JP5528202B2 - 支持トレイ - Google Patents
支持トレイ Download PDFInfo
- Publication number
- JP5528202B2 JP5528202B2 JP2010109247A JP2010109247A JP5528202B2 JP 5528202 B2 JP5528202 B2 JP 5528202B2 JP 2010109247 A JP2010109247 A JP 2010109247A JP 2010109247 A JP2010109247 A JP 2010109247A JP 5528202 B2 JP5528202 B2 JP 5528202B2
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- support tray
- wafer
- circular
- support substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000227 grinding Methods 0.000 claims description 62
- 239000000758 substrate Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 235000012431 wafers Nutrition 0.000 description 45
- 238000005498 polishing Methods 0.000 description 18
- 229910052594 sapphire Inorganic materials 0.000 description 18
- 239000010980 sapphire Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Images
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
4 円形支持基板
6 円形凹部
12 研削手段(研削ユニット)
18 研削ホイール
24 第1の円板
26 貫通穴
28 第2の円板
32 研削手段(研削ユニット)
38 研削ホイール
46 研磨手段(研磨ユニット)
52 研磨パッド
Claims (1)
- 円形支持基板の上面に形成された互いに離間した複数の円形凹部を有する支持トレイの製造方法であって、
研削装置のチャックテーブルで円形支持基板を吸引保持する保持ステップと、
該チャックテーブルに保持された円形支持基板の表面に研削手段を当接させて該チャックテーブルと該研削手段とを摺動しつつ該研削手段を研削送りすることで、該円形支持基板より小径の円形凹部を形成する研削ステップとを具備し、
該円形支持基板を吸引保持したチャックテーブルを所定角度回転してから、該円形支持基板上面の異なる位置にて該研削ステップを繰り返すことで、該円形支持基板上に複数の円形凹部を形成することを特徴とする支持トレイの製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010109247A JP5528202B2 (ja) | 2010-05-11 | 2010-05-11 | 支持トレイ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010109247A JP5528202B2 (ja) | 2010-05-11 | 2010-05-11 | 支持トレイ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011235399A JP2011235399A (ja) | 2011-11-24 |
JP5528202B2 true JP5528202B2 (ja) | 2014-06-25 |
Family
ID=45323940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010109247A Active JP5528202B2 (ja) | 2010-05-11 | 2010-05-11 | 支持トレイ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5528202B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014004663A (ja) * | 2012-06-26 | 2014-01-16 | Disco Abrasive Syst Ltd | 被加工物の加工方法 |
JP6267927B2 (ja) * | 2013-10-29 | 2018-01-24 | 株式会社ディスコ | 研削装置 |
JP6345981B2 (ja) * | 2014-05-15 | 2018-06-20 | 株式会社ディスコ | 支持治具 |
JP6105689B2 (ja) * | 2015-08-11 | 2017-03-29 | 有限会社サクセス | 半導体ウエハ保持具、半導体ウエハ研削装置、及び、半導体ウエハ研削方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005032896A (ja) * | 2003-07-10 | 2005-02-03 | Hitachi Cable Ltd | 両面研磨機用半導体ウェハキャリア |
JP4992306B2 (ja) * | 2006-06-12 | 2012-08-08 | セイコーエプソン株式会社 | ワークキャリアとその製造方法及び両面研磨機 |
-
2010
- 2010-05-11 JP JP2010109247A patent/JP5528202B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2011235399A (ja) | 2011-11-24 |
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