JP5584513B2 - Electric water pump - Google Patents

Electric water pump Download PDF

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JP5584513B2
JP5584513B2 JP2010095538A JP2010095538A JP5584513B2 JP 5584513 B2 JP5584513 B2 JP 5584513B2 JP 2010095538 A JP2010095538 A JP 2010095538A JP 2010095538 A JP2010095538 A JP 2010095538A JP 5584513 B2 JP5584513 B2 JP 5584513B2
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peripheral wall
circuit board
wall portion
closed peripheral
base plate
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JP2011226342A (en
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啓祐 若林
竜一 根岸
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Apic Yamada Corp
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Yamada Manufacturing Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D13/00—Pumping installations or systems
    • F04D13/02—Units comprising pumps and their driving means
    • F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D13/0686—Mechanical details of the pump control unit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/5813—Cooling the control unit

Description

本発明は、ポンプのモータ制御を行う回路基板を樹脂で被覆することにおいて、シリコーンゲルの使用量を最小限とし、軽量化及びコストダウンを実現でき、且つ組み付け作業性を向上させた電動ウォーターポンプに関する。   The present invention provides an electric water pump that can reduce the amount of silicone gel used, reduce the cost and reduce the cost, and improve the assembly workability by covering the circuit board for controlling the motor of the pump with resin. About.

近年車両の電動化，ハイブリッド化の進展により車両への電動ウォーターポンプの搭載が増加している。電動ウォーターポンプの中でもモータの機能を有する部分とポンプの機能を有する部分が一体となった、いわゆる一体型の電動ウォーターポンプが使用されることが多い。一体型の電動ウォーターポンプでは、モータの固定子の役割を担うステータコア及びコイルからなるステータと，モータの回転子の役割を担うインナーマグネットと，該インナーマグネットと一体化されたインペラとが配置されている。このような電動ウォーターポンプにおいて、回路基板上の電子部品の保護や放熱もしくは断熱を目的として回路基板をポッティング材で覆う構成とすることが多い。このような構成が開示された文献として、特許文献１が挙げられる。   In recent years, the mounting of electric water pumps on vehicles has increased due to the progress of electrification and hybridization of vehicles. Of the electric water pumps, a so-called integrated electric water pump in which a portion having a motor function and a portion having a pump function are integrated is often used. In the integrated electric water pump, a stator consisting of a stator core and a coil serving as a motor stator, an inner magnet serving as a motor rotor, and an impeller integrated with the inner magnet are arranged. Yes. In such an electric water pump, the circuit board is often covered with a potting material for the purpose of protecting electronic components on the circuit board, heat dissipation or heat insulation. Patent Document 1 is given as a document disclosing such a configuration.

特開２００４−１８３５９５JP2004-183595

特許文献１の構成では、ハウジング内の領域には熱伝導率の高い伝熱ポッティング材が充填され、且つ支持部材とエンドカバー側の領域には伝熱ポッティング材に接して熱伝導率の低い断熱ポッティング材が充填されている。そのため、ステータは伝熱ポッティング材で覆われ、電解コンデンサやヒューズは断熱ポッティング材で覆われている。これにより、最も発熱量が大きいステータで生じた熱は伝熱ポッティング材を介してハウジングに到達し、ハウジングから外気中へ放熱されるため、ステータは十分に放熱される。また、電解コンデンサやヒューズが断熱ポッティング材で覆われることで、ステータの熱が電解コンデンサやヒューズに伝わるのを極力抑制することができる。   In the configuration of Patent Document 1, the region in the housing is filled with a heat transfer potting material having a high thermal conductivity, and the region on the support member and end cover side is in contact with the heat transfer potting material and has a low heat conductivity. Potting material is filled. Therefore, the stator is covered with a heat transfer potting material, and the electrolytic capacitor and the fuse are covered with a heat insulating potting material. As a result, the heat generated in the stator that generates the largest amount of heat reaches the housing via the heat transfer potting material and is radiated from the housing to the outside air, so that the stator is sufficiently radiated. Further, since the electrolytic capacitor and the fuse are covered with the heat insulating potting material, it is possible to suppress the heat of the stator from being transmitted to the electrolytic capacitor and the fuse as much as possible.

