材とで挟まれた領域の周囲側面を
被覆部材で包囲して、第１の反射面で囲まれた領域内において、光源から取り出された光
、また光透過部材から光源側に放出された一次光、二次光が、各部材と第１の反射面で互
いに重畳し、また反射面による集光作用により、所望の発光特性、特に配向性、色度分布
、輝度分布の光を複合光源の発光面である光透過部材の表面から取り出す構造となってい
る。従って、後述するように光反射性材料を備えた透明部材の被覆部材であると、反射作
用に、散乱作用が加わるため、その機能をより高めることができる。さらに、その複合光
源から取り出された光、すなわち光透過部材の外側に取り出された光に対して、それを反
射する第２の反射面となる被覆部材が付加的に設けられると、上記各特性の制御性が高め
られる。従って、第１，２の反射面は、一体の被覆部材で形成されても良く、各実施形態
で説明するように、個々に成形したものでも良い。 As described above, the light-emitting device of the present invention has a light-emitting element of a light source unit in which at least a side surface is coated on a covering member at the bottom of the covering member having the concave portion and the concave portion. A light-transmitting member that is closed like a closing lid is provided to form a composite light source unit. In the separated area in the composite light source part, that is, the peripheral side surface of the area sandwiched between the light source part and the light transmitting member is surrounded by the covering member, and is taken out from the light source in the area surrounded by the first reflecting surface. The primary light and secondary light emitted from the light transmitting member to the light source side are superimposed on each other and the first reflecting surface, and desired light emission characteristics, In this structure, light of orientation, chromaticity distribution, and luminance distribution is extracted from the surface of the light transmitting member that is the light emitting surface of the composite light source. Therefore, since it is a covering member of a transparent member provided with a light-reflective material as will be described later, the scattering function is added to the reflecting action, so that the function can be further enhanced. Further, when a covering member serving as a second reflecting surface for reflecting the light extracted from the composite light source, that is, the light extracted outside the light transmitting member, is additionally provided, each of the above characteristics. Controllability is improved. Therefore, the first and second reflecting surfaces may be formed of an integral covering member, or may be individually molded as described in each embodiment.

一方、実施形態６，７、図８，９に観るように、光源部に波長変換部材などの光透過部
材が内包され、すなわち発光素子と光透過部材が、直接、あるいは接着剤などを介して、
互いに接合され、複合光源部が一体的なものとすることもできる。この場合は、光源部よ
り前方に突出した被覆部材の反射面は、上記複合光源の外側に設けられる第２の反射面と
同様なものとなる。すなわち、上述したように、光源部近傍において、被覆部材、上記光
源部側の第１の反射面と同様に、反射、集光、散乱作用により、所望の発光特性を得るこ
とができる。さらに、光源部に内包された光透過部材に代えて、別の透光性部材を用いて
、所望形状の被覆部材の延出部、その第２の反射面を設けて、所望の発光面の形状、発光
特性を得ることができる。具体的には、実施形態５，６のように、光源部より幅の狭い放
出口を備えた被覆部材の延出部、またその透光性部材とすることができる。他方、放出側
が幅広となる形状とすることもでき、上記透光性部材を用いることで、上述した離間領域
と同様に、その部材内で光が重畳されて、所望の発光をその透光性部材表面の第２の発光
面から取り出すことができる。 On the other hand, as seen in the sixth and seventh embodiments and FIGS. 8 and 9, the light source includes a light transmitting member such as a wavelength conversion member, that is, the light emitting element and the light transmitting member are directly or via an adhesive or the like. ,
The composite light source units may be integrated with each other. In this case, the reflection surface of the covering member protruding forward from the light source unit is the same as the second reflection surface provided outside the composite light source. That is, as described above, in the vicinity of the light source unit, desired light emission characteristics can be obtained by the reflection, condensing, and scattering actions, similarly to the covering member and the first reflection surface on the light source unit side. Further, instead of the light transmissive member included in the light source unit, another light transmissive member is used to provide an extended portion of the covering member having a desired shape, its second reflecting surface, and a desired light emitting surface. Shape and light emission characteristics can be obtained. Specifically, as in the fifth and sixth embodiments, the extending portion of the covering member having a narrower emission port than the light source portion, and the translucent member thereof can be used. On the other hand, the emission side can also be formed in a wide shape. By using the translucent member, light is superimposed in the member in the same manner as the above-described separated region, and desired light emission is transmitted through the translucent member. It can be taken out from the second light emitting surface of the member surface.

次に、本発明の発光装置の各構成部材について、以下に詳述する。   Next, each component of the light emitting device of the present invention will be described in detail below.

（発光素子）
発光素子１０は公知のもの、具体的には半導体発光素子を利用でき、特にＧａＮ系化合
物半導体であれば、蛍光物質を効率良く励起できる短波長の可視光や紫外光が発光可能で
あるため好ましい。具体的な発光ピーク波長は２４０ｎｍ以上５６０ｎｍ以下、好ましく
は３８０ｎｍ以上４７０ｎｍ以下である。なお、このほか、ＺｎＳｅ系、ＩｎＧａＡｓ系
、ＡｌＩｎＧａＰ系半導体の発光素子でもよい。 (Light emitting element)
The light-emitting element 10 can be a known element, specifically a semiconductor light-emitting element, and is particularly preferably a GaN-based compound semiconductor because it can emit visible light and ultraviolet light having a short wavelength that can excite a fluorescent substance efficiently. . A specific emission peak wavelength is 240 nm or more and 560 nm or less, preferably 380 nm or more and 470 nm or less. In addition, a light emitting element of ZnSe, InGaAs, or AlInGaP semiconductor may be used.

（発光素子構造）
半導体層による発光素子構造１１は、図３に例示するように少なくとも第１導電型（ｎ
型）層２と第２導電型（ｐ型）層４とにより構成され、更にその間に活性層３を有する構
造が好ましい。また、電極構造は、一方の主面側に第１導電型（負）、第２導電型（正）
の両電極６，７が設けられる同一面側電極構造が好ましいが、半導体層の各主面に対向し
て電極が各々設けられる対向電極構造でも良い。発光素子１０の実装形態も、例えば上記
同一面側電極構造では、電極形成面を実装面として、それに対向する基板１側を主な出射
面とするフリップチップ実装が、その出射面と光透過部材２０との光学的な接続上好まし
い。この他、電極形成面側を主な出射面として、その上に光透過部材を結合する実装、フ
ェイスアップ実装、また配線構造を備えた光透過部材にフリップチップ実装、上記対向電
極構造で光透過部材と実装基板に接続すること、ができ、好ましくは発光素子と光透過部
材に配線、電極を備えない実施例の実装が良い。なお、半導体層１１の成長基板１は、発
光素子構造を構成しない場合には除去してもよく、成長基板が除去された半導体層に、支
持基板、例えば導電性基板または別の透光性部材・基板を接着した構造とすることもでき
る。この支持基板に光透過部材２０を用いることもでき、その他、ガラス、樹脂などの光
透過部材により半導体層が接着・被覆されて、支持された構造の素子でもよい。成長基板
の除去は、例えば支持体、装置又はサブマウントに実装又は保持して、剥離、研磨、若し
くはＬＬＯ（Laser Lift Off）で実施できる。また、発光素子１０は光反射構造を有する
ことができ、具体的には、半導体層１１の互いに対向する２つの主面の内、光取り出し側
（出射面側）と対向する他方の主面を光反射側（図１における下側）とし、この光反射側
の半導体層内や電極などに光反射構造を設けることができる。光反射構造の例として、半
導体層内に多層膜反射層が設ける構造、あるいは半導体層の上にＡｇ、Ａｌ等の光反射性
の高い金属膜や誘電体多層膜を有する電極、反射層を設けた構造がある。 (Light emitting element structure)
As illustrated in FIG. 3, the light emitting device structure 11 including a semiconductor layer has at least the first conductivity type (n
Type) layer 2 and second conductivity type (p-type) layer 4, and a structure having active layer 3 between them is preferable. The electrode structure has a first conductivity type (negative) and a second conductivity type (positive) on one main surface side.
Although the same surface side electrode structure in which both the electrodes 6 and 7 are provided is preferable, a counter electrode structure in which electrodes are respectively provided to face the main surfaces of the semiconductor layer may be used. As for the mounting form of the light emitting element 10, for example, in the same surface side electrode structure, flip chip mounting in which the electrode forming surface is the mounting surface and the substrate 1 side facing it is the main emitting surface is the emitting surface and the light transmitting member. 20 is preferable in terms of optical connection. In addition to this, the electrode forming surface side is the main emission surface, and the light transmission member is mounted on it, face-up mounting, flip chip mounting on the light transmission member with wiring structure, and light transmission with the above-mentioned counter electrode structure It is possible to connect the member and the mounting substrate, and it is preferable to mount the embodiment in which the light emitting element and the light transmitting member are not provided with wiring and electrodes. Note that the growth substrate 1 of the semiconductor layer 11 may be removed when the light emitting element structure is not formed, and a support substrate such as a conductive substrate or another translucent member is added to the semiconductor layer from which the growth substrate has been removed. -It is also possible to have a structure in which substrates are bonded. The light transmitting member 20 can also be used for the supporting substrate, and other elements having a structure in which the semiconductor layer is bonded and covered with a light transmitting member such as glass or resin may be used. The removal of the growth substrate can be performed by peeling, polishing, or LLO (Laser Lift Off) by mounting or holding the growth substrate on a support, device, or submount, for example. In addition, the light emitting element 10 can have a light reflecting structure. Specifically, of the two main surfaces of the semiconductor layer 11 facing each other, the other main surface facing the light extraction side (emission surface side) is formed. The light reflection side (the lower side in FIG. 1) can be provided, and a light reflection structure can be provided in the semiconductor layer on this light reflection side or in an electrode. As an example of the light reflecting structure, a structure in which a multilayer reflective layer is provided in the semiconductor layer, or an electrode having a highly light reflective metal film such as Ag or Al or a dielectric multilayer film, or a reflective layer is provided on the semiconductor layer. There is a structure.

（窒化物半導体発光素子）
発光素子１０の一例として、図３の窒化物半導体の発光素子１０では、成長基板１であ
るＣ面サファイア基板の上に、第１の窒化物半導体層２であるｎ型半導体層、活性層３で
ある発光層、第２の窒化物半導体層４であるｐ型半導体層が順にエピタキシャル成長され
ている。そして、ｎ型層２の一部が露出されて第１の電極７であるｎ型パッド電極を形成
し、ｐ型層４のほぼ全面にＩＴＯ等の透光性導電層５、第２の電極６であるｐ型パッド電
極が形成されている。さらに、保護膜８をｎ型、ｐ型パッド電極６，７の表面を露出し、
半導体層を被覆して設けられる。なお、ｎ型パッド電極７は、ｐ型同様に透光性導電層を
介して形成してもよい。成長基板１は、Ｃ面サファイアの他、Ｒ面、及びＡ面、スピネル
（ＭｇＡｌ₂Ｏ₄）のような絶縁性基板、また炭化珪素（６Ｈ、４Ｈ、３Ｃ）、Ｓｉ、Ｚｎ
Ｓ、ＺｎＯ、ＧａＡｓ、ＧａＮやＡｌＮ等の半導体の導電性基板がある。窒化物半導体の
例としては、一般式がＩｎ_xＡｌ_yＧａ_1-x-yＮ（０≦ｘ、０≦ｙ、ｘ＋ｙ≦１）の他、Ｂ
やＰ、Ａｓを混晶してもよい。また、ｎ型、ｐ型半導体層２，４は、単層、多層を特に限
定されず、活性層３は単一（ＳＱＷ）又は多重量子井戸構造（ＭＱＷ）が好ましい。青色
発光の素子構造１１の例としては、サファイア基板上に、バッファ層などの窒化物半導体
の下地層、例えば低温成長薄膜ＧａＮとＧａＮ層、を介して、ｎ型半導体層として、例え
ばＳｉドープＧａＮのｎ型コンタクト層とＧａＮ／ＩｎＧａＮのｎ型多層膜層が積層され
、続いてＩｎＧａＮ／ＧａＮのＭＱＷの活性層、更にｐ型半導体層として、例えばＭｇド
ープのＩｎＧａＮ／ＡｌＧａＮのｐ型多層膜層とＭｇドープＧａＮのｐ型コンタクト層が
積層された構造がある。 (Nitride semiconductor light emitting device)
As an example of the light emitting element 10, in the nitride semiconductor light emitting element 10 of FIG. 3, an n-type semiconductor layer that is the first nitride semiconductor layer 2 and the active layer 3 are formed on the C-plane sapphire substrate that is the growth substrate 1. The light emitting layer and the p-type semiconductor layer which is the second nitride semiconductor layer 4 are epitaxially grown in this order. Then, a part of the n-type layer 2 is exposed to form an n-type pad electrode, which is the first electrode 7, and a light-transmitting conductive layer 5 such as ITO is formed on almost the entire surface of the p-type layer 4. 6, a p-type pad electrode is formed. Further, the protective film 8 is n-type and the surfaces of the p-type pad electrodes 6 and 7 are exposed,
It is provided so as to cover the semiconductor layer. Note that the n-type pad electrode 7 may be formed through a light-transmitting conductive layer as in the p-type. The growth substrate 1 includes C-plane sapphire, R-plane and A-plane, an insulating substrate such as spinel (MgAl ₂ O ₄ ), silicon carbide (6H, 4H, 3C), Si, Zn
There are semiconductor conductive substrates such as S, ZnO, GaAs, GaN, and AlN. Examples of the nitride semiconductor, other general formula _{In x Al y Ga 1-xy} N (0 ≦ x, 0 ≦ y, x + y ≦ 1), B
Or, P and As may be mixed. The n-type and p-type semiconductor layers 2 and 4 are not particularly limited to a single layer or multiple layers, and the active layer 3 preferably has a single (SQW) or multiple quantum well structure (MQW). As an example of the blue light emitting element structure 11, an n-type semiconductor layer such as Si-doped GaN is formed on a sapphire substrate via a nitride semiconductor underlayer such as a buffer layer, for example, a low-temperature growth thin film GaN and a GaN layer. N-type contact layer and GaN / InGaN n-type multilayer film layer, followed by InGaN / GaN MQW active layer, and p-type semiconductor layer, for example, Mg-doped InGaN / AlGaN p-type multilayer film layer And a p-type contact layer of Mg-doped GaN.

