JP5596683B2 - 回路材料、回路積層体及びその製造方法 - Google Patents
回路材料、回路積層体及びその製造方法 Download PDFInfo
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- JP5596683B2 JP5596683B2 JP2011518931A JP2011518931A JP5596683B2 JP 5596683 B2 JP5596683 B2 JP 5596683B2 JP 2011518931 A JP2011518931 A JP 2011518931A JP 2011518931 A JP2011518931 A JP 2011518931A JP 5596683 B2 JP5596683 B2 JP 5596683B2
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Images
Classifications
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
- Y10T428/257—Iron oxide or aluminum oxide
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
上述した方法を用いて、乾燥固形分ベースでフィラー含有量が57〜67体積%のFillite(登録商標)106、Fillite(登録商標)160W及びE−SPHERES L−75セノスフェアを使用して、セノスフェア充填PTFF基板を作製した。
Rogers RO4003C高周波回路基板は、IPC−TM−650 2.5.5.5c試験法に従って10GHzで試験した場合、約3.4の誘電率を示す。誘電率のより低い材料を作製することができることを論証するために、RO4003Cに存在する溶融非晶質シリカフィラーの一部をセノスフェアフィラーに置き換えた。3つの異なるセノスフェア材料、すなわちSL−75、XL−150及びVEA X−10を試験した。
誘電率及び誘電正接を先行する実施例と比較するために、より高価な従来技術の合成中空微小球フィラーを用いて、上述したセノスフェア組成物に類似するPTFE複合材を作製した。
Claims (23)
- 回路サブアセンブリであって、
導電層を誘電体基板層の上に配置した回路積層体を備え、
該誘電体基板層は、該誘電体基板層の体積に基づき、30〜90体積パーセントのポリマーマトリクス材料と、複数のセノスフェアの重量に基づいて3重量パーセント以下の酸化鉄含有量を有する該複数のセノスフェアを含む10〜70体積パーセントのフィラー成分と、を含み、
前記回路積層体は、誘電率が3.5未満であり、誘電正接が0.006未満である、回路サブアセンブリ。 - 前記セノスフェアは中央粒径が20〜100マイクロメートルである、請求項1に記載の回路サブアセンブリ。
- 前記フィラー成分は、前記フィラー成分の全体積に基づいて、1〜100体積パーセントのセノスフェアを含む、請求項1又は2に記載の回路サブアセンブリ。
- 前記フィラー成分は、前記フィラー成分の全体積に基づいて、20〜80体積%の量で追加のフィラーを含む、請求項1〜3のいずれか1項に記載の回路サブアセンブリ。
- 前記追加のフィラーは、シリカ、溶融非晶質シリカ又はそれらの組合せである、請求項4に記載の回路サブアセンブリ。
- 前記追加のフィラーは、アルミナ三水和物、水酸化マグネシウム又はそれらの組合せである、請求項4又は5に記載の回路サブアセンブリ。
- 前記ポリマーマトリクス材料は、1,2−ポリブタジエン、ポリイソプレン、ポリエーテルイミド、フルオロポリマー、ポリテトラフルオロエチレン、ポリフェニレンエーテル、ポリイミド、ポリエーテルエーテルケトン、ポリアミドイミド、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリシクロヘキシレンテレフタレート、又は上記のうちの少なくとも1つを含む組合せを含む、請求項1〜6のいずれか1項に記載の回路サブアセンブリ。
- 前記ポリマーマトリクス材料はポリテトラフルオロエチレンである、請求項1〜6のいずれか1項に記載の回路サブアセンブリ。
- 前記ポリマーマトリクス材料は、1,2−ポリブタジエン、ポリイソプレン、又は1,2−ポリブタジエン及びポリイソプレンの組合せである、請求項1〜6のいずれか1項に記載の回路サブアセンブリ。
- 前記ポリマーマトリクス材料はポリ(アリーレンエーテル)を含む、請求項1〜6のいずれか1項に記載の回路サブアセンブリ。
- 前記ポリ(アリーレンエーテル)はカルボキシ官能化されている、請求項10に記載の回路サブアセンブリ。
- ポリブタジエン又はポリイソプレンポリマーをさらに含む、請求項10に記載の回路サブアセンブリ。
- 前記ポリブタジエンポリマー又はポリイソプレンポリマーはカルボキシ官能化され、ブタジエン、イソプレン、又はブタジエン及びイソプレンと、50重量パーセント未満の共硬化可能なモノマーとを含む、請求項12に記載の回路サブアセンブリ。