特許文献１の構成により、電解コンデンサの寿命を長くでき、耐熱性の低い電解コンデンサを使用できるため、コスト低減に寄与する構成となっている。但し特許文献１の構成では以下のような課題が残されている。回路基板36と回路基板37は隣接しているが、互いにシール（密封）されている構成では無いため、支持部材とエンドカバー側の領域に溶融した断熱ポッティング材を流し込むと、最終的には領域ｂの全ての領域に断熱ポッティング材が充填される。断熱ポッティング材はシリコーンであるがいわゆる樹脂であり、樹脂は空気よりは遥かに密度（比重）が大きいものであり、領域ｂの全ての領域を断熱ポッティング材で充填すれば、電動ブラシレスウォーターポンプとしての重量は大きいものとなる。   With the configuration of Patent Document 1, the lifetime of the electrolytic capacitor can be extended, and an electrolytic capacitor with low heat resistance can be used, which contributes to cost reduction. However, in the configuration of Patent Document 1, the following problems remain. The circuit board 36 and the circuit board 37 are adjacent to each other, but are not sealed (sealed) with each other. Therefore, when the molten heat insulating potting material is poured into the support member and the area on the end cover side, the area eventually becomes the area. Insulating potting material is filled in all areas of b. Although the heat insulating potting material is silicone, it is a so-called resin, and the resin has a density (specific gravity) far greater than that of air. The weight of is large.

また、断熱ポッティング材はシリコーンであるため、伝熱ポッティング材や金属よりは断熱性が高いものであるが、空気の断熱性よりは遥かに劣るものであり、断熱ポッティング材を領域の全ての領域に充填することにより、若干の熱が伝わっていくため、断熱性をそれほど高レベルで達成できないものとなっていた。更に断熱ポッティング材の使用量の増加によるコスト増加についても懸念されるものである。本発明が解決しようとする課題（技術的課題又は目的）は、電動ウォーターポンプの回路基板の防水防湿性及び断熱性を
確実にすると共に、使用する被覆樹脂の量を最小限にして、コストの増加を抑え、且つ軽量化を実現することにある。 Also, since the heat insulating potting material is silicone, it has higher heat insulating properties than heat transfer potting materials and metals, but it is far inferior to the heat insulating properties of air. By filling the, the heat is transmitted, so that the heat insulation cannot be achieved at a very high level. Furthermore, there is concern about an increase in cost due to an increase in the amount of heat-insulating potting material used. The problem (technical problem or object) to be solved by the present invention is to ensure the waterproof and moistureproof and heat insulating properties of the circuit board of the electric water pump and minimize the amount of coating resin to be used. It is to suppress the increase and realize weight reduction.

そこで、発明者は、上記課題を解決すべく、鋭意，研究を重ねた結果、請求項１の発明を、モータハウジングと、該モータハウジングに接続自在であり且つベース板を有する回路ケースと、回路基板と、制御素子とからなり、前記回路ケースのベース板の内面側には前記回路基板が配置される閉鎖周壁部が形成され、前記ベース板の外面側には前記制御素子が装着され、該制御素子の複数本ある端子の一部はベース板を貫通して前記閉鎖周壁部内の回路基板と接続され、前記制御素子の複数本ある残りの端子は前記ベース板の前記閉鎖周壁部の外側に貫通形成されている前記内面側と前記外面側とを連通する複数の端子用通し孔を貫通して前記閉鎖周壁部外に突出し、前記閉鎖周壁部内に被覆樹脂が充填されてなる電動ウォーターポンプとしたことにより、上記課題を解決した。請求項２の発明を、請求項１において、前記閉鎖周壁部は、前記回路基板の形状と略同等且つ極僅かに大きい形状としてなる電動ウォーターポンプとしたことにより、上記課題を解決した。   In view of the above, the inventor has intensively and intensively studied to solve the above-described problems. As a result, the invention of claim 1 is obtained by combining a motor housing, a circuit case that is connectable to the motor housing and has a base plate, and a circuit. A closed peripheral wall portion on which the circuit board is arranged is formed on the inner surface side of the base plate of the circuit case, and the control element is mounted on the outer surface side of the base plate, A part of the plurality of terminals of the control element penetrates the base plate and is connected to the circuit board in the closed peripheral wall portion, and the remaining terminals of the plurality of control elements are outside the closed peripheral wall portion of the base plate. An electric water pump that penetrates through a plurality of terminal through holes that communicate between the inner surface side and the outer surface side that are formed so as to protrude from the closed peripheral wall portion and is filled with a coating resin in the closed peripheral wall portion. By, the above-mentioned problems are eliminated. According to a second aspect of the present invention, in the first aspect, the closed peripheral wall portion is an electric water pump having a shape that is substantially the same as the circuit board and slightly larger than the circuit board.

