JP5474198B2 - マイクロメカニック式のプロジェクション装置及びマイクロメカニック式のプロジェクション装置を製造する方法 - Google Patents
マイクロメカニック式のプロジェクション装置及びマイクロメカニック式のプロジェクション装置を製造する方法 Download PDFInfo
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- JP5474198B2 JP5474198B2 JP2012527358A JP2012527358A JP5474198B2 JP 5474198 B2 JP5474198 B2 JP 5474198B2 JP 2012527358 A JP2012527358 A JP 2012527358A JP 2012527358 A JP2012527358 A JP 2012527358A JP 5474198 B2 JP5474198 B2 JP 5474198B2
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- 229910000831 Steel Inorganic materials 0.000 description 1
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- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
- H04N9/3141—Constructional details thereof
- H04N9/3173—Constructional details thereof wherein the projection device is specially adapted for enhanced portability
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/145—Housing details, e.g. position adjustments thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
- H04N9/3141—Constructional details thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Micromachines (AREA)
- Mechanical Optical Scanning Systems (AREA)
- Transforming Electric Information Into Light Information (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
請求項1記載の本発明による、マイクロメカニック式のプロジェクション装置の構成では、第1の区分、第2の区分及び第3の区分を有する保持体が設けられていて、第2の区分は第1の区分と第3の区分との間に位置していて、可撓性に形成されており、第1の区分にミラーが装着されており、第3の区分に光源が装着されており、第2の区分は、光源からの光線がミラーに向けられるように屈曲されている。
Claims (6)
- マイクロメカニック式のプロジェクション装置(1)であって、
第1の区分(30)、第2の区分(31)及び第3の区分(32)を有する保持体(2)が設けられていて、第2の区分(31)は第1の区分(30)と第3の区分(32)との間に位置していて、可撓性に形成されており、
第1の区分(30)にミラー(6)が装着されており、
第3の区分(32)に光源(15)が装着されており、
第2の区分(31)は、光源(15)からの光線(16)がミラー(6)に向けられるように屈曲されており、
第1の区分(30)の、ミラー(6)とは反対の側に補強エレメント(13)が設けられている
ことを特徴とする、マイクロメカニック式のプロジェクション装置。 - 第2の区分(31)はほぼ半円形、U字形又はL字形に曲げられている、請求項1記載のマイクロメカニック式のプロジェクション装置。
- 少なくとも第2の区分(31)はフレックスプリント基板として形成されている、請求項1又は2記載のマイクロメカニック式のプロジェクション装置。
- 曲げられた第2の区分(31)及び/又は第3の区分(32)の、第1の区分(30)に対するポジションを保持する保持手段(17)が設けられており、該保持手段(17)は、それぞれ第2の区分(31)から離れて第1の区分(30)と第3の区分(32)とを結合する2つの保持区分(18)を有している、請求項1から3までのいずれか1項記載のマイクロメカニック式のプロジェクション装置。
- 光源(15)及び/又はミラー(6)を制御する制御チップ(9)が設けられていて、ミラー(6)はマイクロメカニック式のチップとして形成されていて、制御チップ(9)は第1の区分(30)とミラー(6)との間に配置されている、請求項1から4までのいずれか1項記載のマイクロメカニック式のプロジェクション装置。
- 請求項1から5までのいずれか1項記載のマイクロメカニック式のプロジェクション装置(1)を製造する方法であって、下記のステップ、すなわち、
ほぼ平らな保持体(2)を準備し、
保持体(2)の第1の区分(30)の、次のステップで装着されるミラー(6)とは反対の側に補強エレメント(13)を取り付け、
保持体(2)の第1の区分(30)にミラー(6)を装着し、
保持体(2)の第3の区分(32)に光源(15)を装着し、
第1の区分(30)と第3の区分(32)との間に位置している、保持体(2)の第2の区分(31)を、光源(15)からの光線(16)がミラー(6)に向けられるように、屈曲し、
この場合ミラー(6)及び/又は光源(15)の機能を、保持体(2)への該ミラー(6)及び/又は光源(15)の装着後に、しかしながら第2の区分(31)の屈曲の前に、テストし、かつ/又は、ミラー(6)及び/又は光源(15)を、保持体(2)への該ミラー(6)及び/又は光源(15)の装着後において、屈曲作業中に電気的に作動させる、
というステップを有していることを特徴とする、マイクロメカニック式のプロジェクション装置を製造する方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009045919A DE102009045919A1 (de) | 2009-10-22 | 2009-10-22 | Mikromechanische Projektionsvorrichtung sowie Verfahren zum Herstellen einer mikromechanischen Projektionsvorrichtung |
DE102009045919.7 | 2009-10-22 | ||
PCT/EP2010/065798 WO2011048146A1 (de) | 2009-10-22 | 2010-10-20 | Mikromechanische projektionsvorrichtung sowie verfahren zum herstellen einer mikromechanischen projektionsvorrichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013504085A JP2013504085A (ja) | 2013-02-04 |
JP5474198B2 true JP5474198B2 (ja) | 2014-04-16 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2012527358A Active JP5474198B2 (ja) | 2009-10-22 | 2010-10-20 | マイクロメカニック式のプロジェクション装置及びマイクロメカニック式のプロジェクション装置を製造する方法 |
Country Status (8)
Country | Link |
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US (1) | US9057936B2 (ja) |
EP (1) | EP2491450B1 (ja) |
JP (1) | JP5474198B2 (ja) |
KR (1) | KR101707261B1 (ja) |
CN (1) | CN102576151B (ja) |
DE (1) | DE102009045919A1 (ja) |
TW (1) | TWI526716B (ja) |
WO (1) | WO2011048146A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2013018266A1 (en) * | 2011-06-22 | 2013-02-07 | Seiko Epson Corporation | Projector with housing for inserting light modulator with flexible printed circuit board |
JP5990948B2 (ja) * | 2011-06-22 | 2016-09-14 | セイコーエプソン株式会社 | プロジェクター |
US9405116B2 (en) * | 2012-03-08 | 2016-08-02 | Intel Corporation | MEMS micro-mirror assembly |
CN104363400A (zh) * | 2014-10-29 | 2015-02-18 | 广东欧珀移动通信有限公司 | 一种扫描本地二维码的方法及装置 |
DE102018006625A1 (de) * | 2018-08-22 | 2020-02-27 | Gentherm Gmbh | Schaltungsmodell aus mehreren elektrisch leitend miteinander verbundenen Komponenten sowie Verfahren zur Herstellung eines solchen Schaltungsmoduls |
DE102021207081A1 (de) | 2021-07-06 | 2023-01-12 | Robert Bosch Gesellschaft mit beschränkter Haftung | Projektionsmodul |
KR20230140080A (ko) | 2022-03-29 | 2023-10-06 | 정진호 | 수돗물 정수용 필터 |
Family Cites Families (15)
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US6114712A (en) | 1996-10-09 | 2000-09-05 | Symbol Technologies, Inc. | One piece optical assembly for low cost optical scanner |
US6179426B1 (en) * | 1999-03-03 | 2001-01-30 | 3M Innovative Properties Company | Integrated front projection system |
US6532093B2 (en) * | 2000-12-06 | 2003-03-11 | Xerox Corporation | Integrated micro-opto-electro-mechanical laser scanner |
US6906850B2 (en) | 2000-12-28 | 2005-06-14 | Texas Instruments Incorporated | Capacitively coupled micromirror |
AU782241B2 (en) | 2001-10-19 | 2005-07-14 | Microvision, Inc. | Electro-optical assembly for image projection, especially in portable instruments |
DE10213671A1 (de) | 2002-03-27 | 2003-10-23 | Karlsruhe Forschzent | Aktor für einen optisch-mechanischen Scanner sowie Verfahren unter Verwendung des Aktors |
JP4112888B2 (ja) | 2002-04-08 | 2008-07-02 | 佐々木 実 | 立体構造を持った微小光学系の製造方法とこれを実施した微小光学システム |
US7225987B2 (en) | 2003-09-11 | 2007-06-05 | Symbol Technologies, Inc. | Integrated scanner on a common substrate |
TWI242938B (en) | 2004-02-20 | 2005-11-01 | Ind Tech Res Inst | Parallel optical subassembly module structure |
US7612440B2 (en) * | 2005-05-18 | 2009-11-03 | Texas Instruments Incorporated | Package for an integrated circuit |
TW200802140A (en) | 2006-06-27 | 2008-01-01 | Zebex Ind Inc | Barcode reader by using a micromechanical actuator for scanning |
JP2008020540A (ja) | 2006-07-11 | 2008-01-31 | Ricoh Co Ltd | 光走査装置及び画像形成装置 |
US7548365B2 (en) * | 2007-06-06 | 2009-06-16 | Texas Instruments Incorporated | Semiconductor device and method comprising a high voltage reset driver and an isolated memory array |
US8054531B2 (en) | 2007-06-26 | 2011-11-08 | Hewlett-Packard Development Company, L.P. | Micro-electro-mechanical systems and photonic interconnects employing the same |
US8562149B2 (en) * | 2010-05-21 | 2013-10-22 | Delta Electronics, Inc. | Flexibly connectable digital micromirror device module and projecting apparatus employing same |
-
2009
- 2009-10-22 DE DE102009045919A patent/DE102009045919A1/de not_active Withdrawn
-
2010
- 2010-10-20 JP JP2012527358A patent/JP5474198B2/ja active Active
- 2010-10-20 WO PCT/EP2010/065798 patent/WO2011048146A1/de active Application Filing
- 2010-10-20 CN CN201080047589.0A patent/CN102576151B/zh active Active
- 2010-10-20 EP EP10768487.0A patent/EP2491450B1/de active Active
- 2010-10-20 KR KR1020127010296A patent/KR101707261B1/ko active IP Right Grant
- 2010-10-20 US US13/501,983 patent/US9057936B2/en active Active
- 2010-10-22 TW TW099136019A patent/TWI526716B/zh active
Also Published As
Publication number | Publication date |
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KR20120089299A (ko) | 2012-08-09 |
DE102009045919A1 (de) | 2011-04-28 |
KR101707261B1 (ko) | 2017-02-15 |
EP2491450A1 (de) | 2012-08-29 |
US9057936B2 (en) | 2015-06-16 |
CN102576151A (zh) | 2012-07-11 |
TWI526716B (zh) | 2016-03-21 |
JP2013504085A (ja) | 2013-02-04 |
EP2491450B1 (de) | 2014-06-04 |
WO2011048146A1 (de) | 2011-04-28 |
US20120262681A1 (en) | 2012-10-18 |
TW201126202A (en) | 2011-08-01 |
CN102576151B (zh) | 2014-12-03 |
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