JP5561993B2 - Manufacturing method of surface mount crystal oscillator - Google Patents

Manufacturing method of surface mount crystal oscillator Download PDF

Info

Publication number
JP5561993B2
JP5561993B2 JP2009236458A JP2009236458A JP5561993B2 JP 5561993 B2 JP5561993 B2 JP 5561993B2 JP 2009236458 A JP2009236458 A JP 2009236458A JP 2009236458 A JP2009236458 A JP 2009236458A JP 5561993 B2 JP5561993 B2 JP 5561993B2
Authority
JP
Japan
Prior art keywords
chip
recess
bottom wall
liquid resin
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009236458A
Other languages
Japanese (ja)
Other versions
JP2011087004A (en
Inventor
秀典 播磨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2009236458A priority Critical patent/JP5561993B2/en
Publication of JP2011087004A publication Critical patent/JP2011087004A/en
Application granted granted Critical
Publication of JP5561993B2 publication Critical patent/JP5561993B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)

Description

本発明は表面実装水晶発振器（以下、表面実装発振器とする）の製造方法を技術分野とし、特にＩＣチップの回路機能面を保護する樹脂の塗布（所謂アンダーフィル）を容易にした表面実装容器の製造方法に関する。   The present invention relates to a manufacturing method of a surface-mount crystal oscillator (hereinafter referred to as a surface-mount oscillator), and particularly to a surface-mount container that facilitates application of a resin that protects the circuit functional surface of an IC chip (so-called underfill). It relates to a manufacturing method.

（発明の背景）
表面実装発振器は小型・軽量であることから、例えば携帯型の電子機器に周波数や時間の基準源として適用される。このようなものの一つに、表面実装容器をＨ状としてＩＣチップと水晶片とを上下の別個の空間部内に収容したものや（Ｈ構造型）、表面実装振動子の底面にＩＣチップを収容した凹状の実装基板を接合したもの（接合型）がある。 (Background of the Invention)
Since the surface-mounted oscillator is small and light, it is applied as a frequency and time reference source to, for example, a portable electronic device. One of these is an H-shaped surface-mount container that houses IC chips and crystal pieces in separate upper and lower spaces (H structure type), or an IC chip that is housed on the bottom surface of a surface-mount oscillator. In some cases, the concave mounting board is joined (joint type).

（従来技術の一例）
第４図及び第５図は一従来例を説明する図で、第４図（ａ）はＨ構造型とした表面実装発振器の断面図で、同図（ｂ）は底面図、第５図（ａ）は水晶片の平面図、同図（ｂ）はＩＣチップの回路機能面（一主面）の平面図である。 (Example of conventional technology)
4 and 5 are diagrams for explaining a conventional example. FIG. 4 (a) is a sectional view of an H structure type surface mount oscillator, FIG. 4 (b) is a bottom view, and FIG. FIG. 4A is a plan view of a crystal piece, and FIG. 4B is a plan view of a circuit function surface (one main surface) of an IC chip.

表面実装発振器は例えばＨ状とした表面実装容器１に水晶片２とＩＣチップ３とを収容してなる「第４図」。表面実装容器１は中央底壁１ａ及び上下枠壁１（ｂｃ）の積層セラミックからなり、上下面の両主面にそれぞれ凹部を形成する。上面凹部の内底面には一対の水晶保持端子４を、下面凹部の内底面にはＩＣ保持端子５を有する。そして、表面実装容器１の底面となる下枠壁１ｃの上面には実装端子６を有する。水晶保持端子４はＩＣ保持端子５中の水晶端子に、ＩＣ保持端子５は底面の実装端子６に図示しない配線路によって電気的に接続する。   The surface mount oscillator is formed by, for example, housing a crystal piece 2 and an IC chip 3 in a surface mount container 1 having an H shape (FIG. 4). The surface mount container 1 is made of a laminated ceramic of a center bottom wall 1a and upper and lower frame walls 1 (bc), and has recesses on both main surfaces of the upper and lower surfaces. A pair of crystal holding terminals 4 are provided on the inner bottom surface of the upper surface recess, and an IC holding terminal 5 is provided on the inner bottom surface of the lower surface recess. And the mounting terminal 6 is provided in the upper surface of the lower frame wall 1c used as the bottom face of the surface mounting container 1. FIG. The crystal holding terminal 4 is electrically connected to the crystal terminal in the IC holding terminal 5, and the IC holding terminal 5 is electrically connected to the mounting terminal 6 on the bottom surface via a wiring path (not shown).

水晶片２は例えばＡＴカットとし、両主面に励振電極２ａを有して一端部両側に引出電極２ｂを延出する「第５図（ａ）」。そして、引出電極２ｂの延出した水晶片２の一端部両側を上面凹部（内底面）の水晶保持端子４に導電性接着剤７等によって固着し、電気的・機械的に接続する。上面凹部の枠壁上面には例えば金属リング８が設けられ、シーム溶接によって金属カバー９が接合して水晶片２を密閉封入する。   The crystal piece 2 is, for example, an AT cut, has excitation electrodes 2a on both main surfaces, and extends extraction electrodes 2b on both sides of one end portion (FIG. 5 (a)). Then, both ends of one end portion of the crystal piece 2 from which the extraction electrode 2b extends are fixed to the crystal holding terminal 4 in the upper surface recess (inner bottom surface) by the conductive adhesive 7 or the like, and are electrically and mechanically connected. For example, a metal ring 8 is provided on the upper surface of the frame wall of the upper surface recess, and a metal cover 9 is joined by seam welding to hermetically enclose the crystal piece 2.