請求項１の発明では、回路ケースに閉鎖周壁部が形成され、該閉鎖周壁部に回路基板が装着されて、前記閉鎖周壁部内に被覆樹脂が充填されるので、被覆樹脂が閉鎖周壁部内のみの量で十分であり、被覆樹脂の使用量を従来のものよりも格段に削減できる。よって電動ウォーターポンプの軽量化が図れる。また被覆樹脂の使用量削減によるコストダウンが図れる。さらに、被覆樹脂の充填時に溶融した被覆樹脂が閉鎖周壁部外の制御素子の端子が貫通する孔から回路ケースの裏側に漏れないため作業性が向上する。また請求項２の発明では、閉鎖周壁部は、回路基板の形状と略同等且つ僅かに大きい形状としているので、閉鎖周壁部内に回路基板が装着された状態で、すでに、回路基板は正確な位置に装着されるものであり、作業効率が向上し、作業時間が短縮される。   In the invention of claim 1, the closed peripheral wall portion is formed in the circuit case, the circuit board is mounted on the closed peripheral wall portion, and the covering resin is filled in the closed peripheral wall portion, so that the covering resin is only in the closed peripheral wall portion. The amount is sufficient, and the amount of coating resin used can be significantly reduced as compared with the conventional one. Thus, the weight of the electric water pump can be reduced. In addition, the cost can be reduced by reducing the amount of coating resin used. Furthermore, since the coating resin melted at the time of filling the coating resin does not leak to the back side of the circuit case from the hole through which the terminal of the control element outside the closed peripheral wall portion passes, workability is improved. In the invention of claim 2, since the closed peripheral wall portion has a shape substantially equal to and slightly larger than the shape of the circuit board, the circuit board is already in an accurate position with the circuit board mounted in the closed peripheral wall portion. The work efficiency is improved and the work time is shortened.

（Ａ）は本発明の縦断正面図、（Ｂ）は（Ａ）の要部拡大図である。(A) is a longitudinal front view of the present invention, (B) is an enlarged view of the main part of (A). （Ａ）は回路ケースの縦断正面図、（Ｂ）は回路ケースの内面側平面図、（Ｃ）は回路ケースのヒートシンクを外した状態の外面側平面図である。(A) is a longitudinal front view of the circuit case, (B) is a plan view of the inner side of the circuit case, and (C) is a plan view of the outer side of the circuit case with the heat sink removed. （Ａ）は回路ケースに回路基板を装着しようとする斜視図、（Ｂ）は回路基板が装着された回路ケースの閉鎖周壁部に被覆樹脂が充填された斜視図である。(A) is a perspective view of mounting a circuit board on the circuit case, and (B) is a perspective view in which a closed peripheral wall portion of the circuit case on which the circuit board is mounted is filled with a coating resin. （Ａ）は回路ケースに回路基板を装着しようとする状態の縦断正面図、（Ｂ）は回路基板が装着された回路ケースの閉鎖周壁部に被覆樹脂が充填されている状態の縦断正面図、（Ｃ）は回路基板が装着された回路ケースの閉鎖周壁部に被覆樹脂が充填された状態の縦断正面図である。(A) is a longitudinal front view of a state in which a circuit board is to be attached to a circuit case, (B) is a longitudinal front view of a state in which a closed peripheral wall portion of the circuit case to which the circuit board is attached is filled with a coating resin, (C) is a longitudinal sectional front view of a state where a closed peripheral wall portion of a circuit case on which a circuit board is mounted is filled with a coating resin.

以下、本発明の実施形態を図面に基づいて説明する。本発明の構成は、図１に示すように、モータ部Ａと、モータ制御部Ｂと、ポンプ部９とからなる。モータ部Ａは、モータハウジング１の内部に鉄合金製のステータ２及びインナーマグネット３が装着されている。ステータ２は、ステータコア２１にコイル２２が巻き付けられており、これらが樹脂２３に被覆され防水性も有する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIG. 1, the configuration of the present invention includes a motor unit A, a motor control unit B, and a pump unit 9. In the motor part A, an iron alloy stator 2 and an inner magnet 3 are mounted inside a motor housing 1. In the stator 2, a coil 22 is wound around a stator core 21, which is covered with a resin 23 and has waterproof properties.

そして、ステータコア２１に巻かれたコイル２２の通電を制御により順番に切り替えていくことで磁界が切り替わり、軸中心寄りに配置されたインナーマグネット３を回転駆動させることができる。インナーマグネット３がステータ２の磁力により回転すれば、インナーマグネット３に一体的に装着されているインペラ４２が回転し、ポンプとしての機能を果たすことができる。   The magnetic field is switched by sequentially switching the energization of the coil 22 wound around the stator core 21 by control, and the inner magnet 3 disposed near the axis center can be rotationally driven. If the inner magnet 3 is rotated by the magnetic force of the stator 2, the impeller 42 that is integrally attached to the inner magnet 3 rotates, and can function as a pump.

モータ部Ａには、インペラ４２の周囲で、インナーマグネット３及びインペラシャフト４１が配置される領域までエンジンの冷却水が浸入する。そのためインペラ４２の羽根の軸方向反対側で且つインペラシャフト４１の軸端部近傍にはモータ部Ａと、モータ制御部Ｂとを区画する樹脂製もしくはアルミニウム合金製の区画壁１１が略円板状に形成されている。該区画壁１１は、モータ部Ａとモータ制御部Ｂとの境界壁としての役目をなすものであり、冷却水を密封する〔図１（Ａ）参照〕。   Engine cooling water enters the motor part A to the area around the impeller 42 where the inner magnet 3 and the impeller shaft 41 are disposed. Therefore, on the opposite side of the impeller 42 in the axial direction and in the vicinity of the shaft end of the impeller shaft 41, a partition wall 11 made of resin or aluminum alloy that partitions the motor part A and the motor control part B is formed in a substantially disc shape. Is formed. The partition wall 11 serves as a boundary wall between the motor part A and the motor control part B, and seals the cooling water (see FIG. 1A).

モータ制御部Ｂは、回路ケース５と、回路基板６と、ＦＥＴ等の制御素子７（電界効果トランジスタ）とから構成される。回路ケース５は、合成樹脂にて形成され、略円板形状のベース板５１の外周に両側面より突出する円筒形状の外周側部５２が形成されている。前記ベース板５１には、図２に示すように、内面側５１ａと外面側５１ｂとが存在し、内面側５１ａは、前記モータハウジング１に接続される側であり、回路基板６が装着される〔図２（Ｂ），図３参照〕。また、内面側５１ａには、後述する閉鎖周壁部５３が形成される。前記外面側５１ｂには、ＦＥＴ等の制御素子７及びその他のパワー系電子部品が組み込まれる〔図２（Ｃ）参照〕。   The motor control unit B includes a circuit case 5, a circuit board 6, and a control element 7 (field effect transistor) such as an FET. The circuit case 5 is formed of synthetic resin, and a cylindrical outer peripheral side portion 52 that protrudes from both side surfaces is formed on the outer periphery of a substantially disc-shaped base plate 51. As shown in FIG. 2, the base plate 51 has an inner surface side 51a and an outer surface side 51b. The inner surface side 51a is a side connected to the motor housing 1, and the circuit board 6 is mounted thereon. [Refer FIG. 2 (B) and FIG. 3]. Further, a closed peripheral wall portion 53 described later is formed on the inner surface side 51a. A control element 7 such as an FET and other power system electronic components are incorporated in the outer surface side 51b [see FIG. 2C].

ベース板５１の内面側５１ａには、図２（Ａ），（Ｂ）及び図３（Ａ）に示すように、閉鎖周壁部５３が形成され、該閉鎖周壁部５３内に回路基板６が装着され、シリコーンゲル等の被覆樹脂Ｒが充填されて回路基板６が樹脂で被覆される構成となる。この被覆樹脂Ｒは電子部品の保護や放熱もしくは断熱のために、被覆樹脂Ｒが回路基板６を覆うような充填がされる。   A closed peripheral wall portion 53 is formed on the inner surface 51 a of the base plate 51, as shown in FIGS. 2A, 2 B and 3 A, and the circuit board 6 is mounted in the closed peripheral wall portion 53. Then, the circuit board 6 is coated with the resin by filling the coating resin R such as silicone gel. The coating resin R is filled so that the coating resin R covers the circuit board 6 in order to protect electronic parts and to dissipate heat or insulate.

前記閉鎖周壁部５３は、平面状において閉鎖された周壁を構成するものであり、具体的にはベース板５１の内面側５１ａ上に載置された回路基板６の外周を完全に包囲するものであり、壁面の高さはいずれの位置でも同一高さである。閉鎖周壁部５３は、周方向に沿って閉鎖されたものであり、溶融した被覆樹脂Ｒが閉鎖周壁部５３内に充填されても、閉鎖周壁部５３を越えて外部に拡がることがない。閉鎖周壁部５３は、回路基板６の平面外形よりも大きく形成されるものであれば特に、その形状には限定されない。好ましくは、回路基板６の形状と略同等で且つ極僅かに大きい形状にすると良い。   The closed peripheral wall portion 53 constitutes a peripheral wall closed in a planar shape, and specifically completely surrounds the outer periphery of the circuit board 6 placed on the inner surface side 51a of the base plate 51. Yes, the height of the wall surface is the same at any position. The closed peripheral wall portion 53 is closed along the circumferential direction, and even if the melted coating resin R is filled in the closed peripheral wall portion 53, the closed peripheral wall portion 53 does not extend beyond the closed peripheral wall portion 53 to the outside. The closed peripheral wall portion 53 is not particularly limited as long as it is formed larger than the planar outer shape of the circuit board 6. Preferably, the shape is substantially the same as that of the circuit board 6 and is slightly larger.

また、回路基板６を閉鎖周壁部５３内に配置したときに、回路基板６の外周縁と閉鎖周壁部５３の内壁面との間隔は、可能な限り小さくなるように閉鎖周壁部５３の形状を形成することが特に好ましい。すなわち、回路基板６の平面外周形状に対して閉鎖周壁部５３の内周形状が略同一となるように高い精度にて形成されることで、回路基板６は閉鎖周壁部５３に対して、位置がほとんどズレないで装着することができる。   In addition, when the circuit board 6 is disposed in the closed peripheral wall portion 53, the shape of the closed peripheral wall portion 53 is set so that the distance between the outer peripheral edge of the circuit board 6 and the inner wall surface of the closed peripheral wall portion 53 is as small as possible. It is particularly preferred to form. That is, the circuit board 6 is positioned with respect to the closed peripheral wall portion 53 with high accuracy so that the inner peripheral shape of the closed peripheral wall portion 53 is substantially the same as the planar outer peripheral shape of the circuit board 6. Can be installed with almost no deviation.

これにより回路基板６は、閉鎖周壁部５３内に載置するのみで、回路基板６の位置が適正な位置に設置でき、特に位置合わせすること無くネジやビス等で回路基板６を固定することができる。また、閉鎖周壁部５３の内面側５１ａからの壁面の高さは製品単品寸法や組み付け公差を考慮して、前記モータハウジング１の区画壁１１と干渉しない範囲で高くすることが好ましい。これにより、電子部品の保護や放熱もしくは断熱に寄与するシリコーンゲル等の被覆樹脂Ｒの量を極力多くすることができる。   As a result, the circuit board 6 can be placed at an appropriate position only by placing the circuit board 6 in the closed peripheral wall portion 53, and the circuit board 6 can be fixed with screws, screws or the like without being particularly aligned. Can do. In addition, it is preferable that the height of the wall surface from the inner surface side 51a of the closed peripheral wall portion 53 is increased within a range that does not interfere with the partition wall 11 of the motor housing 1 in consideration of a single product size and assembly tolerance. Thereby, the quantity of coating resin R, such as a silicone gel which contributes to protection of an electronic component, heat dissipation, or heat insulation, can be increased as much as possible.

ベース板５１の外面側５１ｂに装着される制御素子７は、内面側５１ａに装着された回路基板６の命令に基づいて決定されたタイミングで且つ決定された大きさの電力を、それぞれのステータ２のコイル２２に供給する部分である。制御素子７には、端子７１，７１，…が複数本形成されており、複数本ある端子７１，７１，…の一部はベース板５１を貫通して閉鎖周壁部５３内に突出し、該閉鎖周壁部５３内に装着された回路基板６に接続配線される〔図１（Ｂ）参照〕。残りの端子７１，７１，…は、ベース板５１を貫通して閉鎖周壁部５３外に突出し、ベース板５１に配置されたステータ２のコイル２２と連通する
端子に連結される。 The control element 7 attached to the outer surface side 51b of the base plate 51 supplies the electric power of the determined magnitude at the timing determined based on the instruction of the circuit board 6 attached to the inner surface side 51a. This is a portion to be supplied to the coil 22. The control element 7 has a plurality of terminals 71, 71,..., And some of the terminals 71, 71,... Protrude through the base plate 51 into the closed peripheral wall portion 53. The wiring is connected to the circuit board 6 mounted in the peripheral wall 53 (see FIG. 1B). The remaining terminals 71, 71,... Penetrate through the base plate 51, protrude out of the closed peripheral wall portion 53, and are connected to terminals that communicate with the coil 22 of the stator 2 disposed on the base plate 51.

回路基板６と制御素子７は、前述したように、ベース板５１の内面側５１ａ及び外面側５１ｂに分かれて配置されており、残りの端子７１とステータ２のコイル２２との連通する端子２４と連結するために、ベース板５１の内面側５１ａと外面側５１ｂとを連通する複数の端子用通し孔５４，５４，…がベース板５１の閉鎖周壁部５３の外側に貫通形成されている〔図１（Ｂ）参照〕。そして、残りの端子７１は、端子用通し孔５４，５４，…を貫通する。   As described above, the circuit board 6 and the control element 7 are arranged separately on the inner surface side 51 a and the outer surface side 51 b of the base plate 51, and the terminal 24 that communicates with the remaining terminal 71 and the coil 22 of the stator 2. In order to connect, a plurality of terminal through holes 54, 54,... Communicating with the inner surface 51 a and the outer surface 51 b of the base plate 51 are formed through the outside of the closed peripheral wall portion 53 of the base plate 51 [FIG. 1 (B)]. The remaining terminals 71 pass through the terminal through holes 54, 54,.

前述したように、ベース板５１の外面側５１ｂに装着された制御素子７の端子７１，７１，…は、その複数本がベース板５１を貫通して内面側５１ａの閉鎖周壁部５３内に突出している（図２参照）。そして、ベース板５１の内面側５１ａでは、閉鎖周壁部５３に回路基板６を装着することにより、回路基板６と制御素子７とが端子７１で接続できる（図４参照）。回路ケース５のベース板５１に形成された閉鎖周壁部５３に回路基板６を装着して、被覆樹脂Ｒが充填されることにより、被覆樹脂Ｒが回路基板６のみを被覆することができ、被覆樹脂Ｒの樹脂量を従来のものよりも格段に削減できる。さらに閉鎖周壁部５３によって、溶融した被覆樹脂Ｒは閉鎖周壁部５３の外部にまでは広がることがないので、はみ出した被覆樹脂Ｒが端子用通し孔５４からベース板５１の外面側５１ｂに漏れ出すことも防止できる。   As described above, a plurality of terminals 71, 71,... Of the control element 7 mounted on the outer surface side 51b of the base plate 51 pass through the base plate 51 and project into the closed peripheral wall portion 53 on the inner surface side 51a. (See FIG. 2). Then, on the inner surface side 51a of the base plate 51, the circuit board 6 and the control element 7 can be connected by the terminal 71 by mounting the circuit board 6 on the closed peripheral wall portion 53 (see FIG. 4). By mounting the circuit board 6 on the closed peripheral wall portion 53 formed on the base plate 51 of the circuit case 5 and filling the coating resin R, the coating resin R can cover only the circuit board 6. The resin amount of the resin R can be significantly reduced as compared with the conventional one. Further, since the melted coating resin R does not spread to the outside of the closed peripheral wall portion 53 by the closed peripheral wall portion 53, the protruding coating resin R leaks from the terminal through hole 54 to the outer surface side 51 b of the base plate 51. Can also be prevented.

被覆樹脂Ｒは、回路基板６上の電子部品の保護や放熱もしくは断熱の役目をなし、具体的には、前述したようにシリコーンゲル（ポッティング材）が使用される。被覆樹脂Ｒの材質としてウレタンやセラミック，エポキシ等の材質を使用する場合もある。発熱部品であるＦＥＴ等の制御素子７は、ヒートシンク８の裏面に接触して配置されているので、ヒートシンク８のフィンにより制御素子７を効果的に放熱させることができる。   The coating resin R serves to protect the electronic components on the circuit board 6, and to dissipate heat or heat. Specifically, the silicone resin (potting material) is used as described above. A material such as urethane, ceramic, or epoxy may be used as the material of the coating resin R. Since the control element 7 such as FET, which is a heat generating component, is arranged in contact with the back surface of the heat sink 8, the control element 7 can be effectively radiated by the fins of the heat sink 8.

アルミニウム合金製のヒートシンク８として放熱のために多数のフィンが形成され、制御素子７とヒートシンク８は直接、もしくは放熱グリス，放熱シート等を介して接触している。よって、前記制御素子７によって発生した熱は速やかにヒートシンク８に伝達され、フィンから外気中に放出される。ポンプ部９は主に、図１（Ａ）に示すように、ポンプカバー部９１に吸入口９３と吐出口９２とを有したもので、樹脂製もしくはアルミニウム合金製である。ポンプカバー部９１の内部にはインペラ４２が配置されており、インペラ４２は、前記インペラシャフト４１に回転自在に軸支され、モータ部Ａの動力により回転する。   A large number of fins are formed for heat dissipation as the heat sink 8 made of aluminum alloy, and the control element 7 and the heat sink 8 are in contact with each other directly or through heat dissipation grease, a heat dissipation sheet or the like. Therefore, the heat generated by the control element 7 is quickly transmitted to the heat sink 8 and released from the fins into the outside air. As shown in FIG. 1 (A), the pump unit 9 mainly has a suction port 93 and a discharge port 92 in the pump cover unit 91, and is made of resin or aluminum alloy. An impeller 42 is disposed inside the pump cover portion 91, and the impeller 42 is rotatably supported by the impeller shaft 41 and is rotated by the power of the motor portion A.

１…モータハウジング、５…回路ケース、５１…ベース板、５１ａ…内面側、
５１ｂ…外面側、５３…閉鎖周壁部、６…回路基板、７…制御素子、７１…端子、
Ｒ…被覆樹脂。 DESCRIPTION OF SYMBOLS 1 ... Motor housing, 5 ... Circuit case, 51 ... Base board, 51a ... Inner surface side,
51b ... outer surface side, 53 ... closed peripheral wall, 6 ... circuit board, 7 ... control element, 71 ... terminal,
R: Coating resin.

Claims (2)

モータハウジングと、該モータハウジングに接続自在であり且つベース板を有する回路ケースと、回路基板と、制御素子とからなり、前記回路ケースのベース板の内面側には前記回路基板が配置される閉鎖周壁部が形成され、前記ベース板の外面側には前記制御素子が装着され、該制御素子の複数本ある端子の一部はベース板を貫通して前記閉鎖周壁部内の回路基板と接続され、前記制御素子の複数本ある残りの端子は前記ベース板の前記閉鎖周壁部の外側に貫通形成されている前記内面側と前記外面側とを連通する複数の端子用通し孔を貫通して前記閉鎖周壁部外に突出し、前記閉鎖周壁部内に被覆樹脂が充填されてなることを特徴とする電動ウォーターポンプ。 A motor housing, a circuit case that is connectable to the motor housing and has a base plate, a circuit board, and a control element, and the circuit board is disposed on the inner surface side of the base plate of the circuit case. A peripheral wall portion is formed, the control element is mounted on the outer surface side of the base plate, a part of the plurality of terminals of the control element is connected to the circuit board in the closed peripheral wall portion through the base plate, A plurality of remaining terminals of the control element pass through a plurality of terminal through holes communicating with the inner surface side and the outer surface side which are formed to penetrate outside the closed peripheral wall portion of the base plate. An electric water pump characterized in that it protrudes out of the peripheral wall and is filled with a coating resin in the closed peripheral wall. 請求項１において、前記閉鎖周壁部は、前記回路基板の形状と略同等且つ極僅かに大きい形状としてなることを特徴とする電動ウォーターポンプ。
The electric water pump according to claim 1, wherein the closed peripheral wall portion has a shape that is substantially the same as the circuit board and slightly larger.
JP2010095538A 2010-04-16 2010-04-16 Electric water pump Active JP5584513B2 (en)

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IT202000004870A1 (en) * 2020-03-09 2021-09-09 Dab Pumps Spa ELECTRONIC PUMP WITH PERFECT INSULATION OF THE ELECTRONIC PART AND HEAT SINK ELEMENT FOR THIS ELECTRONIC PART
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