JP5539588B2 - 逆テーパ付きヒートシンクを有する照明デバイス - Google Patents
逆テーパ付きヒートシンクを有する照明デバイス Download PDFInfo
- Publication number
- JP5539588B2 JP5539588B2 JP2013513380A JP2013513380A JP5539588B2 JP 5539588 B2 JP5539588 B2 JP 5539588B2 JP 2013513380 A JP2013513380 A JP 2013513380A JP 2013513380 A JP2013513380 A JP 2013513380A JP 5539588 B2 JP5539588 B2 JP 5539588B2
- Authority
- JP
- Japan
- Prior art keywords
- lighting device
- heat sink
- solid state
- state lighting
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007787 solid Substances 0.000 claims description 132
- 230000005855 radiation Effects 0.000 claims description 22
- 230000000903 blocking effect Effects 0.000 claims description 11
- 230000007423 decrease Effects 0.000 claims description 8
- 239000012080 ambient air Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 description 14
- 239000008393 encapsulating agent Substances 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000009182 swimming Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
本出願は、2010年6月4日に出願された米国特許出願第12/794,559号に対して優先権を主張する。こうした出願の全体の内容は、全ての目的のために、参照により本明細書に組込まれる。
[技術分野]
本発明は、固体照明デバイスおよび固体照明デバイスに関連する熱伝達構造に関する。
[背景技術]
発光ダイオード(LED)は、電気エネルギーを光に変換する固体デバイスであり、一般に、反対極性にドープされた層間に挟まれた半導体材料の1つまたは複数の活性層を含む。ドープ済みの層の両端にバイアスが印加されると、正孔および電子が、1つまたは複数の活性層に注入され、活性層で正孔および電子は再結合して、光が生成され、光はデバイスから放射される。レーザダイオードは、同様の原理に従って動作する固体エミッタである。
[発明の概要]
本発明は、種々の実施形態において、固体照明デバイスによって放射される光の遮断を低減し、半角放射を増加させるために、照明デバイスの固体エミッタから基端に延在する方向に沿って幅が増加する部分を有するヒートシンクを備える固体照明デバイスに関する。
本発明の他の態様、特徴、および実施形態は、続く開示および添付特許請求の範囲からより完全に明らかになる。
Claims (18)
- 固体照明デバイスであって、
基端と、
少なくとも1つの固体エミッタと、
前記基端と前記少なくとも1つの固体エミッタとの間に配設され、前記少なくとも1つの固体エミッタによって生成される熱を消散させるように配置されたヒートシンクとを備え、
照明デバイスは、前記基端と、前記少なくとも1つの固体エミッタが搭載されるエミッタ搭載エリアとの間の方向に延在する実質的に中心の軸を有し、
前記ヒートシンクは、固体照明デバイスの全側部周縁の周りで前記中心軸に対して90°より大きいそれぞれの放射半角に従って、前記少なくとも1つの固体エミッタによって生成される光の非遮断放射を可能にするように配置され、
前記ヒートシンクは、第1の端と第2の端とを有し、前記ヒートシンクは、前記第2の端から前記第1の端に向かう方向において、距離に伴って増加し、その後減少し、その後再び増加する幅を有し、順次配置された第1及び第2の逆テーパ付き部分を備える固体照明デバイス。 - 前記ヒートシンクの一部は、周囲空気環境に露出され、前記少なくとも1つの固体エミッタからの放射を受ける請求項1記載の固体照明デバイス。
- 前記ヒートシンクは、周囲空気環境に露出される第1の端と、周囲空気環境に露出される第2の端を備える請求項1又は2に記載の固体照明デバイス。
- 前記ヒートシンクは、固体照明デバイスの全側部周縁の周りで前記中心軸に対して少なくとも約120°のそれぞれの放射半角に従って、前記少なくとも1つの固体エミッタによって生成される光の非遮断放射を可能にするように配置される請求項1〜3のいずれか1項に記載の固体照明デバイス。
- 前記ヒートシンクは、固体照明デバイスの全側部周縁の周りで前記中心軸に対して少なくとも約135°のそれぞれの放射半角に従って、前記少なくとも1つの固体エミッタによって生成される光の非遮断放射を可能にするように配置される請求項1〜3のいずれか1項に記載の固体照明デバイス。
- 前記少なくとも1つの固体エミッタは、カバーの下かまたは前記カバー内に配設される請求項1〜5のいずれか1項に記載の固体照明デバイス。
- 前記基端は、少なくとも1つの電気コンタクトを備える請求項1〜6のいずれか1項に記載の固体照明デバイス。
- 前記ヒートシンクは、複数のフィンを備える請求項1〜7のいずれか1項に記載の固体照明デバイス。
- 前記複数のフィンは、外側に突出するピンまたはロッドとして配置される請求項8に記載の固体照明デバイス。
- 前記複数のフィンは、前記基端およびエミッタ搭載エリアを通って規定される実質的に中心の軸に実質的に平行に配置されたフィンを含む請求項8に記載の固体照明デバイス。
- 前記複数のフィンは、前記基端およびエミッタ搭載エリアを通って規定される実質的に中心の軸に実質的に垂直に配置されたフィンを含む請求項8に記載の固体照明デバイス。
- 前記ヒートシンクは、螺旋形状で配置された少なくとも1つのフィンを備える請求項1〜7のいずれか1項に記載の固体照明デバイス。
- 前記ヒートシンクは、ヒートパイプを備える請求項1〜12のいずれか1項に記載の固体照明デバイス。
- 前記ヒートシンクは、前記ヒートパイプと伝導的熱連通状態にある複数のフィンを備える請求項13に記載の固体照明デバイス。
- 前記ヒートシンク内に配設された、複数の電気導体および複数の電気回路要素の任意のものを備える請求項1〜14のいずれか1項に記載の固体照明デバイス。
- 前記ヒートシンクは、前記少なくとも1つの固体エミッタの接合部温度を約85℃以下に維持しながら、約35℃の周囲空気環境において、少なくとも約2ワットの定常状態熱負荷を消散させるようになっている請求項1〜15のいずれか1項に記載の固体照明デバイス。
- A19電球用のANSI規格C.78.20−2003に従ってサイズ決定され形作られる請求項1〜16のいずれか1項に記載の固体照明デバイス。
- 請求項1〜17のいずれか1項に記載の固体照明デバイスを備えるランプまたは照明器具。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/794,559 US8227961B2 (en) | 2010-06-04 | 2010-06-04 | Lighting device with reverse tapered heatsink |
US12/794,559 | 2010-06-04 | ||
PCT/US2011/039105 WO2011153456A1 (en) | 2010-06-04 | 2011-06-03 | Lighting device with reverse tapered heatsink |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013527589A JP2013527589A (ja) | 2013-06-27 |
JP5539588B2 true JP5539588B2 (ja) | 2014-07-02 |
Family
ID=45063929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013513380A Expired - Fee Related JP5539588B2 (ja) | 2010-06-04 | 2011-06-03 | 逆テーパ付きヒートシンクを有する照明デバイス |
Country Status (8)
Country | Link |
---|---|
US (3) | US8227961B2 (ja) |
EP (2) | EP2450615B1 (ja) |
JP (1) | JP5539588B2 (ja) |
KR (1) | KR101267455B1 (ja) |
CN (1) | CN102686943B (ja) |
BR (1) | BR112012002865A2 (ja) |
RU (1) | RU2527555C2 (ja) |
WO (1) | WO2011153456A1 (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
CN102032473A (zh) * | 2009-09-29 | 2011-04-27 | 富士迈半导体精密工业(上海)有限公司 | Led照明装置 |
US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
US8227961B2 (en) | 2010-06-04 | 2012-07-24 | Cree, Inc. | Lighting device with reverse tapered heatsink |
US8575836B2 (en) | 2010-06-08 | 2013-11-05 | Cree, Inc. | Lighting devices with differential light transmission regions |
US8596821B2 (en) | 2010-06-08 | 2013-12-03 | Cree, Inc. | LED light bulbs |
TWI467115B (zh) * | 2010-08-06 | 2015-01-01 | Ind Tech Res Inst | 具高散熱效能之光源裝置 |
US10400959B2 (en) * | 2010-11-09 | 2019-09-03 | Lumination Llc | LED lamp |
US9395057B2 (en) * | 2011-02-07 | 2016-07-19 | Cree, Inc. | Lighting device with flexibly coupled heatsinks |
KR101326518B1 (ko) | 2011-09-02 | 2013-11-07 | 엘지이노텍 주식회사 | 조명 장치 |
KR102017538B1 (ko) * | 2012-01-31 | 2019-10-21 | 엘지이노텍 주식회사 | 조명 장치 |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
KR102024704B1 (ko) * | 2012-05-24 | 2019-09-24 | 엘지이노텍 주식회사 | 조명 장치 |
US8680755B2 (en) | 2012-05-07 | 2014-03-25 | Lg Innotek Co., Ltd. | Lighting device having reflectors for indirect light emission |
CN103017117A (zh) * | 2012-11-05 | 2013-04-03 | 日月光半导体制造股份有限公司 | 发光二极管灯泡的灯座 |
US9303857B2 (en) | 2013-02-04 | 2016-04-05 | Cree, Inc. | LED lamp with omnidirectional light distribution |
US9052093B2 (en) * | 2013-03-14 | 2015-06-09 | Cree, Inc. | LED lamp and heat sink |
CN103185248A (zh) * | 2013-04-09 | 2013-07-03 | 王桂强 | 新型蜡烛灯 |
US10514489B2 (en) * | 2017-04-19 | 2019-12-24 | Omachron Intellectual Property Inc. | LED light source |
EP4176199B1 (en) * | 2020-08-11 | 2024-01-31 | Signify Holding B.V. | System comprising luminescent material and two-phase cooling device |
EP4219823A1 (en) | 2022-01-26 | 2023-08-02 | BSH Hausgeräte GmbH | Dryer with improved air tigthness of a process air circuit and process for operating the dryer |
EP4219822A1 (en) | 2022-01-26 | 2023-08-02 | BSH Hausgeräte GmbH | Dryer with high air tigthness of a process air circuit and process for operating the dryer |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6350041B1 (en) | 1999-12-03 | 2002-02-26 | Cree Lighting Company | High output radial dispersing lamp using a solid state light source |
US6746885B2 (en) | 2001-08-24 | 2004-06-08 | Densen Cao | Method for making a semiconductor light source |
US6465961B1 (en) | 2001-08-24 | 2002-10-15 | Cao Group, Inc. | Semiconductor light source using a heat sink with a plurality of panels |
US7224001B2 (en) | 2001-08-24 | 2007-05-29 | Densen Cao | Semiconductor light source |
US6634770B2 (en) | 2001-08-24 | 2003-10-21 | Densen Cao | Light source using semiconductor devices mounted on a heat sink |
US7497596B2 (en) | 2001-12-29 | 2009-03-03 | Mane Lou | LED and LED lamp |
US6982518B2 (en) | 2003-10-01 | 2006-01-03 | Enertron, Inc. | Methods and apparatus for an LED light |
JP2005166578A (ja) | 2003-12-05 | 2005-06-23 | Hamai Denkyu Kogyo Kk | 電球形ledランプ |
US7086756B2 (en) | 2004-03-18 | 2006-08-08 | Lighting Science Group Corporation | Lighting element using electronically activated light emitting elements and method of making same |
ES2288394B1 (es) * | 2006-02-24 | 2008-11-16 | Vitri Electro-Metalurgica, S.A.U. | Lampara dotada de medios disipadores de calor. |
US7549782B2 (en) | 2006-05-11 | 2009-06-23 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Semiconductor light source configured as a light tube |
KR101317429B1 (ko) * | 2007-01-31 | 2013-10-10 | 잘만테크 주식회사 | 히트파이프를 이용한 냉각장치를 구비한 led조명 조립체 |
WO2008134056A1 (en) | 2007-04-26 | 2008-11-06 | Deak-Lam Inc. | Photon energy coversion structure |
US7622795B2 (en) | 2007-05-15 | 2009-11-24 | Nichepac Technology Inc. | Light emitting diode package |
US7758214B2 (en) | 2007-07-12 | 2010-07-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | LED lamp |
TW200911808A (en) | 2007-07-23 | 2009-03-16 | Astrazeneca Ab | Novel compounds |
CN201116714Y (zh) * | 2007-11-16 | 2008-09-17 | 天台县海威机电有限公司 | 一种led灯泡的散热装置 |
CN101576205B (zh) * | 2008-05-09 | 2011-01-12 | 范金晶 | 用于替代反光杯形卤素灯泡的led灯泡 |
US20090296387A1 (en) | 2008-05-27 | 2009-12-03 | Sea Gull Lighting Products, Llc | Led retrofit light engine |
US8013501B2 (en) | 2008-06-04 | 2011-09-06 | Forever Bulb, Llc | LED-based light bulb device |
KR20100009909A (ko) | 2008-07-21 | 2010-01-29 | 삼성에스디아이 주식회사 | 플라즈마 표시 장치 및 그 구동 방법 |
CN201246616Y (zh) | 2008-08-19 | 2009-05-27 | 鑫谷光电股份有限公司 | 一种新型大功率led烛型灯 |
CN101363610A (zh) | 2008-09-08 | 2009-02-11 | 广州南科集成电子有限公司 | Led灯泡 |
JP2010073438A (ja) | 2008-09-17 | 2010-04-02 | Panasonic Corp | ランプ |
KR101039073B1 (ko) * | 2008-10-01 | 2011-06-08 | 주식회사 아모럭스 | 방열장치 및 이를 이용한 전구형 led 조명장치 |
KR101007913B1 (ko) * | 2008-10-01 | 2011-01-14 | 주식회사 아모럭스 | 나선형 방열장치 및 이를 이용한 전구형 led 조명장치 |
JP2010108768A (ja) * | 2008-10-30 | 2010-05-13 | Sharp Corp | 光源ユニット及び照明装置 |
JP5152698B2 (ja) * | 2008-11-21 | 2013-02-27 | 東芝ライテック株式会社 | 発光素子ランプ及び照明装置 |
KR20110117090A (ko) | 2009-02-17 | 2011-10-26 | 카오 그룹, 인코포레이티드 | 공간 조명을 위한 led 광 전구 |
KR100951781B1 (ko) | 2009-04-06 | 2010-04-15 | 화우테크놀러지 주식회사 | 엘이디 투광등 |
CN201391774Y (zh) * | 2009-04-10 | 2010-01-27 | 鑫谷光电股份有限公司 | 由多面体大功率led构成的照明灯 |
KR101017349B1 (ko) | 2009-12-03 | 2011-02-28 | 테크룩스 주식회사 | 벌브타입의 엘이디램프 |
US8227961B2 (en) | 2010-06-04 | 2012-07-24 | Cree, Inc. | Lighting device with reverse tapered heatsink |
US8575836B2 (en) | 2010-06-08 | 2013-11-05 | Cree, Inc. | Lighting devices with differential light transmission regions |
US8596821B2 (en) | 2010-06-08 | 2013-12-03 | Cree, Inc. | LED light bulbs |
RU115549U1 (ru) * | 2011-11-10 | 2012-04-27 | Сергей Валентинович Кожевников | Радиатор отвода тепла (варианты) |
-
2010
- 2010-06-04 US US12/794,559 patent/US8227961B2/en active Active
-
2011
- 2011-06-03 JP JP2013513380A patent/JP5539588B2/ja not_active Expired - Fee Related
- 2011-06-03 KR KR1020127003774A patent/KR101267455B1/ko active IP Right Grant
- 2011-06-03 WO PCT/US2011/039105 patent/WO2011153456A1/en active Application Filing
- 2011-06-03 RU RU2012103752/07A patent/RU2527555C2/ru active
- 2011-06-03 BR BR112012002865A patent/BR112012002865A2/pt not_active Application Discontinuation
- 2011-06-03 CN CN201180004124.1A patent/CN102686943B/zh active Active
- 2011-06-03 EP EP12152917.6A patent/EP2450615B1/en active Active
- 2011-06-03 EP EP11790482.1A patent/EP2446186B1/en active Active
-
2012
- 2012-07-03 US US13/541,651 patent/US8779653B2/en active Active
-
2013
- 2013-05-21 US US13/898,986 patent/US8552626B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20130257260A1 (en) | 2013-10-03 |
US8552626B1 (en) | 2013-10-08 |
CN102686943A (zh) | 2012-09-19 |
WO2011153456A1 (en) | 2011-12-08 |
JP2013527589A (ja) | 2013-06-27 |
CN102686943B (zh) | 2015-03-25 |
EP2446186A4 (en) | 2012-05-02 |
KR101267455B1 (ko) | 2013-06-04 |
US8779653B2 (en) | 2014-07-15 |
EP2450615B1 (en) | 2015-02-25 |
BR112012002865A2 (pt) | 2016-03-22 |
RU2527555C2 (ru) | 2014-09-10 |
US20110298350A1 (en) | 2011-12-08 |
US8227961B2 (en) | 2012-07-24 |
RU2012103752A (ru) | 2013-11-10 |
EP2446186B1 (en) | 2015-07-22 |
KR20120025016A (ko) | 2012-03-14 |
EP2450615A1 (en) | 2012-05-09 |
US20120280267A1 (en) | 2012-11-08 |
EP2446186A1 (en) | 2012-05-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5539588B2 (ja) | 逆テーパ付きヒートシンクを有する照明デバイス | |
US10557594B2 (en) | Solid-state lamps utilizing photoluminescence wavelength conversion components | |
US9648673B2 (en) | Lighting device with spatially segregated primary and secondary emitters | |
US9217544B2 (en) | LED based pedestal-type lighting structure | |
US8491140B2 (en) | Lighting device with multiple emitters and remote lumiphor | |
US8749131B2 (en) | Lamp using solid state source and doped semiconductor nanophosphor | |
US8794793B2 (en) | Solid state lighting device with elongated heatsink | |
US20130094177A1 (en) | Wavelength conversion component with improved thermal conductive characteristics for remote wavelength conversion | |
CN103180659A (zh) | Led灯 | |
KR102125887B1 (ko) | 발광 장치 및 램프 | |
JP3112794U (ja) | 発光ダイオードランプ用放熱装置 | |
US10578294B2 (en) | Reflector lamp with improved heat dissipation and reduced weight | |
TW201721053A (zh) | 燈殼整合型發光二極體及其製作方法 | |
KR20120019264A (ko) | 엘이디 등기구 구조체 | |
US20140016316A1 (en) | Illuminant device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130410 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130410 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20131126 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140221 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140401 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5539588 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140430 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |