JP5511290B2 - Light emitting device - Google Patents

Light emitting device Download PDF

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JP5511290B2
JP5511290B2 JP2009228763A JP2009228763A JP5511290B2 JP 5511290 B2 JP5511290 B2 JP 5511290B2 JP 2009228763 A JP2009228763 A JP 2009228763A JP 2009228763 A JP2009228763 A JP 2009228763A JP 5511290 B2 JP5511290 B2 JP 5511290B2
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substrate
light emitting
light
heat
case member
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JP2011076946A (en
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智也 田淵
真吾 松浦
常幸 平林
将三 豊久
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Kyocera Corp
Kilt Planning Office Inc
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Kyocera Corp
Kilt Planning Office Inc
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本発明は、発光ダイオード等の発光素子を用いた発光装置に関するものである。   The present invention relates to a light emitting device using a light emitting element such as a light emitting diode.

近年、発光ダイオード(ＬＥＤ：Light Emitting Diode)等の発光素子を基板に実装し、この発光素子を光源として用いた発光装置が種々実用化され、照明器具等に利用されている。このような発光装置としては、例えば特許文献１に示すものが知られている。この発光装置は、開口部を有するケース部材と、ケース部材内部に収容される基板と、この基板に実装される発光ダイオードとを備え、発光ダイオードから出射される光を開口部から外部に放射するように構成されたものである。   In recent years, various light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) mounted on a substrate and using the light-emitting elements as light sources have been put to practical use and used in lighting fixtures and the like. As such a light emitting device, for example, the one disclosed in Patent Document 1 is known. The light emitting device includes a case member having an opening, a substrate housed in the case member, and a light emitting diode mounted on the substrate, and radiates light emitted from the light emitting diode to the outside through the opening. It is comprised as follows.

特開２００９−１５８１４４号公報JP 2009-158144 A

上記のような発光装置では、発光ダイオードを実装した基板は、ケース部材内部において基板保持部材によって固定されている。ここで、基板と基板保持部材とが異なる部材で構成されている場合、両部材の線膨張率は異なる。このため、発光ダイオードの発熱に伴う基板保持部材の膨張に応じて、基板に対して保持部材からの応力が作用し、この応力により基板に撓みが生じる。基板が撓むと、基板に実装された発光ダイオードの光の出射方向が変化する。発光ダイオードから出射される光は指向性が強いため、このように光の出射方向が変化した場合には所望の配光が得られなくなるという問題がある。   In the light emitting device as described above, the substrate on which the light emitting diode is mounted is fixed inside the case member by the substrate holding member. Here, when the substrate and the substrate holding member are made of different members, the linear expansion coefficients of the two members are different. For this reason, the stress from the holding member acts on the substrate in accordance with the expansion of the substrate holding member accompanying the heat generation of the light emitting diode, and the substrate bends due to the stress. When the substrate bends, the light emitting direction of the light emitting diode mounted on the substrate changes. Since the light emitted from the light emitting diode has a strong directivity, there is a problem that a desired light distribution cannot be obtained when the light emission direction changes in this way.

本発明は、上記に鑑みてなされたものであって、発光素子の光の出射方向の変化を抑制することのできる発光装置を提供することを目的とする。   The present invention has been made in view of the above, and an object of the present invention is to provide a light emitting device capable of suppressing a change in the light emitting direction of a light emitting element.

上述した課題を解決し、目的を達成するために、本発明に係る発光装置は、開口部を有するケース部材と、前記ケース部材内部に収容される基板と、前記基板に実装される発光ランプと、前記ケース部材内部において前記基板を保持する保持部材とを有し、前記発光ランプから出射される光を前記開口部から外部に放出するように構成された発光装置において、前記保持部材は、熱伝導性を有する材料から構成されるとともに、その一端部が前記基板の発光素子実装面と反対側の面であって平面透過して前記発光ランプと重なる領域に接続されるとともに、他端部が前記ケース部材に接続される熱伝導部を備えることを特徴とする。   In order to solve the above-described problems and achieve the object, a light-emitting device according to the present invention includes a case member having an opening, a substrate accommodated in the case member, and a light-emitting lamp mounted on the substrate. A light-emitting device configured to emit light emitted from the light-emitting lamp to the outside through the opening. It is composed of a material having conductivity, and one end portion thereof is a surface opposite to the light emitting element mounting surface of the substrate and is transmitted through a plane and connected to a region overlapping the light emitting lamp, and the other end portion is A heat conduction part connected to the case member is provided.

本発明の好ましい態様としては、前記保持部材は、前記基板の両端部にそれぞれ接続される一対の基板接続部を備えており、前記一対の基板接続部の一方が、前記熱伝導部の他端部と接続されていることが望ましい。   As a preferred aspect of the present invention, the holding member includes a pair of substrate connection portions respectively connected to both end portions of the substrate, and one of the pair of substrate connection portions is the other end of the heat conducting portion. It is desirable to be connected to the part.

本発明の好ましい態様としては、前記基板が矩形状を成し前記基板の長手方向に沿って複数の前記発光ランプが線状に配列して実装され、前記基板において線状に配列された前記発光ランプを挟んで対向する両端部が、前記保持部材の一対の基板接続部に接続されていることが望ましい。   In a preferred aspect of the present invention, the substrate has a rectangular shape, and a plurality of the light-emitting lamps are arranged in a line along the longitudinal direction of the substrate, and the light emission is arranged in a line on the substrate. It is desirable that both end portions facing each other with the lamp interposed therebetween are connected to a pair of substrate connecting portions of the holding member.

本発明の好ましい態様としては、前記熱伝導部にヒートシンクが設けられていることが望ましい。   As a preferred aspect of the present invention, it is desirable that a heat sink is provided in the heat conducting portion.

本発明に係る発光装置によれば、発光素子の光の出射方向の変化を抑制することができる。   According to the light emitting device of the present invention, it is possible to suppress a change in the light emission direction of the light emitting element.

図１は、実施の形態１の発光装置を適用した照明器具の平面図である。FIG. 1 is a plan view of a lighting fixture to which the light-emitting device of Embodiment 1 is applied. 図２は、図１に示した照明器具のＡ−Ａ線断面図である。FIG. 2 is a cross-sectional view taken along line AA of the lighting apparatus illustrated in FIG. 図３は、図１に示した照明器具の一部を破断して示した斜視図である。3 is a perspective view showing a part of the lighting apparatus shown in FIG. 図４は、図１に示した照明器具における発光ランプの断面図である。4 is a cross-sectional view of a light-emitting lamp in the lighting fixture shown in FIG. 図５は、図２及び図３に示した照明器具における熱伝導部の形状の一例を示す斜視図である。FIG. 5 is a perspective view showing an example of the shape of the heat conducting portion in the lighting fixture shown in FIGS. 2 and 3. 図６は、実施の形態２の発光装置を適用した照明器具の断面図である。FIG. 6 is a cross-sectional view of a lighting fixture to which the light-emitting device of Embodiment 2 is applied.

以下、本発明につき図面を参照しつつ詳細に説明する。なお、以下の説明により本発明が限定されるものではない。また、以下の説明における構成要素には、当業者が容易に想定できるもの、実質的に同一のもの、いわゆる均等の範囲のものが含まれる。以下では、本発明の発光装置を照明器具に適用した例について説明するが、本発明の適用対象は照明器具に限定されない。例えば、表示装置や液晶パネルのバックライト等に対しても本発明の発光装置を適用することができる。   Hereinafter, the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following description. In addition, constituent elements in the following description include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Below, although the example which applied the light-emitting device of this invention to the lighting fixture is demonstrated, the application object of this invention is not limited to a lighting fixture. For example, the light emitting device of the present invention can be applied to a display device, a backlight of a liquid crystal panel, and the like.

（実施の形態１）
図１は、実施の形態１の発光装置を適用した照明器具の平面図であり、（ａ）は光出射面側から見た平面図、（ｂ）は天井等への取付面側から見た平面図である。また、図２は、図１に示した照明器具のＡ−Ａ線断面図であり、図３は、図１及び図２に示した照明器具の一部を破断させて内部構造を露出させた斜視図である。ここで、図３では、図１に示される反射部材連結板２３ａが省略されている。 (Embodiment 1)
1A and 1B are plan views of a lighting fixture to which the light-emitting device of Embodiment 1 is applied. FIG. 1A is a plan view seen from a light emitting surface side, and FIG. It is a top view. 2 is a cross-sectional view taken along the line AA of the lighting fixture shown in FIG. 1, and FIG. 3 is a partial cutaway view of the lighting fixture shown in FIGS. 1 and 2 to expose the internal structure. It is a perspective view. Here, in FIG. 3, the reflecting member connecting plate 23a shown in FIG. 1 is omitted.

図１〜図３に例示される照明器具１０は、長尺のケース部材１１の内部に複数の光源が直線状に配置された構成を有している。照明器具１０は、例えばケース部材１１の取付壁１２を図示しない天井や壁等に直接取り付けるか、あるいは、天井等から吊下げて使用するものであり、線状光源から出射される光によって室内等を照明するものである。以下では、照明器具１０において、取付壁１２側を「上」、光出射側を「下」として説明する。この照明器具１０は、ケース部材１１と、ケース部材１１に取り付けられるカバー部材１３と、ケース部材１１の内部に収容される発光モジュール２０と、ケース部材１１の内部で発光モジュール２０を保持する保持部材３０とを備えている。   The lighting fixture 10 illustrated in FIGS. 1 to 3 has a configuration in which a plurality of light sources are linearly arranged inside a long case member 11. The luminaire 10 is used, for example, by directly attaching the mounting wall 12 of the case member 11 to a ceiling or wall (not shown), or by hanging from the ceiling or the like, and is used indoors by light emitted from a linear light source. Is used for lighting. Below, in the lighting fixture 10, the attachment wall 12 side is demonstrated as "upper", and the light-projection side is demonstrated as "lower". The lighting fixture 10 includes a case member 11, a cover member 13 attached to the case member 11, a light emitting module 20 accommodated inside the case member 11, and a holding member that holds the light emitting module 20 inside the case member 11. 30.

ケース部材１１は、金属等の熱の良導体から構成された略直方体形状の長尺の筐体である。ケース部材１１において取付壁１２に対向する壁１４には、図１及び図２に示すように、ケース部材１１の長手方向に延在する態様で開口部１５が形成されている。また、図２に示すように、ケース部材１１の側壁１６ａ，１６ｂには、複数の通気孔１７が設けられている。かかる通気孔１７は、後述する発光素子２２ｃが発する熱を外部に向かって放散するためのものである。   The case member 11 is a long casing having a substantially rectangular parallelepiped shape made of a heat good conductor such as metal. As shown in FIGS. 1 and 2, an opening 15 is formed in the case member 11 so as to extend in the longitudinal direction of the case member 11, as shown in FIGS. 1 and 2. Further, as shown in FIG. 2, a plurality of vent holes 17 are provided in the side walls 16 a and 16 b of the case member 11. The vent hole 17 is for radiating heat generated by the light emitting element 22c described later toward the outside.

カバー部材１３は、例えば樹脂やガラス等、透光性を有した材料から構成される板材であり、ケース部材１１の開口部１５に取り付けられるものである。なお、カバー部材１３の透光性とは、発光素子２２ｃから出射された光の少なくとも一部の波長が透過できることをいう。   The cover member 13 is a plate material made of a translucent material such as resin or glass, and is attached to the opening 15 of the case member 11. The translucency of the cover member 13 means that at least a part of the wavelength of the light emitted from the light emitting element 22c can be transmitted.

発光モジュール２０は、基板２１と、基板２１の一方の面に実装される複数の発光ランプ２２と、各発光ランプ２２の周囲に配置される複数の反射部材２３とで構成してある。なお、反射部材２３は、発光ランプ２２が発する光をカバー部材１３に向かって反射するものである。   The light emitting module 20 includes a substrate 21, a plurality of light emitting lamps 22 mounted on one surface of the substrate 21, and a plurality of reflecting members 23 arranged around each light emitting lamp 22. The reflecting member 23 reflects light emitted from the light emitting lamp 22 toward the cover member 13.

基板２１は、例えば矩形状を成し、その長手方向寸法がケース部材１１の開口部１５とほぼ同じ長さを有した長尺の板材である。基板２１としては、樹脂からなるプリント配線基板、あるいは、アルミ基板が用いられる。基板２１の一方の面には、複数の発光ランプ２２が等間隔に実装されている。また発光ランプ２２が実装される面２４（以下、これを「発光ランプ実装面２４」とよぶ）と反対側の面２５（以下、これを「裏面２５」とよぶ）には、コネクタ２６等の電子部品が実装されている。また、基板２１の短手方向の両端部２７，２７には、後述する保持部材３０を取り付けるためのネジ孔２８が複数箇所設けられている。   The substrate 21 is a long plate material having a rectangular shape, for example, and having a length in the longitudinal direction substantially the same as the opening 15 of the case member 11. As the substrate 21, a printed wiring board made of resin or an aluminum substrate is used. A plurality of light-emitting lamps 22 are mounted on one surface of the substrate 21 at equal intervals. A surface 25 (hereinafter referred to as “back surface 25”) opposite to the surface 24 on which the light emitting lamp 22 is mounted (hereinafter referred to as “light emitting lamp mounting surface 24”) is provided with a connector 26 and the like. Electronic components are mounted. Further, a plurality of screw holes 28 for attaching a holding member 30 to be described later are provided at both ends 27 of the short side direction of the substrate 21.

複数の発光ランプ２２は、例えば白色の可視光を放射するものであり、基板２１の長手方向に沿って、かつ、基板の中心線上に等間隔に直線状に並列して配置されている。図４は、発光ランプ２２の断面図である。発光ランプ２２は、図４に示すように、基体２２ａと、基体２２ａ上に設けられたフレーム部材２２ｂと、基体２２ａ上に実装された発光素子２２ｃと、フレーム部材２２ｂの内側に設けられた封入部材２２ｄと、フレーム部材２２ｂの上端部に設けられた波長変換部材２２ｅとを有している。   The plurality of light-emitting lamps 22 emit, for example, white visible light, and are arranged in parallel along the longitudinal direction of the substrate 21 and in a straight line at equal intervals on the center line of the substrate. FIG. 4 is a cross-sectional view of the light emitting lamp 22. As shown in FIG. 4, the light-emitting lamp 22 includes a base 22a, a frame member 22b provided on the base 22a, a light-emitting element 22c mounted on the base 22a, and an enclosure provided inside the frame member 22b. It has the member 22d and the wavelength conversion member 22e provided in the upper end part of the frame member 22b.

基体２２ａ及びフレーム部材２２ｂはセラミックス等から構成されている。発光素子２２ｃは、例えば、発光ダイオード(ＬＥＤ：Light Emitting Diode)等の半導体素子であり、発光色が紫色、青色のＬＥＤ素子、もしくはＬＥＤチップ等が用いられる。発光素子２２ｃは、配線を通して電源に接続され、電源から供給される電力に応じて第１次光を放射する。封入部材２２ｄは、発光素子２２ｃの上端及び側面を囲むものであり、透光性材料を含んでいる。封入部材２２ｄの透光性とは、発光素子２２ｃから放射される光の少なくとも一部の波長が透過できることをいう。封入部材２２ｄの透光性材料は例えばシリコーン樹脂である。波長変換部材２２ｅは、透光性材料からなるマトリクス部材と、蛍光材料からなる複数の蛍光粒子を含んでいる。マトリクス部材の透光性とは、発光素子２２ｃから放射された光の少なくとも一部の波長と、複数の蛍光粒子から放射された光の少なくとも一部の波長が透過できることをいう。透光性材料は、例えばシリコーン樹脂である。複数の蛍光粒子は、発光素子２２ｃから放射された第１次光によって励起されて、波長が第１次光と異なる波長の第２次光を放射する。   The base 22a and the frame member 22b are made of ceramics or the like. The light emitting element 22c is, for example, a semiconductor element such as a light emitting diode (LED), and a purple or blue LED element or LED chip is used as the light emission color. The light emitting element 22c is connected to a power source through wiring, and emits primary light according to the power supplied from the power source. The enclosing member 22d surrounds the upper end and the side surface of the light emitting element 22c, and includes a translucent material. The translucency of the encapsulating member 22d means that at least part of the wavelength of light emitted from the light emitting element 22c can be transmitted. The translucent material of the enclosing member 22d is, for example, a silicone resin. The wavelength conversion member 22e includes a matrix member made of a translucent material and a plurality of fluorescent particles made of a fluorescent material. The translucency of the matrix member means that at least some wavelengths of light emitted from the light emitting element 22c and at least some wavelengths of light emitted from a plurality of fluorescent particles can be transmitted. The translucent material is, for example, a silicone resin. The plurality of fluorescent particles are excited by the primary light emitted from the light emitting element 22c, and emit secondary light having a wavelength different from that of the primary light.

反射部材２３は、発光ランプ２２から出射された光を反射させるものであり、例えば金属等の熱の良導体から構成されている。反射部材２３は、各発光ランプ２２を取り囲む態様で配置され、その基端部分が基板２１の発光ランプ実装面２４に取り付けられている。また、図２及び図３では図示を省略したが、複数の反射部材２３は、それぞれの先端部分が図１に示すように反射部材連結板２３ａによって連結されており、この反射部材連結板２３ａによりケース部材１１の内部が外部から見えないように構成されている。   The reflecting member 23 reflects the light emitted from the light emitting lamp 22 and is made of a good heat conductor such as metal. The reflection member 23 is disposed in a manner surrounding each light emitting lamp 22, and a base end portion thereof is attached to the light emitting lamp mounting surface 24 of the substrate 21. Although not shown in FIGS. 2 and 3, the plurality of reflecting members 23 are connected at their tip portions by a reflecting member connecting plate 23a as shown in FIG. The inside of the case member 11 is configured not to be visible from the outside.

上記のように構成される発光モジュール２０は、発光ランプ２２から出射された光を反射部材２３の光反射面２３ｂで反射させる。反射した光は、ケース部材１１の開口部１５に取り付けられたカバー部材１３を透過し、室内等を照明する。   The light emitting module 20 configured as described above reflects the light emitted from the light emitting lamp 22 by the light reflecting surface 23 b of the reflecting member 23. The reflected light passes through the cover member 13 attached to the opening 15 of the case member 11 and illuminates the interior of the room.

保持部材３０は、ケース部材１１の内部において上述した発光モジュール２０を保持するものである。この保持部材３０は、アルミニウム等の金属などの熱の良導体から構成されており、発光モジュール２０を保持する機能に加えて、発光ランプ２２から発生する熱を基板２１から受け取りケース部材１１に放熱する機能を兼ね備えている。保持部材３０は、第１保持部材３０Ａ及び第２保持部材３０Ｂとから構成されている。第１保持部材３０Ａ及び第２保持部材３０Ｂは、図２及び図３に示すように、その長手方向寸法が基板２１の長手方向寸法とほぼ同じ長さに形成されたものであり、基板２１の長手方向に沿って基板２１の両側に配置されている。第１保持部材３０Ａ及び第２保持部材３０Ｂは、それぞれケース部材接続部３１と、基板接続部３２と、介在部３３とをそれぞれ有している。さらに第１保持部材３０Ａは、熱伝導部３５を有している。   The holding member 30 holds the light emitting module 20 described above inside the case member 11. The holding member 30 is composed of a good heat conductor such as a metal such as aluminum, and in addition to the function of holding the light emitting module 20, receives heat generated from the light emitting lamp 22 from the substrate 21 and dissipates it to the case member 11. It has a function. The holding member 30 includes a first holding member 30A and a second holding member 30B. As shown in FIGS. 2 and 3, the first holding member 30 </ b> A and the second holding member 30 </ b> B are formed so that the longitudinal dimension thereof is substantially the same as the longitudinal dimension of the substrate 21. It is arranged on both sides of the substrate 21 along the longitudinal direction. The first holding member 30 </ b> A and the second holding member 30 </ b> B each have a case member connecting part 31, a board connecting part 32, and an interposition part 33. Further, the first holding member 30 </ b> A has a heat conducting portion 35.

ケース部材接続部３１は、保持部材３０がケース部材１１に接続される部位である。ケース部材接続部３１は、その長手方向寸法が基板２１の長手方向寸法とほぼ同じ長さを有した長尺の平板状に形成されている。ケース部材接続部３１は、図２及び図３に示すように、ケース部材１１の側壁１６ａ，１６ｂの各内壁面に設けられた凸部１８に接触した状態で、ネジ１９により凸部１８に締結されている。ネジ１９は熱伝導性を有する金属製のものが用いられる。なお、ケース部材接続部３１の凸部１８への取り付けはネジ締め以外でもよい。たとえば、熱伝導性を有する接着剤を用いてケース部材接続部３１を凸部１８に固着させてもよい。   The case member connection part 31 is a part where the holding member 30 is connected to the case member 11. The case member connecting portion 31 is formed in a long flat plate shape whose longitudinal dimension has substantially the same length as the longitudinal dimension of the substrate 21. As shown in FIGS. 2 and 3, the case member connecting portion 31 is fastened to the convex portion 18 with a screw 19 in contact with the convex portion 18 provided on each inner wall surface of the side walls 16 a and 16 b of the case member 11. Has been. The screw 19 is made of a metal having thermal conductivity. Note that the case member connection portion 31 may be attached to the convex portion 18 other than by screw tightening. For example, the case member connecting portion 31 may be fixed to the convex portion 18 using an adhesive having thermal conductivity.

基板接続部３２は、保持部材３０が基板２１の短手方向の両端部２７、２７にそれぞれ接続される部位である。ここで、基板２１の短手方向の両端部２７、２７とは、長方形状を成す基板２１の長辺を含む端部であり、具体的には、基板２１において複数の発光ランプ２２からなる線状光源を挟んで対向する２つの側端面の近傍領域である。基板接続部３２は、その長手方向寸法が基板２１の長手方向寸法とほぼ同じ長さを有した長尺の平板状に形成され、所定の間隔ごとにネジ孔３６が形成されている。基板接続部３２は、図２及び図３に示すように、基板２１の端部２７の裏面２５側に接触した状態で、ネジ３７により締結される。ネジ３７としては熱伝導性を有する金属製のものが用いられる。なお、図１に例示されるように複数の光源が線状に配置される照明器具の場合、基板２１の温度は、その長手方向の中央付近が最も高くなる。発光ランプ２２から発生する熱は、主に後述する熱伝導部３５を介してケース部材１１に放熱されるが、一部の熱はネジ３７を通して逃げる。このため、ネジ３７の配置間隔を、基板２１の中央に行くほど密にすることで、基板２１の中央付近の温度を下げることが可能である。   The board connecting part 32 is a part where the holding member 30 is connected to both ends 27 and 27 of the board 21 in the short direction. Here, both ends 27 and 27 in the short direction of the substrate 21 are ends including the long side of the substrate 21 having a rectangular shape, and specifically, a line composed of a plurality of light-emitting lamps 22 on the substrate 21. This is a region in the vicinity of two side end faces that face each other with a shaped light source interposed therebetween. The board connecting portion 32 is formed in a long flat plate shape whose longitudinal dimension is substantially the same as the longitudinal dimension of the board 21, and screw holes 36 are formed at predetermined intervals. As shown in FIGS. 2 and 3, the board connecting portion 32 is fastened with screws 37 while being in contact with the back surface 25 side of the end portion 27 of the board 21. As the screw 37, a metal having heat conductivity is used. In the case of a lighting fixture in which a plurality of light sources are linearly arranged as illustrated in FIG. 1, the temperature of the substrate 21 is highest near the center in the longitudinal direction. The heat generated from the light-emitting lamp 22 is radiated to the case member 11 mainly through the heat conducting portion 35 described later, but part of the heat escapes through the screw 37. For this reason, it is possible to lower the temperature near the center of the substrate 21 by making the arrangement intervals of the screws 37 closer to the center of the substrate 21.

なお、基板接続部３２の基板２１への取り付けはネジ締め以外でもよい。たとえば、熱伝導性を有する接着剤を用いて基板接続部３２を基板２１に固着させてもよい。また、図２及び図３に示す例では、基板接続部３２を基板２１の裏面２５側に取り付けたが、発光ランプ実装面２４側に取り付けてもよい。   Note that the attachment of the substrate connecting portion 32 to the substrate 21 may be other than screw tightening. For example, the substrate connecting portion 32 may be fixed to the substrate 21 using an adhesive having thermal conductivity. In the example shown in FIGS. 2 and 3, the substrate connecting portion 32 is attached to the back surface 25 side of the substrate 21, but may be attached to the light emitting lamp mounting surface 24 side.

介在部３３は、上述したケース部材接続部３１と基板接続部３２との間に介在する部位であり、後述する熱伝導部３５及び基板接続部３２から伝達される熱を、ケース部材接続部３１を介してケース部材１１に伝達する経路となる部位である。介在部３３は、その長手方向寸法がケース部材接続部３１と基板接続部３２の長手方向寸法と同じ長さを有した長尺の平板状に形成されている。この介在部３３には、後述する熱伝導部３５の一端部が接続される。   The interposition part 33 is a part interposed between the case member connection part 31 and the board connection part 32 described above, and the case member connection part 31 transfers heat transmitted from the heat conduction part 35 and the board connection part 32 described later. It is a site | part used as the path | route which transmits to the case member 11 via. The interposition part 33 is formed in a long flat plate shape having the same length in the longitudinal direction as that of the case member connection part 31 and the board connection part 32. One end portion of a heat conducting portion 35 described later is connected to the interposition portion 33.

熱伝導部３５は、図２に示すように、基板２１と介在部３３とを連結するものであり、発光ランプ２２から発生する熱を介在部３３に伝える機能を有している。図５は、熱伝導部３５付近を拡大して示した斜視図である。熱伝導部３５は、その長手方向寸法が基板２１の長手方向寸法とほぼ同じ長さを有した長尺の板材である。熱伝導部３５は、基板２１に接続される基板側の端部３８と、介在部３３に接続される介在部側の端部３９とを有している。そして、熱伝導部３５の端部３８は、平面透過して発光ランプ２２と重なる領域に設けられている。ここで、「平面透過」とは、熱伝導部３５の端部３８が基板２１を透過した場合に、発光ランプ２２と重なることを意味している。なお、熱伝導部３５は、例えばアルミニウム、銅又はステンレス鋼（ＳＵＳ）等の熱伝導性の有する材料から構成されている。なお、熱伝導部３５の熱伝導率は、例えば１０Ｗ／ｍ・Ｋ以上５００Ｗ／ｍ・Ｋ以下で設定されている。   As shown in FIG. 2, the heat conducting portion 35 connects the substrate 21 and the interposition portion 33, and has a function of transmitting heat generated from the light emitting lamp 22 to the interposition portion 33. FIG. 5 is an enlarged perspective view showing the vicinity of the heat conducting portion 35. The heat conducting portion 35 is a long plate material having a length in the longitudinal direction substantially the same as the length in the longitudinal direction of the substrate 21. The heat conducting portion 35 has a substrate-side end portion 38 connected to the substrate 21 and an interposed portion-side end portion 39 connected to the interposed portion 33. Further, the end portion 38 of the heat conducting portion 35 is provided in a region that is planarly transmitted and overlaps the light emitting lamp 22. Here, “planar transmission” means that the end portion 38 of the heat conducting portion 35 overlaps the light-emitting lamp 22 when passing through the substrate 21. In addition, the heat conductive part 35 is comprised from the material which has heat conductivity, such as aluminum, copper, or stainless steel (SUS), for example. The thermal conductivity of the heat conducting unit 35 is set to, for example, 10 W / m · K or more and 500 W / m · K or less.

基板側の端部３８は、図２に示すように、基板２１の裏面２５において発光ランプ２２に対向する部位を含む領域、すなわち、発光ランプ２２の実装位置の直上及びその近傍領域に接触した状態で配置される。一方、介在部側の端部３９は、介在部３３において、上述した基板接続部３２から所定距離だけ離れた位置に接続されている。介在部側の端部３９と基板接続部３２との間の距離が短すぎると、熱伝導部３５から介在部３３に伝達される熱が基板接続部３２に伝達されてしまう。このため、上記距離は、基板接続部３２が熱伝導部３５からの熱の影響を受けない程度の距離に設定される。このように熱伝導部３５を配置することで、発光ランプ２２から発生する熱は速やかに熱伝導部３５を通り、介在部３３を介してケース部材１１に放熱される。   As shown in FIG. 2, the substrate-side end 38 is in contact with a region including a portion facing the light-emitting lamp 22 on the back surface 25 of the substrate 21, that is, a region immediately above and near the mounting position of the light-emitting lamp 22. It is arranged with. On the other hand, the end portion 39 on the intervening portion side is connected to the interposition portion 33 at a position away from the substrate connecting portion 32 described above by a predetermined distance. If the distance between the end 39 on the intervening part side and the board connecting part 32 is too short, the heat transmitted from the heat conducting part 35 to the interposing part 33 will be transferred to the board connecting part 32. For this reason, the distance is set to such a distance that the board connecting portion 32 is not affected by the heat from the heat conducting portion 35. By arranging the heat conducting portion 35 in this way, the heat generated from the light emitting lamp 22 quickly passes through the heat conducting portion 35 and is radiated to the case member 11 through the interposition portion 33.

基板側の端部３８は、少なくとも基板２１の裏面２５に接触して配置されていればよく、必ずしも固定される必要はないが、基板２１が熱伝導部３５の基板側の端部３８と離間する方向に変形した場合に、基板側の端部３８が基板２１から離れるのを防ぐために、金属製のネジを用いて基板側の端部３８を基板２１に締結するか、あるいは、熱伝導性を有する接着剤を用いて固着するのが好ましい。   The substrate-side end portion 38 only needs to be disposed in contact with at least the back surface 25 of the substrate 21 and does not necessarily need to be fixed, but the substrate 21 is separated from the substrate-side end portion 38 of the heat conducting unit 35. In order to prevent the end portion 38 on the substrate side from being separated from the substrate 21 when it is deformed in the direction to be bent, the end portion 38 on the substrate side is fastened to the substrate 21 using a metal screw, or the thermal conductivity It is preferable to fix using an adhesive having

さらに、図示は省略するが、熱伝導部３５に放熱フィン（ヒートシンク）を設けてもよい。放熱フィンは、アルミニウムや銅等の熱伝導率の高い金属製の薄板が複数枚並設された構成を有したものであり、熱伝導部３５から熱を受け取り、その熱を複数の薄板に伝え、薄板の表面から熱を放散させることで熱伝導部３５の温度を下げるものである。このように熱伝導部３５の温度を下げる放熱フィンを設けることで、基板２１全体に熱が伝わるのを抑制する効果がさらに高まる。   Furthermore, although illustration is omitted, a heat radiating fin (heat sink) may be provided in the heat conducting portion 35. The heat radiating fin has a structure in which a plurality of thin metal plates having high thermal conductivity such as aluminum and copper are arranged side by side, receives heat from the heat conducting portion 35, and transmits the heat to the plurality of thin plates. The temperature of the heat conducting part 35 is lowered by dissipating heat from the surface of the thin plate. Thus, the effect which suppresses that heat is transmitted to the board | substrate 21 whole further increases by providing the radiation fin which lowers the temperature of the heat conductive part 35.

なお、本実施の形態では、第１保持部材３０Ａのみに熱伝導部３５を設けた構成としているが、上述した効果をより高めるために、第２保持部材３０Ｂにも上記と同様の熱伝導部３５を設けてもよい。   In the present embodiment, only the first holding member 30A is provided with the heat conducting portion 35. However, in order to further enhance the above-described effects, the second holding member 30B has the same heat conducting portion as described above. 35 may be provided.

上述したケース部材接続部３１、基板接続部３２、介在部３３及び熱伝導部３５は、押出成形により一体に成形されている。しかしながら必ずしも一体成形で形成する必要はなく、各部材を別個に製造して、これらをネジ等の締結手段で締結してもよく、また、各部材を接着剤で接着して一体化させてもよい。また、各部材を必ずしも同じ材質で構成する必要はなく、例えば熱伝導部３５の材質として、他の部材と比べて熱伝導率の高いものを用いてもよい。   The case member connecting portion 31, the substrate connecting portion 32, the interposition portion 33, and the heat conducting portion 35 described above are integrally formed by extrusion molding. However, it is not always necessary to form by integral molding, and each member may be manufactured separately and fastened with fastening means such as screws, or each member may be bonded and integrated with an adhesive. Good. In addition, it is not always necessary to configure each member with the same material. For example, a material having a higher thermal conductivity than other members may be used as the material of the heat conduction portion 35.

次に、図２を参照しながら、上記のように構成される照明器具１０の作用について説明する。発光素子２２ｃ（発光ランプ２２）は、発光するのに伴い発熱する。発光素子２２ｃから発生した熱は、基板２１を介して、発光素子２２ｃの直上に位置する熱伝導部３５の基板側の端部３８に伝わる。熱伝導部３５に伝わった熱は、介在部３３及びケース部材接続部３１を介してケース部材１１に伝わり、放熱される。一方、発光素子２２ｃから基板２１の両端部２７，２７に達した熱は、基板接続部３２及びネジ３７を介して介在部３３に伝わる。   Next, the operation of the lighting fixture 10 configured as described above will be described with reference to FIG. The light emitting element 22c (light emitting lamp 22) generates heat as it emits light. The heat generated from the light emitting element 22c is transmitted through the substrate 21 to the end portion 38 on the substrate side of the heat conducting unit 35 located immediately above the light emitting element 22c. The heat transferred to the heat conducting portion 35 is transferred to the case member 11 through the interposition portion 33 and the case member connecting portion 31, and is radiated. On the other hand, the heat reaching the both end portions 27, 27 of the substrate 21 from the light emitting element 22 c is transmitted to the interposition portion 33 via the substrate connection portion 32 and the screw 37.

ここで、発光素子２２ｃから発生する熱は、発光素子２２ｃの直上に位置する熱伝導部３５に主に伝達されるため、基板２１の両端２７，２７に伝わる熱は少なくなる。このため、基板２１全体の熱膨張が抑制される。その結果、従来に比して基板の撓みが抑制されるため、基板に実装された発光ダイオードの光の出射方向の変化も抑制されることになる。   Here, since the heat generated from the light emitting element 22c is mainly transmitted to the heat conducting portion 35 located immediately above the light emitting element 22c, the heat transmitted to both ends 27, 27 of the substrate 21 is reduced. For this reason, the thermal expansion of the whole substrate 21 is suppressed. As a result, since the bending of the substrate is suppressed as compared with the conventional case, the change in the light emitting direction of the light emitting diode mounted on the substrate is also suppressed.

以上説明したように、実施の形態１の発光装置１０は、ケース部材１１内部で基板２１を保持する保持部材３０が熱伝導性を有する材料で構成され、保持部材３０は、ケース部材１１に接続されるケース部材接続部３１と、基板２１の両端部２７，２７に接続される一対の基板接続部３２と、ケース部材接続部３１と基板接続部３２との間に介在する介在部３３と、その一端部（基板側の端部３８）が基板２１の裏面２５において発光素子２２ｃに対向する部位を含む領域に接続される一方、他端部（介在部側の端部３９）が介在部３３に接続される熱伝導部３５と、を備えている。上記のように構成したことで、発光素子２２ｃから発生した熱は、発光素子２２ｃの直上及びその近傍領域に配置された熱伝導部３５に伝わり、介在部３３を介してケース部材１１に放熱される。これにより、基板２１の両端２７，２７に伝わる熱が少なくなるため、基板２１全体の熱膨張が抑制され、基板２１の撓みが抑制される。その結果、基板２１に実装された発光素子２２ｃの光の出射方向が変化するのを抑制することができる。   As described above, in the light emitting device 10 according to the first embodiment, the holding member 30 that holds the substrate 21 inside the case member 11 is made of a material having thermal conductivity, and the holding member 30 is connected to the case member 11. A case member connecting portion 31, a pair of substrate connecting portions 32 connected to both end portions 27, 27 of the substrate 21, an interposition portion 33 interposed between the case member connecting portion 31 and the substrate connecting portion 32, One end (the end 38 on the substrate side) is connected to a region including the portion facing the light emitting element 22c on the back surface 25 of the substrate 21, while the other end (the end 39 on the interposition side) is connected to the interposition part 33. And a heat conducting portion 35 connected to the. With the configuration described above, the heat generated from the light emitting element 22c is transmitted to the heat conducting part 35 disposed immediately above and near the light emitting element 22c, and is radiated to the case member 11 through the interposition part 33. The Thereby, since the heat transmitted to the both ends 27 of the board | substrate 21 decreases, the thermal expansion of the board | substrate 21 whole is suppressed, and the bending of the board | substrate 21 is suppressed. As a result, it is possible to suppress a change in the light emission direction of the light emitting element 22c mounted on the substrate 21.

また、実施の形態１の発光装置１０では、基板２１の長手方向に沿って複数の発光素子２２ｃが線状に配列して実装され、線状に配列された発光素子２２ｃを挟んで対向する基板２１の両端部２７,２７が、保持部材３０の一対の基板接続部３２に接続された構成としている。上記のように構成したことで、広い範囲を照明する照明器具に適用することが可能となる。   Further, in the light emitting device 10 according to the first embodiment, a plurality of light emitting elements 22c are arranged in a line along the longitudinal direction of the substrate 21, and are opposed to each other with the light emitting elements 22c arranged in a line interposed therebetween. Both end portions 27 and 27 of 21 are connected to a pair of substrate connection portions 32 of the holding member 30. It becomes possible to apply to the lighting fixture which illuminates a wide range by having comprised as mentioned above.

また、実施の形態１の発光装置１０によれば、熱伝導部３５にヒートシンクが設けられているため、熱伝導部３５の熱伝達効率を向上させることができ、基板２１全体に熱が伝わるのを抑制する効果をさらに高めることができる。   Further, according to the light emitting device 10 of the first embodiment, since the heat conduction part 35 is provided with a heat sink, the heat transfer efficiency of the heat conduction part 35 can be improved, and heat is transmitted to the entire substrate 21. It is possible to further enhance the effect of suppressing the above.

（実施の形態２）
次に、実施の形態２に係る発光装置について説明する。なお、上述した実施の形態１と同一の構成には同一の符号を付し、その説明を省略する。図６は、実施の形態２の発光装置を適用した照明器具１０の断面図である。上述した実施の形態１では、基板２１の端部２７を保持部材３０の基板接続部３２にネジ締めすることにより、基板接続部３２に対して基板２１の端部２７を固定したが、実施の形態２では、図６に示すように、基板２１の端部２７を保持部材３０の熱伝導部３５にネジ締めすることにより、熱伝導部３５に対して基板２１の端部２７を固定した点が、実施の形態１と異なっている。それ以外の構成は実施の形態１と同じである。 (Embodiment 2)
Next, the light emitting device according to Embodiment 2 will be described. In addition, the same code | symbol is attached | subjected to the structure same as Embodiment 1 mentioned above, and the description is abbreviate | omitted. FIG. 6 is a cross-sectional view of a lighting fixture 10 to which the light-emitting device of Embodiment 2 is applied. In the first embodiment described above, the end portion 27 of the substrate 21 is fixed to the substrate connection portion 32 by screwing the end portion 27 of the substrate 21 to the substrate connection portion 32 of the holding member 30. In the second embodiment, as shown in FIG. 6, the end portion 27 of the substrate 21 is fixed to the heat conducting portion 35 by screwing the end portion 27 of the substrate 21 to the heat conducting portion 35 of the holding member 30. However, this is different from the first embodiment. Other configurations are the same as those in the first embodiment.

図６に示すように、基板２１の短手方向の端部２７には、ネジ４１の軸部の外径よりも大きな内径を有するネジ挿通孔４２が、基板２１の長手方向に沿って所定の間隔をあけて複数形成されている。同様に、保持部材３０の基板接続部３２には、ネジ４１の軸部の外径よりも大きな内径を有するネジ挿通孔４３が複数形成されている。さらに、保持部材３０の熱伝導部３５において、ネジ挿通孔４２，４３に対応する位置（ネジ挿通孔４２，４３の直上）には、ネジ孔４４が複数設けられている。図６に示すように、ネジ４１としては、軸部の長さ寸法が実施の形態１で用いたネジ３７よりも長いものが用いられる。基板接続部３２は、基板２１の端部２７の裏面２５に接触した状態で配置されている。ネジ４１は、基板２１と基板接続部３２に形成されたネジ挿通孔４２，４３に挿通された状態で、熱伝導部３５のネジ孔４４に螺合されることにより、基板２１の端部２７が熱伝導部３５に締結される。   As shown in FIG. 6, a screw insertion hole 42 having an inner diameter larger than the outer diameter of the shaft portion of the screw 41 is provided at the end portion 27 in the short direction of the substrate 21 along the longitudinal direction of the substrate 21. A plurality are formed at intervals. Similarly, a plurality of screw insertion holes 43 having an inner diameter larger than the outer diameter of the shaft portion of the screw 41 are formed in the board connecting portion 32 of the holding member 30. Further, in the heat conducting portion 35 of the holding member 30, a plurality of screw holes 44 are provided at positions corresponding to the screw insertion holes 42 and 43 (immediately above the screw insertion holes 42 and 43). As shown in FIG. 6, as the screw 41, a screw whose length is longer than that of the screw 37 used in the first embodiment is used. The board connecting portion 32 is disposed in contact with the back surface 25 of the end portion 27 of the board 21. The screw 41 is screwed into the screw hole 44 of the heat conducting portion 35 in a state where the screw 41 is inserted into the screw insertion holes 42 and 43 formed in the substrate 21 and the substrate connecting portion 32, whereby the end portion 27 of the substrate 21. Is fastened to the heat conducting portion 35.

このように、基板２１を熱伝導部３５にネジ締め・固定することで、上記実施の形態１に比して、基板２１に対して熱伝導部３５の基板側の端部３８が常に強く押し付けられた状態となるため、基板２１から熱伝導部３５への熱伝導が良好になる。   Thus, by screwing and fixing the substrate 21 to the heat conducting portion 35, the end portion 38 on the substrate side of the heat conducting portion 35 is always strongly pressed against the substrate 21 as compared to the first embodiment. Therefore, the heat conduction from the substrate 21 to the heat conducting portion 35 is improved.

以上説明したように、実施の形態２の発光装置１０においても、発光素子２２ｃから発生した熱は、発光素子２２ｃの直上及びその近傍領域に配置された熱伝導部３５に主に伝わることになり、介在部３３を介してケース部材１１に放熱される。これにより、基板２１の両端２７，２７に伝わる熱が少なくなるため、基板２１全体の熱膨張が抑制され、基板２１の撓みが抑制される。その結果、基板２１に実装された発光素子２２ｃの光の出射方向が変化するのを抑制することができる。   As described above, also in the light emitting device 10 according to the second embodiment, the heat generated from the light emitting element 22c is mainly transmitted to the heat conducting unit 35 disposed immediately above and near the light emitting element 22c. Then, heat is radiated to the case member 11 through the interposition part 33. Thereby, since the heat transmitted to the both ends 27 of the board | substrate 21 decreases, the thermal expansion of the board | substrate 21 whole is suppressed, and the bending of the board | substrate 21 is suppressed. As a result, it is possible to suppress a change in the light emission direction of the light emitting element 22c mounted on the substrate 21.

さらに、実施の形態２の発光装置１０によれば、上記実施の形態１に比して、基板２１に対して熱伝導部３５の基板側の端部３８が強く押し付けられた状態となる。このため、上記実施の形態１の効果に加えて、基板２１から熱伝導部３５への熱伝導がより良好になるという効果を奏する。   Furthermore, according to the light emitting device 10 of the second embodiment, the end portion 38 on the substrate side of the heat conducting unit 35 is strongly pressed against the substrate 21 as compared with the first embodiment. For this reason, in addition to the effect of the said Embodiment 1, there exists an effect that the heat conduction from the board | substrate 21 to the heat conductive part 35 becomes more favorable.

なお、上記実施の形態１，２では、熱伝導部３５の他端部（介在部側の端部３９）を保持部材３０の介在部３３に接続することで、熱伝導部３５に伝わった熱を介在部３３及びケース部材接続部３１を介してケース部材１１に伝える構成としたが、それ以外の構成としてもよい。たとえば、熱伝導部３５の他端部を直接、ケース部材１１に接続し、熱伝導部３５に伝わった熱を直接ケース部材１１に伝える構成としてもよい。   In the first and second embodiments, the heat transmitted to the heat conducting unit 35 is obtained by connecting the other end (the end 39 on the interposed unit side) of the heat conducting unit 35 to the interposed unit 33 of the holding member 30. Is transmitted to the case member 11 via the interposition part 33 and the case member connection part 31, but other structures may be adopted. For example, the other end portion of the heat conducting unit 35 may be directly connected to the case member 11 and the heat transmitted to the heat conducting unit 35 may be directly transmitted to the case member 11.

また、熱伝導部３５の他端部は介在部３３に接続されることが望ましいが、熱伝導部３５の他端部を基板接続部３２に接続した構成とすることも可能である。この場合も、発光ランプ２２の熱が熱伝導部３５から放熱されるため、従来のように熱伝導部３５を設けない場合と比べて基板２１の昇温を抑えることができるという効果が得られる。   The other end of the heat conducting unit 35 is preferably connected to the interposition part 33, but the other end of the heat conducting unit 35 may be connected to the board connecting unit 32. Also in this case, since the heat of the light emitting lamp 22 is dissipated from the heat conducting portion 35, the temperature rise of the substrate 21 can be suppressed as compared with the conventional case where the heat conducting portion 35 is not provided. .

また、上記実施の形態１，２では、第１保持部材３０Ａのみに熱伝導部３５を設けた構成としたが、第２保持部材３０Ｂにも同様にして熱伝導部３５を設けてもよい。また、上記実施の形態１，２では、熱伝導部３５を基板２１の長手方向寸法とほぼ同じ長さの長尺の板材として構成したが、熱伝導部３５の形状はこれに限定されない。すなわち、熱伝導部３５の基板側の端部３８は、少なくとも発光ランプ２２の実装位置の直上に配置されていればよい。従って、熱伝導部３５を棒状の部材で構成し、複数の棒状の熱伝導部３５を各発光ランプ２２に対応する位置に配置する構成としてもよい。   In the first and second embodiments, the heat conducting unit 35 is provided only on the first holding member 30A. However, the heat conducting unit 35 may be provided on the second holding member 30B in the same manner. In the first and second embodiments, the heat conducting unit 35 is configured as a long plate having a length substantially the same as the longitudinal dimension of the substrate 21, but the shape of the heat conducting unit 35 is not limited to this. In other words, the end 38 on the substrate side of the heat conducting unit 35 may be disposed at least immediately above the mounting position of the light emitting lamp 22. Therefore, the heat conducting portion 35 may be configured by a rod-shaped member, and a plurality of rod-shaped heat conducting portions 35 may be arranged at positions corresponding to the respective light emitting lamps 22.

さらに、上記実施の形態１，２では、発光モジュール２０を、長尺の基板上に複数の発光ランプが線状に実装された線状光源とした例について説明したが、発光モジュール２０は線状光源に限定されるものではなく、一つの基板上に一つの発光ランプが実装された点光源であってもよい。   Further, in the first and second embodiments, the light emitting module 20 is described as an example of a linear light source in which a plurality of light emitting lamps are linearly mounted on a long substrate. The light source is not limited to a light source, and may be a point light source in which one light emitting lamp is mounted on one substrate.

以上のように、本発明に係る発光装置は、上述した照明器具の他、表示装置や液晶パネルのバックライト等に対しても適用することができる。   As described above, the light-emitting device according to the present invention can be applied to a display device, a backlight of a liquid crystal panel, and the like in addition to the lighting fixture described above.

１０ 照明器具（発光装置）
１１ ケース部材
１２ 取付壁
１３ カバー部材
１４ 取付壁と対向する壁
１５ 開口部
１６ａ，１６ｂ 側壁
１７ 通気孔
１８ 凸部
１９ ネジ
２０ 発光モジュール
２１ 基板
２２ 発光ランプ
２３ 反射部材
２３ａ 反射部材連結板
２３ｂ 光反射面
２４ 発光ランプ実装面
２５ 裏面
２６ コネクタ
２７ 基板の端部
２８ ネジ孔
３０ 保持部材
３０Ａ 第１保持部材
３０Ｂ 第２保持部材
３１ ケース部材接続部
３２ 基板接続部
３３ 介在部
３５ 熱伝導部
３６ ネジ孔
３７ ネジ
３８ 基板側の端部
３９ 介在部側の端部
４１ ネジ
４２，４３ ネジ挿通孔
４４ ネジ孔
１０ 筐体 10 Lighting equipment (light emitting device)
DESCRIPTION OF SYMBOLS 11 Case member 12 Mounting wall 13 Cover member 14 Wall facing mounting wall 15 Opening part 16a, 16b Side wall 17 Vent hole 18 Convex part 19 Screw 20 Light emitting module 21 Substrate 22 Light emitting lamp 23 Reflective member 23a Reflective member connection plate 23b Light reflection Surface 24 Light emitting lamp mounting surface 25 Back surface 26 Connector 27 Substrate end 28 Screw hole 30 Holding member 30A First holding member 30B Second holding member 31 Case member connecting portion 32 Substrate connecting portion 33 Interposing portion 35 Heat conducting portion 36 Screw hole 37 Screw 38 End portion on substrate side 39 End portion on interposition side 41 Screw 42, 43 Screw insertion hole 44 Screw hole 10 Housing

Claims (3)

開口部を有するケース部材と、前記ケース部材内部に収容される基板と、前記基板に実装される発光ランプと、前記ケース部材内部において前記基板を保持する保持部材とを有し、前記発光ランプから出射される光を前記開口部から外部に放出するように構成された発光装置において、
前記保持部材は、
熱伝導性を有する材料から構成されるとともに、
その一端部が前記基板の発光素子実装面と反対側の面であって平面透過して前記発光ランプと重なる領域に接続されるとともに、他端部が前記ケース部材に接続される熱伝導部と、
前記基板の両端部にそれぞれ接続される一対の基板接続部と
を備え、
前記一対の基板接続部の一方が、前記熱伝導部の他端部と接続されていることを特徴とする発光装置。 A case member having an opening; a substrate housed in the case member; a light emitting lamp mounted on the substrate; and a holding member for holding the substrate inside the case member; In a light emitting device configured to emit emitted light to the outside from the opening,
The holding member is
It is composed of a material with thermal conductivity,
One end portion of the substrate is a surface opposite to the light emitting element mounting surface and is transmitted through the plane and connected to a region overlapping the light emitting lamp, and the other end portion is connected to the case member ; ,
A pair of substrate connection portions respectively connected to both ends of the substrate ;
Wherein one of the pair of board connecting portion, the light emitting device characterized that it is connected to the other end portion of the heat-conducting portion. 前記基板は矩形状を成し
前記基板の長手方向に沿って複数の前記発光ランプが線状に配列して実装され、
前記基板において線状に配列された前記発光ランプを挟んで対向する両端部が、前記保持部材の一対の基板接続部に接続されていることを特徴とする請求項１に記載の発光装置。 The substrate has a rectangular shape, and a plurality of the light emitting lamps are arranged in a line along the longitudinal direction of the substrate.
The light emitting device according to claim 1, both end portions facing each other across the light emitting lamps arranged in a line shape in the substrate, characterized in that it is connected to a pair of board connecting portion of the holding member. 前記熱伝導部にヒートシンクが設けられていることを特徴とする請求項１または２に記載の発光装置。 The light emitting device according to claim 1 or 2, characterized in that the heat sink is provided on the heat conducting part.
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