- 前記誘電体基板層の前記第1の導電層の反対側に配置された第2の導電層をさらに備える、請求項1〜13のいずれか1項に記載の回路サブアセンブリ。
- 前記導電層は銅箔である、請求項1〜14のいずれか1項に記載の回路サブアセンブリ。
- 前記導電層はエッチングされて回路を提供する、請求項1〜15のいずれか1項に記載の回路サブアセンブリ。
- 前記導電層は前記誘電体材料の層と接触している、請求項1〜16のいずれか1項に記載の回路サブアセンブリ。
- 前記導電層及び前記誘電体基板層の間に、前記導電層及び前記誘電体基板層と接触するボンドプライが配置されている、請求項1〜17のいずれか1項に記載の回路サブアセンブリ。
- 請求項1〜18のいずれか1項に記載の回路サブアセンブリを含む回路。
- 請求項1〜18のいずれか1項に記載の回路サブアセンブリを含む多層回路。
- 回路サブアセンブリを製造する方法であって、
複数のセノスフェアの重量に基づいて3重量パーセント以下の酸化鉄含有量を有する該複数のセノスフェアを含むフィラー成分と、ポリマーマトリクス材料とを結合して、誘電体複合材料を形成する工程と、
前記誘電体複合材料の層を形成する工程と、
前記誘電体複合材料の層の上に導電層を配置する工程と、
前記誘電体複合材料の層と前記導電層とを積層して、誘電率が3.5未満でありかつ誘電正接が0.006未満である回路サブアセンブリを形成する工程と、
を含む、方法。 - 前記誘電体複合材料は、30〜90体積パーセントの前記ポリマーマトリクス材料と、10〜70体積パーセントの前記フィラー成分とを含む、請求項21に記載の方法。
- 請求項21または22に記載の方法によって製造された回路サブアセンブリ。
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US8190608P | 2008-07-18 | 2008-07-18 | |
US61/081,906 | 2008-07-18 | ||
PCT/US2009/050968 WO2010009381A1 (en) | 2008-07-18 | 2009-07-17 | Circuit materials, circuits laminates, and method of manufacture thereof |
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JP5596683B2 true JP5596683B2 (ja) | 2014-09-24 |
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US (1) | US8187696B2 (ja) |
JP (1) | JP5596683B2 (ja) |
CN (1) | CN102100130B (ja) |
DE (1) | DE112009001730T5 (ja) |
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2009
- 2009-07-17 WO PCT/US2009/050968 patent/WO2010009381A1/en active Application Filing
- 2009-07-17 JP JP2011518931A patent/JP5596683B2/ja active Active
- 2009-07-17 DE DE200911001730 patent/DE112009001730T5/de not_active Ceased
- 2009-07-17 GB GB201100113A patent/GB2473982B/en active Active
- 2009-07-17 US US12/504,996 patent/US8187696B2/en active Active
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US8187696B2 (en) | 2012-05-29 |
GB201100113D0 (en) | 2011-02-16 |
US20100015404A1 (en) | 2010-01-21 |
DE112009001730T5 (de) | 2012-11-22 |
GB2473982B (en) | 2013-01-23 |
CN102100130B (zh) | 2014-02-26 |
WO2010009381A1 (en) | 2010-01-21 |
GB2473982A (en) | 2011-03-30 |
CN102100130A (zh) | 2011-06-15 |
JP2011528853A (ja) | 2011-11-24 |
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