ＩＣチップ３は水晶振動子（水晶片２）とともに少なくとも発振回路を形成する回路素子を集積化し、回路が形成された一主面の回路機能面にＩＣ端子３ａを有する「第５図（ｂ）」。ＩＣ端子３ａは少なくとも電源、出力、アース等の複数の端子例えば６個を有し、一主面の両端側に平行として３個ずつを有する。ＩＣ端子３ａ上には例えばＡu（金）としたバンプ１５（球状粒）が設けられる。そして、回路機能面（一主面）が下面凹部の内底面に対面し、ＩＣ端子３Ａに対応して３個ずつが平行に配置されたＩＣ保持端子５に、超音波熱圧着によって、ＩＣ端子３ａ上のバンプ１５が接続する。これにより、ＩＣチップ３が内底面に電気的・機械的に接続する。   The IC chip 3 integrates at least a circuit element that forms an oscillation circuit together with a crystal resonator (crystal piece 2), and has an IC terminal 3a on a circuit functional surface of one main surface on which the circuit is formed (FIG. 5B). " The IC terminal 3a has at least a plurality of terminals such as a power source, an output, and an earth, for example, six, and three in parallel on both ends of one main surface. Bumps 15 (spherical particles) made of, for example, Au (gold) are provided on the IC terminal 3a. Then, the IC function surface (one main surface) faces the inner bottom surface of the concave portion of the lower surface, and the IC terminals are placed on the IC holding terminals 5 arranged in parallel corresponding to the IC terminals 3A by ultrasonic thermocompression bonding. The bumps 15 on 3a are connected. Thereby, the IC chip 3 is electrically and mechanically connected to the inner bottom surface.

その後、通常では、第６図（断面図）に示したように、ＩＣチップ３の外周と下枠壁１ｃの内周との間隙にノズル１０の先端を接近してアンダーフィルとなる液状樹脂１１を注入する。これにより、ＩＣチップ３の回路機能面（一主面）と内底面との間に液状樹脂１１を浸透（充填）して、回路機能面を保護する。アンダーフィルとしての液状樹脂１１は、多数の樹脂粒を溶媒（液体）に混入して撹拌されてなる。なお、液状樹脂１１は充填後に加熱されて硬化する。   Thereafter, normally, as shown in FIG. 6 (cross-sectional view), the liquid resin 11 that becomes an underfill with the tip of the nozzle 10 approaching the gap between the outer periphery of the IC chip 3 and the inner periphery of the lower frame wall 1c. Inject. Thus, the liquid resin 11 is infiltrated (filled) between the circuit function surface (one main surface) and the inner bottom surface of the IC chip 3 to protect the circuit function surface. The liquid resin 11 as the underfill is obtained by mixing a large number of resin particles in a solvent (liquid) and stirring. The liquid resin 11 is heated and cured after filling.

特開２００３−２６４４２９号公報JP 2003-264429 A 特開２００７−１４３０７９号公報JP 2007-143079 A

（従来技術の問題点）
しかしながら、上記構成の表面実装発振器では、特に表面実装容器１の平面外形が小さくなると、ＩＣチップ３（外周）と下枠壁１ｃ（内周）との間隙が小さくなって、液状樹脂１１の注入を困難にする。例えばノズル１０との対面側となるＩＣチップ３の他主面上に液状樹脂１１が表面張力によって盛り上がるのみで、間隙からの注入が損なわれる。この場合、液状樹脂１１の量を多くして無理に間隙から侵入させても、下面凹部の開口端面から液状樹脂１１が突出するので不良品となる。 (Problems of conventional technology)
However, in the surface mount oscillator having the above configuration, especially when the planar outer shape of the surface mount container 1 is reduced, the gap between the IC chip 3 (outer periphery) and the lower frame wall 1c (inner periphery) is reduced, and the liquid resin 11 is injected. Make it difficult. For example, the liquid resin 11 only rises on the other main surface of the IC chip 3 facing the nozzle 10 due to surface tension, and injection from the gap is impaired. In this case, even if the amount of the liquid resin 11 is increased and the liquid resin 11 is forced to enter from the gap, the liquid resin 11 protrudes from the opening end surface of the lower surface recess, resulting in a defective product.

