JP5561020B2

JP5561020B2 - Vehicle lighting

Info

Publication number: JP5561020B2
Application number: JP2010186472A
Authority: JP
Inventors: 良裕杉江
Original assignee: Ichikoh Industries Ltd
Current assignee: Ichikoh Industries Ltd
Priority date: 2010-08-23
Filing date: 2010-08-23
Publication date: 2014-07-30
Anticipated expiration: 2030-08-23
Also published as: JP2012043748A

Description

この発明は、半導体型光源を光源とする車両用灯具に関するものである。 The present invention relates to a vehicular lamp using a semiconductor-type light source as a light source.

この種の車両用灯具は、従来からある（たとえば、特許文献１）。以下、従来の車両用灯具について説明する。従来の車両用灯具は、複数個の発光部が一方向に配列されている発光素子と、発光素子の複数個の発光部からの光の一部を上縁において遮る遮光部材と、発光素子と遮光部材とを支持する支持部材と、から構成されているものである。 This type of vehicular lamp is conventionally known (for example, Patent Document 1). Hereinafter, a conventional vehicle lamp will be described. A conventional vehicle lamp includes a light emitting element in which a plurality of light emitting portions are arranged in one direction, a light shielding member that blocks a part of light from the plurality of light emitting portions of the light emitting element at an upper edge, a light emitting element, And a support member that supports the light shielding member.

かかる車両用灯具においては、複数個の発光部の配列において、複数個の発光部の配列方向に対して鉛直（垂直）もしくはほぼ鉛直（垂直）方向にばらつき（位置誤差）があると、配光パターンの適正な配光制御を行うことが難しく、かつ、配光パターンの明瞭なカットオフラインを得ることが難しくなる。 In such a vehicular lamp, if there is variation (position error) in the vertical (vertical) or substantially vertical (vertical) direction with respect to the arrangement direction of the plurality of light emitting units in the arrangement of the plurality of light emitting units, the light distribution It is difficult to perform appropriate light distribution control of the pattern, and it becomes difficult to obtain a clear cut-off line of the light distribution pattern.

そこで、前記の従来の車両用灯具は、遮光部材の上縁により、複数個の発光部の配列において多少のばらつき（位置誤差）があっても、配光パターンの適正な配光制御を行うことができ、かつ、配光パターンの明瞭なカットオフラインを得ることができる。 Therefore, the conventional vehicle lamp described above performs appropriate light distribution control of the light distribution pattern even if there is some variation (position error) in the arrangement of the plurality of light emitting units due to the upper edge of the light shielding member. And a cut-off line with a clear light distribution pattern can be obtained.

かかる車両用灯具においては、複数個の発光部の配列において多少のばらつき（位置誤差）があっても、配光パターンの適正な配光制御を行うことができ、かつ、配光パターンの明瞭なカットオフラインを得ることができることが重要である。 In such a vehicular lamp, even if there is some variation (position error) in the arrangement of the plurality of light emitting units, it is possible to perform appropriate light distribution control of the light distribution pattern, and the light distribution pattern is clear. It is important to be able to obtain a cut-off line.

特開２００８−８４８７６号公報JP 2008-84876 A

この発明が解決しようとする問題点は、この種の車両用灯具においては、複数個の発光部の配列において多少のばらつき（位置誤差）があっても、配光パターンの適正な配光制御を行うことができ、かつ、配光パターンの明瞭なカットオフラインを得ることができることが重要である、という点にある。 The problem to be solved by the present invention is that, in this type of vehicular lamp, even if there is some variation (position error) in the arrangement of the plurality of light emitting units, appropriate light distribution control of the light distribution pattern is performed. It is important that it can be performed and that a clear cut-off line of the light distribution pattern can be obtained.

この発明（請求項１にかかる発明）は、半導体型光源を保持部材と取付部材との間に挟み込んだ状態で、取付具を取付部材を介して保持部材に取り付けることにより、半導体型光源が保持部材と取付部材との間に固定される車両用灯具であって、半導体型光源が、本体部と、本体部の一面に設けられていて、かつ、複数個の発光チップが一方向に配列されている発光部と、から構成されていて、保持部材には、半導体型光源の本体部の他面が載置する載置面が、設けられていて、取付部材の半導体型光源の発光部に対応する箇所には、開口部が設けられていて、取付部材の開口部の周縁部には、半導体型光源の本体部の一面を保持部材の載置面側に押える押え面と、複数個の発光チップの配列方向と平行もしくはほぼ平行なエッジを有し、かつ、複数個の発光チップの一部を複数個の発光チップの配列方向に対して鉛直もしくはほぼ鉛直な方向において覆って、複数個の発光チップから放射される光の一部を遮蔽する遮光部とが、それぞれ設けられていて、遮光部のエッジが、複数個の発光チップのうち、車両用灯具の光の照射方向と最も反対側にある発光チップの縁に合わせる、ことを特徴とする。 In the present invention (the invention according to claim 1), the semiconductor light source is held by attaching the fixture to the holding member via the mounting member in a state where the semiconductor light source is sandwiched between the holding member and the mounting member. A vehicular lamp that is fixed between a member and a mounting member, wherein a semiconductor-type light source is provided on a main body portion and one surface of the main body portion, and a plurality of light emitting chips are arranged in one direction. The holding member is provided with a mounting surface on which the other surface of the main body portion of the semiconductor light source is placed, and the light emitting portion of the semiconductor light source of the mounting member is provided on the holding member. The corresponding portion is provided with an opening, and a peripheral surface of the opening of the mounting member is provided with a pressing surface for pressing one surface of the main body of the semiconductor-type light source against the mounting surface of the holding member, It has an edge that is parallel or nearly parallel to the direction of arrangement of the light emitting chips. A light-shielding portion that covers a part of the plurality of light-emitting chips in a direction perpendicular or substantially perpendicular to the arrangement direction of the plurality of light-emitting chips and shields a part of the light emitted from the plurality of light-emitting chips; Are provided, and the edge of the light-shielding part is aligned with the edge of the light-emitting chip that is the most opposite to the light irradiation direction of the vehicular lamp among the plurality of light-emitting chips.

また、この発明（請求項２にかかる発明）は、遮光部のエッジが複数個の発光チップに近接している、ことを特徴とする。 Further, the present invention (the invention according to claim 2) is characterized in that the edge of the light shielding portion is close to the plurality of light emitting chips.

さらに、この発明（請求項３にかかる発明）は、半導体型光源の本体部と取付部材とには、半導体型光源の本体部の一面に取付部材の押え面を載置する際の位置決めを行い、かつ、半導体型光源の本体部と取付部材との相対位置の微調整を行う位置決め部がそれぞれ設けられている、ことを特徴とする。 Further, according to the present invention (the invention according to claim 3), positioning is performed when the pressing surface of the mounting member is placed on one surface of the main body portion of the semiconductor type light source on the main body portion and the mounting member of the semiconductor type light source. And the positioning part which performs fine adjustment of the relative position of the main-body part of a semiconductor type light source and an attachment member is each provided, It is characterized by the above-mentioned.

この発明（請求項１にかかる発明）の車両用灯具は、遮光部のエッジにより、複数個の発光チップの配列において多少のばらつき（位置誤差）があっても、配光パターンの適正な配光制御を行うことができ、かつ、配光パターンの明瞭なカットオフラインを得ることができる。しかも、この発明（請求項１にかかる発明）の車両用灯具は、取付部材の押え面が半導体型光源の本体部の一面を保持部材の載置面側に押えると、半導体型光源の本体部の一面と取付部材の押え面とが確固に当接し、かつ、半導体型光源の本体部の他面と保持部材の載置面とが確固に当接している状態で、半導体型光源が取付部材と保持部材との間に挟み込まれて固定されている。この結果、この発明（請求項１にかかる発明）の車両用灯具は、車両の振動に対して十分に耐えられるように、半導体型光源が保持部材に取付部材を介して確実に固定することができると共に、半導体型光源の複数個の発光チップと取付部材の遮光部のエッジとの相対位置を高精度に保つことができるので、配光パターンの適正な配光制御を確実に行うことができ、かつ、配光パターンの明瞭なカットオフラインを確実に得ることができる。 The vehicular lamp of the present invention (the invention according to claim 1) has an appropriate light distribution pattern even if there is some variation (position error) in the arrangement of the plurality of light emitting chips due to the edge of the light shielding portion. Control can be performed and a clear cut-off line of the light distribution pattern can be obtained. In addition, in the vehicular lamp according to the present invention (the invention according to claim 1), when the pressing surface of the mounting member presses one surface of the main body portion of the semiconductor light source against the mounting surface side of the holding member, the main body portion of the semiconductor light source The semiconductor light source is attached to the mounting member in a state where the one surface of the mounting member and the pressing surface of the mounting member are firmly in contact, and the other surface of the main body of the semiconductor light source is firmly in contact with the mounting surface of the holding member. And the holding member. As a result, in the vehicular lamp according to the present invention (the invention according to claim 1), the semiconductor light source can be securely fixed to the holding member via the mounting member so as to sufficiently withstand the vibration of the vehicle. In addition, since the relative position between the plurality of light emitting chips of the semiconductor light source and the edge of the light shielding portion of the mounting member can be maintained with high accuracy, it is possible to reliably perform proper light distribution control of the light distribution pattern. In addition, a clear cut-off line with a clear light distribution pattern can be obtained with certainty.

また、この発明（請求項２にかかる発明）の車両用灯具は、遮光部のエッジを複数個の発光チップに近接させるので、半導体型光源の複数個の発光チップと取付部材の遮光部のエッジとの相対位置をさらに高精度に保つことができ、配光パターンの適正な配光制御をさらに確実に行うことができ、かつ、配光パターンの明瞭なカットオフラインをさらに確実に得ることができる。 Further, in the vehicular lamp of the present invention (the invention according to claim 2), since the edge of the light shielding portion is brought close to the plurality of light emitting chips, the plurality of light emitting chips of the semiconductor type light source and the edge of the light shielding portion of the mounting member are provided. The relative position of the light distribution pattern can be maintained with higher accuracy, proper light distribution control of the light distribution pattern can be performed more reliably, and a clear cut-off line of the light distribution pattern can be more reliably obtained. .

さらに、この発明（請求項３にかかる発明）の車両用灯具は、位置決め部により、半導体型光源の本体部と取付部材との相対位置の微調整を行うことができるので、複数個の発光チップの配列のばらつき（位置誤差）の程度に応じて対応することができ、半導体型光源の複数個の発光チップと取付部材の遮光部のエッジとの相対位置をさらに高精度に保つことができ、配光パターンの適正な配光制御をさらに確実に行うことができ、かつ、配光パターンの明瞭なカットオフラインをさらに確実に得ることができる。 Furthermore, in the vehicle lamp of the present invention (the invention according to claim 3), the relative position between the main body portion of the semiconductor type light source and the mounting member can be finely adjusted by the positioning portion. The relative position of the plurality of light emitting chips of the semiconductor light source and the edge of the light shielding portion of the mounting member can be maintained with higher accuracy. Appropriate light distribution control of the light distribution pattern can be more reliably performed, and a clear cut-off line of the light distribution pattern can be more reliably obtained.

図１は、この発明にかかる車両用灯具の実施例を示す要部（半導体型光源、保持部材、取付部材、取付具）の分解斜視図である。FIG. 1 is an exploded perspective view of essential parts (semiconductor light source, holding member, mounting member, mounting tool) showing an embodiment of a vehicular lamp according to the present invention. 図２は、同じく、要部（半導体型光源、保持部材、取付部材、取付具）の取付状態すなわち半導体型光源を保持部材に載置した状態を示す分解斜視図である。FIG. 2 is also an exploded perspective view showing a state where main parts (semiconductor-type light source, holding member, attachment member, fixture) are attached, that is, a state where the semiconductor-type light source is placed on the holding member. 図３は、同じく、要部（半導体型光源、保持部材、取付部材、取付具）の取付状態を示す平面図である。FIG. 3 is also a plan view showing a mounting state of main parts (semiconductor light source, holding member, mounting member, mounting tool). 図４は、同じく、図３におけるＩＶ−ＩＶ線断面図である。4 is also a cross-sectional view taken along line IV-IV in FIG. 図５は、同じく、図３におけるＩＶ−ＩＶ線断面図の分解断面図である。FIG. 5 is an exploded cross-sectional view taken along the line IV-IV in FIG. 図６は、同じく、図３におけるＶＩ−ＶＩ線断面図である。6 is also a cross-sectional view taken along line VI-VI in FIG. 図７は、同じく、図３におけるＶＩ−ＶＩ線断面図の分解断面図である。FIG. 7 is also an exploded cross-sectional view taken along the line VI-VI in FIG. 図８は、同じく、車両用灯具を示す縦断面図（垂直断面図）である。FIG. 8 is also a longitudinal sectional view (vertical sectional view) showing the vehicular lamp. 図９は、同じく、複数個の発光チップと遮光部との相対関係を示す説明図である。FIG. 9 is also an explanatory diagram showing a relative relationship between a plurality of light emitting chips and a light shielding portion. 図１０は、同じく、水平カットオフラインおよび斜めカットオフラインを有するすれ違い用配光パターンを示す説明図である。FIG. 10 is also an explanatory diagram showing a passing light distribution pattern having a horizontal cutoff line and an oblique cutoff line.

以下、この発明にかかる車両用灯具の実施例を図面に基づいて詳細に説明する。なお、この実施例によりこの発明が限定されるものではない。なお、この明細書および特許請求の範囲において、「上、下、前、後、左、右」とは、この発明にかかる車両用灯具を車両（自動車）に取り付けた際の車両の「上、下、前、後、左、右」である。 Embodiments of a vehicular lamp according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments. In this specification and claims, “up, down, front, back, left, right” means “up, down” of the vehicle when the vehicular lamp according to the present invention is attached to the vehicle (automobile). Bottom, front, back, left, right ".

（構成の説明）
以下、この実施例における車両用灯具の構成について説明する。なお、図３においては、保持部材３を省略してある。 (Description of configuration)
Hereinafter, the configuration of the vehicular lamp in this embodiment will be described. In FIG. 3, the holding member 3 is omitted.

図８中、符号１は、この実施例における車両用灯具（たとえば、ヘッドランプなどの自動車用前照灯）である。前記車両用灯具１は、半導体型光源（たとえばＬＥＤモジュール）２と、保持部材（たとえば、ベースやホルダ）３と、取付部材（たとえば、カバーやカバー部材）４と、取付具この例としてはスクリュー５と、リフレクタ６と、ヒートシンク７と、図示しないランプハウジングおよびランプレンズ（たとえば、素通しのアウターレンズなど）と、から構成されている。 In FIG. 8, reference numeral 1 denotes a vehicular lamp (for example, an automotive headlamp such as a headlamp) in this embodiment. The vehicular lamp 1 includes a semiconductor-type light source (for example, an LED module) 2, a holding member (for example, a base and a holder) 3, an attachment member (for example, a cover and a cover member) 4, and a fixture, for example, a screw. 5, a reflector 6, a heat sink 7, and a lamp housing and a lamp lens (for example, a transparent outer lens) (not shown).

前記半導体型光源２および前記保持部材３および前記取付部材４および前記スクリュー５および前記リフレクタ６および前記ヒートシンク７は、ランプユニットを構成する。前記ランプユニット２、３、４、５、６、７は、前記ランプハウジングおよび前記ランプレンズにより区画されている灯室内に、たとえば光軸調整機構を介して配置されている。なお、前記灯室内には、前記ランプユニット２、３、４、５、６、７以外に、フォグランプ、コーナリングランプ、クリアランスランプ、ターンシグナルランプなどの他のランプユニットが配置されている場合がある。 The semiconductor-type light source 2, the holding member 3, the mounting member 4, the screw 5, the reflector 6, and the heat sink 7 constitute a lamp unit. The lamp units 2, 3, 4, 5, 6, 7 are arranged, for example, via an optical axis adjustment mechanism in a lamp chamber defined by the lamp housing and the lamp lens. In addition to the lamp units 2, 3, 4, 5, 6, and 7, other lamp units such as a fog lamp, a cornering lamp, a clearance lamp, and a turn signal lamp may be arranged in the lamp chamber. .

前記半導体型光源２は、発光部としての基板２０と、本体部としての熱伝導部材２１および絶縁部材２２と、２個のターミナル（端子）２３と、から構成されている。前記基板２０と、前記熱伝導部材２１と、前記絶縁部材２２と、前記ターミナル２３とは、一体に組み込まれている。 The semiconductor light source 2 includes a substrate 20 as a light emitting part, a heat conducting member 21 and an insulating member 22 as main body parts, and two terminals (terminals) 23. The substrate 20, the heat conducting member 21, the insulating member 22, and the terminal 23 are integrally incorporated.

前記基板２０は、長方形の板形状をなす。前記基板２０の一面（上面）には、発光チップ２００と、２個の電極２０１と、前記電極２０１から前記発光チップ２００に電流を供給制御する回路や部品など（図示せず）と、がそれぞれ実装されている。前記基板２０の一面には、封止部材（図示せず）が施されている。なお、前記封止部材は、少なくとも、前記電極２０１に施されていれば良い。前記発光チップ２００は、複数個（この例では、４個）の正方形のチップを一方向に配列してなるものである。前記複数個の発光チップ２００の配列方向は、前記車両用灯具１の光の照射方向（図９中の実線矢印方向）に対して直交もしくはほぼ直交している。 The substrate 20 has a rectangular plate shape. On one surface (upper surface) of the substrate 20, a light emitting chip 200, two electrodes 201, a circuit and a component (not shown) for controlling current supply from the electrode 201 to the light emitting chip 200, respectively. Has been implemented. A sealing member (not shown) is provided on one surface of the substrate 20. The sealing member only needs to be applied to at least the electrode 201. The light emitting chip 200 is formed by arranging a plurality (four in this example) of square chips in one direction. The arrangement direction of the plurality of light emitting chips 200 is orthogonal or almost orthogonal to the light irradiation direction of the vehicular lamp 1 (indicated by the solid arrow in FIG. 9).

前記熱伝導部材２１は、たとえば、熱伝導率が高い金属部材もしくは樹脂部材から構成されている。前記熱伝導部材２１は、図４、図５に示すように、断面逆Ｔ字形状をなす。一方、前記絶縁部材２２は、絶縁性の部材から構成されている。前記絶縁部材２２は、直方体形状をなす。前記熱伝導部材２１と前記絶縁部材２２とは、インサート成形などにより一体に構成されている。 The heat conducting member 21 is made of, for example, a metal member or a resin member having a high heat conductivity. As shown in FIGS. 4 and 5, the heat conducting member 21 has an inverted T-shaped cross section. On the other hand, the insulating member 22 is made of an insulating member. The insulating member 22 has a rectangular parallelepiped shape. The heat conducting member 21 and the insulating member 22 are integrally formed by insert molding or the like.

前記熱伝導部材２１の一面（上面）と前記絶縁部材２２の一面（上面）とは、面一である。前記熱伝導部材２１の一面は、前記基板２０の一面よりも一回り大きい長方形をなしていて前記絶縁部材２２の一面の中央に位置する。前記熱伝導部材２１の一面には、前記基板２０の他面（下面）が接着剤など（図示せず）により固定されている。 One surface (upper surface) of the heat conducting member 21 and one surface (upper surface) of the insulating member 22 are flush with each other. One surface of the heat conducting member 21 forms a rectangle that is slightly larger than one surface of the substrate 20 and is located at the center of one surface of the insulating member 22. The other surface (lower surface) of the substrate 20 is fixed to one surface of the heat conducting member 21 with an adhesive or the like (not shown).

前記熱伝導部材２１の他面（下面）と前記絶縁部材２２の他面（下面）とは、面一である。前記熱伝導部材２１の他面は、図６〜図８に示すように、前記絶縁部材２２の他面の中間部に位置する。 The other surface (lower surface) of the heat conducting member 21 and the other surface (lower surface) of the insulating member 22 are flush with each other. The other surface of the heat conducting member 21 is located in the middle of the other surface of the insulating member 22 as shown in FIGS.

前記絶縁部材２２の一端部（前端部）の両側（左右両側）には、小長円形の第１位置決め孔部２２１が、前記絶縁部材２２の一面、他面に対して垂直方向に設けられている。また、前記絶縁部材２２の一端部の中央と他端部（後端部）の両側（左右両側）とには、小円形の第２位置決め孔部２２２が、前記絶縁部材２２の一面、他面に対して垂直方向に設けられている。 On both sides (left and right sides) of one end portion (front end portion) of the insulating member 22, small oval first positioning holes 221 are provided in a direction perpendicular to one surface and the other surface of the insulating member 22. Yes. In addition, small circular second positioning holes 222 are provided on one side and the other side of the insulating member 22 at the center of one end of the insulating member 22 and both sides (left and right sides) of the other end (rear end). It is provided in the direction perpendicular to.

前記ターミナル２３は、前記絶縁部材２２の他端部の中央にインサート成形などにより一体に構成されている。前記ターミナル２３の一端部は、上側に湾曲して、前記基板２０の前記電極２０１にそれぞれ電気的に接続されている。また、前記ターミナル２３の中間部は、図６〜図８に示すように、前記熱伝導部材２１および前記絶縁部材２２中に垂直状態で収納されている。さらに、前記ターミナル２３の他端部は、図６〜図８に示すように、水平に折り曲げられていて、前記絶縁部材２２の他端部の中央と共にコネクタ部を構成する。前記コネクタ部は、電源側のコネクタ（図示せず）を着脱可能に取り付けることにより電源側と電気的に接続するものである。なお、前記ターミナル２３の他端部にハーネス（図示せず）の一端を電気的に接続し、前記ハーネスの他端に光源側のコネクタ（図示せず）を電気的に接続し、前記光源側のコネクタに電源側のコネクタ（図示せず）を着脱可能に取り付けることにより電源側と電気的に接続するものであっても良い。 The terminal 23 is integrally formed at the center of the other end of the insulating member 22 by insert molding or the like. One end of the terminal 23 is curved upward and is electrically connected to the electrode 201 of the substrate 20. Further, the intermediate portion of the terminal 23 is accommodated in the heat conducting member 21 and the insulating member 22 in a vertical state as shown in FIGS. Further, the other end portion of the terminal 23 is bent horizontally as shown in FIGS. 6 to 8 and constitutes a connector portion together with the center of the other end portion of the insulating member 22. The connector portion is electrically connected to the power source side by detachably attaching a power source side connector (not shown). One end of a harness (not shown) is electrically connected to the other end of the terminal 23, and a light source side connector (not shown) is electrically connected to the other end of the harness. A connector on the power supply side (not shown) may be detachably attached to the connector of the power supply to electrically connect to the power supply side.

前記保持部材３は、たとえば、熱伝導率が高い金属部材もしくは樹脂部材から構成されている。前記保持部材３は、平板形状をなす。前記保持部材３の一面（上面）の中央には、載置面３０が設けられている。前記保持部材３の前記載置面３０の一端部（前端部）の両側（左右両側）には、小長円形の第１位置決め凸部３１が、前記保持部材３の前記載置面３０に対して垂直方向にかつ前記第１位置決め孔部２２１に対応して一体に突設されている。 The holding member 3 is made of, for example, a metal member or a resin member having a high thermal conductivity. The holding member 3 has a flat plate shape. A mounting surface 30 is provided at the center of one surface (upper surface) of the holding member 3. On both sides (right and left sides) of one end portion (front end portion) of the mounting surface 30 of the holding member 3, small oval first positioning convex portions 31 are provided on the mounting surface 30 of the holding member 3. And projecting integrally in the vertical direction and corresponding to the first positioning hole 221.

前記保持部材３のうち前記スクリュー５ねじ込まれる箇所、すなわち、前記載置面３０より外れた箇所であって前記載置面３０の中間の両側（左右両側）には、前記載置面３０よりも突出する凸部３２が一体に設けられている。前記凸部３２には、透孔もしくはねじ孔が設けられている。 Of the holding member 3, a place where the screw 5 is screwed, that is, a place deviated from the placement surface 30, and on both sides (left and right sides) in the middle of the placement surface 30, than the placement surface 30. A protruding protrusion 32 is provided integrally. The convex portion 32 is provided with a through hole or a screw hole.

前記取付部材４は、たとえば、光を散乱（乱反射）させ、もしくは、光を吸収する部材あるいは反射率が低い部材から構成されている。前記取付部材４は、覆い部４０と、前記覆い部４０の両側（左右両側）に一体に設けられている取付部４１と、から構成されている。前記覆い部４０は、前記半導体型光源２の前記絶縁部材２２の一面の殆どの部分を覆い、かつ、前記半導体型光源２の前記絶縁部材２２の両側面（左右両側面）を挟み込む逆凹形状をなす。 The mounting member 4 is made of, for example, a member that scatters (diffusely reflects) light, or absorbs light, or a member that has low reflectance. The attachment member 4 includes a cover part 40 and attachment parts 41 provided integrally on both sides (left and right sides) of the cover part 40. The covering portion 40 covers most of one surface of the insulating member 22 of the semiconductor-type light source 2 and has an inverted concave shape that sandwiches both side surfaces (left and right side surfaces) of the insulating member 22 of the semiconductor-type light source 2. Make.

前記覆い部４０の中央部であって前記半導体型光源２の前記基板２０に対応する箇所には、開口部４００が設けられている。前記開口部４００は、前記半導体型光源２の前記絶縁部材２２の一面に露出する前記熱伝導部材２１の一面よりも一回り小さくかつ前記基板２０よりも一回り大きい長方形をなしている。 An opening 400 is provided at a central portion of the cover portion 40 and corresponding to the substrate 20 of the semiconductor light source 2. The opening 400 has a rectangular shape that is slightly smaller than one surface of the heat conducting member 21 exposed on one surface of the insulating member 22 of the semiconductor light source 2 and larger than the substrate 20.

前記覆い部４０の前記開口部４００の周縁部であって前記半導体型光源２の前記絶縁部材２２の一面と対向する面には、前記半導体型光源２の前記絶縁部材２２の一面を前記保持部材３の前記載置面３０側に押える押え面４０１が、設けられている。 One surface of the insulating member 22 of the semiconductor-type light source 2 is disposed on the surface of the peripheral portion of the opening 400 of the cover 40 that faces the one surface of the insulating member 22 of the semiconductor-type light source 2. 3 is provided with a pressing surface 401 that is pressed to the placement surface 30 side.

前記覆い部４０の前記開口部４００の周縁部のうち、前記車両用灯具１の光の照射方向（図９中の実線矢印方向）側の周縁部には、遮光部４０４が一体に設けられている。前記遮光部４０４は、図９に示すように、前記複数個の発光チップ２００の一部（前記車両用灯具１の光の照射方向側の端部）を前記複数個の発光チップ２００の配列方向に対して鉛直（垂直）もしくはほぼ鉛直（垂直）な方向において覆うものである。前記遮光部４０４は、前記複数個の発光チップ２００から放射される光の一部を遮蔽するものである。 Of the peripheral edge of the opening 400 of the cover 40, a light-shielding portion 404 is integrally provided on the peripheral edge of the vehicular lamp 1 on the light irradiation direction (indicated by the solid arrow in FIG. 9). Yes. As shown in FIG. 9, the light shielding portion 404 is configured such that a part of the plurality of light emitting chips 200 (an end portion on the light irradiation direction side of the vehicular lamp 1) is arranged in the arrangement direction of the plurality of light emitting chips 200. Is covered in a vertical (vertical) or almost vertical (vertical) direction. The light shielding unit 404 shields part of the light emitted from the plurality of light emitting chips 200.

前記遮光部４０４は、前記複数個の発光チップ２００の配列方向と平行もしくはほぼ平行なエッジ４０５を有するものである。前記遮光部４０４の前記エッジ４０５は、前記複数個の発光チップ２００に近接している。前記遮光部４０４の前記エッジ４０５は、前記遮光部４０４の下面（前記複数個の発光チップ２００と対向する面）と、前記遮光部４０４の後面（前記複数個の発光チップ２００からの光の放射方向に傾斜する傾斜面）との角部に形成されている。 The light shielding unit 404 has an edge 405 that is parallel or substantially parallel to the arrangement direction of the plurality of light emitting chips 200. The edge 405 of the light shielding unit 404 is close to the plurality of light emitting chips 200. The edge 405 of the light shielding unit 404 includes a lower surface of the light shielding unit 404 (a surface facing the plurality of light emitting chips 200) and a rear surface of the light shielding unit 404 (light emission from the plurality of light emitting chips 200). It is formed in the corner | angular part with the inclined surface inclined in the direction.

前記覆い部４０の前記押え面４０１の一端部（前端部）の中央と他端部（後端部）の両側（左右両側）とには、小円形の第２位置決め凸部４０２が、前記覆い部４０の前記押え面４０１に対して垂直方向にかつ前記第２位置決め孔部２２２に対応して一体に突設されている。前記第２位置決め凸部４０２の外径は、前記第２位置決め孔部２２２の内径よりも若干小さい。この結果、前記第２位置決め凸部４０２と前記第２位置決め孔部２２２とからなる位置決め部は、前記半導体型光源２の前記本体部２１および２２の前記一面に前記取付部材４の前記押え面４０１を載置する際の位置決めを行い、かつ、前記半導体型光源２の前記本体部２１および２２と前記取付部材４との相対位置の微調整を行うものである。 A small circular second positioning projection 402 is provided at the center of one end (front end) of the pressing surface 401 and both sides (right and left sides) of the other end (rear end) of the cover 40. The portion 40 is integrally projected in a direction perpendicular to the pressing surface 401 and corresponding to the second positioning hole 222. The outer diameter of the second positioning protrusion 402 is slightly smaller than the inner diameter of the second positioning hole 222. As a result, the positioning portion composed of the second positioning convex portion 402 and the second positioning hole portion 222 has the pressing surface 401 of the mounting member 4 on the one surface of the main body portions 21 and 22 of the semiconductor light source 2. Is positioned, and the relative position between the main body portions 21 and 22 of the semiconductor-type light source 2 and the mounting member 4 is finely adjusted.

前記覆い部４０の前記開口部４００の周縁部であって前記半導体型光源２の前記ターミナル２３に対応する部分４０３は、立ち上がった形状をなす。前記立ち上がり部分４０３は、上側に湾曲する前記ターミナル２３の一端部から避けるものである。２個の前記取付部４１には、円形の透孔４１０が前記保持部材３の前記凸部３２に対応して設けられている。 A portion 403 corresponding to the terminal 23 of the semiconductor light source 2 at the periphery of the opening 400 of the cover 40 has a raised shape. The rising portion 403 is avoided from one end of the terminal 23 that curves upward. The two attachment portions 41 are provided with circular through holes 410 corresponding to the convex portions 32 of the holding member 3.

以下、前記半導体型光源２を前記保持部材３と前記取付部材４との間に挟み込んで固定する工程について説明する。 Hereinafter, the process of sandwiching and fixing the semiconductor-type light source 2 between the holding member 3 and the mounting member 4 will be described.

まず、前記保持部材３の前記載置面３０上に前記半導体型光源２の本体部すなわち前記熱伝導部材２１および前記絶縁部材２２の他面を載置する。このとき、前記保持部材３の前記第１位置決め凸部３１と前記半導体型光源２の前記第１位置決め孔部２２１とが相互に嵌合して、前記半導体型光源２の本体部の前記熱伝導部材２１および前記絶縁部材２２の他面が前記保持部材３の前記載置面３０の所定の位置に位置決めされた状態で載置される（図１、図２、図５、図７参照）。 First, the main body of the semiconductor light source 2, that is, the other surfaces of the heat conducting member 21 and the insulating member 22 are placed on the placement surface 30 of the holding member 3. At this time, the first positioning protrusion 31 of the holding member 3 and the first positioning hole 221 of the semiconductor light source 2 are fitted to each other, and the heat conduction of the main body of the semiconductor light source 2 is performed. The other surfaces of the member 21 and the insulating member 22 are placed in a state where they are positioned at predetermined positions on the placement surface 30 of the holding member 3 (see FIGS. 1, 2, 5, and 7).

つぎに、前記半導体型光源２の本体部の前記熱伝導部材２１および前記絶縁部材２２の一面に前記取付部材４の前記覆い部４０の前記押え面４０１を載置する。このとき、前記前記半導体型光源２の前記第２位置決め孔部２２２と前記取付部材４の前記第２位置決め凸部４０２とが相互に嵌合して、前記取付部材４の前記覆い部４０の前記押え面４０１が前記半導体型光源２の本体部の前記熱伝導部材２１および前記絶縁部材２２の一面の所定の位置に位置決めされた状態で載置される（図２、図４、図６参照）。 Next, the pressing surface 401 of the covering portion 40 of the mounting member 4 is placed on one surface of the heat conducting member 21 and the insulating member 22 of the main body portion of the semiconductor light source 2. At this time, the second positioning hole 222 of the semiconductor-type light source 2 and the second positioning projection 402 of the mounting member 4 are fitted to each other, and the cover 40 of the mounting member 4 is The pressing surface 401 is placed in a state where it is positioned at a predetermined position on one surface of the heat conducting member 21 and the insulating member 22 of the main body of the semiconductor light source 2 (see FIGS. 2, 4, and 6). .

すなわち、前記取付部材４の前記覆い部４０の前記開口部４００が前記半導体型光源２の発光部すなわち前記基板２０に位置する。また、前記取付部材４の前記取付部４１が前記保持部材３の前記凸部３２に位置する。 That is, the opening 400 of the cover portion 40 of the mounting member 4 is located in the light emitting portion of the semiconductor light source 2, that is, the substrate 20. Further, the mounting portion 41 of the mounting member 4 is located on the convex portion 32 of the holding member 3.

ここで、前記第２位置決め凸部４０２の外径が前記第２位置決め孔部２２２の内径よりも若干小さいので、前記半導体型光源２の前記本体部２１および２２と前記取付部材４との相対位置の微調整を行うことができる。前記微調整は、図９に示すように、前記複数個の発光チップ２００のばらつき（位置誤差）、特に、前記複数個の発光チップ２００の配列方向に対して直交もしくはほぼ直交する方向のばらつき（位置誤差）を吸収するために、前記遮光部４０４の前記エッジ４０５の位置を、前記複数個の発光チップ２００のうち、前記車両用灯具１の光の照射方向（図９中の実線矢印方向）に最も低い発光チップ２００（図９中の左から２個の発光チップ２００）の縁に合わせるものである。なお、前記微調整は、前記複数個の発光チップ２００を点灯発光させて図１０に示す水平カットオフラインＣＬおよび斜めカットオフラインＣＬを有するすれ違い用配光パターンＰをスクリーンに照射させて行っても良い。 Here, since the outer diameter of the second positioning projection 402 is slightly smaller than the inner diameter of the second positioning hole 222, the relative position between the main body portions 21 and 22 of the semiconductor-type light source 2 and the mounting member 4. Can be fine-tuned. As shown in FIG. 9, the fine adjustment is performed by variation (position error) of the plurality of light emitting chips 200, particularly variation in a direction orthogonal or substantially orthogonal to the arrangement direction of the plurality of light emitting chips 200 ( In order to absorb (position error), the position of the edge 405 of the light shielding portion 404 is determined from the light irradiation direction of the vehicle lamp 1 among the plurality of light emitting chips 200 (the direction indicated by the solid line in FIG. 9). And the edge of the lowest light emitting chip 200 (two light emitting chips 200 from the left in FIG. 9). The fine adjustment may be performed by lighting the plurality of light emitting chips 200 and irradiating the screen with a passing light distribution pattern P having a horizontal cutoff line CL and an oblique cutoff line CL shown in FIG. .

前記微調整が完了してから、取付具すなわち前記スクリュー５を、前記取付部材４の前記取付部４１の前記透孔４１０中に挿通させて前記保持部材３の前記凸部３２の透孔もしくはねじ孔にねじ込む。すると、図４中の実線矢印に示すように、前記取付部材４の前記覆い部４０の前記押え面４０１が前記半導体型光源２の本体部の前記熱伝導部材２１および前記絶縁部材２２の一面を前記保持部材３の前記載置面３０側に押える。この結果、前記半導体型光源２の本体部の前記熱伝導部材２１および前記絶縁部材２２の一面と前記取付部材４の前記覆い部４０の前記押え面４０１とが確固に当接し、かつ、前記半導体型光源２の本体部の前記熱伝導部材２１および前記絶縁部材２２の他面と前記保持部材３の前記載置面３０とが確固に当接する。この状態で、前記半導体型光源２が前記取付部材４と前記保持部材３との間に挟み込まれて固定されることとなる。 After the fine adjustment is completed, the fixture, that is, the screw 5 is inserted into the through-hole 410 of the attachment portion 41 of the attachment member 4 and the through-hole or screw of the convex portion 32 of the holding member 3 is inserted. Screw into the hole. Then, as shown by a solid line arrow in FIG. 4, the pressing surface 401 of the cover portion 40 of the mounting member 4 is connected to one surface of the heat conducting member 21 and the insulating member 22 of the main body portion of the semiconductor light source 2. The holding member 3 is pressed against the placement surface 30 side. As a result, one surface of the heat conducting member 21 and the insulating member 22 of the main body portion of the semiconductor-type light source 2 and the pressing surface 401 of the cover portion 40 of the mounting member 4 firmly contact each other, and the semiconductor The other surfaces of the heat conducting member 21 and the insulating member 22 of the main body portion of the mold light source 2 firmly contact the mounting surface 30 of the holding member 3. In this state, the semiconductor light source 2 is sandwiched and fixed between the mounting member 4 and the holding member 3.

このとき、図４に示すように、前記保持部材３と前記取付部材４との間には、隙間８が形成されている。すなわち、前記保持部材３のうち前記半導体型光源２が載置されている前記載置面３０以外の面であって、前記保持部材３の前記凸部３２の一面（上面）と、前記取付部材４のうち前記半導体型光源２を押える前記押え面４０１以外の面であって、前記取付部材４の前記取付部４１の他面（下面）との間には、前記隙間８が形成されている。 At this time, as shown in FIG. 4, a gap 8 is formed between the holding member 3 and the mounting member 4. That is, the surface of the holding member 3 other than the mounting surface 30 on which the semiconductor light source 2 is mounted, and one surface (upper surface) of the convex portion 32 of the holding member 3 and the mounting member 4 is a surface other than the pressing surface 401 for pressing the semiconductor-type light source 2 and between the other surface (lower surface) of the mounting portion 41 of the mounting member 4. .

前記リフレクタ６は、たとえば、光不透過性の樹脂部材などから構成されている。前記リフレクタ６は、前部分と下部分とが開口し、その他の部分（上部分、後部分、左右両側部分）が閉塞した形状をなす。前記リフレクタ６の内面には、反射面６０が設けられている。前記反射面６０は、前記半導体型光源２の前記発光チップ２００からの光を図１０に示す所定の配光パターンすなわち水平カットオフラインＣＬおよび斜めカットオフラインＣＬを有するすれ違い用配光パターンＰとして前方に反射照射するものである。 The reflector 6 is made of, for example, a light impermeable resin member. The reflector 6 has a shape in which a front portion and a lower portion are opened and other portions (upper portion, rear portion, and left and right side portions) are closed. A reflective surface 60 is provided on the inner surface of the reflector 6. The reflection surface 60 forwards light from the light emitting chip 200 of the semiconductor-type light source 2 as a passing light distribution pattern P having a predetermined light distribution pattern shown in FIG. 10, that is, a horizontal cutoff line CL and an oblique cutoff line CL. Reflective irradiation.

前記ヒートシンク７は、たとえば、熱伝導率が高い樹脂部材もしくは金属部材から構成されている。前記ヒートシンク７は、前部分が平板形状をなし、かつ、中間部分から後部分にかけての部分がフィン形状の放熱部７０をなす。前記リフレクタ６および前記ヒートシンク７は、前記保持部材３に取り付けられている。 The heat sink 7 is made of, for example, a resin member or a metal member having a high thermal conductivity. In the heat sink 7, the front portion has a flat plate shape, and the portion from the intermediate portion to the rear portion forms a fin-shaped heat dissipation portion 70. The reflector 6 and the heat sink 7 are attached to the holding member 3.

（作用の説明）
以下、この実施例における車両用灯具１は、以上のごとき構成からなり、以下、その作用について説明する。 (Description of action)
Hereinafter, the vehicular lamp 1 according to this embodiment is configured as described above, and the operation thereof will be described below.

車両用灯具１の半導体型光源２の発光チップ２００を点灯発光させる。すると、半導体型光源２の発光チップ２００から光が放射される。この光は、リフレクタ６の反射面６０で反射し、図１０に示す、水平カットオフラインＣＬおよび斜めカットオフラインＣＬを有するすれ違い用配光パターンＰとして車両の前方に照射される。 The light emitting chip 200 of the semiconductor-type light source 2 of the vehicular lamp 1 is turned on to emit light. Then, light is emitted from the light emitting chip 200 of the semiconductor-type light source 2. This light is reflected by the reflecting surface 60 of the reflector 6 and is irradiated forward of the vehicle as a passing light distribution pattern P having a horizontal cutoff line CL and an oblique cutoff line CL shown in FIG.

（効果の説明）
この実施例における車両用灯具１は、以上のごとき構成および作用からなり、以下、その効果について説明する。 (Explanation of effect)
The vehicular lamp 1 in this embodiment is configured and operated as described above, and the effects thereof will be described below.

この実施例における車両用灯具１は、遮光部４０４のエッジ４０５により、複数個の発光チップ２００の配列において多少のばらつき（位置誤差）、特に、複数個の発光チップ２００の配列方向に対して直交もしくはほぼ直交する方向のばらつき（位置誤差）があっても、すれ違い用配光パターンＰの適正な配光制御を行うことができ、かつ、すれ違い用配光パターンＰの明瞭なカットオフラインＣＬを得ることができる。 In the vehicle lamp 1 in this embodiment, due to the edge 405 of the light shielding portion 404, there is some variation (position error) in the arrangement of the plurality of light emitting chips 200, in particular, orthogonal to the arrangement direction of the plurality of light emitting chips 200. Or, even if there is a variation (position error) in a substantially orthogonal direction, the proper light distribution control of the passing light distribution pattern P can be performed, and a clear cut-off line CL of the passing light distribution pattern P is obtained. be able to.

しかも、この実施例における車両用灯具１は、取付部材４の覆い部４０の押え面４０１が半導体型光源２の本体部の熱伝導部材２１および絶縁部材２２の一面を保持部材３の載置面３０側に押えると、半導体型光源２の本体部の熱伝導部材２１および絶縁部材２２の一面と取付部材４の覆い部４０の押え面４０１とが確固に当接し、かつ、半導体型光源２の本体部の熱伝導部材２１および絶縁部材２２の他面と保持部材３の載置面３０とが確固に当接している状態で、半導体型光源２が取付部材４と保持部材３との間に挟み込まれて固定されている。この結果、この実施例における車両用灯具１は、車両の振動に対して十分に耐えられるように、半導体型光源２が保持部材３に取付部材４を介して確実に固定することができると共に、半導体型光源２の複数個の発光チップ２００と取付部材４の遮光部４０４のエッジ４０５との相対位置を高精度に保つことができるので、すれ違い用配光パターンＰの適正な配光制御を確実に行うことができ、かつ、すれ違い用配光パターンＰの明瞭なカットオフラインＣＬを確実に得ることができる。 Moreover, in the vehicular lamp 1 according to this embodiment, the pressing surface 401 of the cover portion 40 of the mounting member 4 is placed on one surface of the heat conducting member 21 and the insulating member 22 of the main body of the semiconductor light source 2 and the mounting surface of the holding member 3. When pressed to the 30 side, the one surface of the heat conducting member 21 and the insulating member 22 of the main body of the semiconductor light source 2 and the pressing surface 401 of the cover 40 of the mounting member 4 firmly contact each other, and the semiconductor light source 2 The semiconductor light source 2 is placed between the mounting member 4 and the holding member 3 in a state where the other surfaces of the heat conducting member 21 and the insulating member 22 of the main body and the mounting surface 30 of the holding member 3 are firmly in contact. It is pinched and fixed. As a result, the vehicular lamp 1 in this embodiment can securely fix the semiconductor-type light source 2 to the holding member 3 via the mounting member 4 so as to sufficiently withstand the vibration of the vehicle. Since the relative position between the plurality of light emitting chips 200 of the semiconductor light source 2 and the edge 405 of the light shielding portion 404 of the mounting member 4 can be maintained with high accuracy, proper light distribution control of the passing light distribution pattern P is ensured. And a clear cut-off line CL of the passing light distribution pattern P can be obtained with certainty.

また、この実施例における車両用灯具１は、遮光部４０４のエッジ４０５を複数個の発光チップ２００に近接させるので、半導体型光源２の複数個の発光チップ２００と取付部材４の遮光部４０４のエッジ４０５との相対位置をさらに高精度に保つことができ、すれ違い用配光パターンＰの適正な配光制御をさらに確実に行うことができ、かつ、すれ違い用配光パターンＰの明瞭なカットオフラインＣＬをさらに確実に得ることができる。 Further, in the vehicle lamp 1 in this embodiment, the edges 405 of the light shielding portion 404 are brought close to the plurality of light emitting chips 200, so that the plurality of light emitting chips 200 of the semiconductor type light source 2 and the light shielding portion 404 of the mounting member 4 are arranged. The relative position with respect to the edge 405 can be maintained with higher accuracy, the proper light distribution control of the passing light distribution pattern P can be performed more reliably, and the clear cut-off line of the passing light distribution pattern P is clear. CL can be obtained more reliably.

さらに、この実施例における車両用灯具１は、取付部材４の第２位置決め凸部４０２と半導体型光源２の第２位置決め孔部２２２とからなる位置決め部により、半導体型光源２の本体部の熱伝導部材２１および絶縁部材２２と取付部材４との相対位置の微調整を行うことができるので、複数個の発光チップ２００の配列のばらつき（位置誤差）、特に、複数個の発光チップ２００の配列方向に対して直交もしくはほぼ直交する方向のばらつき（位置誤差）の程度に応じて対応することができ、半導体型光源２の複数個の発光チップ２００と取付部材４の遮光部４０４のエッジ４０５との相対位置をさらに高精度に保つことができ、すれ違い用配光パターンＰの適正な配光制御をさらに確実に行うことができ、かつ、すれ違い用配光パターンＰの明瞭なカットオフラインＣＬをさらに確実に得ることができる。 Further, the vehicular lamp 1 according to this embodiment is configured such that the heat of the main body portion of the semiconductor light source 2 is provided by the positioning portion including the second positioning convex portion 402 of the mounting member 4 and the second positioning hole portion 222 of the semiconductor light source 2. Since the relative positions of the conductive member 21 and the insulating member 22 and the mounting member 4 can be finely adjusted, variations in the arrangement (position error) of the plurality of light emitting chips 200, particularly the arrangement of the plurality of light emitting chips 200. This can be dealt with according to the degree of variation (position error) in the direction orthogonal or substantially orthogonal to the direction, and the plurality of light emitting chips 200 of the semiconductor type light source 2 and the edge 405 of the light shielding portion 404 of the mounting member 4 Can be maintained with higher accuracy, the proper light distribution control of the passing light distribution pattern P can be performed more reliably, and the passing light distribution pattern P It can be obtained more reliably clear cut-off line CL.

（その他の例）
なお、前記の実施例においては、取付具としてスクリュー５を使用するものである。ところが、この発明においては、取付具としてスクリュー以外のもの、たとえば、弾性係合爪部と係合部との弾性係合（いわゆる、パッチン嵌合）、加締めピンの加締め付け、ボルトナットの取付などを使用しても良い。 (Other examples)
In addition, in the said Example, the screw 5 is used as a fixture. However, in the present invention, as a fixture, other than the screw, for example, elastic engagement between the elastic engagement claw portion and the engagement portion (so-called patch-on fitting), crimping of the crimping pin, and bolt nut installation Etc. may be used.

また、前記の実施例においては、リフレクタ６として固定リフレクタ６を使用するものである。ところが、この発明においては、リフレクタとして、固定リフレクタと可動リフレクタとを使用して、第１配光パターン（たとえば、すれ違い用配光パターンやロービーム配光パターン）と第２配光パターン（たとえば、走行用配光パターンやハイビーム配光パターン）とが切り替えて得られるものであっても良い。 Further, in the above-described embodiment, the fixed reflector 6 is used as the reflector 6. However, in the present invention, as the reflector, a fixed reflector and a movable reflector are used, and a first light distribution pattern (for example, a passing light distribution pattern or a low beam light distribution pattern) and a second light distribution pattern (for example, traveling) are used. (A light distribution pattern for use or a high beam distribution pattern) may be obtained by switching.

さらに、前記の実施例においては、ヘッドランプとして使用するものである。ところが、この発明においては、水平なカットオフラインを有するフォグ用配光パターンを照射するフォグランプ、または、その他のランプ、たとえば、テール・ストップランプ、デイタイムランニングランプ、カーブランプなどに使用しても良い。 Furthermore, in the said Example, it uses as a headlamp. However, in the present invention, it may be used for a fog lamp that irradiates a fog light distribution pattern having a horizontal cut-off line, or other lamps such as a tail / stop lamp, a daytime running lamp, and a curve lamp. .

さらにまた、前記の実施例においては、保持部材３とヒートシンク７とを別体のものを使用するものである。ところが、この発明においては、保持部材とヒートシンクとを一体のものを使用しても良い。 Furthermore, in the above-described embodiment, the holding member 3 and the heat sink 7 are separately used. However, in the present invention, the holding member and the heat sink may be integrated.

さらにまた、前記の実施例においては、第１位置決め部および第２位置決め部として第１位置決め孔部２２１および第２位置決め孔部２２２を使用するものである。ところが、この発明においては、第１位置決め部および第２位置決め部として、孔部ではなく凹部でも良い。 Furthermore, in the said Example, the 1st positioning hole part 221 and the 2nd positioning hole part 222 are used as a 1st positioning part and a 2nd positioning part. However, in the present invention, the first positioning portion and the second positioning portion may be recesses instead of holes.

さらにまた、前記の実施例においては、取付部材４として光を散乱（乱反射）させ、もしくは、光を吸収する部材あるいは反射率が低い部材から構成されているものである。ところが、この発明においては、取付部材として使用する部材を特に限定せずに、取付部材の開口部の周縁部の表面に、光吸収処理を施すようにしても良い。 Furthermore, in the above-described embodiment, the mounting member 4 is composed of a member that scatters (diffusely reflects) light, or absorbs light, or a member having low reflectance. However, in the present invention, the member used as the attachment member is not particularly limited, and the surface of the peripheral portion of the opening of the attachment member may be subjected to light absorption treatment.

さらにまた、前記の実施例においては、保持部材３の一面（上面）に半導体型光源２を取付部材４およびスクリュー５により取り付けたものである。ところが、この発明においては、保持部材３の両面（上面および下面）に半導体型光源２を取付部材４およびスクリュー５によりそれぞれ取り付けたものであっても良い。 Furthermore, in the above-described embodiment, the semiconductor light source 2 is attached to one surface (upper surface) of the holding member 3 with the attachment member 4 and the screw 5. However, in the present invention, the semiconductor light source 2 may be attached to both surfaces (upper surface and lower surface) of the holding member 3 with the mounting member 4 and the screw 5, respectively.

さらにまた、前記の実施例においては、半導体型光源２の複数個の発光チップ２００から放射される光をリフレクタ６の反射面６０で反射させてすれ違い用配光パターンＰを照射する、いわゆる、レフタイプ（反射型）の車両用灯具について使用するものである。ところが、この発明においては、プロジェクタタイプの車両用灯具あるいは直射タイプの車両用灯具にも使用することができる。 Furthermore, in the above-described embodiment, the light emitted from the plurality of light emitting chips 200 of the semiconductor light source 2 is reflected by the reflecting surface 60 of the reflector 6 to irradiate the passing light distribution pattern P. This type is used for vehicle lamps of the type (reflection type). However, the present invention can also be used for a projector-type vehicle lamp or a direct-type vehicle lamp.

１車両用灯具
２半導体型光源
２０基板（発光部）
２００発光チップ
２０１電極
２１熱伝導部材（本体部）
２２絶縁部材（本体部）
２２１第１位置決め孔部
２２２第２位置決め孔部
２３ターミナル
３保持部材
３０載置面
３１第１位置決め凸部
３２凸部
４取付部材
４０覆い部
４００開口部
４０１押え面
４０２第２位置決め凸部
４０３立ち上がり部分
４０４遮光部
４０５エッジ
４１取付部
４１０透孔
５スクリュー（取付具）
６リフレクタ
６０反射面
７ヒートシンク
７０放熱部
８隙間
Ｐすれ違い用配光パターン
ＣＬ水平カットオフラインおよび斜めカットオフライン DESCRIPTION OF SYMBOLS 1 Vehicle lamp 2 Semiconductor type light source 20 Board | substrate (light emission part)
200 Light-Emitting Chip 201 Electrode 21 Heat Conducting Member (Main Body)
22 Insulation member (main part)
221 1st positioning hole part 222 2nd positioning hole part 23 Terminal 3 Holding member 30 Mounting surface 31 1st positioning convex part 32 Convex part 4 Mounting member 40 Cover part 400 Opening part 401 Holding surface 402 2nd positioning convex part 403 Standing up Part 404 Light-shielding part 405 Edge 41 Attachment part 410 Through-hole 5 Screw (attachment tool)
6 Reflector 60 Reflecting surface 7 Heat sink 70 Heat sink 8 Clearance P Light distribution pattern for passing CL Horizontal cut-off line and oblique cut-off line

Claims

半導体型光源を光源とする車両用灯具において、
半導体型光源と、保持部材と、取付部材と、取付具と、を備え、
前記半導体型光源を前記保持部材と前記取付部材との間に挟み込んだ状態で、前記取付具を前記取付部材を介して前記保持部材に取り付けることにより、前記半導体型光源が前記保持部材と前記取付部材との間に固定される車両用灯具であって、
前記半導体型光源は、本体部と、前記本体部の一面に設けられていて、かつ、複数個の発光チップが一方向に配列されている発光部と、から構成されていて、
前記保持部材には、前記半導体型光源の前記本体部の他面が載置する載置面が、設けられていて、
前記取付部材の前記半導体型光源の前記発光部に対応する箇所には、開口部が設けられていて、
前記取付部材の前記開口部の周縁部には、前記半導体型光源の前記本体部の前記一面を前記保持部材の前記載置面側に押える押え面と、前記複数個の発光チップの配列方向と平行もしくはほぼ平行なエッジを有し、かつ、前記複数個の発光チップの一部を前記複数個の発光チップの配列方向に対して鉛直もしくはほぼ鉛直な方向において覆って、前記複数個の発光チップから放射される光の一部を遮蔽する遮光部とが、それぞれ設けられていて、
前記遮光部の前記エッジは、前記複数個の発光チップのうち、車両用灯具の光の照射方向と最も反対側にある発光チップの縁に合わせる、
ことを特徴とする車両用灯具。 In a vehicular lamp using a semiconductor-type light source as a light source,
A semiconductor-type light source, a holding member, an attachment member, and a fixture;
The semiconductor-type light source is attached to the holding member via the attachment member in a state where the semiconductor-type light source is sandwiched between the holding member and the attachment member. A vehicular lamp fixed between the members,
The semiconductor-type light source is composed of a main body part and a light emitting part that is provided on one surface of the main body part and in which a plurality of light emitting chips are arranged in one direction,
The holding member is provided with a mounting surface on which the other surface of the main body of the semiconductor-type light source is mounted,
An opening is provided at a location corresponding to the light emitting portion of the semiconductor light source of the mounting member,
At the periphery of the opening of the mounting member, a pressing surface that presses the one surface of the main body portion of the semiconductor light source against the mounting surface side of the holding member; and an arrangement direction of the plurality of light emitting chips; A plurality of light emitting chips having parallel or substantially parallel edges and covering a part of the plurality of light emitting chips in a direction perpendicular or substantially perpendicular to an arrangement direction of the plurality of light emitting chips; And a light shielding part that shields a part of the light emitted from the
The edge of the light shielding portion is aligned with the edge of the light emitting chip that is the most opposite to the light irradiation direction of the vehicular lamp among the plurality of light emitting chips.
A vehicular lamp characterized by the above.

前記遮光部の前記エッジは、前記複数個の発光チップに近接している、
ことを特徴とする請求項１に記載の車両用灯具。 The edge of the light-shielding part is close to the plurality of light emitting chips,
The vehicular lamp according to claim 1.

前記半導体型光源の前記本体部と前記取付部材とには、前記半導体型光源の前記本体部の前記一面に前記取付部材の前記押え面を載置する際の位置決めを行い、かつ、前記半導体型光源の前記本体部と前記取付部材との相対位置の微調整を行う位置決め部がそれぞれ設けられている、
ことを特徴とする請求項１または２に記載の車両用灯具。 Positioning when placing the pressing surface of the mounting member on the one surface of the main body portion of the semiconductor type light source is performed on the main body portion and the mounting member of the semiconductor type light source, and the semiconductor type Positioning portions for finely adjusting the relative position between the main body portion of the light source and the mounting member are provided, respectively.
The vehicular lamp according to claim 1 or 2.