JP5564271B2 - 真空処理装置 - Google Patents
真空処理装置 Download PDFInfo
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- JP5564271B2 JP5564271B2 JP2010009615A JP2010009615A JP5564271B2 JP 5564271 B2 JP5564271 B2 JP 5564271B2 JP 2010009615 A JP2010009615 A JP 2010009615A JP 2010009615 A JP2010009615 A JP 2010009615A JP 5564271 B2 JP5564271 B2 JP 5564271B2
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- Prior art keywords
- vacuum
- vacuum processing
- chamber
- jig
- processing apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
105 カセット台
110 大気搬送室
120 ロック室
130 真空搬送室
140 副真空室
150 真空処理室
160 真空処理ユニット
170 高真空排気ポンプ
180 圧力調整機構
190 コイル上下装置
200 メンテナンス治具
210 スライドレール
220 第一関節アーム
230 第二関節アーム
240 バランサー
250 レバーロック
260 治具ヘッド
510 石英板
520 放電ブロックベース
610 内側上部チャンバー
620 内側下部チャンバー
910 試料台
920 つり下げ梁
930 支持梁
Claims (4)
- 減圧された内部の空間を処理対象ウエハが搬送される搬送容器と、この搬送容器の側壁に連結されその内部に前記処理対象のウエハが配置される試料台を有した処理室を備えた真空容器と、 この真空容器の上部であってこれを開閉する蓋部材と、前記真空容器内部に配置され前記処理室の内側壁を構成する内側チャンバー部材と、前記真空容器の外側で前記真空処理容器の側壁に連結されて配置された治具であって、上下方向の軸及び水平方向の軸を有した第1の関節部(230)及びこの関節部(230)の前記上下方向の軸及び水平方向の軸の各々の軸周りに上下方向及び左右方向に回動されると共にその長さが伸縮可能であってその先端部が前記内側チャンバー部材に連結される腕部(250)とを備えた治具とを備えた真空処理装置であって、
前記治具が、前記腕部(250)の先端部に配置され前記内側チャンバー部材に連結されるヘッド(260)と、このヘッド(260)と連結された状態の前記内側チャンバー部材をその水平方向の軸周りに回転させる第2の関節部(810)とを備えて、前記蓋部材を開放させて前記真空容器内部を大気に開放した状態で当該真空容器内部に前記腕部(250)の前記先端部を入れてこれと連結させた前記内側チャンバー部材をこの真空容器内部から取り外し可能に構成された真空処理装置。
- 請求項1に記載の真空処理装置であって、前記内側チャンバー部材が上下方向に配置された複数の部材から構成され、前記試料台が上方に持ち上げられて前記真空容器内部から取り出された後、前記内側チャンバー部材の前記複数の部材のうち前記試料台の下方に配置された部材が前記治具の先端部と連結された状態で前記腕部(250)が前記第1の関節部(230)周りに回転して前記真空容器から取り出し可能に構成された真空処理装置。
- 請求項1または2に記載の真空処理装置であって、前記搬送容器が多角形状の平面径を有し、この多角形の隣り合う辺を構成する前記搬送容器の側壁に複数の前記真空容器が隣り合って連結され、これら各々の真空容器の側壁に前記治具が取り付けられた真空処理装置。
- 請求項3に記載の真空処理装置であって、前記隣り合う真空容器同士の間に作業者が立って前記内側チャンバー部材と前記治具とを連結する作業を行える空間を備えた真空処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010009615A JP5564271B2 (ja) | 2010-01-20 | 2010-01-20 | 真空処理装置 |
US12/712,834 US8366370B2 (en) | 2010-01-20 | 2010-02-25 | Vacuum processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010009615A JP5564271B2 (ja) | 2010-01-20 | 2010-01-20 | 真空処理装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011151098A JP2011151098A (ja) | 2011-08-04 |
JP2011151098A5 JP2011151098A5 (ja) | 2013-02-14 |
JP5564271B2 true JP5564271B2 (ja) | 2014-07-30 |
Family
ID=44277692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010009615A Active JP5564271B2 (ja) | 2010-01-20 | 2010-01-20 | 真空処理装置 |
Country Status (2)
Country | Link |
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US (1) | US8366370B2 (ja) |
JP (1) | JP5564271B2 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3027989B1 (en) * | 2013-07-30 | 2018-02-28 | Board of Regents, The University of Texas System | Sample transfer to high vacuum transition flow |
JP6293499B2 (ja) * | 2014-01-27 | 2018-03-14 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
JP6311579B2 (ja) * | 2014-11-12 | 2018-04-18 | 株式会社ダイフク | 物品搬送設備 |
US10280047B2 (en) * | 2015-04-13 | 2019-05-07 | Brunkeberg Systems Ab | Lifting jig for lifting elements along the facade of a building |
CN105834429A (zh) * | 2016-06-08 | 2016-08-10 | 王艺 | 一种3d打印机环境状态保持与隔离装置 |
JP6960830B2 (ja) * | 2017-11-17 | 2021-11-05 | 株式会社日立ハイテク | 真空処理装置および真空処理装置の運転方法 |
JP6475877B2 (ja) * | 2018-02-14 | 2019-02-27 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
JP6666630B2 (ja) * | 2019-02-01 | 2020-03-18 | 株式会社日立ハイテク | 真空処理装置 |
WO2020180505A1 (en) | 2019-03-01 | 2020-09-10 | Lam Research Corporation | Integrated tool lift |
CN110527946B (zh) * | 2019-09-04 | 2024-03-19 | 立讯电子科技(昆山)有限公司 | 镀膜装置 |
US11534967B2 (en) | 2019-12-12 | 2022-12-27 | Arcam Ab | Additive manufacturing apparatuses with powder distributors and methods of use |
JP7482746B2 (ja) | 2020-10-19 | 2024-05-14 | 東京エレクトロン株式会社 | 基板処理装置、基板処理システム、及びメンテナンス方法 |
CN114044289B (zh) * | 2021-10-11 | 2023-03-14 | 中国科学院沈阳科学仪器股份有限公司 | 一种真空垂直交接样品传输*** |
CN114941124B (zh) * | 2022-06-01 | 2024-04-30 | 江苏邑文微电子科技有限公司 | 一种真空晶圆镀膜装置 |
CN114777490B (zh) * | 2022-06-21 | 2022-09-09 | 上海陛通半导体能源科技股份有限公司 | 可实现自动全向开合的半导体设备 |
CN115547908B (zh) * | 2022-11-29 | 2023-03-28 | 浙江果纳半导体技术有限公司 | 一种装载*** |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0745684A (ja) * | 1993-07-27 | 1995-02-14 | Kokusai Electric Co Ltd | 半導体製造装置の処理室 |
US5674123A (en) * | 1995-07-18 | 1997-10-07 | Semifab | Docking and environmental purging system for integrated circuit wafer transport assemblies |
JPH11288991A (ja) * | 1998-04-03 | 1999-10-19 | Shinko Electric Co Ltd | ロードポート |
JP3363405B2 (ja) * | 1999-03-17 | 2003-01-08 | 株式会社日立製作所 | プラズマ処理装置およびプラズマ処理装置システム |
KR100596822B1 (ko) * | 1999-03-30 | 2006-07-03 | 동경 엘렉트론 주식회사 | 플라즈마 처리 장치, 그 보수 방법 및 그 시공 방법 |
US6396072B1 (en) * | 1999-06-21 | 2002-05-28 | Fortrend Engineering Corporation | Load port door assembly with integrated wafer mapper |
US6413356B1 (en) * | 2000-05-02 | 2002-07-02 | Applied Materials, Inc. | Substrate loader for a semiconductor processing system |
US6866460B2 (en) * | 2001-07-16 | 2005-03-15 | Semitool, Inc. | Apparatus and method for loading of carriers containing semiconductor wafers and other media |
JP4522795B2 (ja) | 2003-09-04 | 2010-08-11 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
US7845618B2 (en) * | 2006-06-28 | 2010-12-07 | Applied Materials, Inc. | Valve door with ball coupling |
US7581916B2 (en) * | 2006-07-14 | 2009-09-01 | Ulvac-Phi, Inc. | Sample introduction and transfer system and method |
JP4309935B2 (ja) * | 2007-07-31 | 2009-08-05 | Tdk株式会社 | 密閉容器の蓋開閉システム及び当該システムを用いた基板処理方法 |
-
2010
- 2010-01-20 JP JP2010009615A patent/JP5564271B2/ja active Active
- 2010-02-25 US US12/712,834 patent/US8366370B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US8366370B2 (en) | 2013-02-05 |
US20110176893A1 (en) | 2011-07-21 |
JP2011151098A (ja) | 2011-08-04 |
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