このことから、例えば第７図（ａ）に示したように、表面実装容器１の下面凹部に予め液状樹脂１１を塗布した状態で、その上からＩＣチップ３を位置決して超音波熱圧着することが提案された。しかし、この場合には、下面凹部の内底面のＩＣ保持端子５は液状樹脂１１によって遮られて直接に視認できないことから、位置決めを困難にする。この場合、例えばＩＣ保持端子５の外周からバンプ１５がずれたり、第７図（ｂ）の一部拡大断面図に示したようにＩＣ保持端子５とバンプ１５との間に液状樹脂１１に混入する樹脂粒１１ａが介在したりする。したがって、電気的な接続や機械的な接続強度を損なう問題があった。   For this reason, for example, as shown in FIG. 7 (a), the IC chip 3 is never subjected to ultrasonic thermocompression bonding from above in a state in which the liquid resin 11 is previously applied to the concave portion of the lower surface of the surface mounting container 1. Was proposed. However, in this case, since the IC holding terminal 5 on the inner bottom surface of the lower surface recess is blocked by the liquid resin 11 and cannot be directly recognized, positioning is difficult. In this case, for example, the bump 15 is displaced from the outer periphery of the IC holding terminal 5 or mixed in the liquid resin 11 between the IC holding terminal 5 and the bump 15 as shown in the partially enlarged sectional view of FIG. The resin particle 11a to intervene. Therefore, there has been a problem of impairing electrical connection and mechanical connection strength.

（発明の目的）
本発明は、バンプを用いた超音波熱圧着によるＩＣチップとＩＣ保持端子との位置決めを確実にし、アンダーフィルを容易に形成できる表面実装発振器の製造方法を提供することを目的とする。 (Object of invention)
An object of the present invention is to provide a method for manufacturing a surface-mount oscillator that can ensure the positioning of an IC chip and an IC holding terminal by ultrasonic thermocompression bonding using bumps and can easily form an underfill.

本発明は、特許請求の範囲（請求項１）に示したように、少なくともＩＣチップを収容する底壁と枠壁とからなる凹部を有する表面実装容器を備え、前記凹部の内底面に設けられたＩＣ保持端子にＩＣチップの一主面のＩＣ端子をバンプを用いた超音波熱圧着によって固着し、水晶振動子とともに構成される表面実装水晶発振器の製造方法において、前記表面実装容器の底壁は少なくとも第１及び第２底壁を有し、前記第２底壁は開口部を有して前記凹部の開放面側に窪みを形成するとともに前記枠壁から前記第１底壁上に突出した前記第２底壁の段部上に前記ＩＣ保持端子を有し、前記第２底壁の開口部による窪みに液状樹脂を塗布して前記液状樹脂の表面張力によって前記窪みの開口面から前記液状樹脂を盛り上げる第１工程と、前記ＩＣチップの一主面のＩＣ端子に設けられたバンプを前記ＩＣ保持端子に位置決するとともに前記ＩＣチップの一主面を前記液状樹脂に当接して押し広げ、前記段部上に流出して前記ＩＣチップの一主面を覆う第２工程と、前記ＩＣチップの他主面を押圧しながら超音波振動を加えて前記バンプを前記ＩＣ保持端子に電気的・機械的に接続する第３工程とからなる製造方法とする。   The present invention includes a surface mount container having a recess composed of at least a bottom wall and a frame wall for accommodating an IC chip, and is provided on the inner bottom surface of the recess, as indicated in the claims (Claim 1). In the method of manufacturing a surface-mounted crystal oscillator, in which an IC terminal on one main surface of an IC chip is fixed to an IC holding terminal by ultrasonic thermocompression using a bump, Has at least a first and a second bottom wall, the second bottom wall has an opening to form a recess on the open surface side of the recess and protrudes from the frame wall onto the first bottom wall The IC holding terminal is provided on a step portion of the second bottom wall, a liquid resin is applied to a recess formed by the opening of the second bottom wall, and the liquid is applied from the opening surface of the recess by surface tension of the liquid resin. A first step of raising the resin and the I A bump provided on an IC terminal on one main surface of the chip is positioned on the IC holding terminal, and one main surface of the IC chip is abutted against the liquid resin and spreads, and flows out onto the stepped portion and the IC. From the second step of covering one main surface of the chip, and the third step of electrically and mechanically connecting the bumps to the IC holding terminals by applying ultrasonic vibration while pressing the other main surface of the IC chip. The manufacturing method is as follows.

このような構成であれば、表面実装容器の第２底壁の開口部による底壁の窪みに液状樹脂を注入して表面張力によって盛り上がった液状樹脂にＩＣチップの主面を当接して押し広げるので、液状樹脂を段部上に流出してＩＣチップの一主面を覆うことができる。これにより、表面実装容器の平面外形が小さくなっても、ＩＣチップと枠壁との間隙から液状樹脂を注入する必要がなく、予め底壁の窪みに液状樹脂を注入すればよいので、アンダーフィルの形成を容易にできる。この際、液状樹脂の塗布以前には段部上のＩＣ保持端子が露出するので、ＩＣ保持端子を視認してバンプを位置決めできる。これにより、ＩＣ保持端子に対するバンプの位置決めを確実にする。   With such a configuration, the liquid resin is injected into the recess of the bottom wall by the opening of the second bottom wall of the surface mount container, and the main surface of the IC chip is brought into contact with the liquid resin swelled by the surface tension and spreads. Therefore, the liquid resin can flow out onto the step portion to cover one main surface of the IC chip. This eliminates the need to inject liquid resin from the gap between the IC chip and the frame wall even if the planar outer shape of the surface mount container is reduced, and it is only necessary to inject liquid resin into the bottom wall in advance. Can be easily formed. At this time, since the IC holding terminal on the stepped portion is exposed before the application of the liquid resin, the bump can be positioned by visually recognizing the IC holding terminal. This ensures the positioning of the bump with respect to the IC holding terminal.

また、例えば液状樹脂の高さを制御することによって、ＩＣ保持端子にバンプを当接した後に超音波熱圧着できる。したがって、バンプとＩＣ保持端子と間に介在する液状樹脂中の樹脂粒を排除できる。これらから、ＩＣチップとＩＣ保持端子との電気的・機械的な接続を確実にできる。   Further, for example, by controlling the height of the liquid resin, ultrasonic thermocompression bonding can be performed after the bump is brought into contact with the IC holding terminal. Therefore, resin particles in the liquid resin interposed between the bump and the IC holding terminal can be eliminated. Thus, the electrical and mechanical connection between the IC chip and the IC holding terminal can be ensured.

（実施態様項）
本発明の請求項２では、請求項１において、前記表面実装容器は両主面に上下面凹部を有し、前記上面凹部には前記水晶片を、前記下面凹部には前記ＩＣチップを収容したＨ型構造の表面実装水晶発振器の製造方法とする。 (Embodiment section)
According to a second aspect of the present invention, in the first aspect, the surface mount container has upper and lower concave portions on both main surfaces, the crystal piece is accommodated in the upper concave portion, and the IC chip is accommodated in the lower concave portion. A method of manufacturing a surface-mount crystal oscillator having an H-type structure is provided.

同請求項３では、請求項１において、前記表面実装容器を水晶片の密閉封入された水晶振動子の底面に接合した接合型構造の表面実装水晶発振器の製造方法とする。これらの請求項２及び３によって表面実装発振器の構成をさらに明確にする。   The third aspect of the present invention is the manufacturing method of the surface mount crystal oscillator having a junction type structure according to the first aspect, wherein the surface mount container is bonded to a bottom surface of a crystal resonator in which a crystal piece is hermetically sealed. These claims 2 and 3 further clarify the configuration of the surface-mount oscillator.

本発明の一実施形態としての製造方法に適用される表面実装容器の図で、同図（ａ）は表面実装容器の断面図、同図（ｂ）は同底面図である。It is a figure of the surface mount container applied to the manufacturing method as one embodiment of the present invention, the figure (a) is a sectional view of the surface mount container, and the figure (b) is the bottom view. 本発明の一実施形態としての製造方法（工程）を説明する図で、同図（ａｂｃｄ）はいずれも表面実装発振器の工程断面図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram for explaining a manufacturing method (process) as an embodiment of the present invention, in which (abcd) is a process cross-sectional view of a surface mount oscillator. 本発明の製造方法が適用される接合型とした表面実装発振器の図で、同図（ａｂ）ともに断面図である。It is a figure of the surface mount oscillator made into the junction type to which the manufacturing method of this invention is applied, The figure (ab) is sectional drawing. 従来例を説明するＨ構造型とした表面実装発振器の図で、同図（ａ）は断面図、同図（ｂ）は底面図である。It is a figure of the surface mount oscillator made into the H structure type explaining a prior art example, the figure (a) is a sectional view and the figure (b) is a bottom view. 従来例を説明する図で、同図（ａ）は水晶片の平面図、同図（ｂ）はＩＣチップの回路機能面（一主面）の平面図である。It is a figure explaining a prior art example, the figure (a) is a top view of a crystal piece, and the figure (b) is a top view of the circuit function surface (one main surface) of an IC chip. 従来例を説明する特に液状樹脂の注入状態を示す表面実装発振器の断面図である。It is sectional drawing of the surface mount oscillator which shows the injection | pouring state of the liquid resin explaining a prior art example. 従来例を説明する特にＩＣチップの固着状態を示す図で、同図（ａ）は表面実装発振器の断面図、同図（ｂ）は問題点を示す一部拡大断面図である。FIGS. 2A and 2B are diagrams illustrating a conventional example, in particular, showing a fixed state of an IC chip, where FIG. 1A is a cross-sectional view of a surface-mount oscillator, and FIG. 1B is a partially enlarged cross-sectional view illustrating a problem.

以下、本発明の一実施形態として表面実装容器１を含めた表面実装発振器の製造方法を第１図（表面実装容器の図）及び第２図（表面実装発振器の工程断面図）によって説明する。なお、前従来例と同一部分には同番号を付与してその説明は簡略又は省略する。   Hereinafter, a method for manufacturing a surface mount oscillator including the surface mount container 1 as one embodiment of the present invention will be described with reference to FIG. 1 (view of the surface mount container) and FIG. 2 (process sectional views of the surface mount oscillator). In addition, the same number is attached | subjected to the same part as a prior art example, and the description is simplified or abbreviate | omitted.

表面実装発振器（前第４図等参照）は、前述したように、上下面（両主面）に凹部を有する積層セラミックからなるＨ状とした表面実装容器１を有し、上面凹部には水晶片２が密閉封入され、下面凹部にはアンダーフィル（樹脂１１）によって一主面が保護されたＩＣチップ３が収容される。水晶片２は両主面に励振電極２ａを有して一端部両側に引出電極２ｂを延出する。ＩＣチップ３は回路機能面としての一主面の両端側に平行に３個ずつの計６個を有する。   As described above, the surface-mount oscillator (see FIG. 4 and the like) has an H-shaped surface-mount container 1 made of a multilayer ceramic having recesses on the upper and lower surfaces (both main surfaces), and a crystal on the top recess. The piece 2 is hermetically sealed, and the IC chip 3 whose one main surface is protected by the underfill (resin 11) is accommodated in the lower surface recess. The crystal piece 2 has excitation electrodes 2a on both main surfaces, and extends extraction electrodes 2b on both sides of one end. The IC chip 3 has a total of six IC chips 3 in parallel with both end sides of one main surface as a circuit function surface.

そして、この実施形態では、表面実装容器１（第１図）は、Ｈ状とした表面実装容器１の下面凹部を形成する中央底壁１ａの内底面には、下面凹部の開放面側に窪み（穴部）１２を有する。ここでの中央底壁１ａは少なくとも第１底壁１ａ1及び第２底壁１ａ2を有する。第２底壁１ａ2は開口部を有して第１底壁１ａ1上に積層し、下枠壁１ｃから第１底壁１ａ1上に突出して段部１３を形成する。これにより、下面凹部の開放面側に窪み１２を形成する。そして、下枠壁１ｃから突出した段部１３の表面上には、ＩＣチップ３のＩＣ端子に対応して両側に３個ずつとしたＩＣ保持端子５を有する。   In this embodiment, the surface mounting container 1 (FIG. 1) is recessed on the open surface side of the lower surface recess on the inner bottom surface of the central bottom wall 1a forming the lower surface recess of the surface mounting container 1 having an H shape. (Hole) 12 is provided. The central bottom wall 1a here has at least a first bottom wall 1a1 and a second bottom wall 1a2. The second bottom wall 1a2 has an opening and is laminated on the first bottom wall 1a1, and projects from the lower frame wall 1c onto the first bottom wall 1a1 to form a stepped portion 13. Thereby, the depression 12 is formed on the open surface side of the lower surface recess. On the surface of the stepped portion 13 protruding from the lower frame wall 1c, there are three IC holding terminals 5 on both sides corresponding to the IC terminals of the IC chip 3.

このようなものでは、先ず、一般的な手法として、表面実装容器１の上面凹部の水晶保持端子４に引出電極２ｂの延出した水晶片２の一端部両側を導電性接着剤７によって固着する。そして、例えばガスイオンの照射によって励振電極２ａの厚みを減じて振動周波数を調整する。その後、上面凹部の開口端面にシーム溶接によって金属カバー９を接合し、水晶片２を密閉封入する「第２図（ａ）」。通常では、水晶片２が密閉封入された状態で水晶振動子（水晶ユニット）と呼称される。   In such a case, first, as a general technique, both sides of one end of the crystal piece 2 where the extraction electrode 2 b extends are fixed to the crystal holding terminal 4 in the concave portion of the upper surface of the surface mounting container 1 by the conductive adhesive 7. . Then, for example, the vibration frequency is adjusted by reducing the thickness of the excitation electrode 2a by irradiation with gas ions. Thereafter, a metal cover 9 is joined to the opening end face of the upper surface recess by seam welding, and the crystal piece 2 is hermetically sealed (FIG. 2 (a)). Usually, it is called a crystal resonator (crystal unit) in a state where the crystal piece 2 is hermetically sealed.

次に、水晶片２を密閉封入して水晶振動子を完成させた後、表面実装容器１の下面凹部に第１〜第３工程を経てＩＣチップ３が収容される。先ず、第１工程では「第２図（ｂ）」、表面実装容器１の下面凹部の中央底壁１ａに設けた窪み１２（第２底壁１ａ2による開口部）に液状の液状樹脂１１を注入する。この場合、液状樹脂１１は窪み１２を満杯にするとともに、表面張力によって特に中央部を窪み１２の開口面から盛り上げさせる。そして、液状樹脂１１の中央部の先端はＩＣ保持端子５よりも同程度以上の高い位置とする。   Next, after the crystal piece 2 is hermetically sealed to complete the crystal resonator, the IC chip 3 is accommodated in the lower surface recess of the surface mount container 1 through the first to third steps. First, in the first step, "FIG. 2 (b)", a liquid liquid resin 11 is injected into a recess 12 (an opening formed by the second bottom wall 1a2) provided in the central bottom wall 1a of the lower surface recess of the surface mount container 1. To do. In this case, the liquid resin 11 fills the recess 12 and raises the central portion from the opening surface of the recess 12 by surface tension. And the front-end | tip of the center part of the liquid resin 11 is made into a position higher than the IC holding terminal 5 at the same level or more.

次に、第２工程では「第２図（ｃ）」、ＩＣチップ３の一主面のＩＣ端子３ａに設けられたバンプ１５をＩＣ保持端子５に位置決めする。そして、ＩＣチップ３の一主面は窪み１２の開口面から盛り上がった液状樹脂１１に当接するとともに、液状樹脂１１を押圧する。これにより、ＩＣチップ３の一主面は液状樹脂１１を押し広げて、液状樹脂１１を段部１３上に流出させる。そして、結果として、例えばＩＣチップ３の側面にまで液状樹脂１１が回り込み、液状樹脂１１はＩＣチップ３の一主面を覆う。   Next, in the second step, “FIG. 2 (c)”, the bump 15 provided on the IC terminal 3 a on one main surface of the IC chip 3 is positioned on the IC holding terminal 5. One main surface of the IC chip 3 abuts on the liquid resin 11 rising from the opening surface of the recess 12 and presses the liquid resin 11. As a result, one main surface of the IC chip 3 spreads the liquid resin 11 and causes the liquid resin 11 to flow out onto the step portion 13. As a result, for example, the liquid resin 11 wraps around the side surface of the IC chip 3, and the liquid resin 11 covers one main surface of the IC chip 3.

次に、第３工程では「第2図（ｄ）」、ＩＣチップ３の他主面を押圧しながら加熱とともに超音波振動を加える（所謂超音波熱圧着）。これにより、球状のバンプ１５が押しつぶされて楕円状となり、ＩＣ保持端子５にバンプ１５が電気的・機械的に接続する。なお、バンプ１５及びＩＣ保持端子５はいずれもＡu（金）であり、熱圧着によってＡu同士が拡散して接合する。   Next, in the third step, "FIG. 2 (d)", ultrasonic vibration is applied with heating while pressing the other main surface of the IC chip 3 (so-called ultrasonic thermocompression bonding). As a result, the spherical bumps 15 are crushed into an oval shape, and the bumps 15 are electrically and mechanically connected to the IC holding terminals 5. The bump 15 and the IC holding terminal 5 are both Au (gold), and Au is diffused and bonded by thermocompression bonding.

なお、ここでは、表面実装容器はＩＣチップ３内に電圧制御による温度補償機構を設けた温度補償型とする。この場合、水晶端子を形成した第１〜第３工程後に、図示しない温度補償データの書込端子から常温時の補償電圧を書き込み、これにより発振周波数を調整して公称周波数に一致させる。   Here, the surface mount container is a temperature compensation type in which a temperature compensation mechanism by voltage control is provided in the IC chip 3. In this case, after the first to third steps of forming the crystal terminal, a compensation voltage at room temperature is written from a temperature compensation data writing terminal (not shown), thereby adjusting the oscillation frequency to match the nominal frequency.

このような構成であれば、発明の効果の欄でも記載するように、表面実装容器１の底壁１ａの窪み１２に液状樹脂を注入して表面張力によって盛り上がった液状樹脂１１にＩＣチップ３の主面を当接して押し広げる。したがって、液状樹脂１１を段部１３上に流出してＩＣチップ３の一主面を覆い、アンダーフィルを形成できる。   In such a configuration, as described in the column of the effect of the invention, the liquid resin 11 is injected into the recess 12 of the bottom wall 1a of the surface mount container 1 and the IC chip 3 is formed on the liquid resin 11 raised by the surface tension. Abut the main surface and spread. Therefore, the liquid resin 11 can flow out onto the step portion 13 to cover one main surface of the IC chip 3 and form an underfill.

この場合、表面実装容器１の平面外形が小さくなっても、ＩＣチップ３と枠壁１ｃとの間隙から液状樹脂１１を注入する必要がなく、予め底壁１ａの窪み１２に液状樹脂１１を注入すればよいので、アンダーフィルの形成を容易にできる。この際、液状樹脂１１の塗布以前には段部１３上のＩＣ保持端子５が露出する。したがって、ＩＣ保持端子５を視認してバンプ１５位置決めを確実にする。   In this case, even if the planar outer shape of the surface mount container 1 is reduced, it is not necessary to inject the liquid resin 11 from the gap between the IC chip 3 and the frame wall 1c, and the liquid resin 11 is injected into the recess 12 of the bottom wall 1a in advance. Therefore, the underfill can be easily formed. At this time, the IC holding terminal 5 on the step portion 13 is exposed before the application of the liquid resin 11. Therefore, the IC holding terminals 5 are visually recognized to ensure the positioning of the bumps 15.

また、例えば液状樹脂１１の高さを制御することによって、ＩＣ保持端子５にバンプ１５を当接した後に超音波熱圧着できる。この場合、例えば液状樹脂１１の高さを基本的にバンプ１５の高さと同等以内とし、超音波熱圧着によるバンプ１５の押圧時に液状樹脂１１が押し広げられる。したがって、バンプ１５とＩＣ保持端子５と間に介在する液状樹脂１１中の樹脂粒１１ａを排除できる「前第７図（ｂ）参照」。これらから、ＩＣチップ３とＩＣ保持端子５との電気的・機械的な接続をさらに確実にできる。   Further, for example, by controlling the height of the liquid resin 11, ultrasonic thermocompression bonding can be performed after the bump 15 is brought into contact with the IC holding terminal 5. In this case, for example, the height of the liquid resin 11 is basically equal to or less than the height of the bump 15, and the liquid resin 11 is spread when the bump 15 is pressed by ultrasonic thermocompression bonding. Therefore, the resin particles 11a in the liquid resin 11 interposed between the bumps 15 and the IC holding terminals 5 can be eliminated (see FIG. 7B). Accordingly, the electrical and mechanical connection between the IC chip 3 and the IC holding terminal 5 can be further ensured.

（他の事項）
上記実施形態では表面実装発振器（表面実装容器１）はＨ構造型としたが、例えば第３図に示したように接合型とした場合でも適用できる。すなわち、水晶片２を密閉封入した水晶振動子２Ａの底面に、ＩＣチップ３収容した表面実装容器１を接合して表面実装発振器を構成する。これらの場合、表面実装容器１の閉塞面を水晶振動子２Ａの底面に接合する場合「第３図（ａ）」、あるいは表面実装容器１の開放面を水晶振動子２Ａの底面に接合する場合「同図（ｂ）」場合のいずれであっても適用できる。なお、図中の符号１４（ａｂ）は水晶振動子２Ａの底面４角部の、同１４ｂは表面実装容器１の閉塞面あるいは開放面の接合端子である。 (Other matters)
In the above embodiment, the surface mount oscillator (surface mount container 1) is an H structure type, but it can also be applied to a junction type as shown in FIG. 3, for example. That is, the surface mount oscillator 1 is configured by bonding the surface mount container 1 containing the IC chip 3 to the bottom surface of the crystal resonator 2A in which the crystal piece 2 is hermetically sealed. In these cases, when the closed surface of the surface mount container 1 is bonded to the bottom surface of the crystal resonator 2A "FIG. 3 (a)", or when the open surface of the surface mount container 1 is bonded to the bottom surface of the crystal resonator 2A. Any of the cases shown in FIG. In the figure, reference numeral 14 (ab) denotes the bottom four corners of the quartz crystal resonator 2A, and reference numeral 14b denotes a closed or open joint terminal of the surface mount container 1.

１ 表面実装容器、２ 水晶片、３ ＩＣチップ、４ 水晶保持端子、５ ＩＣ保持端子、６ 実装端子、７ 導電性接着剤、８ 金属リング、９ 金属カバー、１０ ノズル、１１ 液状樹脂、１２ 窪み、１３ 段部、１４ 接合端子、１５ バンプ。   DESCRIPTION OF SYMBOLS 1 Surface mount container, 2 Crystal piece, 3 IC chip, 4 Crystal holding terminal, 5 IC holding terminal, 6 Mounting terminal, 7 Conductive adhesive, 8 Metal ring, 9 Metal cover, 10 Nozzle, 11 Liquid resin, 12 Indentation , 13 steps, 14 junction terminals, 15 bumps.

Claims (3)

少なくともＩＣチップを収容する底壁と枠壁とからなる凹部を有する表面実装容器を備え、前記凹部の内底面に設けられたＩＣ保持端子にＩＣチップの一主面に設けたＩＣ端子をバンプを用いた超音波熱圧着によって固着し、水晶振動子に接合して構成される表面実装水晶発振器の製造方法において、
前記表面実装容器の前記底壁は少なくとも第１底壁及び第２底壁を有し、前記第２底壁は開口部を有して前記凹部の開放面側に窪みを形成するとともに前記枠壁から前記第１底壁上に突出した前記第２底壁の段部上に前記ＩＣ保持端子を有し、
前記第２底壁の開口部からなる窪みに液状樹脂を塗布して前記液状樹脂の表面張力によって前記窪みの開口面から前記液状樹脂を盛り上げる第１工程と、
前記ＩＣチップの一主面に設けた前記ＩＣ端子の前記バンプを前記ＩＣ保持端子に位置決めした後、前記ＩＣチップの一主面を前記液状樹脂に当接して前記液状樹脂を押し広げて、前記段部上に流出させて前記ＩＣチップの一主面を前記液状樹脂で覆う第２工程と、
前記ＩＣチップの他主面を押圧しながら超音波振動を前記他主面に加えて前記バンプを前記ＩＣ保持端子に電気的・機械的に接続する第３工程と、からなる表面実装水晶発振器の製造方法。 A surface mounting container having a recess composed of at least a bottom wall and a frame wall for accommodating an IC chip is provided, and an IC terminal provided on one main surface of the IC chip is bumped to an IC holding terminal provided on the inner bottom surface of the recess. In the method of manufacturing a surface-mount crystal oscillator that is fixed by ultrasonic thermocompression bonding and bonded to a crystal resonator,
The bottom wall of the surface mount container has at least a first bottom wall and a second bottom wall, and the second bottom wall has an opening to form a depression on the open surface side of the recess and the frame wall The IC holding terminal on the step of the second bottom wall protruding from the first bottom wall from
A first step in which a liquid resin is applied to a recess made of an opening of the second bottom wall and the liquid resin is raised from the opening surface of the recess by surface tension of the liquid resin;
Wherein after said bumps of said IC terminals provided on one principal surface of the IC chip is positioned on the IC holding terminal, and spread the liquid resin one main surface of the IC chip in contact with said liquid resin, said A second step of allowing the liquid crystal resin to cover one main surface of the IC chip by allowing it to flow out onto the step portion;
A third step of applying ultrasonic vibration to the other main surface while pressing the other main surface of the IC chip to electrically and mechanically connect the bump to the IC holding terminal. Production method. 請求項１において、前記表面実装容器は上下両主面に凹部を有し、前記上面凹部に前記水晶片を、また、前記下面凹部に前記ＩＣチップを収容した断面Ｈ型構造とする表面実装発振器の製造方法。   2. The surface-mount oscillator according to claim 1, wherein the surface-mount container has recesses on both upper and lower main surfaces, the crystal piece is stored in the upper-surface recess, and the cross-sectional H-shaped structure houses the IC chip in the lower-surface recess. Manufacturing method. 請求項１において、前記表面実装容器を水晶片が密閉封入された水晶振動子の底面に接合した接合型構造とする表面実装発振器の製造方法。   2. The method of manufacturing a surface-mount oscillator according to claim 1, wherein the surface-mount container has a bonded structure in which a crystal piece is hermetically sealed and bonded to a bottom surface of a crystal resonator.
JP2009236458A 2009-10-13 2009-10-13 Manufacturing method of surface mount crystal oscillator Expired - Fee Related JP5561993B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009236458A JP5561993B2 (en) 2009-10-13 2009-10-13 Manufacturing method of surface mount crystal oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009236458A JP5561993B2 (en) 2009-10-13 2009-10-13 Manufacturing method of surface mount crystal oscillator

Publications (2)

Publication Number Publication Date
JP2011087004A JP2011087004A (en) 2011-04-28
JP5561993B2 true JP5561993B2 (en) 2014-07-30

Family

ID=44079657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009236458A Expired - Fee Related JP5561993B2 (en) 2009-10-13 2009-10-13 Manufacturing method of surface mount crystal oscillator

Country Status (1)

Country Link
JP (1) JP5561993B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017183856A (en) * 2016-03-29 2017-10-05 京セラ株式会社 Crystal oscillator

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3451018B2 (en) * 1998-07-31 2003-09-29 京セラ株式会社 Crystal oscillator
JP3896792B2 (en) * 2001-02-06 2007-03-22 セイコーエプソン株式会社 Electronic device and piezoelectric device package
JP2003133857A (en) * 2001-10-22 2003-05-09 Citizen Watch Co Ltd Oscillator
JP2006351810A (en) * 2005-06-15 2006-12-28 Epson Toyocom Corp Ic (integrated circuit) chip storing container and piezo-oscillator
JP4907962B2 (en) * 2005-11-22 2012-04-04 日本電波工業株式会社 Surface mount crystal oscillator

Also Published As

Publication number Publication date
JP2011087004A (en) 2011-04-28

Similar Documents

Publication Publication Date Title
JP2007208568A (en) Surface-mounted crystal oscillator
JP2010050778A (en) Piezoelectric device
JP4750177B2 (en) Crystal oscillator for surface mounting
US6833768B2 (en) Surface-mount crystal oscillator
JP2002330027A (en) Temperature compensating crystal oscillator for surface mounting
JP4907962B2 (en) Surface mount crystal oscillator
JP2009188633A (en) Surface-mount type crystal oscillator
JP5561993B2 (en) Manufacturing method of surface mount crystal oscillator
JP4426395B2 (en) Manufacturing method of crystal oscillator for surface mounting
JP2009105628A (en) Crystal device and manufacturing method thereof
JP2007104005A (en) Surface mount crystal oscillator
JP5075401B2 (en) Piezoelectric oscillator and manufacturing method thereof
JP5651312B2 (en) Method for manufacturing piezoelectric device
JP2001053546A (en) Structure for piezoelectric oscillator
JP4645393B2 (en) Surface mount type piezoelectric oscillator and electronic component unit
JP2003179432A (en) Piezoelectric oscillator manufacturing method, piezoelectric oscillator and integrated circuit element package
JP2006174370A (en) Mounted body, tab substrate, piezoelectric vibration piece, and piezoelectric device
JP2010147850A (en) Crystal oscillator for surface mounting
JP5144060B2 (en) Piezoelectric oscillator and manufacturing method thereof
JP4439489B2 (en) Crystal oscillator container
JP4359933B2 (en) Crystal oscillator
JP2010011385A (en) Method of manufacturing piezoelectric oscillator
JP2004343681A (en) Manufacturing method for temperature compensated crystal oscillator
JP2007189581A (en) Sheet base material, and method of manufacturing piezoelectric device employing same
JP2003163296A (en) Surface-mounting electronic component

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20120719

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120720

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130617

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130716

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130815

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140218

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140328

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140513

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140610

R150 Certificate of patent or registration of utility model

Ref document number: 5561993

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees