JP5533431B2 - 光モジュール - Google Patents
光モジュール Download PDFInfo
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- JP5533431B2 JP5533431B2 JP2010186148A JP2010186148A JP5533431B2 JP 5533431 B2 JP5533431 B2 JP 5533431B2 JP 2010186148 A JP2010186148 A JP 2010186148A JP 2010186148 A JP2010186148 A JP 2010186148A JP 5533431 B2 JP5533431 B2 JP 5533431B2
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- 230000003287 optical effect Effects 0.000 title claims description 54
- 230000017525 heat dissipation Effects 0.000 claims description 24
- 230000008878 coupling Effects 0.000 claims description 22
- 238000010168 coupling process Methods 0.000 claims description 22
- 238000005859 coupling reaction Methods 0.000 claims description 22
- 239000000919 ceramic Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 230000005855 radiation Effects 0.000 description 19
- 238000012546 transfer Methods 0.000 description 10
- 239000013307 optical fiber Substances 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4283—Electrical aspects with electrical insulation means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
なお、セラミックパッケージの背面に電子冷却器を搭載して、発熱素子の温度調節を行うようにする。
この構成により、パッケージ部22内で発生する熱は、放熱板16を伝熱媒体として放熱カバー11に伝熱され、外部に放熱することができる。
なお、例えば、放熱板に用いるアルミ板の熱伝導率は236(W/m・K)、銅板の熱伝導率は398(W/m・K)、亜鉛板の熱伝導率は98(W/m・K)で、樹脂材と比べて圧倒的に熱伝導率がよい。
この他、支持部片17の他方の脚片17aの側部側には、放熱部片19と反対の側の下部カバーに接触する放熱部片19’が、弾性を付与するための屈曲部19’aを介して形成されていてもよい。
この結果、一体形成された単一の放熱板16により、互いに直交する関係にあるパッケージ背面の放熱面部25と放熱カバー11の放熱接触面11bとを、熱的に良好な伝熱路を形成することができる。
Claims (3)
- 光電変換素子が実装された光サブアセンブリ、電気信号の授受を行う電子部品群が実装されている回路基板を、放熱カバーにより覆った光モジュールであって、
少なくとも発光素子が実装される光サブアセンブリがセラミックパッケージで形成され、前記セラミックパッケージの背面の放熱面が前記放熱カバーの放熱接触面と直交するように配され、前記放熱面と前記放熱接触面とは弾性と熱伝導性を有する金属板からなる放熱板により熱的に結合され、
前記放熱板は、前記セラミックパッケージの前面側に係合される支持部片と、該支持部片からU字状に曲げられて前記セラミックパッケージの背面の放熱面に弾性的に接触する熱結合部片と、前記支持部片に側縁側から前記熱結合部片と直交する方向に延びて前記放熱カバーの放熱接触面に弾性的に接触する放熱部片を備えていることを特徴とする光モジュール。 - 前記放熱板は、下部カバーにも弾性的に接触する放熱部片を備えていることを特徴とする請求項1に記載の光モジュール。
- 前記セラミックパッケージの背面に電子冷却器が搭載されていることを特徴とする請求項1または2に記載の光モジュール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010186148A JP5533431B2 (ja) | 2010-08-23 | 2010-08-23 | 光モジュール |
US13/211,709 US8469609B2 (en) | 2010-08-23 | 2011-08-17 | Optical transceiver having effective heat dissipating path from OSA to cover |
CN201110243493.8A CN102375187B (zh) | 2010-08-23 | 2011-08-23 | 具有从osa到盖的有效散热路径的光收发器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010186148A JP5533431B2 (ja) | 2010-08-23 | 2010-08-23 | 光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012044095A JP2012044095A (ja) | 2012-03-01 |
JP5533431B2 true JP5533431B2 (ja) | 2014-06-25 |
Family
ID=45594143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010186148A Active JP5533431B2 (ja) | 2010-08-23 | 2010-08-23 | 光モジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US8469609B2 (ja) |
JP (1) | JP5533431B2 (ja) |
CN (1) | CN102375187B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102438426B (zh) * | 2010-08-20 | 2016-08-24 | 住友电气工业株式会社 | 具有从tosa到金属壳体的有效传热路径的光收发器 |
JP5939041B2 (ja) * | 2012-06-01 | 2016-06-22 | 住友電気工業株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |
CN103257413B (zh) * | 2013-05-07 | 2015-02-25 | 苏州旭创科技有限公司 | 一种微型串行scsi宽带高速传输的并行光收发组件 |
CN104661487B (zh) * | 2013-11-20 | 2017-06-20 | 华为技术有限公司 | 光模块散热结构及电子产品 |
CN104793300A (zh) * | 2015-04-30 | 2015-07-22 | 东南大学 | 一种具有内部散热通道的光模块组件级复合散热结构 |
CN105431006B (zh) * | 2015-11-27 | 2019-01-22 | 武汉光迅科技股份有限公司 | 一种低成本的光电模块 |
US10164362B2 (en) * | 2015-12-31 | 2018-12-25 | Foxconn Interconnect Technology Limited | Plug connecetor with a metallic enclosure having heat sink member thereon |
JP7153507B2 (ja) * | 2018-08-30 | 2022-10-14 | 日本ルメンタム株式会社 | 光サブアセンブリ及び光モジュール |
JP7192343B2 (ja) * | 2018-09-20 | 2022-12-20 | 住友電気工業株式会社 | 光トランシーバ |
JP7426843B2 (ja) * | 2020-02-12 | 2024-02-02 | 古河電気工業株式会社 | 光学装置 |
JP2022077866A (ja) * | 2020-11-12 | 2022-05-24 | 住友電気工業株式会社 | 光トランシーバ |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0249155U (ja) * | 1988-09-30 | 1990-04-05 | ||
SE522857C2 (sv) * | 2001-11-23 | 2004-03-09 | Optillion Ab | Värmestyrd optoelektrisk enhet |
JP3922152B2 (ja) | 2002-09-27 | 2007-05-30 | 住友電気工業株式会社 | 光モジュール |
JP3861864B2 (ja) * | 2002-10-10 | 2006-12-27 | 住友電気工業株式会社 | 光モジュール |
JP4134695B2 (ja) * | 2002-11-21 | 2008-08-20 | 住友電気工業株式会社 | 光モジュール |
US7359641B2 (en) * | 2003-07-28 | 2008-04-15 | Emcore Corporation | Modular optical transceiver |
US7365923B2 (en) * | 2004-01-26 | 2008-04-29 | Jds Uniphase Corporation | Heat sink tab for optical sub-assembly |
US7350979B2 (en) * | 2004-02-13 | 2008-04-01 | Sumitomo Electric Industries, Ltd. | Optical transceiver having an optical receptacle optionally fixed to a frame |
JP3909853B2 (ja) * | 2004-04-26 | 2007-04-25 | 株式会社東芝 | 半導体レーザ装置及び半導体レーザ組立体 |
JP4525478B2 (ja) * | 2004-06-16 | 2010-08-18 | 住友電気工業株式会社 | 放熱フィンを備えた光サブアセンブリ |
US7280724B2 (en) * | 2004-06-16 | 2007-10-09 | Sumitomo Electric Industries, Ltd. | Optical subassembly and optical transceiver installing the same |
GB2428134A (en) * | 2005-07-07 | 2007-01-17 | Agilent Technologies Inc | Optical transceiver with heat sink |
JP2007141317A (ja) * | 2005-11-16 | 2007-06-07 | Sharp Corp | 光集積ユニット、光ピックアップ装置およびセラミック基板 |
-
2010
- 2010-08-23 JP JP2010186148A patent/JP5533431B2/ja active Active
-
2011
- 2011-08-17 US US13/211,709 patent/US8469609B2/en active Active
- 2011-08-23 CN CN201110243493.8A patent/CN102375187B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012044095A (ja) | 2012-03-01 |
US20120045181A1 (en) | 2012-02-23 |
CN102375187B (zh) | 2015-06-10 |
US8469609B2 (en) | 2013-06-25 |
CN102375187A (zh) | 2012-03-14 |
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