JP5480722B2 - 放熱用部品及びそれを備えた半導体パッケージ - Google Patents
放熱用部品及びそれを備えた半導体パッケージ Download PDFInfo
- Publication number
- JP5480722B2 JP5480722B2 JP2010123326A JP2010123326A JP5480722B2 JP 5480722 B2 JP5480722 B2 JP 5480722B2 JP 2010123326 A JP2010123326 A JP 2010123326A JP 2010123326 A JP2010123326 A JP 2010123326A JP 5480722 B2 JP5480722 B2 JP 5480722B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- semiconductor element
- thermal expansion
- expansion coefficient
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/04—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes comprising shape memory alloys or bimetallic elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/06—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes composite, e.g. polymers with fillers or fibres
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/26—Safety or protection arrangements; Arrangements for preventing malfunction for allowing differential expansion between elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
- F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Description
図3は、第1の実施の形態に係る放熱用部品を装着した半導体パッケージを例示する断面図である。図3を参照するに、半導体パッケージ10において、基板20上には、接続端子30を介して半導体素子40が実装され、基板20と半導体素子40との間にはアンダーフィル樹脂50が充填されている。
第1の実施の形態の変形例では、半導体素子上部の第1層の厚さを、他の部分の厚さよりも厚くする例を示す。
第2の実施の形態では、放熱用部品を3層から構成する例を示す。
20 基板
30 接続端子
40 半導体素子
50 アンダーフィル樹脂
60 熱伝導部材
70、70A、70B 放熱用部品
71、71A、71B 第1層
72、72A、72B 第2層
73B 第3層
75 金属層
80 接着剤
T1、T2、T3、T4、T5、T6 厚さ
Claims (4)
- 基板上に実装された半導体素子上に、熱伝導部材を介して配置される放熱用部品であって、
前記半導体素子に近い側に配置される第1層と、前記第1層上に積層され前記半導体素子から遠い側に配置される第2層と、を有し、
前記第1層において、前記半導体素子上部に配置される部分の厚さが、他の部分の厚さよりも厚く、
前記第2層において、前記半導体素子上部に配置される部分の厚さが、他の部分の厚さよりも薄く、
前記第2層の熱膨張係数が、前記第1層の熱膨張係数よりも小さく、
前記第1層の熱膨張係数と前記第2層の熱膨張係数との差と、前記基板の熱膨張係数と前記半導体素子の熱膨張係数との差との差が5ppm/℃以下であることを特徴とする放熱用部品。 - 前記第1層の前記半導体素子に近い側に第3層を、前記第2層の前記半導体素子から遠い側に第4層を更に有し、
前記第3層及び前記第4層は、同一の材料から構成され、
前記第3層は、前記第4層よりも層厚が厚くされていることを特徴とする請求項1記載の放熱用部品。 - 前記第3層及び前記第4層は、めっきにより形成されていることを特徴とする請求項2記載の放熱用部品。
- 基板上に接続端子を介して半導体素子が実装された半導体パッケージであって、
前記半導体素子上に、熱伝導部材を介して放熱用部品が配置され、
前記放熱用部品は、
前記半導体素子に近い側に配置される第1層と、前記第1層上に積層され前記半導体素子から遠い側に配置される第2層と、を有し、
前記第1層において、前記半導体素子上部に配置される部分の厚さが、他の部分の厚さよりも厚く、
前記第2層において、前記半導体素子上部に配置される部分の厚さが、他の部分の厚さよりも薄く、
前記第2層の熱膨張係数が、前記第1層の熱膨張係数よりも小さく、
前記第1層の熱膨張係数と前記第2層の熱膨張係数との差と、前記基板の熱膨張係数と前記半導体素子の熱膨張係数との差との差が5ppm/℃以下であることを特徴とする半導体パッケージ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010123326A JP5480722B2 (ja) | 2010-05-28 | 2010-05-28 | 放熱用部品及びそれを備えた半導体パッケージ |
US13/114,188 US8674499B2 (en) | 2010-05-28 | 2011-05-24 | Heat radiation component and semiconductor package including same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010123326A JP5480722B2 (ja) | 2010-05-28 | 2010-05-28 | 放熱用部品及びそれを備えた半導体パッケージ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011249684A JP2011249684A (ja) | 2011-12-08 |
JP2011249684A5 JP2011249684A5 (ja) | 2013-03-21 |
JP5480722B2 true JP5480722B2 (ja) | 2014-04-23 |
Family
ID=45021405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010123326A Active JP5480722B2 (ja) | 2010-05-28 | 2010-05-28 | 放熱用部品及びそれを備えた半導体パッケージ |
Country Status (2)
Country | Link |
---|---|
US (1) | US8674499B2 (ja) |
JP (1) | JP5480722B2 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5838065B2 (ja) * | 2011-09-29 | 2015-12-24 | 新光電気工業株式会社 | 熱伝導部材及び熱伝導部材を用いた接合構造 |
JP6189015B2 (ja) * | 2012-04-19 | 2017-08-30 | 昭和電工株式会社 | 放熱装置および放熱装置の製造方法 |
US20130308273A1 (en) * | 2012-05-21 | 2013-11-21 | Hamilton Sundstrand Space Systems International | Laser sintered matching set radiators |
US20130306293A1 (en) * | 2012-05-21 | 2013-11-21 | Hamilton Sundstrand Space Systems International | Extruded matching set radiators |
US9041192B2 (en) | 2012-08-29 | 2015-05-26 | Broadcom Corporation | Hybrid thermal interface material for IC packages with integrated heat spreader |
US20140117527A1 (en) * | 2012-11-01 | 2014-05-01 | Nvidia Corporation | Reduced integrated circuit package lid height |
WO2015025447A1 (ja) | 2013-08-23 | 2015-02-26 | 富士電機株式会社 | 半導体装置 |
US9892990B1 (en) * | 2014-07-24 | 2018-02-13 | Amkor Technology, Inc. | Semiconductor package lid thermal interface material standoffs |
JP6109274B1 (ja) * | 2015-11-09 | 2017-04-05 | かがつう株式会社 | ヒートシンク及び該ヒートシンクの製造方法並びに該ヒートシンクを用いた電子部品パッケージ |
JP6409846B2 (ja) * | 2016-10-18 | 2018-10-24 | トヨタ自動車株式会社 | 半導体装置 |
US10551132B2 (en) * | 2017-11-28 | 2020-02-04 | International Business Machines Corporation | Heat removal element with thermal expansion coefficient mismatch |
US10607857B2 (en) * | 2017-12-06 | 2020-03-31 | Indium Corporation | Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger |
US11410905B2 (en) * | 2019-03-18 | 2022-08-09 | International Business Machines Corporation | Optimized weight heat spreader for an electronic package |
US11817369B2 (en) * | 2019-06-07 | 2023-11-14 | Intel Corporation | Lids for integrated circuit packages with solder thermal interface materials |
US11915991B2 (en) * | 2021-03-26 | 2024-02-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04186869A (ja) | 1990-11-21 | 1992-07-03 | Denki Kagaku Kogyo Kk | 金属板ベース回路基板 |
US5608267A (en) * | 1992-09-17 | 1997-03-04 | Olin Corporation | Molded plastic semiconductor package including heat spreader |
JPH09306954A (ja) * | 1996-05-20 | 1997-11-28 | Hitachi Ltd | 半導体装置及びその実装方法並びに実装構造体 |
JP2856192B2 (ja) * | 1997-04-10 | 1999-02-10 | 日本電気株式会社 | 半導体装置 |
JP3216620B2 (ja) * | 1998-11-11 | 2001-10-09 | 日本電気株式会社 | 半導体装置 |
US6288900B1 (en) * | 1999-12-02 | 2001-09-11 | International Business Machines Corporation | Warpage compensating heat spreader |
KR100447867B1 (ko) * | 2001-10-05 | 2004-09-08 | 삼성전자주식회사 | 반도체 패키지 |
US6882535B2 (en) * | 2003-03-31 | 2005-04-19 | Intel Corporation | Integrated heat spreader with downset edge, and method of making same |
JP2004327711A (ja) | 2003-04-24 | 2004-11-18 | Toyota Motor Corp | 半導体モジュール |
JP4186869B2 (ja) | 2004-05-14 | 2008-11-26 | ブラザー工業株式会社 | インクジェット記録装置 |
US7180179B2 (en) * | 2004-06-18 | 2007-02-20 | International Business Machines Corporation | Thermal interposer for thermal management of semiconductor devices |
JP2006019535A (ja) * | 2004-07-02 | 2006-01-19 | Sony Corp | 半導体パッケージ |
WO2008013279A1 (fr) * | 2006-07-28 | 2008-01-31 | Kyocera Corporation | Boîtier de stockage de composant électronique et dispositif électronique |
JP2008135627A (ja) * | 2006-11-29 | 2008-06-12 | Nec Electronics Corp | 半導体装置 |
US7737550B2 (en) * | 2007-08-30 | 2010-06-15 | International Business Machines Corporation | Optimization of electronic package geometry for thermal dissipation |
-
2010
- 2010-05-28 JP JP2010123326A patent/JP5480722B2/ja active Active
-
2011
- 2011-05-24 US US13/114,188 patent/US8674499B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20110291258A1 (en) | 2011-12-01 |
JP2011249684A (ja) | 2011-12-08 |
US8674499B2 (en) | 2014-03-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5480722B2 (ja) | 放熱用部品及びそれを備えた半導体パッケージ | |
JP5128951B2 (ja) | ヒートシンクモジュール及びその製造方法 | |
US7875972B2 (en) | Semiconductor device assembly having a stress-relieving buffer layer | |
WO2009116439A1 (ja) | ヒートシンク付パワーモジュール用基板及びその製造方法、並びに、ヒートシンク付パワーモジュール、パワーモジュール用基板 | |
WO2015163452A1 (ja) | パワーモジュール用基板及びヒートシンク付パワーモジュール用基板並びにヒートシンク付パワーモジュール | |
US20040232544A1 (en) | Semiconductor device and method of manufacturing the same | |
US9530717B2 (en) | Bonded body and power module substrate | |
US6918438B2 (en) | Finned heat sink | |
JP2008235852A (ja) | セラミックス基板及びこれを用いた半導体モジュール | |
JP2007299973A (ja) | 回路基板およびこれを用いた半導体モジュール | |
JP2006269966A (ja) | 配線基板およびその製造方法 | |
JP2008147308A (ja) | 回路基板およびこれを用いた半導体モジュール | |
JP2004356625A (ja) | 半導体装置及びその製造方法 | |
JP2010098057A (ja) | ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール及び緩衝層付パワーモジュール用基板 | |
JP2010098059A (ja) | ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール、緩衝層付パワーモジュール用基板及びヒートシンク付パワーモジュール用基板の製造方法 | |
JP5370460B2 (ja) | 半導体モジュール | |
JP2011035308A (ja) | 放熱板、半導体装置及び放熱板の製造方法 | |
JP2002064169A (ja) | 放熱構造体 | |
JP2017063143A (ja) | 冷却器付き発光モジュールおよび冷却器付き発光モジュールの製造方法 | |
JP6303420B2 (ja) | パワーモジュール用基板 | |
JP2008147307A (ja) | 回路基板およびこれを用いた半導体モジュール | |
JP5411174B2 (ja) | 回路板およびその製造方法 | |
JP6789968B2 (ja) | 熱抵抗が向上した電子チップデバイス、および関連する製造プロセス | |
JP5648705B2 (ja) | ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール及び緩衝層付パワーモジュール用基板 | |
JP6139331B2 (ja) | パワーモジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130131 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130131 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20131031 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20131112 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140110 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140204 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140214 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5480722 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |