JP5553919B2 - 光電装置 - Google Patents
光電装置 Download PDFInfo
- Publication number
- JP5553919B2 JP5553919B2 JP2013076778A JP2013076778A JP5553919B2 JP 5553919 B2 JP5553919 B2 JP 5553919B2 JP 2013076778 A JP2013076778 A JP 2013076778A JP 2013076778 A JP2013076778 A JP 2013076778A JP 5553919 B2 JP5553919 B2 JP 5553919B2
- Authority
- JP
- Japan
- Prior art keywords
- lens
- photoelectric
- photoelectric device
- chip
- hollow columnar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003287 optical effect Effects 0.000 claims description 24
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 4
- 238000004023 plastic welding Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 13
- 230000008878 coupling Effects 0.000 description 9
- 238000010168 coupling process Methods 0.000 description 9
- 238000005859 coupling reaction Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
Landscapes
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Blocking Light For Cameras (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Photovoltaic Devices (AREA)
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
Description
102…ベース、
102b…光電チップ、
102c…周辺チップ、
102d…上周縁、
102e…ベースの下周縁、
103、103’…レンズキャップ、
104…内柱状部、
104a…位置決め部材、
104b…上環状部、
104c…レンズ部、
104d…下環状部、
104e…内柱状部の下周縁、
106、106’…中空柱状部、
106a、106a’…開口、
106b…中空柱状部の下周縁、
106c…環状溝、
108a、108b…光学フィルタ、
110…気密封止剤。
Claims (9)
- 上に光電チップを有するベースと、
トップに開口を有する金属中空柱状部と、前記中空柱状部内にぴったりと配置されており、前記開口内に位置するレンズ部と、及び前記レンズ部が前記光電チップに位置合わせすることができるように前記ベースの上周縁に当接する少なくとも3つの位置決め部材を有するプラスチック内柱状部と、を含み、前記光電チップの上方に覆われるレンズキャップと、
を備え、前記位置決め部材は、前記内柱状部の下周縁に位置する光電装置。 - 前記中空柱状部のレンズ部は、はんだ付け又はプラスチック溶接によって前記ベースに固定される請求項1に記載の光電装置。
- 前記レンズ部は、球状レンズ、非球状レンズ、凹レンズ、又は凸レンズである請求項1又は請求項2に記載の光電装置。
- 前記内柱状部は、前記レンズ部を取り囲む上環状部を有し、前記開口と前記上環状部との間に環状溝が形成される請求項1ないし請求項3のいずれか一項に記載の光電装置。
- 前記環状溝内に充填するための気密封止剤を更に備える請求項4に記載の光電装置。
- 前記レンズ部に位置合わせできるように前記上環状部に固定される光学フィルタを更に備える請求項4又は請求項5に記載の光電装置。
- 前記内柱状部は、前記レンズ部を取り囲む下環状部を有する請求項1ないし請求項6のいずれか一項に記載の光電装置。
- 前記レンズ部に位置合わせできるように前記下環状部に固定される光学フィルタを更に備える請求項7に記載の光電装置。
- 前記内柱状部の屈折係数の範囲は、1.35〜1.7である請求項1ないし請求項8のいずれか一項に記載の光電装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/438,686 | 2012-04-03 | ||
US13/438,686 US20130258474A1 (en) | 2012-04-03 | 2012-04-03 | Optoelectronic device with improved lens cap |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013214074A JP2013214074A (ja) | 2013-10-17 |
JP5553919B2 true JP5553919B2 (ja) | 2014-07-23 |
Family
ID=49234681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013076778A Active JP5553919B2 (ja) | 2012-04-03 | 2013-04-02 | 光電装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130258474A1 (ja) |
JP (1) | JP5553919B2 (ja) |
TW (1) | TWI447503B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105526987A (zh) * | 2016-01-07 | 2016-04-27 | 北京万顺华科技有限公司 | 一种光电液位开关用检测头 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3506962B2 (ja) * | 1998-08-10 | 2004-03-15 | オリンパス株式会社 | 撮像モジュール |
JP2006180487A (ja) * | 2001-01-12 | 2006-07-06 | Konica Minolta Holdings Inc | 撮像装置 |
TW523924B (en) * | 2001-01-12 | 2003-03-11 | Konishiroku Photo Ind | Image pickup device and image pickup lens |
JP3603056B2 (ja) * | 2001-07-11 | 2004-12-15 | 美▲キ▼科技股▲フン▼有限公司 | 固体撮像装置及びその製造方法 |
US6700138B2 (en) * | 2002-02-25 | 2004-03-02 | Silicon Bandwidth, Inc. | Modular semiconductor die package and method of manufacturing thereof |
US20050242410A1 (en) * | 2002-07-18 | 2005-11-03 | Koninklijke Philips Electronics N.V. | Camera module, holder for use in a camera module, camera system and method of manufacturing a camera module |
US7821564B2 (en) * | 2003-12-30 | 2010-10-26 | Given Imaging Ltd. | Assembly for aligning an optical system |
DE102004001698A1 (de) * | 2004-01-13 | 2005-08-11 | Robert Bosch Gmbh | Optisches Modul |
JP2007029713A (ja) * | 2005-07-28 | 2007-02-08 | Olympus Winter & Ibe Gmbh | 複合ハウジングを有する硬性内視鏡光学系 |
JP2008160348A (ja) * | 2006-12-22 | 2008-07-10 | Yoshikawa Kasei Kk | 撮像レンズモジュール、カメラモジュールおよび撮像レンズモジュールの実装方法 |
JP2008182051A (ja) * | 2007-01-25 | 2008-08-07 | Matsushita Electric Ind Co Ltd | 光学デバイス、光学デバイス装置、カメラモジュールおよび光学デバイス装置の製造方法 |
US8270089B2 (en) * | 2007-04-05 | 2012-09-18 | Essilor International (Compagnie Generale D'optique) | Thermoplastic polyurethane lenses with a specified weight percentage of urethane repeating units |
JP2010027886A (ja) * | 2008-07-22 | 2010-02-04 | Toshiba Corp | 半導体装置とそれを用いたカメラモジュール |
US9140863B2 (en) * | 2011-03-01 | 2015-09-22 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Fixed connection (FC)-type optoelectronic assembly having a transparent threaded plastic body with an optical element integrally formed therein |
-
2012
- 2012-04-03 US US13/438,686 patent/US20130258474A1/en not_active Abandoned
-
2013
- 2013-02-26 TW TW102106705A patent/TWI447503B/zh active
- 2013-04-02 JP JP2013076778A patent/JP5553919B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TWI447503B (zh) | 2014-08-01 |
JP2013214074A (ja) | 2013-10-17 |
TW201341933A (zh) | 2013-10-16 |
US20130258474A1 (en) | 2013-10-03 |
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