（光透過部材）
また図１の発光装置１００は、発光素子１０からの光を透過する光透過部材２０を備え
る。光透過部材２０は、通過する光の少なくとも一部を波長変換可能な波長変換材料を有
する光変換部材であることが好ましい。例えば実施例のように、光源からの一次光が、光
透過部材２０中の波長変換材料としての蛍光体を励起することで、一次光と異なった波長
を持つ二次光が得られ、さらに一次光との混色により、所望の色相を有する出射光を実現
できる。 (Light transmission member)
The light emitting device 100 of FIG. 1 includes a light transmitting member 20 that transmits light from the light emitting element 10. The light transmission member 20 is preferably a light conversion member having a wavelength conversion material capable of converting the wavelength of at least part of the light passing therethrough. For example, as in the embodiment, the primary light from the light source excites the phosphor as the wavelength conversion material in the light transmitting member 20 to obtain secondary light having a wavelength different from that of the primary light. Outgoing light having a desired hue can be realized by color mixing with light.

上述の通り、実施の形態１の光透過部材２０は、表面２１（発光面９０）からの平面視
において発光素子１０を内包し、その側面が、発光素子１０の側面（端面）よりも外方に
突出し、発光素子１０の出射面より幅広な受光面２２でもって発光素子１０と光学的に接
続されるため損失が少ない。このほか、後述の実施の形態６，７に示すように、光透過部
材２０の側面が、発光素子１０の側面よりも内側に位置する、つまり発光素子１０の出射
面が突出される形態でもよく、この例のように光透過部材の受光面２２を発光素子１０の
出射面より小さくした形態であってもよい。発光素子に対して発光領域を絞ることで相対
的に輝度が高められ、また混色の均一化が図れ、色ムラが低減される。また、光透過部材
２０の側面が発光素子１０の側面と略同一面上に位置する形態であれば、光透過部材の外
縁部において、発光素子１０からの光量が不足して色ムラが発生しやすくなるのを抑制で
きる。 As described above, the light transmissive member 20 according to the first embodiment includes the light emitting element 10 in a plan view from the surface 21 (light emitting surface 90), and the side surface is outward from the side surface (end surface) of the light emitting element 10. The light receiving surface 22 is wider than the light emitting surface of the light emitting element 10 and is optically connected to the light emitting element 10 so that there is little loss. In addition, as shown in Embodiments 6 and 7 to be described later, the side surface of the light transmitting member 20 may be positioned inside the side surface of the light emitting element 10, that is, the emission surface of the light emitting element 10 may protrude. As in this example, the light receiving surface 22 of the light transmitting member may be smaller than the light emitting surface of the light emitting element 10. By narrowing the light emitting region with respect to the light emitting element, the luminance is relatively increased, the color mixture is made uniform, and the color unevenness is reduced. Further, if the side surface of the light transmitting member 20 is located on the same plane as the side surface of the light emitting element 10, the amount of light from the light emitting element 10 is insufficient at the outer edge portion of the light transmitting member, resulting in color unevenness. It can suppress becoming easy.

ここで、光透過部材２０の母材となる透光性材料としては、下記被覆部材４０と同様な
材料を用いることができ、例えば樹脂、又はガラスなどの無機物を用いることができる。
変換機能を備えない場合も、蛍光体を除いて、又はそれに置換して、光変換の光透過部材
と同様の材料を用いることが好ましい。また、表面２１、受光面２２は、実施例のように
光透過部材が板状である場合には、両面とも略平坦な面であること、更には対向する両面
が互いに略平行であることが本発明の導光部材を介した光結合の効率が高まり、また接合
が容易となり好ましい。一方で、板状に限らず、全体又は一部に曲面を有する形態、凹凸
面などの面状の形態など、種々の形状若しくは形態、例えば集光、分散するための形状、
例えばレンズ状などのような光学的な形状とすることもできる。また、波長変換機能とし
て、発光素子の一次光とその変換光（二次光）の混色光を発光する他に、例えば発光素子
の紫外光による変換光、若しくは複数の変換光による混色光のように、一次光から変換さ
れた二次光を主に出射する発光装置とすることもできる。 Here, as a translucent material used as a base material of the light transmissive member 20, the material similar to the following coating member 40 can be used, for example, inorganic substances, such as resin or glass, can be used.
Even when the conversion function is not provided, it is preferable to use the same material as the light transmission member for light conversion, excluding or replacing the phosphor. Further, when the light transmitting member is plate-like as in the embodiment, both the front surface 21 and the light receiving surface 22 are substantially flat surfaces, and furthermore, both opposing surfaces are substantially parallel to each other. The efficiency of optical coupling through the light guide member of the present invention is increased, and joining is facilitated, which is preferable. On the other hand, it is not limited to a plate shape, various shapes or forms such as a form having a curved surface in whole or in part, a surface form such as an uneven surface, for example, a shape for condensing and dispersing,
For example, it may be an optical shape such as a lens shape. Further, as a wavelength conversion function, in addition to emitting primary light of the light emitting element and mixed light of the converted light (secondary light), for example, converted light by ultraviolet light of the light emitting element or mixed light by a plurality of converted lights In addition, a light-emitting device that mainly emits secondary light converted from primary light can be used.

波長変換機能を備えた光透過部材２０は、具体的にガラス板、それに光変換部材を備え
たもの、あるいは光変換部材の蛍光体結晶若しくはその相を有する単結晶体、多結晶体、
アモルファス体、セラミック体、あるいは蛍光体結晶粒子による、それと適宜付加された
透光性材料との焼結体、凝集体、多孔質性材料、それらに透光性材料、例えば透光性樹脂
を混入、含浸したもの、あるいは蛍光体粒子を含有する透光性部材、例えば透光性樹脂の
成形体等から構成される。なお、光透過部材２０は、樹脂等の有機材料よりも無機材料で
構成されることが耐熱性の観点からは好ましい。具体的には蛍光体を含有する透光性の無
機材料からなることが好ましく、特に蛍光体と無機物（結合材、バインダー）との焼結体
、あるいは蛍光体からなる焼結体や結晶とすることで信頼性が高まる。なお、実施例のＹ
ＡＧの蛍光体を用いる場合、ＹＡＧの単結晶や高純度の焼結体のほか、アルミナ（Ａｌ₂
Ｏ₃）を結合材とするＹＡＧ／アルミナの焼結体、ガラスを結合材とした焼結体が信頼性
の観点から好ましい。また、光透過部材２０を板状とすることで、面状に構成される発光
素子１０の出射面との結合効率が良く、光透過部材２０の主面とが略平行になるよう容易
に位置合わせできる。加えて、光透過部材２０の厚みを略一定とすることで、通過する光
の波長変換量を略均一として混色の割合を安定させ、発光面９０の部位における色むらを
抑止できる。このため、１つの光透過部材２０に複数の発光素子１０を搭載する場合にお
いて、個々の発光素子１０の配置に起因する発光面９０内の輝度や色度の分布にむらが少
なく略均一で高輝度の発光を得ることができる。なお、波長変換機能を備えた光透過部材
２０の厚みは、発光効率や色度調整において、１０μｍ以上５００μｍ以下であることが
好ましく、さらには５０μｍ以上３００μｍ以下であることがより好ましい。 The light transmissive member 20 having a wavelength conversion function is specifically a glass plate, a material provided with the light conversion member, or a phosphor crystal of the light conversion member or a single crystal having a phase thereof, a polycrystal,
Sintered body, aggregate, porous material, and translucent material, such as translucent resin, with amorphous body, ceramic body, or phosphor crystal particles and appropriately added translucent material , Impregnated materials, or translucent members containing phosphor particles, for example, molded products of translucent resin. In addition, it is preferable from a heat resistant viewpoint that the light transmissive member 20 is comprised with an inorganic material rather than organic materials, such as resin. Specifically, it is preferably made of a translucent inorganic material containing a phosphor, and in particular, a sintered body of a phosphor and an inorganic substance (binding material, binder), or a sintered body or crystal made of a phosphor. This increases reliability. In the example, Y
When using an AG phosphor, in addition to YAG single crystals and high-purity sintered bodies, alumina (Al ₂
From the viewpoint of reliability, a sintered body of YAG / alumina having O ₃ ) as a binder and a sintered body having glass as a binder are preferable. Further, by forming the light transmitting member 20 in a plate shape, the coupling efficiency with the emission surface of the light emitting element 10 configured in a planar shape is good, and the light transmitting member 20 can be easily positioned so as to be substantially parallel to the main surface of the light transmitting member 20. Can be combined. In addition, by making the thickness of the light transmissive member 20 substantially constant, the wavelength conversion amount of the light passing therethrough can be made substantially uniform, the ratio of color mixing can be stabilized, and color unevenness at the site of the light emitting surface 90 can be suppressed. Therefore, in the case where a plurality of light emitting elements 10 are mounted on one light transmitting member 20, there is little unevenness in luminance and chromaticity distribution in the light emitting surface 90 due to the arrangement of the individual light emitting elements 10, and it is substantially uniform and high. Luminous light emission can be obtained. Note that the thickness of the light transmitting member 20 having a wavelength conversion function is preferably 10 μm or more and 500 μm or less, and more preferably 50 μm or more and 300 μm or less, in terms of light emission efficiency and chromaticity adjustment.

波長変換部材は、青色発光素子と好適に組み合わせて白色発光とでき、波長変換部材に
用いられる代表的な蛍光体としては、ガーネット構造のセリウムで付括されたＹＡＧ系蛍
光体（イットリウム・アルミニウム・ガーネット）及びＬＡＧ系蛍光体（ルテチウム・ア
ルミニウム・ガーネット）が挙げられ、特に、高輝度且つ長時間の使用時においては（Ｒ
ｅ_1-xＳｍ_x）₃（Ａｌ_1-yＧａ_y）₅Ｏ₁₂：Ｃｅ（０≦ｘ＜１、０≦ｙ≦１、但し、Ｒｅは、
Ｙ、Ｇｄ、Ｌａ、Ｌｕからなる群より選択される少なくとも一種の元素である。）等が好
ましい。またＹＡＧ、ＬＡＧ、ＢＡＭ、ＢＡＭ：Ｍｎ、（Ｚｎ、Ｃｄ）Ｚｎ：Ｃｕ、ＣＣ
Ａ、ＳＣＡ、ＳＣＥＳＮ、ＳＥＳＮ、ＣＥＳＮ、ＣＡＳＢＮ及びＣａＡｌＳｉＮ₃：Ｅｕ
からなる群から選択される少なくとも１種を含む蛍光体が使用できる。波長変換部材は、
光透過部材の他に、例えば光透過部材と発光素子との間、その結合部材中、発光素子と被
覆部材との間、にも設けることもできる。光透過部材、波長変換部材及び焼結体も同様に
発光装置中に配置できる。黄〜赤色発光を有する窒化物系蛍光体等を用いて赤味成分を増
し、平均演色評価数Ｒａの高い照明や電球色ＬＥＤ等を実現することもできる。具体的に
は、発光素子の発光波長に合わせてＣＩＥの色度図上の色度点の異なる蛍光体の量を調整
し含有させることでその蛍光体間と発光素子で結ばれる色度図上の任意の点を発光させる
ことができる。その他に、近紫外〜可視光を黄色〜赤色域に変換する窒化物蛍光体、酸窒
化物蛍光体、珪酸塩蛍光体を用いることができる。例えば、Ｌ₂ＳｉＯ₄：Ｅｕ（Ｌはアル
カリ土類金属）、特に（Ｓｒ_xＭａｅ_1-x）₂ＳｉＯ₄：Ｅｕ（ＭａｅはＣａ、Ｂａなどのア
ルカリ土類金属）などが挙げられる。窒化物系蛍光体、オキシナイトライド（酸窒化物）
蛍光体としては、Ｓｒ−Ｃａ−Ｓｉ−Ｎ：Ｅｕ、Ｃａ−Ｓｉ−Ｎ：Ｅｕ、Ｓｒ−Ｓｉ−Ｎ
：Ｅｕ、Ｓｒ−Ｃａ−Ｓｉ−Ｏ−Ｎ：Ｅｕ、Ｃａ−Ｓｉ−Ｏ−Ｎ：Ｅｕ、Ｓｒ−Ｓｉ−Ｏ
−Ｎ：Ｅｕなどがあり、アルカリ土類窒化ケイ素蛍光体としては、一般式ＬＳｉ₂Ｏ₂Ｎ₂
：Ｅｕ、一般式Ｌ_xＳｉ_yＮ_(2/3x+4/3y)：Ｅｕ若しくはＬ_xＳｉ_yＯ_zＮ_{(2/3x+4/3y-2/3z)}：
Ｅｕ（Ｌは、Ｓｒ、Ｃａ、ＳｒとＣａのいずれか）で表される。 The wavelength conversion member can be suitably combined with a blue light emitting element to emit white light. As a typical phosphor used for the wavelength conversion member, a YAG phosphor (yttrium, aluminum, Garnet) and LAG-based phosphors (lutetium / aluminum / garnet), particularly in the case of high brightness and long time use (R
e _1-x Sm _x ) ₃ (Al _1-y Ga _y ) ₅ O ₁₂ : Ce (0 ≦ x <1, 0 ≦ y ≦ 1, where Re is
It is at least one element selected from the group consisting of Y, Gd, La, and Lu. Etc.) are preferred. YAG, LAG, BAM, BAM: Mn, (Zn, Cd) Zn: Cu, CC
A, SCA, SCESN, SESN, CESN, CASBN and CaAlSiN ₃ : Eu
A phosphor containing at least one selected from the group consisting of can be used. The wavelength conversion member is
In addition to the light transmitting member, for example, it can be provided between the light transmitting member and the light emitting element, in the coupling member, and between the light emitting element and the covering member. Similarly, the light transmitting member, the wavelength converting member, and the sintered body can be disposed in the light emitting device. It is also possible to increase the reddish component using a nitride-based phosphor having yellow to red light emission, and to realize illumination with high average color rendering index Ra, light bulb color LED, and the like. Specifically, by adjusting the amount of phosphors having different chromaticity points on the CIE chromaticity diagram according to the light emission wavelength of the light emitting device, the phosphors are connected with each other on the chromaticity diagram. Any point can be made to emit light. In addition, nitride phosphors, oxynitride phosphors, and silicate phosphors that convert near-ultraviolet to visible light into a yellow to red region can be used. For example, L ₂ SiO ₄ : Eu (L is an alkaline earth metal), particularly (Sr _x Mae _1-x ) ₂ SiO ₄ : Eu (Mae is an alkaline earth metal such as Ca and Ba) and the like. Nitride phosphors, oxynitrides (oxynitrides)
Examples of the phosphor include Sr—Ca—Si—N: Eu, Ca—Si—N: Eu, and Sr—Si—N.
: Eu, Sr-Ca-Si-ON: Eu, Ca-Si-ON: Eu, Sr-Si-O
-N: Eu and the like, and as the alkaline earth silicon nitride phosphor, the general formula LSi ₂ O ₂ N ₂
: Eu, general formula _{L x Si y N (2 /} 3x + 4 / 3y): Eu or _{L x Si y O z N (} 2 / 3x + 4 / 3y-2 / 3z):
Eu (L is Sr, Ca, or any one of Sr and Ca).

（被覆部材）
被覆部材４０，４５は、図１に示すように、発光素子１０、光透過部材２０の一部を被
覆する。そして、本発明においては、被覆部材が素子等から垂下され、光の漏れ経路の形
成を防ぐことから、実装基板、更にはそれに設けられた配線より、被覆部材の反射率が高
いことが好ましい。また、光反射材料４６，４７を含有する被覆部材４０，４５は、その
基材は透光性の樹脂材料が好ましく、シリコーン樹脂組成物、変性シリコーン樹脂組成物
等を使用することが好ましいが、エポキシ樹脂組成物、変性エポキシ樹脂組成物、アクリ
ル樹脂組成物等の透光性を有する絶縁樹脂組成物を用いることができる。また、これらの
樹脂を少なくとも一種以上含むハイブリッド樹脂等、耐候性に優れた被覆部材も利用でき
る。さらに、ガラス、シリカゲル等の耐光性に優れた無機物を用いることもできる。また
、樹脂材料を成形することで、所望の形状に成形でき、また所望領域を被覆でき、本発明
では光源部の発光素子、光透過部材の表面、特にその側面を被覆して形成できる。また、
その発光面側の表面も同様に所望形状とでき、図示するような平坦な面状の他、凹や凸の
曲面とできる。実施の形態１では耐熱性・耐候性の観点から被覆部材としてシリコーン樹
脂を使用する。 (Coating member)
The covering members 40 and 45 cover a part of the light emitting element 10 and the light transmitting member 20 as shown in FIG. In the present invention, since the covering member hangs down from the element or the like and prevents the formation of a light leakage path, it is preferable that the reflectance of the covering member is higher than that of the mounting substrate and the wiring provided thereon. In addition, the covering members 40 and 45 containing the light reflecting materials 46 and 47 are preferably made of a translucent resin material for the base material, preferably a silicone resin composition, a modified silicone resin composition, etc. An insulating resin composition having translucency such as an epoxy resin composition, a modified epoxy resin composition, and an acrylic resin composition can be used. A covering member having excellent weather resistance, such as a hybrid resin containing at least one of these resins, can also be used. Furthermore, inorganic materials having excellent light resistance such as glass and silica gel can be used. Further, by molding the resin material, it can be formed into a desired shape, and a desired region can be covered. In the present invention, the surface of the light emitting element of the light source unit and the light transmitting member, particularly the side surfaces thereof, can be formed. Also,
The surface on the light emitting surface side can be similarly formed in a desired shape, and can be a concave or convex curved surface in addition to a flat surface shape as illustrated. In the first embodiment, a silicone resin is used as a covering member from the viewpoint of heat resistance and weather resistance.

また、被覆部材４０，４５は、上記基材中に少なくとも１種類の光反射性材料４６，４
７を含有してなる。光反射性材料４６，４７を含有することで、被覆部材４０，４５の反
射率が高まり、更に好適には低吸収性の粒子を用いると、光吸収、損失が低減され、光散
乱性を備えた被覆部材とできる。被覆部材４０，４５中に含有される光反射性材料４６，
４７は、Ｔｉ、Ｚｒ、Ｎｂ、Ａｌ、Ｓｉからなる群から選択される１種の酸化物、若しく
はＡｌＮ、ＭｇＦの少なくとも１種であり、具体的にはＴｉＯ₂、ＺｒＯ₂、Ｎｂ₂Ｏ₅、Ａ
ｌ₂Ｏ₃、ＭｇＦ、ＡｌＮ、ＳｉＯ₂よりなる群から選択される少なくとも１種である。光
反射性材料の粒子が、Ｔｉ、Ｚｒ、Ｎｂ、Ａｌからなる群から選択される１種の酸化物で
あることで、材料の高い反射性及び低吸収性とでき、基材、特に透光性樹脂との屈折率差
を高められ、好ましい。また、被覆部材４０，４５は、上記光反射性材料による成形体で
もって構成することもでき、具体的には上記粒子を凝集した凝集体、焼結体、などの多孔
質材料とすることもでき、その他に、ゾル・ゲル法による成形体でもよく、上記光反射性
材料と多孔質内の空気との屈折率差を大きくし、光反射性を高められるため、また無機材
料で構成できるため、好ましい。一方、上記樹脂などの母材を備えた被覆部材と比較する
と、所望の形状に成形すること及びその被覆領域の制御性が良く、また封止性能、気密性
能を高めること、ができ、本発明では上記母材を備えた被覆部材とする方が好ましい。ま
た、両者の被覆部材の特性を考慮して、両者の複合的な成形体とでき、例えば、多孔質成
形体の外表面側に樹脂を含浸させ、発光素子側の内表面側では多孔質とした構造とできる
。このように、被覆部材若しくはそれによる包囲体は、内部領域と外部とが連通されたり
、気体透過性であったりしてもよく、少なくとも光が漏れ出さない形態であれば良い。 Further, the covering members 40 and 45 include at least one kind of light reflective material 46 and 4 in the base material.
7 is contained. By including the light reflecting materials 46 and 47, the reflectivity of the covering members 40 and 45 is increased, and more preferably, when low-absorbing particles are used, light absorption and loss are reduced, and light scattering is provided. A covering member can be formed. A light reflecting material 46 contained in the covering members 40, 45;
47 is one oxide selected from the group consisting of Ti, Zr, Nb, Al, and Si, or at least one of AlN and MgF, specifically, TiO ₂ , ZrO ₂ , Nb ₂ O _5. , A
It is at least one selected from the group consisting of l ₂ O ₃ , MgF, AlN, and SiO ₂ . Since the light-reflective material particles are one kind of oxide selected from the group consisting of Ti, Zr, Nb, and Al, the material can be made highly reflective and low-absorbent. The difference in refractive index with the functional resin is increased, which is preferable. The covering members 40 and 45 can also be formed of a molded body made of the light reflecting material. Specifically, the covering members 40 and 45 may be made of a porous material such as an aggregate obtained by agglomerating the particles or a sintered body. In addition, a molded body by the sol-gel method may be used, because the difference in refractive index between the light reflective material and the air in the porous layer can be increased, and the light reflectivity can be increased. ,preferable. On the other hand, compared with a covering member provided with a base material such as the resin, it can be molded into a desired shape and controllability of the covering region is good, and sealing performance and airtightness can be improved. Then, it is preferable to use a covering member provided with the base material. Also, considering the characteristics of both covering members, a composite molded body of both can be formed. For example, the outer surface side of the porous molded body is impregnated with resin, and the inner surface side of the light emitting element side is porous. The structure can be made. As described above, the covering member or the surrounding body may be configured such that the inner region communicates with the outside or is gas permeable and at least does not leak light.

上述した母材中に光反射性材料４６，４７を含有する被覆部材４０，４５では、その含
有濃度、密度により光の漏れ出す深さが異なるため、発光装置形状、大きさに応じて、適
宜濃度、密度を調整すると良い。例えば比較的小さな発光装置で肉厚を小さくする場合は
、高濃度の光反射性材料４６，４７を備えることが好ましい。一方で、光反射性材料４６
，４７を含有する被覆部材４０，４５の原料の調製、その原料の塗布、成形などの製造過
程において、それに適したようにその濃度を調整する。上記多孔質体についても同様であ
る。一例として、実施例の場合には、光反射性材料４６，４７の含有濃度は２０重量パー
セント濃度（ｗｔ％）以上、その肉厚は２０μｍ以上とするのが好適であり、発光面９０
から高輝度で指向性の高い放出光が得られ、適度な粘性で被覆部材によるアンダーフィル
の形成など容易にできる。また、光反射性材料の濃度を高くすれば被覆部材の熱拡散性を
高めることができる。 In the covering members 40 and 45 containing the light-reflective materials 46 and 47 in the base material described above, the depth at which light leaks differs depending on the concentration and density of the materials. The density and density should be adjusted. For example, when the wall thickness is reduced with a relatively small light emitting device, it is preferable to provide high-concentration light reflecting materials 46 and 47. On the other hand, the light reflective material 46
, 47 in the manufacturing process such as preparation of the covering members 40 and 45, application of the raw materials, molding, and the like, the concentration thereof is adjusted appropriately. The same applies to the porous body. As an example, in the case of the embodiment, it is preferable that the light-reflecting materials 46 and 47 have a concentration of 20 weight percent (wt%) or more and a thickness of 20 μm or more.
Therefore, emitted light with high brightness and high directivity can be obtained, and underfill can be easily formed with a covering member with an appropriate viscosity. Moreover, if the density | concentration of a light reflective material is made high, the thermal diffusibility of a coating | coated member can be improved.

被覆部材の形成領域は、発光素子１０における少なくとも側面に被覆部材４０を設け、
好ましくは光透過部材２０の側面も被覆し、更に好ましくは、光透過部材及び発光素子を
含む光源部において発光面を露出させてその他を被覆する。これにより、光透過部材の側
面から光が漏れ出すのを回避でき、その側面からの比較的強度の大きい、また光変換部材
を有する場合は色味差を有する光を抑止して、放射光の指向性を良好にし、輝度ムラ、色
ムラを低減できる。また、各部材、素子の側面を被覆して、光取り出し方向側へ制限する
ことで、指向性、輝度を高められる。また、光透過部材２０が波長変換材料を含有する場
合には、この波長変換材料の発熱が特に著しいため、それを改善できる。光透過部材２０
の側面が被覆部材４５により被覆され、かつ表面２１が露出されていれば、その外面形状
は特に限定されない。また図８に示すように、複数の発光素子１０が１つの光透過部材２
０に接合される場合には、その発光素子間についても被覆部材４０が充填されて、受光面
２２の離間領域を被覆することが好ましい。接合領域の光変換部材の熱に対し、この構成
により上記離間領域の放熱性を高めることができる。 The formation region of the covering member is provided with a covering member 40 on at least the side surface of the light emitting element 10.
Preferably, the side surface of the light transmitting member 20 is also covered, and more preferably, the light emitting surface is exposed and covered in the light source unit including the light transmitting member and the light emitting element. As a result, light can be prevented from leaking from the side surface of the light transmitting member, and if the light converting member has a relatively high intensity from the side surface, light having a color difference can be suppressed, and radiation light can be prevented. The directivity can be improved, and luminance unevenness and color unevenness can be reduced. Moreover, the directivity and the brightness can be improved by covering the side surfaces of the respective members and elements and restricting them to the light extraction direction side. In addition, when the light transmitting member 20 contains a wavelength conversion material, the heat generation of the wavelength conversion material is particularly significant, which can be improved. Light transmissive member 20
As long as the side surface is covered with the covering member 45 and the surface 21 is exposed, the outer surface shape is not particularly limited. In addition, as shown in FIG. 8, the plurality of light emitting elements 10 includes one light transmitting member 2.
In the case of bonding to 0, it is preferable that the light-emitting elements are filled with the covering member 40 to cover the separation region of the light receiving surface 22. With respect to the heat of the light conversion member in the joining region, this configuration can enhance the heat dissipation of the separation region.

（添加部材）
また、被覆部材４０，４５には、光反射性材料４６，４７、光変換部材の他、粘度増量
剤等を適宜添加することができ、これによって所望の発光色、それら部材若しくは装置表
面の色、例えば高コントラスト化の為の黒色など、また所望の指向特性を有する発光装置
が得られる。同様に不要な波長をカットするフィルター材として各種着色剤を添加できる
。他の部材、また導光部材、封止部材、光透過部材などの光透過性材料も同様である。 (Additive components)
In addition to the light-reflective materials 46 and 47 and the light conversion member, a viscosity extender or the like can be added as appropriate to the covering members 40 and 45, so that the desired light emission color, the color of these members or the device surface can be obtained. For example, a light emitting device having desired directivity characteristics such as black for increasing the contrast can be obtained. Similarly, various colorants can be added as filter materials for cutting unnecessary wavelengths. The same applies to other members, and light transmissive materials such as a light guide member, a sealing member, and a light transmissive member.

（実装基板５０）
一方、図１の発光装置１００において、上記の発光素子１０が実装される基板５０は、
少なくとも表面が素子の電極と接続される配線５５を形成したものが利用でき、また図４
（ａ）に示すように外部接続用の配線（５６）などが設けられても良い。基板の材料は、
例として窒化アルミニウム（ＡｌＮ）で構成され、単結晶、多結晶、焼結基板、他の材料
としてアルミナ等のセラミック、ガラス、Ｓｉ等の半金属あるいは金属基板、またそれら
の積層体、複合体が使用でき、金属性、セラミックは放熱性が高いため好ましい。なお、
基板５０は配線が無くてもよく、例えば図３の素子で成長基板側を実装して素子の電極を
装置の電極にワイヤー接続する形態、光透過部材に配線を設けて接続する形態でもでもよ
い。また、図示する発光装置のように、被覆部材４０，４５が実装基板５０の上に設けら
れる形態の他、実装基板５０の外側側面も覆う形態でもよい。また実装基板５０は、少な
くともその表面が高反射性材料で構成されることが好ましい。図１，２に示すように、発
光素子１０は、導電性接着材６０により配線５５上に接着されて外部と電気的に接続され
る。導電性接着材６０は、半田、Ａｇペースト、Ａｕバンプなどが利用できる。 (Mounting board 50)
On the other hand, in the light emitting device 100 of FIG. 1, the substrate 50 on which the light emitting element 10 is mounted is as follows.
A wiring having at least a surface connected to the electrode of the element 55 can be used, and FIG.
As shown to (a), the wiring (56) for external connection etc. may be provided. The material of the substrate is
Examples include aluminum nitride (AlN), single crystals, polycrystals, sintered substrates, ceramics such as alumina as other materials, glass, metal or metal substrates such as Si, and laminates and composites thereof. Metallic and ceramic materials are preferred because of their high heat dissipation. In addition,
The substrate 50 may have no wiring. For example, the growth substrate side may be mounted with the element of FIG. 3, and the electrode of the element may be wire-connected to the electrode of the apparatus, or the light-transmitting member may be provided with wiring. . Moreover, the form which covers the outer side surface of the mounting board | substrate 50 other than the form in which the coating | coated members 40 and 45 are provided on the mounting board | substrate 50 like the light-emitting device to show in figure may be sufficient. Further, it is preferable that at least the surface of the mounting substrate 50 is made of a highly reflective material. As shown in FIGS. 1 and 2, the light emitting element 10 is bonded onto the wiring 55 by a conductive adhesive 60 and is electrically connected to the outside. As the conductive adhesive 60, solder, Ag paste, Au bump, or the like can be used.

（枠体）
図１に示す発光装置１００は、枠体５１，５２を有し、これらは被覆部材４０，４５の
保持部材としても機能する。枠体５１，５２は、セラミックや樹脂などで形成することが
できる。光反射性の高いアルミナが好ましいが、表面に反射膜を形成すればこれに限らな
い。樹脂であれば、スクリーン印刷等を用いるほか、成形体を実装基板に接着してもよい
。また、被覆部材４０，４５と同様に光反射性材料を用いるなどして、反射率を高くする
と好ましい。また、上記添加部材同様に、枠体を目的に応じて着色してもよい。なお、こ
の枠体は、被覆部材を充填又は成形後に、取り外すこともできる。また、枠体として、積
層基板、基材などでキャビティ構造を有する装置基体など、発光素子の実装基板に一体に
形成されている形態でもよい。 (Frame)
The light emitting device 100 shown in FIG. 1 has frames 51 and 52, which also function as holding members for the covering members 40 and 45. The frames 51 and 52 can be formed of ceramic or resin. Alumina having high light reflectivity is preferable, but not limited to this as long as a reflective film is formed on the surface. If it is resin, besides using screen printing or the like, the molded body may be bonded to the mounting substrate. Further, it is preferable to increase the reflectance by using a light reflective material as in the case of the covering members 40 and 45. Moreover, you may color a frame according to the objective like the said addition member. In addition, this frame can also be removed after filling or forming the covering member. Further, the frame body may be formed integrally with the mounting substrate of the light emitting element, such as a laminated substrate, an apparatus base having a cavity structure with a base material, and the like.

（発光装置の製造方法）
図１に示される例の発光装置１００の製造方法の一例として以下に説明する。まず、実
装基板５０上または発光素子１０に導電性接着材６０を形成しフリップチップ実装する。
この例では個片化前の基板５０上で、１つの発光装置に対応する領域に１個の発光素子１
０を並べて実装する。次に、発光素子１０の周囲に立設された第１の枠体５１（発光素子
１０の出射面（成長基板裏面あるいはＬＬＯで基板除去した場合であれば窒化物半導体露
出面）の高さより高い）内に、光透過部材２０の側面を被覆するように、ディスペンサ（
液体定量吐出装置）等により、被覆部材４０を構成する樹脂をポッティングする。滴下さ
れた樹脂４０は、表面張力によって発光素子１０の側面および第１の枠体５１の内壁を這
い上がり被覆し、発光素子１０の出射面より第１の枠体５１の上面に向かって高くなる傾
斜表面が形成される。次に、第１の枠体５１上に光透過部材２０を載置する。そして、第
１の枠体の周囲に立設された第２の枠体５２（第１の枠体より高い）内に、同様に被覆部
材４５を構成する樹脂をポッティングする。滴下された樹脂４５は、表面張力によって光
透過部材２０の側面および第２の枠体５２の内壁を這い上がり被覆し、表面２１より第２
の枠体５２の上面に向かって高くなる傾斜表面が形成される。最後に、樹脂４０，４５を
硬化させた後、所定の位置でダイシングを行い、所望の大きさに切り出して発光装置１０
０を得る。 (Method for manufacturing light emitting device)
An example of a method for manufacturing the light emitting device 100 shown in FIG. 1 will be described below. First, the conductive adhesive 60 is formed on the mounting substrate 50 or the light emitting element 10 and is flip-chip mounted.
In this example, one light emitting element 1 is provided in a region corresponding to one light emitting device on the substrate 50 before separation.
Implement 0 side by side. Next, the height of the first frame 51 standing up around the light emitting element 10 (the emission surface of the light emitting element 10 (or the nitride semiconductor exposed surface if the substrate is removed by the growth substrate rear surface or LLO)) is higher. ) So as to cover the side surface of the light transmitting member 20.
The resin constituting the covering member 40 is potted by a liquid dispensing apparatus) or the like. The dropped resin 40 scoops up and covers the side surface of the light emitting element 10 and the inner wall of the first frame body 51 by surface tension, and becomes higher from the emission surface of the light emitting element 10 toward the upper surface of the first frame body 51. An inclined surface is formed. Next, the light transmission member 20 is placed on the first frame 51. And the resin which comprises the coating | coated member 45 is similarly potted in the 2nd frame 52 (it is higher than a 1st frame) standingly arranged around the 1st frame. The dropped resin 45 scoops up and covers the side surface of the light transmitting member 20 and the inner wall of the second frame body 52 by surface tension.
An inclined surface that increases toward the upper surface of the frame body 52 is formed. Finally, after the resins 40 and 45 are cured, dicing is performed at a predetermined position, and the light emitting device 10 is cut out to a desired size.
Get 0.

＜実施の形態２＞
図４は、本発明の実施の形態２に係る発光装置の概略図であり、図４（ａ）は概略上面
図の図４（ｂ）のＡ−Ａにおける概略断面図であり、図４（ｃ）はその光源部周辺の概略
断面図である。図４に示す例の発光装置において、上述の実施の形態１と実質上同様の構
成については、同一の符号を付して適宜説明を省略する。 <Embodiment 2>
4 is a schematic view of a light emitting device according to Embodiment 2 of the present invention, FIG. 4 (a) is a schematic cross-sectional view taken along line AA of FIG. 4 (b), and FIG. c) is a schematic sectional view of the periphery of the light source section. In the light emitting device of the example shown in FIG. 4, the same reference numerals are given to substantially the same configurations as those of the above-described first embodiment, and description thereof will be omitted as appropriate.

図４に示す例の発光装置２００は、外部に開口した第２の凹部５８内に該第２の凹部よ
り口径の小さい第１の凹部５７が設けられたキャビティ構造を有する装置基体５９を備え
、その第１の凹部５７の底部に設けられた配線５５上に複数（図中では２個）の発光素子
１０がフリップ実装されている。第２の凹部５８の底部には、互いに対向する表面２１（
発光面９０）と受光面２２とを有する１枚の板状の光透過部材２０が載置されており、第
１の凹部５７を閉蓋している。そして、第１の凹部５７内に、光反射性材料４６を含有す
る被覆部材４０が充填され、発光素子１０の基板の裏面を露出させて発光素子１０の周部
が該被覆部材４０に被覆されている。またその第１の凹部５７内の被覆部材４０は、第１
の凹部５７の内壁を該第１の凹部５７の上面（第２の凹部底面）まで這い上がって形成さ
れ、発光素子１０の側面から上面まで、素子の外側に、また出射面の前方に延在している
。また、図のように光透過部材の受光面２２に当接しても良い。そして、その表面に第１
の反射面３１が設けられている。 The light emitting device 200 of the example shown in FIG. 4 includes a device base 59 having a cavity structure in which a first recess 57 having a smaller diameter than the second recess is provided in a second recess 58 opened to the outside. A plurality of (two in the drawing) light emitting elements 10 are flip-mounted on the wiring 55 provided at the bottom of the first recess 57. On the bottom of the second recess 58, the surfaces 21 (
A plate-like light transmitting member 20 having a light emitting surface 90) and a light receiving surface 22 is placed, and the first recess 57 is closed. The first concave portion 57 is filled with the covering member 40 containing the light reflective material 46, the back surface of the substrate of the light emitting element 10 is exposed, and the peripheral portion of the light emitting element 10 is covered with the covering member 40. ing. Further, the covering member 40 in the first recess 57 is the first
The inner wall of the recess 57 is formed so as to crawl up to the upper surface of the first recess 57 (the bottom surface of the second recess), and extends from the side surface to the upper surface of the light emitting element 10 to the outside of the element and forward of the emission surface. doing. Moreover, you may contact | abut to the light-receiving surface 22 of a light transmissive member like a figure. And the first on the surface
The reflective surface 31 is provided.

この第１の反射面３１によって、上述のように、光透過部材の受光面２２に対して高角
度に入射する光成分を反射、散乱させ、低角度の入射光成分を増やすことができ、光透過
部材２０への光結合効率を高め、また波長変換部材内の光路長差により発生する色ムラを
低減することができる。また本実施の形態２において、第１の反射面３１は凸曲面となっ
ており、平面である場合に比して反射面の面積が増え、凹曲面の場合に比べて光透過部材
２０の中央部への集光作用が強く、低角度の入射光成分を増やしながら、装置正面方向の
輝度を高めることができる。 As described above, the first reflecting surface 31 can reflect and scatter light components incident on the light receiving surface 22 of the light transmitting member at a high angle, and increase the incident light components at a low angle. The optical coupling efficiency to the transmissive member 20 can be increased, and color unevenness caused by the optical path length difference in the wavelength conversion member can be reduced. Further, in the second embodiment, the first reflecting surface 31 is a convex curved surface, and the area of the reflecting surface is increased as compared with the case where it is a flat surface, and the center of the light transmitting member 20 is compared with the case where it is a concave curved surface. The effect of condensing light on the part is strong, and the luminance in the front direction of the apparatus can be increased while increasing the incident light component at a low angle.

また図４（ｃ）に示すように、被覆部材４０は、隣接する発光素子１０の間に位置する
離間領域にも充填されている。このように複数の発光素子１０を被覆部材４０により被覆
して、その出射光および第１の反射面３１による反射光を光透過部材２０に光結合させる
ことで、光束を高めることができる。また光透過部材２０の周縁部において、１つの発光
素子１０から側方つまり他方の発光素子１０側に出射される高角度の光成分を第１の反射
面３１により反射、散乱して光透過部材の受光面２２に結合させることができる。したが
って、光透過部材の受光面２２の面積が大きくなっても、発光素子１０からの一次光成分
の不足しやすい周縁部の光量を補って、色ムラの発生を低減することができる。さらに、
光透過部材２０が波長変換部材である場合には、１つの発光素子１０から出射される高角
度の光成分と、他方の発光素子１０から出射される低角度の光成分とを混合することがで
き、さらに素子間の被覆部材４０表面の反射も加わって、すなわち離間領域３０内で各発
光素子１０の光が好適に混合される。それにより、光透過部材の受光面２２の幅広い領域
で光が重畳し、入射光の角度成分を補填し合って光路長差による色ムラを低減することが
でき、さらに受光面２２から離間領域３０に放出される一次光、二次光も同様に離間領域
３０内で互いに混合される。 Further, as shown in FIG. 4C, the covering member 40 is also filled in a separation region located between the adjacent light emitting elements 10. In this way, by covering the plurality of light emitting elements 10 with the covering member 40 and optically coupling the emitted light and the reflected light from the first reflecting surface 31 to the light transmitting member 20, the luminous flux can be increased. In addition, the light transmitting member 20 reflects and scatters a high-angle light component emitted from one light emitting element 10 to the side, that is, the other light emitting element 10 side, by the first reflecting surface 31 at the peripheral portion of the light transmitting member 20. Can be coupled to the light receiving surface 22. Therefore, even when the area of the light receiving surface 22 of the light transmitting member is increased, the amount of light at the peripheral portion where the primary light component from the light emitting element 10 is likely to be insufficient can be compensated to reduce the occurrence of color unevenness. further,
When the light transmitting member 20 is a wavelength conversion member, a high angle light component emitted from one light emitting element 10 and a low angle light component emitted from the other light emitting element 10 can be mixed. Further, the reflection of the surface of the covering member 40 between the elements is also added, that is, the light of each light emitting element 10 is suitably mixed in the separated region 30. As a result, light is superimposed over a wide area of the light receiving surface 22 of the light transmitting member, the angle component of the incident light can be compensated for, and color unevenness due to the optical path length difference can be reduced. Similarly, the primary light and the secondary light emitted to each other are mixed with each other in the separation region 30.

さらに本実施の形態２では、第２の凹部５８に設けられた被覆部材４５は、第２の凹部
５８の内壁を這い上がって形成され、また光透過部材２０の側面を露出させ、さらには図
のように光透過部材２０から離間して、光透過部材２０を包囲するように形成されている
。第２の反射面３２は、この被覆部材４５の表面に、光透過部材２０の側面に対向するよ
うに設けられ、第１の実施形態の第２の反射面３２に比べて、比較的広い配光を実現する
ことができる。 Further, in the second embodiment, the covering member 45 provided in the second recess 58 is formed by scooping up the inner wall of the second recess 58, and also exposes the side surface of the light transmission member 20, and further, FIG. In this manner, the light transmitting member 20 is formed so as to be separated from the light transmitting member 20. The second reflecting surface 32 is provided on the surface of the covering member 45 so as to face the side surface of the light transmitting member 20, and has a relatively wide arrangement compared to the second reflecting surface 32 of the first embodiment. Light can be realized.

なお図４（ａ）および（ｂ）に示すように、光透過部材２０および被覆部材４５の表面
の一部を被覆するように、封止部材７０を設けることもできる。このような発光装置では
、封止部材７０により光透過部材の表面２１との界面における屈折率差が緩和されて光透
過部材の表面２１から光を効率良く取り出すことができる。そのうえ、第１および第２の
反射面３１，３２によって高角度の光成分が低減されているため、色ムラが少なく、また
封止部材７０の内面に対して全反射角を超える入射角の光成分が低減され、扁形であって
も高い透過率が得られるので、高い発光効率を有しながら装置の薄型化を図ることができ
る。 As shown in FIGS. 4A and 4B, the sealing member 70 can be provided so as to cover part of the surfaces of the light transmitting member 20 and the covering member 45. In such a light emitting device, the refractive index difference at the interface with the surface 21 of the light transmitting member is relaxed by the sealing member 70, and light can be efficiently extracted from the surface 21 of the light transmitting member. In addition, since the light component at a high angle is reduced by the first and second reflecting surfaces 31 and 32, there is little color unevenness, and light having an incident angle exceeding the total reflection angle with respect to the inner surface of the sealing member 70. Since components are reduced and a high transmittance can be obtained even in a flat shape, the device can be thinned while having high luminous efficiency.

（封止部材）
ここで、封止部材７０の光取り出し側の表面は目的に応じて種々の形状に形成すること
ができる。例えば図４（ａ）および（ｂ）に点線で示すように、光取り出し側の表面を球
面状（半球面状）のレンズ形状、凸曲面とすることで、光透過部材２０の発光に対し効率
良く外部に取り出すことができる。また、これに限らず、種々の光学素子、所望形状の光
学部材とでき、凹レンズ形状、放物曲面、先端が平坦な凸形状とでき、また凹凸面として
光を散乱させてもよい。 (Sealing member)
Here, the surface of the sealing member 70 on the light extraction side can be formed in various shapes according to the purpose. For example, as shown by the dotted lines in FIGS. 4A and 4B, the light extraction side surface has a spherical (hemispherical) lens shape and a convex curved surface, so that the light transmission member 20 can efficiently emit light. It can be taken out well. Further, the present invention is not limited to this, and various optical elements and optical members having desired shapes can be used. A concave lens shape, a parabolic curved surface, a convex shape with a flat tip can be formed, and light can be scattered as an uneven surface.

封止部材７０は、光透過部材２０より屈折率が低いと、その表面と接合して光の取り出
し効率を向上させることができる。この封止部材７０は、上述の被覆部材４０，４５の基
材と同様に、例えばエポキシ樹脂、シリコーン樹脂、変成シリコーン樹脂、ユリア樹脂、
ウレタン樹脂、アクリル樹脂、ポリカーボネイト樹脂、ポリイミド樹脂などの樹脂材料を
用いて形成することができる。また封止部材７０は、発光素子１０や光透過部材２０を保
護する封止材としての役割も果たすため、耐候性、耐熱性、硬度に優れる材料が好ましく
、上記のなかではエポキシ樹脂、又は硬質のシリコーン樹脂が好ましい。このほか、ガラ
スを用いてもよい。さらに、封止部材７０に、上述のような蛍光体、及び／又はＴｉＯ₂
などの光散乱粒子、及び／又は石英ガラス等のフィラーなどを適宜添加することができる
。なお封止部材は圧縮成形、トランスファー成形、ポッティングなどにより形成する。 If the refractive index of the sealing member 70 is lower than that of the light transmitting member 20, the sealing member 70 can be bonded to the surface to improve the light extraction efficiency. The sealing member 70 is, for example, an epoxy resin, a silicone resin, a modified silicone resin, a urea resin,
It can be formed using a resin material such as urethane resin, acrylic resin, polycarbonate resin, or polyimide resin. Moreover, since the sealing member 70 also plays a role as a sealing material for protecting the light emitting element 10 and the light transmitting member 20, a material excellent in weather resistance, heat resistance, and hardness is preferable. Among these, an epoxy resin or a hard material is preferable. The silicone resin is preferred. In addition, glass may be used. Further, the phosphor 70 and / or TiO ₂ as described above is provided on the sealing member 70.
Such as light scattering particles and / or fillers such as quartz glass can be added as appropriate. The sealing member is formed by compression molding, transfer molding, potting, or the like.

＜実施の形態３＞
図５は、本発明の実施の形態３に係る発光装置の概略断面図である。図５に示す例の発
光装置において、上述の実施の形態１と実質上同様の構成については、同一の符号を付し
て適宜説明を省略する。 <Embodiment 3>
FIG. 5 is a schematic cross-sectional view of a light-emitting device according to Embodiment 3 of the present invention. In the light emitting device of the example shown in FIG. 5, the same reference numerals are given to substantially the same configurations as those of the first embodiment described above, and description thereof will be omitted as appropriate.

図５に示す例の発光装置３００は、実装基板５０の配線５５上に複数（図中では２個）
の発光素子１０が互いに直列接続されてフリップチップ実装されており、駆動電圧を大き
くすることができる。また上述の実施の形態１と同様に、第１の枠体５１内に被覆部材４
０が充填されて、各発光素子１０の基板の裏面を露出して各発光素子１０の周部が被覆さ
れており、第１の枠体５１の内壁を這い上がるように形成されて、その表面に第１の反射
面３１が設けられている。発光素子１０の間の領域においても被覆部材が充填されている
。 A plurality of light emitting devices 300 shown in FIG. 5 are provided on the wiring 55 of the mounting substrate 50 (two in the drawing).
The light emitting elements 10 are connected in series with each other and flip-chip mounted, so that the driving voltage can be increased. Similarly to the first embodiment, the covering member 4 is provided in the first frame 51.
0 is filled, the back surface of the substrate of each light emitting element 10 is exposed and the peripheral portion of each light emitting element 10 is covered, and is formed so as to scoop up the inner wall of the first frame 51, and its surface A first reflecting surface 31 is provided. The covering member is also filled in the region between the light emitting elements 10.

また、第１の枠体５１の外側に形成される被覆部材４５の表面は、下方（実装基板）側
に形成されている。言い換えれば、被覆部材４５は、光透過部材２０の側面を被覆しなが
ら、外側から光透過部材２０の側面に這い上がるように形成されており、光透過部材２０
から連続する被覆部材４５の表面は凹曲面となっている。このような形態は、第１の実施
の形態における第２の枠体５２に第１の枠体５１より低い枠体を用いて被覆部材４５を充
填、硬化させた後、第２の枠体５２を除去することで作製することができる。したがって
、この場合、第２の反射面３２は光透過部材３０の側面と被覆部材４５の界面にのみ設け
られている。このように被覆部材４５の表面が、光透過部材２０の外側で、その側方に向
かって、その発光面９０の後方側に傾斜しており、発光面９０から放出される光が遮光さ
れることがなく、高い光束と広い配光を得ることができる。またこの例では光透過部材２
０が枠体５１より側方に突出するような幅を有しており、さらに高い光束と広い配光が得
られる。 Further, the surface of the covering member 45 formed outside the first frame 51 is formed on the lower side (mounting substrate) side. In other words, the covering member 45 is formed so as to creep up from the outside to the side surface of the light transmitting member 20 while covering the side surface of the light transmitting member 20.
The surface of the covering member 45 that is continuous from 1 to 2 is a concave curved surface. In such a form, the second frame body 52 in the first embodiment is filled and cured with the covering member 45 using a frame body lower than the first frame body 51, and then the second frame body 52. It can produce by removing. Therefore, in this case, the second reflecting surface 32 is provided only at the interface between the side surface of the light transmitting member 30 and the covering member 45. In this way, the surface of the covering member 45 is inclined to the rear side of the light emitting surface 90 toward the side outside the light transmitting member 20, and the light emitted from the light emitting surface 90 is shielded. In this way, a high luminous flux and a wide light distribution can be obtained. In this example, the light transmitting member 2
The width is such that 0 protrudes from the frame 51 to the side, and a higher luminous flux and wider light distribution can be obtained.

＜実施の形態４＞
図６は、本発明の実施の形態４に係る発光装置の概略断面図である。図６に示す例の発
光装置において、上述の実施の形態１と実質上同様の構成については、同一の符号を付し
て適宜説明を省略する。 <Embodiment 4>
FIG. 6 is a schematic cross-sectional view of a light-emitting device according to Embodiment 4 of the present invention. In the light emitting device of the example shown in FIG. 6, components substantially similar to those of the first embodiment described above are denoted by the same reference numerals and description thereof is omitted as appropriate.

図６に示す例の発光装置４００において、枠体等を有し凹部が設けられた装置基体（５
０，５１）の凹部内の配線５５上に複数（図中では２個）の発光素子１０がフリップチッ
プ実装されている。その凹部内側に被覆部材４０が充填されており、この被覆部材４０は
、発光素子１０の基板の裏面を各々露出して各発光素子１０の周部を被覆し、その凹部内
壁を這い上がるように形成されて、素子外側に向かって基板の裏面より前方に延出した形
状で、その表面は発光素子１０の基板の裏面をその底面に含む凹部を形成している。光透
過部材２０は、被覆部材４０により形成された凹部内に設置されており、その受光面側の
周縁部が被覆部材４０の表面に当接している。よって、光透過部材２０は、被覆部材４０
による凹部の一部、すなわちその凹部で被覆部材４０より窪んだ発光素子領域を閉蓋し、
発光素子１０と離間されており、発光素子１０との離間領域３０には空隙が設けられ、該
離間領域３０における凹部内面に第１の反射面３１が設けられている。 In the light emitting device 400 of the example shown in FIG. 6, a device base (5
A plurality (two in the figure) of light emitting elements 10 are flip-chip mounted on the wiring 55 in the recess of (0, 51). The inside of the recess is filled with a covering member 40. The covering member 40 exposes the back surface of the substrate of the light emitting element 10 so as to cover the peripheral portion of each light emitting element 10 and scoop up the inner wall of the recess. The surface is formed and extends forward from the back surface of the substrate toward the outside of the device, and the surface forms a recess including the back surface of the substrate of the light emitting device 10 at the bottom surface. The light transmissive member 20 is installed in a recess formed by the covering member 40, and the peripheral edge portion on the light receiving surface side is in contact with the surface of the covering member 40. Therefore, the light transmissive member 20 includes the covering member 40.
Close the light emitting element region that is recessed from the covering member 40 by a part of the concave portion, that is, the concave portion,
The light emitting element 10 is separated from the light emitting element 10. A space 30 is provided in the space 30 with respect to the light emitting element 10, and a first reflecting surface 31 is provided on the inner surface of the recess in the space 30.

さらに、光透過部材２０の側面を被覆するように、被覆部材４５が光透過部材２０の周
囲に充填されており、光透過部材２０を固定すると共に、光透過部材２０の側面からの光
の放出を防止している。第２の反射面３２は、少なくとも被覆部材４５と光透過部材２０
の側面との界面（３２ａ）に設けられ、さらに実施形態２の第１の反射面３１と同様に、
即から延出した凸曲面の第２の反射面３２ｂも有している。なお、それより外側の被覆部
材４５の表面は、図のように略平坦であるが、実施形態１のように発光面９０より前方に
延出させてもよいし、実施形態３のように下垂させてもよい。 Further, a covering member 45 is filled around the light transmitting member 20 so as to cover the side surface of the light transmitting member 20, and the light transmitting member 20 is fixed and light is emitted from the side surface of the light transmitting member 20. Is preventing. The second reflecting surface 32 includes at least the covering member 45 and the light transmitting member 20.
In the same manner as the first reflecting surface 31 of the second embodiment, it is provided at the interface (32a) with the side surface of
It also has a convex second reflecting surface 32b that extends from the instant. The outer surface of the covering member 45 is substantially flat as shown in the figure, but may be extended forward from the light emitting surface 90 as in the first embodiment, or may be suspended as in the third embodiment. You may let them.

なお本実施の形態４において、図６に点線で示すように、被覆部材を成形、硬化後に、
枠体に加えて、さらに実装基板を除去してもよく、被覆部材自体が発光装置４００の基体
を成すことになる。またこの場合には、被覆部材からなる基体の裏面に、発光素子１０上
の各電極に接合した配線５５を残して露出させ、外部接続端子として発光素子１０に給電
可能とする。このような発光装置４００は、上述のように、光透過部材２０への光結合効
率を維持しながら、高い信頼性を有し、色ムラの発生を抑制することができ、そのうえ基
体そのものが発光素子１０を被覆する被覆部材により構成されているため、装置の薄型化
、小型化が図れ、発光装置の汎用性を向上させることができる。 In the fourth embodiment, as shown by a dotted line in FIG. 6, after forming and curing the covering member,
In addition to the frame body, the mounting substrate may be further removed, and the covering member itself forms the base of the light emitting device 400. Further, in this case, the wiring 55 bonded to each electrode on the light emitting element 10 is left exposed on the back surface of the substrate made of the covering member so that the light emitting element 10 can be fed as an external connection terminal. As described above, the light emitting device 400 has high reliability while suppressing the optical coupling efficiency to the light transmitting member 20, can suppress the occurrence of color unevenness, and the substrate itself emits light. Since it is comprised by the coating | coated member which coat | covers the element 10, thickness reduction and size reduction of an apparatus can be achieved and the versatility of a light-emitting device can be improved.

このような発光装置は、例えば支持基板上に発光素子を載置して、被覆部材を塗布して
成形体とし、予め離型剤等により表面処理するなどして、その支持基板から剥がして、光
源部が埋め込まれた被覆部材の成形体を取り出す方法により実現できる。また、光源部の
配線構造は、上述したようにその出射領域側表面を支持基板と対向して載置し、発光素子
の電極、またその上の導体として、剥離後に成膜、めっき、バンプなどで導電体を形成し
、上記被覆部材を形成してもよく、配線側表面を支持基板に対向して載置し、予め発光素
子側、支持基板側又はその両方に、上記導電体又は支持基板上の配線層、それらを組み合
わせた導電体を設けた後、剥離して配線を支持基板から分離してもよい。 Such a light emitting device, for example, by placing a light emitting element on a support substrate, applying a covering member to form a molded body, and performing surface treatment with a release agent or the like in advance, is peeled off from the support substrate, This can be realized by a method of taking out the molded body of the covering member in which the light source part is embedded. In addition, the wiring structure of the light source part is mounted with the surface of the emission region facing the support substrate as described above, and as a light emitting element electrode and a conductor thereon, film formation, plating, bump, etc. after peeling The conductor may be formed by forming the above-mentioned covering member, the wiring side surface is placed facing the support substrate, and the conductor or support substrate is previously placed on the light emitting element side, the support substrate side or both. After providing the upper wiring layer and a conductor combining them, the wiring may be separated from the support substrate by peeling.

＜実施の形態５＞
図７は、本発明の実施の形態５に係る発光装置を説明するための概略断面図である。図
７に示す例の発光装置において、上述の実施の形態１と実質上同様の構成については、同
一の符号を付して適宜説明を省略する。 <Embodiment 5>
FIG. 7 is a schematic cross-sectional view for explaining the light emitting device according to Embodiment 5 of the present invention. In the light emitting device of the example shown in FIG. 7, the same reference numerals are given to substantially the same configurations as those of the above-described first embodiment, and description thereof will be omitted as appropriate.

図７に示す例の発光装置は、上述の実施の形態４と同様に、実装基板の枠体内の配線５
５上に１個の発光素子１０がフリップチップ実装されており、被覆部材４０は、発光素子
１０の周部を被覆して発光素子１０の基板の裏面をその底面に含む凹部をその表面に形成
している。光透過部材２０は、この被覆部材４０により形成された凹部の表面にその受光
面２２側の周縁部を当接させて載置している。よって、光透過部材２０は、被覆部材４０
による凹部の一部を閉蓋し、発光素子１０とは離間されており、発光素子１０との離間領
域３０における被覆部材４０の凹部内面に第１の反射面が設けられている。ここで、発光
素子１０と光透過部材３０との離間領域３０は、上述のように空隙としてもよく、その変
形例として後述する実施形態７のように、被覆部材４０による凹部内に透光性部材（３５
）を設けて、光透過部材２０をその透光性部材（３５）上に接合してもよい。これにより
、発光素子１０の基板の裏面との界面、並びに光透過部材の受光面２２との界面における
屈折率差が緩和されて、光透過部材２０への光結合効率を高めることができる。 The light emitting device of the example shown in FIG. 7 is similar to the above-described fourth embodiment in that the wiring 5 in the frame of the mounting substrate.
One light-emitting element 10 is flip-chip mounted on 5, and the covering member 40 covers the peripheral part of the light-emitting element 10 and forms a recess on its surface that includes the back surface of the substrate of the light-emitting element 10 on its bottom surface. doing. The light transmitting member 20 is placed with the peripheral portion on the light receiving surface 22 side in contact with the surface of the recess formed by the covering member 40. Therefore, the light transmissive member 20 includes the covering member 40.
A part of the concave portion is closed and separated from the light emitting element 10, and the first reflecting surface is provided on the inner surface of the concave portion of the covering member 40 in the separation region 30 from the light emitting element 10. Here, the separation region 30 between the light emitting element 10 and the light transmissive member 30 may be a gap as described above, and as a modified example thereof, as in a seventh embodiment to be described later, the light transmissive property is formed in the concave portion by the covering member 40. Member (35
) And the light transmitting member 20 may be bonded onto the light transmitting member (35). Thereby, the refractive index difference in the interface with the back surface of the substrate of the light emitting element 10 and the interface with the light receiving surface 22 of the light transmitting member is relaxed, and the optical coupling efficiency to the light transmitting member 20 can be increased.

また図７に示す例の発光装置では、互いに対向する上面および底面を有する別の透光性
部材７１を、底面側を接合面として光透過部材２０の上に接合して、その透光性部材７１
の側面および光透過部材２０の側面を被覆部材４５により被覆している。これにより、こ
の発光装置は、透光性部材７１の上面を主たる光取り出しの窓部とする面発光型の発光装
置となっている。 Further, in the light emitting device of the example shown in FIG. 7, another translucent member 71 having a top surface and a bottom surface facing each other is joined on the light transmissive member 20 with the bottom surface side as a joint surface, and the translucent member. 71
These side surfaces and the side surface of the light transmitting member 20 are covered with a covering member 45. Thus, this light emitting device is a surface light emitting type light emitting device in which the upper surface of the translucent member 71 is the main light extraction window.

（透光性部材）
このような透光性部材７１は、透光性を有して、発光素子１０の出射光を光取り出し側
へ導光でき、双方の部材を光学的に結合できる材質が好ましい。光透過部材、実施の形態
２の封止部材７０と同様の材料により、具体的には透明樹脂、ガラスにより構成すること
ができ、例えば光透過部材２０の形状に合わせた底面及び上面が四角形の錐体形状の透明
樹脂を成形、加工して作製する。さらに具体的な材料としては、シリコーン樹脂やエポキ
シ樹脂など透光性の熱硬化性樹脂がよく、シリコーン樹脂は耐熱性、耐光性に優れるため
好ましい。また、シリコーン樹脂を使用すれば、上記フッ素系離型剤の効果が高いため好
ましい。さらに、ジメチル系シリコーン樹脂であれば高温耐性など信頼性において優れ、
フェニル系シリコーン樹脂であれば屈折率を高くして発光素子１０からの光の取り出し効
率を高めることができる。また後述の実施の形態７のように、発光素子１０と光透過部材
２０との間に介在して双方の部材を固着する接着剤３５として用いることもできる。 (Translucent member)
Such a translucent member 71 is preferably made of a material having translucency so that the emitted light of the light emitting element 10 can be guided to the light extraction side and both the members can be optically coupled. The light transmissive member can be made of the same material as the sealing member 70 of the second embodiment, specifically, a transparent resin or glass. For example, the bottom surface and the top surface of the light transmissive member 20 have a rectangular shape. A cone-shaped transparent resin is formed and processed. Further, as a specific material, a light-transmitting thermosetting resin such as a silicone resin or an epoxy resin is preferable, and a silicone resin is preferable because it is excellent in heat resistance and light resistance. In addition, it is preferable to use a silicone resin because the effect of the fluorine-based mold release agent is high. Furthermore, if it is a dimethyl silicone resin, it is excellent in reliability such as high temperature resistance,
A phenyl silicone resin can increase the refractive index and increase the light extraction efficiency from the light emitting element 10. Further, as in the seventh embodiment described later, it can be used as an adhesive 35 that is interposed between the light emitting element 10 and the light transmitting member 20 and fixes both members.

第２の反射面は、透光性部材７１の側面および光透過部材２０の側面と被覆部材４５と
の界面に連続して設けられている。また底面の大きさは、光透過部材の発光面９０の大き
さと略同じであり、上面は底面より小さくなっており、透光性部材７１の側面は上方に先
細る傾斜面となっている。したがって、透光性部材７１の側面との界面に設けられる第２
の反射面は、内側に向かって傾斜しており、光透過部材の発光面９０から上方に出射され
る光を中央に向かって集光するように反射させることができ、高輝度の発光が得ることが
でき、また一次光と二次光の混色が促進され色ムラが低減される。 The second reflecting surface is continuously provided on the side surface of the translucent member 71 and the interface between the side surface of the light transmitting member 20 and the covering member 45. Further, the size of the bottom surface is substantially the same as the size of the light emitting surface 90 of the light transmitting member, the top surface is smaller than the bottom surface, and the side surface of the light transmitting member 71 is an inclined surface that tapers upward. Therefore, the second provided at the interface with the side surface of the translucent member 71.
The reflecting surface of the light-transmitting member is inclined inward, so that light emitted upward from the light-emitting surface 90 of the light transmitting member can be reflected so as to be condensed toward the center, and high-luminance light emission is obtained. In addition, color mixing of the primary light and the secondary light is promoted, and color unevenness is reduced.

なお、図７に示す例の発光装置において、光透過部材の表面２３は凹凸面２３Ａとなっ
ており、該凹凸面２３Ａにより光を散乱させて、光の取り出し効率を高めながら輝度ムラ
を低減し、また一次光と二次光の重畳が促進され色ムラの発生を低減して、略均一な配光
を得ることができる。このような凹凸面２３Ａは、研磨、ドライエッチング、ウエットエ
ッチングなどの処理により形成でき、不規則な凹凸構造のほか、規則的なパターンの凹凸
構造も形成できる。また、このような凹凸構造２３Ａは、光透過部材の表面２３だけでな
く、受光面２２、さらに光路上にある各部材の表面に設けて同様な効果を得ることができ
、例えば発光素子１０の基板の半導体素子構造側の表面に設けてもよく、実施の形態１で
は詳述していないが、図２（図中の１Ａ）に示すような構造としてもよい。 In the light emitting device of the example shown in FIG. 7, the surface 23 of the light transmitting member is an uneven surface 23A, and light is scattered by the uneven surface 23A to reduce luminance unevenness while improving the light extraction efficiency. In addition, the superimposition of the primary light and the secondary light is promoted to reduce the occurrence of color unevenness, and a substantially uniform light distribution can be obtained. Such a concavo-convex surface 23A can be formed by a process such as polishing, dry etching, wet etching, etc., and an irregular concavo-convex structure can be formed in addition to an irregular concavo-convex structure. Further, such a concavo-convex structure 23A can be provided not only on the surface 23 of the light transmitting member but also on the light receiving surface 22 and further on the surface of each member on the optical path. It may be provided on the surface of the substrate on the semiconductor element structure side, and although not described in detail in Embodiment 1, a structure as shown in FIG. 2 (1A in the drawing) may be used.

＜実施の形態６＞
図８は、本発明の実施の形態６に係る発光装置を説明するための概略断面図である。図
８に示す例の発光装置において、上述の実施の形態１，３と実質上同様の構成については
、同一の符号を付して適宜説明を省略する。 <Embodiment 6>
FIG. 8 is a schematic cross-sectional view for explaining the light emitting device according to Embodiment 6 of the present invention. In the light emitting device of the example shown in FIG. 8, the same reference numerals are given to the substantially same configurations as those of the first and third embodiments, and the description will be omitted as appropriate.

図８に示す例の発光装置５００は、上述の実施の形態５と同様に、実装基板５０の枠体
内の配線５５上に２個の発光素子１０がフリップチップ実装されており、被覆部材４０は
、発光素子１０の側面などの周部と、その発光素子１０の基板に接合した光透過部材２０
の側面を被覆している。光透過部材２０は、透光性の接着剤を介して（不図示）発光素子
１０に接着し、また、発光素子１０の外側の側面より内側に、その端部が設けられ、すな
わち、発光素子、複数の発光素子の領域に内包されている。よって、光源部は上述した離
間領域３０を実質的に有さずに素子１０と接合されたものとなっている。その光源付近の
第２の反射面３２ｂは、実施形態１と同様に、光源部の光透過部材２０の側方の外側で、
被覆部材４０がその発光面９０より前方に延出して、延出部が設けられ、その内側表面に
設けられる。尚、枠体は実施形態３と同様に被覆部材４０の成形後に除去している。図示
するように、被覆部材４０は、光源部を底部として、凹部を形成しており、その凹部内壁
に当たる第２の反射面３２ｂでもって、実施形態１と同様に、光源部からの光、特に発光
面９０からの高角度成分を好適に反射して、高角度成分を光軸側に集光して、放射角の狭
い高指向性の発光とできる。また波長変換部材を用いた場合の色ムラ、特に高角度側のそ
れを被覆部材４０の乱反射により、好適に改善できる。また、実施の形態１に比して、光
源部内で発光素子１０と光透過部材２０が接合されているため、高出力化、高輝度化が望
める。 In the light emitting device 500 of the example shown in FIG. 8, the two light emitting elements 10 are flip-chip mounted on the wiring 55 in the frame of the mounting substrate 50 as in the above-described fifth embodiment, and the covering member 40 is A light transmission member 20 bonded to a peripheral portion such as a side surface of the light emitting element 10 and a substrate of the light emitting element 10.
The sides are covered. The light transmitting member 20 is bonded to the light emitting element 10 via a light transmitting adhesive (not shown), and its end is provided on the inner side of the outer side surface of the light emitting element 10, that is, the light emitting element. And are included in the region of the plurality of light emitting elements. Therefore, the light source unit is joined to the element 10 without substantially having the above-described separation region 30. The second reflecting surface 32b in the vicinity of the light source is outside the side of the light transmitting member 20 of the light source unit, as in the first embodiment.
The covering member 40 extends forward from the light emitting surface 90 to be provided with an extending portion, which is provided on the inner surface thereof. The frame is removed after the covering member 40 is formed, as in the third embodiment. As shown in the figure, the covering member 40 forms a recess with the light source portion as the bottom, and with the second reflecting surface 32b that hits the inner wall of the recess, the light from the light source portion, particularly the embodiment 1, The high angle component from the light emitting surface 90 is suitably reflected, and the high angle component is condensed on the optical axis side, so that the light can be emitted with high directivity with a narrow emission angle. Further, the color unevenness when using the wavelength conversion member, particularly on the high angle side, can be preferably improved by the irregular reflection of the covering member 40. Compared with Embodiment 1, since the light emitting element 10 and the light transmission member 20 are joined in the light source unit, higher output and higher luminance can be expected.

上述したように、被覆部材４０表面、本実施形態の凹部に、封止部材７０で封止して、
図９のように、例えば延出部上端と略一致する略平坦な表面（第２の発光面９１）として
、その封止領域を透光性部材領域として、上記離間領域３０と同様に好適な光の重畳によ
り所望の発光特性を得ることもできる。また、その凹部の凹曲面を利用して、その上に、
それに適合する光学レンズ、例えばコリメートレンズや、光学部材を成形して、所望の指
向性とでき、また光ファイバを、光源部をコア領域に、クラッド領域を被覆部材に対応し
て、接合させることもできる。 As described above, the surface of the covering member 40, the recess of the present embodiment, is sealed with the sealing member 70,
As shown in FIG. 9, for example, as a substantially flat surface (second light emitting surface 91) substantially coinciding with the upper end of the extended portion, the sealing region is a translucent member region, which is suitable similarly to the separation region 30. Desired light emission characteristics can also be obtained by superimposing light. In addition, using the concave curved surface of the concave,
A suitable optical lens, such as a collimator lens or an optical member, can be formed to have a desired directivity, and an optical fiber can be bonded with the light source portion corresponding to the core region and the cladding region corresponding to the covering member. You can also.

＜実施の形態７＞
図９は、本発明の実施の形態７に係る発光装置を説明するための概略断面図である。図
９に示す例の発光装置において、上述の実施の形態５と実質上同様の構成については、同
一の符号を付して適宜説明を省略する。 <Embodiment 7>
FIG. 9 is a schematic cross-sectional view for explaining the light-emitting device according to Embodiment 7 of the present invention. In the light emitting device of the example shown in FIG. 9, the substantially same configuration as that of the above-described fifth embodiment is denoted by the same reference numeral, and description thereof is omitted as appropriate.

本実施の形態において、実施の形態６と同様に光源部を形成し、実施の形態５と同様に
光透過部材２０の上に、透光性部材７１を設けて、その表面を第２の発光面９１としてお
り、被覆部材４０はその側面を覆って、延出部を形成し、その内壁側、すなわち透光性部
材７１との界面に第２の反射面３２ｂを形成している。光源部内の発光素子１０と光透過
部材２０は、実施の形態６同様に発光素子１０の側面が光透過部材２０より突出して、光
透過部材２０が素子１０、その基板の出射面内に内包された構造となっている。さらに、
その光源、すなわち光透過部材２０上に接合された透光性部材７１も同様に、光透過部材
２０より幅狭で、その発光面９０に内包され、また実施の形態５と同様にその幅は第２の
発光面９１側より発光面９０側が幅広となる構造である。このように、発光素子１０から
第２の発光面９１に向かって、各部材が順次、小さくなる構造とすることで、上記実施の
形態６における第２の発光面側９１への集光効果を高めることができる。 In the present embodiment, a light source part is formed in the same manner as in the sixth embodiment, and a light transmissive member 71 is provided on the light transmissive member 20 in the same manner as in the fifth embodiment, and the surface thereof is subjected to the second light emission. The covering member 40 covers the side surface of the covering member 40 to form an extending portion, and the second reflecting surface 32b is formed on the inner wall side thereof, that is, on the interface with the translucent member 71. As in the sixth embodiment, the light emitting element 10 and the light transmitting member 20 in the light source section have the side surfaces of the light emitting element 10 projecting from the light transmitting member 20, and the light transmitting member 20 is included in the output surface of the element 10 and its substrate. It has a structure. further,
The light source, that is, the translucent member 71 bonded on the light transmissive member 20 is also narrower than the light transmissive member 20 and is included in the light emitting surface 90, and the width is the same as in the fifth embodiment. The light emitting surface 90 side is wider than the second light emitting surface 91 side. As described above, the structure in which the respective members are sequentially reduced from the light emitting element 10 toward the second light emitting surface 91 allows the condensing effect to the second light emitting surface side 91 in the sixth embodiment. Can be increased.

この変形例として、それとは逆に、放出口となる透光性部材７１表面（第２の発光面９
１）の幅、延出部の開口幅を、発光面９０側より幅広とすることができる。この場合、開
口した構造であるため、光取り出し効率を高められ、また、光源サイズの大型化が可能と
なる。 As a modified example, on the contrary, the surface of the translucent member 71 serving as the emission port (the second light emitting surface 9).
The width of 1) and the opening width of the extended portion can be made wider than the light emitting surface 90 side. In this case, since it is an open structure, the light extraction efficiency can be increased, and the size of the light source can be increased.

このように、透光性部材７１を有する場合には、上述した離間領域３０と同様に、その
部材内への光の閉じ込めによる、光の重畳効果が得られ、輝度ムラ、色ムラを好適に抑制
できる。さらに、透光性部材７１中にフィラーなどの拡散粒子、光反射材料を混入するこ
とで、さらにそれを改善でき、その場合、被覆部材４０より、その光反射材料の濃度を小
さくすると良い。一方で、例えば、被覆部材４０の成形後に、第２の反射面３２ｂの傾斜
が小さければ、透光性部材７１を抜き取ることができ、これにより、延出部で包囲された
内部を実施の形態１〜４同様に外気とできる。このように、延出部、その表面の第２の反
射面３２ｂで囲まれただけの領域としても、その延出部の開口幅に応じて、上記集光、散
乱効果を得ることができ、透光性部材７１を用いる場合に比して、その包囲領域への光閉
じ込めが小さくなるため、高光束化が可能となる。 As described above, when the translucent member 71 is provided, similarly to the above-described separation region 30, a light superimposing effect can be obtained by confining light in the member, and uneven luminance and uneven color can be suitably obtained. Can be suppressed. Furthermore, it can be further improved by mixing diffusing particles such as a filler and a light reflecting material in the translucent member 71. In this case, the concentration of the light reflecting material is preferably smaller than that of the covering member 40. On the other hand, for example, if the inclination of the second reflecting surface 32b is small after the covering member 40 is formed, the translucent member 71 can be extracted, and thereby the inside surrounded by the extending portion is described in the embodiment. It can be outside air like 1-4. In this way, the extension part, even as a region only surrounded by the second reflection surface 32b on the surface, according to the opening width of the extension part, it is possible to obtain the light collection and scattering effect, Compared with the case where the translucent member 71 is used, light confinement in the surrounding region is reduced, so that a high luminous flux can be achieved.

また、光透過部材２０が波長変換部材である場合、その厚さ並びに含有する蛍光体の粒
径や濃度などが、装置出射光の色度に及ぼす影響は大きい。そのため、光透過部材２０の
みにより装置出射光を制御するよりも、光透過部材２０の厚さや形状により装置出射光の
色度や光束を制御し、別途光透過部材２０に接合させた封止部材７０や透光性部材７１あ
るいは上記のような包囲領域により装置出射光の配光を制御するといった、各部材・領域
に機能、役割を分担させることで、装置出射光を好適に制御することが可能となる。さら
に、このような封止部材７０や透光性部材７１が光透過部材２０を含む光源部とともに被
覆部材により包囲又は被覆されること、あるいは上記のような被覆部材による包囲領域が
形成されること、によって、比較的簡便に、光透過部材２０から光を該部材・領域に効率
良く光結合できるとともに、該部材・領域による光の制御機能を高めることができる。 Further, when the light transmitting member 20 is a wavelength conversion member, the thickness and the particle size or concentration of the phosphor contained therein have a great influence on the chromaticity of the light emitted from the apparatus. Therefore, rather than controlling the light emitted from the apparatus only by the light transmissive member 20, the sealing member that controls the chromaticity and light flux of the light emitted from the apparatus by the thickness and shape of the light transmissive member 20 and is joined to the light transmissive member 20 separately. It is possible to control the light emitted from the apparatus suitably by assigning the function and role to each member / region, such as controlling the light distribution of the light emitted from the apparatus by 70, the translucent member 71 or the surrounding area as described above. It becomes possible. Furthermore, such a sealing member 70 and the translucent member 71 are surrounded or covered by a covering member together with the light source part including the light transmitting member 20, or an enclosing region by the covering member as described above is formed. Thus, light can be efficiently coupled to the member / region from the light transmitting member 20 in a relatively simple manner, and the light control function by the member / region can be enhanced.

＜実施例１＞
以下、本発明に係る実施例について詳述する。なお、本発明は以下に示す実施例のみに
限定されないことは言うまでもない。 <Example 1>
Examples according to the present invention will be described in detail below. Needless to say, the present invention is not limited to the following examples.

実施例１の発光装置は、図１に示すように、ＡｌＮのセラミックス基板５０の配線５５
上に、発光素子１０として約１ｍｍ×１ｍｍの略正方形のＬＥＤチップ（サファイア基板
上に窒化物半導体が積層された構造で発光波長４５５ｎｍ、厚さ約９０μｍ）が１個フリ
ップチップ実装されている。セラミックス基板５０上には、ＬＥＤチップ１０を包囲する
高さ約１５０μｍの第１の枠体５１が設けられている。その第１の枠体５１の内側には、
粒径約２７０ｎｍのＴｉＯ₂の微粒子である光反射性材料４６を約２３重量パ
ーセント濃度で含有するシリコーン樹脂の被覆部材４０が充填されており、ＬＥＤチップ１０のサフ
ァイア基板の裏面が露出される状態に、ＬＥＤチップ１０が被覆部材４０でもって被覆さ
れている。また被覆部材４０はＬＥＤチップ１０から第１の枠体５１の内壁を該枠体５１
の上面まで緩やかに這い上がって、凹曲面からなる第１の反射面３１がその表面に形成さ
れている。そして、第１の枠体５１上には、板状の光透過部材２０としてＹＡＧの蛍光体
とアルミナ（Ａｌ₂Ｏ₃）との焼結体である蛍光体板（この表面２１及び受光面２２の外形
は約７．４ｍｍ×３．３ｍｍの略矩形状であり、厚さは約１２０μｍ）が１枚載置されて
おり、第１の枠体５１を閉蓋している。この蛍光体板２０は、第１の枠体５１の内壁を這
い上がった被覆部材４０に当接しており、ＬＥＤチップ１０と蛍光体板２０との離間領域
３０には空隙が設けられている。さらに、セラミック基板５０上には第１の枠体５１を包
囲するように該第１の枠体５１より背の高い第２の枠体５５が設けられている。この第２
の枠体５５の内側には、上記と同様の被覆部材４５が充填されており、該被覆部材４５は
、蛍光体板２０の表面２１を発光面９０として露出し蛍光体板２０の側面を被覆して、ま
た第２の枠体５２の内壁を該枠体５２の上面近傍まで緩やかに這い上がっている。これに
より、被覆部材４５と蛍光体板２０の側面との界面およびその上方に延出した凹曲面から
なる第２の反射面３２が、その被覆部材４５の表面に形成されている。 As shown in FIG. 1, the light-emitting device of Example 1 has a wiring 55 of an AlN ceramic substrate 50.
On the top, one LED chip having a substantially square shape of about 1 mm × 1 mm (a light emitting wavelength of 455 nm and a thickness of about 90 μm with a structure in which a nitride semiconductor is laminated on a sapphire substrate) is mounted as a light-emitting element 10 in a flip-chip manner. A first frame 51 having a height of about 150 μm is provided on the ceramic substrate 50 to surround the LED chip 10. On the inside of the first frame 51,
A state in which the back surface of the sapphire substrate of the LED chip 10 is exposed, which is filled with a coating member 40 of a silicone resin containing a light-reflecting material 46 which is a fine particle of TiO _{2 having} a particle size of about 270 nm at a concentration of about 23 weight percent. Further, the LED chip 10 is covered with a covering member 40. The covering member 40 extends from the LED chip 10 to the inner wall of the first frame 51.
The first reflecting surface 31 formed of a concave curved surface is formed on the surface of the first reflecting surface. On the first frame 51, a phosphor plate (this surface 21 and light receiving surface 22) that is a sintered body of YAG phosphor and alumina (Al ₂ O ₃ ) as the plate-like light transmitting member 20. The outer shape is a substantially rectangular shape of about 7.4 mm × 3.3 mm and the thickness is about 120 μm), and the first frame 51 is closed. The phosphor plate 20 is in contact with the covering member 40 scooping up the inner wall of the first frame 51, and a gap 30 is provided in the separation region 30 between the LED chip 10 and the phosphor plate 20. Further, a second frame body 55 that is taller than the first frame body 51 is provided on the ceramic substrate 50 so as to surround the first frame body 51. This second
The inside of the frame 55 is filled with a covering member 45 similar to the above, and the covering member 45 exposes the surface 21 of the phosphor plate 20 as the light emitting surface 90 and covers the side surface of the phosphor plate 20. In addition, the inner wall of the second frame 52 is gently creeped up to the vicinity of the upper surface of the frame 52. As a result, the second reflecting surface 32 is formed on the surface of the covering member 45, which is composed of an interface between the covering member 45 and the side surface of the phosphor plate 20 and a concave curved surface extending upward.

以上により、実施例１では、実施の形態１とほぼ同様の効果を奏する発光装置を提供す
ることができる。 As described above, Example 1 can provide a light-emitting device that exhibits substantially the same effect as that of Embodiment 1.

本発明の発光装置は、照明用光源、ＬＥＤディスプレイ、液晶表示装置などのバックラ
イト光源、信号機、照明式スイッチ、各種センサ及び各種インジケータ等に好適に利用す
ることができる。 The light-emitting device of the present invention can be suitably used for backlight sources such as illumination light sources, LED displays, liquid crystal display devices, traffic lights, illumination switches, various sensors, various indicators, and the like.

１０…発光素子（１…成長基板、２…第１導電型（ｎ型）半導体層、３…活性層、４…第
２導電型（ｐ型）半導体層、５…透光性導電層、６…第２の電極（ｐ側パッド電極）、７
…第１の電極（ｎ側パッド電極）、８…保護膜、１１…素子構造）
２０…光透過部材（２１，２３…表面、２２…受光面、２３Ａ…凹凸面・凹凸構造）
３０…離間領域・空隙
３１…第１の反射面
３２…第２の反射面
４０（第1），４５（第2）…被覆部材（４６（第1），４７（第2）…光反射性材料）
５０…実装基板（５１，５２…枠体、５５、５６…配線、５７、５８…凹部、５９…装置
基体）
６０…導電性接着材
７０…封止部材
７１…透光性部材
９０…発光面
９１…第２の発光面 DESCRIPTION OF SYMBOLS 10 ... Light emitting element (1 ... Growth substrate, 2 ... 1st conductivity type (n-type) semiconductor layer, 3 ... Active layer, 4 ... 2nd conductivity type (p-type) semiconductor layer, 5 ... Translucent conductive layer, 6 ... Second electrode (p-side pad electrode), 7
... 1st electrode (n side pad electrode), 8 ... Protective film, 11 ... Element structure)
20 ... light transmission member (21, 23 ... surface, 22 ... light receiving surface, 23A ... concave / concave structure)
30 ... separation region / gap 31 ... first reflecting surface 32 ... second reflecting surface 40 (first), 45 (second) ... covering member (46 (first), 47 (second) ... light reflectivity material)
50 ... Mounting substrate (51, 52 ... Frame, 55, 56 ... Wiring, 57, 58 ... Recess, 59 ... Device base)
60 ... conductive adhesive 70 ... sealing member 71 ... translucent member 90 ... light emitting surface 91 ... second light emitting surface

Claims (7)

半導体素子構造を有する発光素子と、
光反射性材料を含有し、前記発光素子の出射面を露出して、該発光素子の側面を被覆する被覆部材と、
互いに対向する発光面と、前記発光素子の出射表面からの光を受光する受光面と、を有し、前記発光素子の出射面に接合する光透過部材と、を備え、
前記被覆部材は、さらに前記光透過部材の側面を被覆するとともに、該光透過部材の外側において、前記光透過部材の側面から前記発光面より前方に延出した延出部を有し、該延出部が前記発光面を包囲し、該延出部の発光面側表面と、前記光透過部材の側面とに反射面を有する発光装置。 A light emitting device having a semiconductor device structure;
Contains a light reflective material, to expose the exit surface of the light emitting element, and a covering member covering the side surface of the light emitting element,
A light-transmitting member that has a light-emitting surface facing each other and a light-receiving surface that receives light from the light-emitting surface of the light-emitting element, and that is joined to the light-emitting surface of the light-emitting element,
The covering member further while covering the side surface of the light transmitting member, the outside of the light transmitting member has an extending portion extending forward from the light-emitting surface from a side surface of the light transmitting member, said extension A light emitting device in which a projecting portion surrounds the light emitting surface and has a reflecting surface on a light emitting surface side surface of the extending portion and a side surface of the light transmitting member. 前記光透過部材の側面が、前記発光素子の外側の側面より、内側に設けられている請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein a side surface of the light transmitting member is provided on an inner side than an outer side surface of the light emitting element. 前記延出部は、該延出部の前記反射面が発光面に対面するように傾斜して、該発光面の前方を一部覆っている請求項１又は２に記載の発光装置。 The extending portion, the reflective surface of the extending portion is inclined so as to face the light emitting surface, the light emitting device according to claim 1 or 2 covers part of the front of the light emitting surface. 前記延出部は、該延出部の前記反射面が発光面より側方の外側に設けられている請求項１又は２に記載の発光装置。 The extending portion, the reflective surface of the extending portion emitting device according to claim 1 or 2 is provided on the outside of the side from the light emitting surface. 前記光透過部材の発光面に接合し、該接合側に対向する表面の第２の発光面を備えた透光性部材を有し、
前記延出部は、前記透光性部材の側面を被覆しており、該側面に前記反射面が設けられている請求項３又は４に記載の発光装置。 A light-transmitting member that is bonded to the light-emitting surface of the light-transmitting member and includes a second light-emitting surface on the surface facing the bonding side;
The light emitting device according to claim 3 or 4, wherein the extending portion covers a side surface of the translucent member, and the reflective surface is provided on the side surface. 前記光透過部材は、前記発光素子に励起される波長変換部材である請求項１乃至５のいずれか１項に記載の発光装置。   The light emitting device according to claim 1, wherein the light transmitting member is a wavelength conversion member excited by the light emitting element. 前記波長変換部材は板状体である請求項６に記載の発光装置。   The light emitting device according to claim 6, wherein the wavelength conversion member is a plate-like body.

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